MPC875CVR133 vs MPC870ZT133 比較

詳細並排比較 MPC875CVR133 由 NXP Semiconductors 與 MPC870ZT133 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC870ZT133 MPC870ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP | 256-BGA

MPC870ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP | 256-BGA

MPC870ZT133 Obsolete

規格比較

參數 MPC875CVR133 MPC870ZT133
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) NXP USA Inc. (formerly Freescale)
Product Category Microprocessors (MPU) —
Processor Series MPC8xx / PowerQUICC —
Core MPC8xx (Power Architecture Technology) —
資料匯流排寬度 32-bit —
最大時脈頻率 133 MHz —
Performance 176 MIPS —
Number of Cores 1 1
Core Supply Voltage 1.8 V —
I/O Supply Voltage 3.3 V —
工作溫度 -40C to +100C 0C to +95C (commercial)
封裝 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) —
安裝類型 Surface Mount Surface Mount
On-chip Communication Processor Module (CPM) Yes (FCC/SCC/SMC/USB/FEC/ATM) —
RoHS 狀態 [DATA_NEEDED: rohs status] Non-Compliant (legacy part)
MSL 等級 [DATA_NEEDED: MSL level] —
Product Family — PowerQUICC MPC8xx
Processor Type — MPC8xx PowerQUICC, 32-Bit
Core Architecture — Power Architecture (G2_LE)
Core Frequency — 133 MHz
External Data Bus Width — 32-bit
供應電壓 — 3.3 V I/O, 1.8 V core
封裝 / 外殼 — 256-PBGA (23 x 23 mm)
Terminal Form — BALL
Number of Terminals — 256
Package Code — HBGA
Lead Free Status — Contains Lead
Packaging — Tray

資料表與資源

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