MPC860DEZQ50D4 vs MPC860DTVR50D4 比較
詳細並排比較 MPC860DEZQ50D4 由 NXP Semiconductors 與 MPC860DTVR50D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC860DEZQ50D4 | MPC860DTVR50D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | Obsolete |
| Processor Type | MPC8xx PowerQUICC, 32-bit | MPC8xx PowerQUICC |
| Core Architecture | Power Architecture (embedded) | 32-bit PowerPC |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| 封裝 | 357-Ball PBGA (25x25 mm) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 工作溫度 | 0 C to +95 C | 0C to +95C |
| RoHS 狀態 | Contains Lead (legacy BGA) | RoHS Compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Tray |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Number of Cores | — | 1 |
| Speed | — | 50 MHz |
| 供應電壓 | — | 3.3 V |
| 封裝 / 外殼 | — | 357-PBGA (25 x 25 mm) |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 0.32 um CMOS |
| Communications Processor Module (CPM) | — | Integrated (RISC-based) |
| DMA Channels | — | 4 |
| External Memory Bus | — | 32-bit (single/dual bus) |