MPC875CVR133 vs MPC870ZT133 Perbandingan

Perbandingan bersamaan detil MPC875CVR133 dari NXP Semiconductors dan MPC870ZT133 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC870ZT133 MPC870ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP | 256-BGA

MPC870ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP | 256-BGA

MPC870ZT133 Obsolete

Perbandingan Spesifikasi

Parameter Umum MPC875CVR133 MPC870ZT133
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) NXP USA Inc. (formerly Freescale)
Product Category Microprocessors (MPU) —
Processor Series MPC8xx / PowerQUICC —
Core MPC8xx (Power Architecture Technology) —
Lebar Bus Data 32-bit —
Frekuensi Bawah Maximum 133 MHz —
Performance 176 MIPS —
Number of Cores 1 1
Core Supply Voltage 1.8 V —
I/O Supply Voltage 3.3 V —
Suhu Kerja -40C to +100C 0C to +95C (commercial)
Paket 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) —
Tipe Mounting Surface Mount Surface Mount
On-chip Communication Processor Module (CPM) Yes (FCC/SCC/SMC/USB/FEC/ATM) —
Status RoHS [DATA_NEEDED: rohs status] Non-Compliant (legacy part)
Level MSL [DATA_NEEDED: MSL level] —
Product Family — PowerQUICC MPC8xx
Processor Type — MPC8xx PowerQUICC, 32-Bit
Core Architecture — Power Architecture (G2_LE)
Core Frequency — 133 MHz
External Data Bus Width — 32-bit
Tegangan Pemuat — 3.3 V I/O, 1.8 V core
Paket / Case — 256-PBGA (23 x 23 mm)
Terminal Form — BALL
Number of Terminals — 256
Package Code — HBGA
Lead Free Status — Contains Lead
Packaging — Tray

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon