SPAK56F803BU80 vs DSP56F803BU80E Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng SPAK56F803BU80 sa pamamagitan ng NXP Semiconductors at DSP56F803BU80E sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
SPAK56F803BU80 SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP

SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP

SPAK56F803BU80 Nrnd
NXP Semiconductors
DSP56F803BU80E DSP56F803BU80E - 16-bit DSC 80MHz 64KB Flash LQFP-100 | NXP

DSP56F803BU80E - 16-bit DSC 80MHz 64KB Flash LQFP-100 | NXP

DSP56F803BU80E ✗ Tapus ng Buhay

Pagsanggunian na paghahambing

Parametro SPAK56F803BU80 DSP56F803BU80E
Brand NXP Semiconductors NXP Semiconductors
Kategorya DSP DSP
Katayuan ng Lifecycle NRND Tapus ng Buhay
Product Type 16-bit Digital Signal Processor —
Core Architecture DSP56F803 (DSP + MCU unified core) —
Core Frequency 80 MHz —
Core Performance 40 MIPS —
Instruction Set MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops —
Addressing Modes 14 addressing modes —
Program Memory On-chip Flash (size [DATA_NEEDED: program memory size in KB]) —
Data Memory On-chip RAM (size [DATA_NEEDED: data memory size in KB]) —
Packhaging LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) —
Package Outline 100 terminals, square, gull-wing lead form —
Operating Temperature Grade Industrial —
Uri ng Pagpapasok Surface Mount Surface Mount
Manufacturer NXP Semiconductors (formerly Freescale / Motorola) —
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Typical Applications Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning —
Core Processor — 56800
Core Size — 16-bit
Series — 56F8xx
Maksimum na Taktiko ng Oras — 80 MHz
Performance — 40 MIPS (80MHz/40MIPS per Mouser)
Program Memory Size — 64 KB (32K x 16)
Program Memory Type — Flash
Architecture — Harvard-style, DSP + MCU hybrid
Connectivity — CANbus, EBI/EMI, SCI
Package Type — 100-LQFP (14x14 mm), LFQFP, square, gull wing
Number of Terminals — 100
Temperature Grade — Industrial
Packaging — Tray
Product Status — End of Life (EOL) per NXP product page
Supply Voltage na Operasyon — [DATA_NEEDED: operating supply voltage]
Hanay ng Temperature na Operasyon — [DATA_NEEDED: operating temperature range]

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