XC3S200-4FT256I vs XC3S200-4FTG256I Perbandingan

Perbandingan bersamaan detil XC3S200-4FT256I dari AMD dan XC3S200-4FTG256I dari Xilinx. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Xilinx
XC3S200-4FTG256I XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx

XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx

XC3S200-4FTG256I ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum XC3S200-4FT256I XC3S200-4FTG256I
Merek AMD Xilinx
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Device Type Spartan-3 field-programmable gate array (FPGA) —
System Gates 50,000 gates 200,000
Nominal System Gates 200,000 gates —
Logic Cells / Logic Blocks 4,320 —
Frekuensi Bawah Maximum 630 MHz —
Technology 90 nm —
Core Supply Voltage 1.14 V to 1.26 V —
Package Type FTBGA-256 —
Package Dimensions 17 mm x 17 mm —
Number of Terminals 256 —
Tipe Mounting Surface Mount Surface Mount (BGA)
Suhu Kerja 0 C to +85 C -40C to +100C (Industrial)
Device Family Spartan-3 —
Speed Grade -4 -4
Temperature Grade Industrial —
Status RoHS Compliant Compliant (G suffix = lead-free)
User I/O Count [DATA_NEEDED: user I/O count] —
Block RAM [DATA_NEEDED: block RAM resources] 216 Kbit (12 blocks x 18 Kbit)
DSP Resources [DATA_NEEDED: DSP resources] —
Family — Spartan-3
Logic Cells — 4,320
Slices — 2,160
Dedicated Multipliers — 4 (18x18)
DCM (Digital Clock Manager) — 4
Maximum User I/O — 173
Core Voltage — 1.2 V
Process Technology — 90 nm
Paket — 256-ball FTBGA (FTG256), 17 x 17 mm
Terminal Form — Ball
Peak Reflow Time — 30 s

Spek dan Sumber

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