SPAK56F803BU80 vs DSP56F803BU80E Karşılaştırma
Ayrıntılı yan yana karşılaştırma SPAK56F803BU80 tarafından NXP Semiconductors ve DSP56F803BU80E tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP
SPAK56F803BU80 NrndNXP Semiconductors
DSP56F803BU80E - 16-bit DSC 80MHz 64KB Flash LQFP-100 | NXP
DSP56F803BU80E ✗ Son Kullanım ZamanıÖzellik Karşılaştırması
| Parametre | SPAK56F803BU80 | DSP56F803BU80E |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Yaşam Döngüsü Durumu | NRND | Hayat Dönemi Sonu |
| Product Type | 16-bit Digital Signal Processor | — |
| Core Architecture | DSP56F803 (DSP + MCU unified core) | — |
| Core Frequency | 80 MHz | — |
| Core Performance | 40 MIPS | — |
| Instruction Set | MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops | — |
| Addressing Modes | 14 addressing modes | — |
| Program Memory | On-chip Flash (size [DATA_NEEDED: program memory size in KB]) | — |
| Data Memory | On-chip RAM (size [DATA_NEEDED: data memory size in KB]) | — |
| Paket | LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) | — |
| Package Outline | 100 terminals, square, gull-wing lead form | — |
| Operating Temperature Grade | Industrial | — |
| Montaj Türü | Surface Mount | Surface Mount |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | — |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Typical Applications | Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning | — |
| Core Processor | — | 56800 |
| Core Size | — | 16-bit |
| Series | — | 56F8xx |
| Azami Saat Hızı | — | 80 MHz |
| Performance | — | 40 MIPS (80MHz/40MIPS per Mouser) |
| Program Memory Size | — | 64 KB (32K x 16) |
| Program Memory Type | — | Flash |
| Architecture | — | Harvard-style, DSP + MCU hybrid |
| Connectivity | — | CANbus, EBI/EMI, SCI |
| Package Type | — | 100-LQFP (14x14 mm), LFQFP, square, gull wing |
| Number of Terminals | — | 100 |
| Temperature Grade | — | Industrial |
| Packaging | — | Tray |
| Product Status | — | End of Life (EOL) per NXP product page |
| İşletim Besleme Gerilimi | — | [DATA_NEEDED: operating supply voltage] |
| İşletim Sıcaklığı Aralığı | — | [DATA_NEEDED: operating temperature range] |