MPC860DEZQ50D4 vs MPC860DTVR50D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860DEZQ50D4 disebabkan oleh NXP Semiconductors dan MPC860DTVR50D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC860DEZQ50D4 | MPC860DTVR50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Processor Type | MPC8xx PowerQUICC, 32-bit | MPC8xx PowerQUICC |
| Core Architecture | Power Architecture (embedded) | 32-bit PowerPC |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Kemasan | 357-Ball PBGA (25x25 mm) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Suhu Operasi | 0 C to +95 C | 0C to +95C |
| Status RoHS | Contains Lead (legacy BGA) | RoHS Compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Tray |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Number of Cores | — | 1 |
| Speed | — | 50 MHz |
| Tegangan Pemberi Arus | — | 3.3 V |
| Kemasan / Case | — | 357-PBGA (25 x 25 mm) |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 0.32 um CMOS |
| Communications Processor Module (CPM) | — | Integrated (RISC-based) |
| DMA Channels | — | 4 |
| External Memory Bus | — | 32-bit (single/dual bus) |