MPC860DEZQ50D4 vs MPC860DTVR50D4 Perbandingan
Perbandingan bersamaan detil MPC860DEZQ50D4 dari NXP Semiconductors dan MPC860DTVR50D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC860DEZQ50D4 | MPC860DTVR50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Processor Type | MPC8xx PowerQUICC, 32-bit | MPC8xx PowerQUICC |
| Core Architecture | Power Architecture (embedded) | 32-bit PowerPC |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Paket | 357-Ball PBGA (25x25 mm) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Suhu Kerja | 0 C to +95 C | 0C to +95C |
| Status RoHS | Contains Lead (legacy BGA) | RoHS Compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Tray |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Number of Cores | — | 1 |
| Speed | — | 50 MHz |
| Tegangan Pemuat | — | 3.3 V |
| Paket / Case | — | 357-PBGA (25 x 25 mm) |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 0.32 um CMOS |
| Communications Processor Module (CPM) | — | Integrated (RISC-based) |
| DMA Channels | — | 4 |
| External Memory Bus | — | 32-bit (single/dual bus) |