SPAK56F803BU80 vs DSP56F803BU80E Perbandingan
Perbandingan bersamaan detil SPAK56F803BU80 dari NXP Semiconductors dan DSP56F803BU80E dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP
SPAK56F803BU80 NrndNXP Semiconductors
DSP56F803BU80E - 16-bit DSC 80MHz 64KB Flash LQFP-100 | NXP
DSP56F803BU80E ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | SPAK56F803BU80 | DSP56F803BU80E |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Product Type | 16-bit Digital Signal Processor | — |
| Core Architecture | DSP56F803 (DSP + MCU unified core) | — |
| Core Frequency | 80 MHz | — |
| Core Performance | 40 MIPS | — |
| Instruction Set | MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops | — |
| Addressing Modes | 14 addressing modes | — |
| Program Memory | On-chip Flash (size [DATA_NEEDED: program memory size in KB]) | — |
| Data Memory | On-chip RAM (size [DATA_NEEDED: data memory size in KB]) | — |
| Paket | LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) | — |
| Package Outline | 100 terminals, square, gull-wing lead form | — |
| Operating Temperature Grade | Industrial | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Typical Applications | Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning | — |
| Core Processor | — | 56800 |
| Core Size | — | 16-bit |
| Series | — | 56F8xx |
| Frekuensi Bawah Maximum | — | 80 MHz |
| Performance | — | 40 MIPS (80MHz/40MIPS per Mouser) |
| Program Memory Size | — | 64 KB (32K x 16) |
| Program Memory Type | — | Flash |
| Architecture | — | Harvard-style, DSP + MCU hybrid |
| Connectivity | — | CANbus, EBI/EMI, SCI |
| Package Type | — | 100-LQFP (14x14 mm), LFQFP, square, gull wing |
| Number of Terminals | — | 100 |
| Temperature Grade | — | Industrial |
| Packaging | — | Tray |
| Product Status | — | End of Life (EOL) per NXP product page |
| Tegangan Pemuat Kerja | — | [DATA_NEEDED: operating supply voltage] |
| Rentang Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |