MPC8541EPXALF vs MPC8541EPXAJD Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8541EPXALF disebabkan oleh NXP Semiconductors dan MPC8541EPXAJD disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP
MPC8541EPXALF ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | MPC8541EPXALF | MPC8541EPXAJD |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC III (MPC85xx) | MPC85xx (PowerQUICC III) |
| Core Architecture | PowerPC e500, 32-bit | PowerPC e500 |
| Lebar Bus Data | 64-bit | 32-bit |
| Core Frequency | 667 MHz | — |
| Tegangan Pemberi Arus | 1.2 V (core); 2.5 V / 3.3 V (I/O) | — |
| Suhu Operasi | 0C to +105C | — |
| Package Type | FCBGA-783 (29 x 29 mm, 1 mm pitch, Flip-Chip) | — |
| Kiraan Pin | 783 | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 256 KB unified with ECC | — |
| Ethernet Controllers | 3 x eTSEC (10/100/1000 Mbps) | — |
| Memory Controller | 64-bit DDR/DDR2 with ECC | DDR/DDR2 SDRAM |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) | — |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant (per NXP product page) |
| Lead Free | Yes | — |
| Core Count | — | 1 |
| Maximum Core Frequency | — | 533 MHz |
| Kemasan | — | 783-FCPBGA (29x29 mm) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 783 |
| Package Code | — | HBGA |
| Ethernet | — | Dual 10/100/1000 Mbps (TSEC) |
| PCI/PCI-X | — | Dual PCI/PCI-X interface |
| Security Engine (SEC) | — | Integrated crypto accelerator |
| Operating Temperature Grade | — | OTHER (extended) |