MPC875CVR133 vs MPC870ZT133 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC875CVR133 disebabkan oleh NXP Semiconductors dan MPC870ZT133 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPC870ZT133 MPC870ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP | 256-BGA

MPC870ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP | 256-BGA

MPC870ZT133 Obsolete

Pengandingan Spesifikasi

Parametr MPC875CVR133 MPC870ZT133
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) NXP USA Inc. (formerly Freescale)
Product Category Microprocessors (MPU) —
Processor Series MPC8xx / PowerQUICC —
Core MPC8xx (Power Architecture Technology) —
Lebar Bus Data 32-bit —
Frekuensi Klock Maksimum 133 MHz —
Performance 176 MIPS —
Number of Cores 1 1
Core Supply Voltage 1.8 V —
I/O Supply Voltage 3.3 V —
Suhu Operasi -40C to +100C 0C to +95C (commercial)
Kemasan 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) —
Jenis Pemasangan Surface Mount Surface Mount
On-chip Communication Processor Module (CPM) Yes (FCC/SCC/SMC/USB/FEC/ATM) —
Status RoHS [DATA_NEEDED: rohs status] Non-Compliant (legacy part)
Aras MSL [DATA_NEEDED: MSL level] —
Product Family — PowerQUICC MPC8xx
Processor Type — MPC8xx PowerQUICC, 32-Bit
Core Architecture — Power Architecture (G2_LE)
Core Frequency — 133 MHz
External Data Bus Width — 32-bit
Tegangan Pemberi Arus — 3.3 V I/O, 1.8 V core
Kemasan / Case — 256-PBGA (23 x 23 mm)
Terminal Form — BALL
Number of Terminals — 256
Package Code — HBGA
Lead Free Status — Contains Lead
Packaging — Tray

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