EP1K30FC256-1N - 30K Gate ACEX-1K FPGA 256-BGA | Intel EP1K30FC256-1N oleh Intel - komponen elektronik
Intel

EP1K30FC256-1N - 30K Gate ACEX-1K FPGA 256-BGA | Intel

MPN: EP1K30FC256-1N ✗ Akhir Hidup
2.5 V Vdss 256-BGA (FineLine BGA, 17x17 mm) Package -1 Speed
Ajukan Diskon
MOQ: 1 |
Lihat Datasheet (PDF) Lihat Alternatif

EP1K30FC256-1N Ringkasan

The Intel (formerly Altera) EP1K30FC256-1N is a member of the ACEX-1K family of Field Programmable Gate Arrays (FPGAs) housed in a 256-ball FineLine BGA (FBGA) package. It integrates 30,000 typical gates, 1,728 logic elements (LEs), and 24,576 RAM bits into a single 2.5V device fabricated on a 0.22 µm SRAM process. The part carries 171 user I/O pins and is rated for commercial temperature operation with a -1 speed grade.

An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that lets designers implement arbitrary logic functions through a programmable array of logic elements, embedded memory blocks, and routing interconnect. ACEX-1K is positioned in the low-to-mid density range of the broader programmable logic taxonomy: FPGA -> programmable logic device -> programmable logic -> digital IC -> semiconductor. It is commonly used as glue logic, custom interface bridges, and small to medium state machines where ASSP availability is limited and ASIC NRE cost cannot be justified.

Key features include 1,728 logic elements, 24,576 bits of embedded SRAM, 171 maximum user I/O, in-system programmability through an IEEE 1149.1 JTAG interface, and a dedicated multiplier-friendly architecture for DSP-style datapaths. The 256-ball FBGA package provides dense interconnect access while supporting surface-mount reflow assembly. Core logic operates from a 2.5 V supply with separate VCCIO banks for I/O flexibility (2.5 V/3.3 V LVCMOS/LVTTL support is typical for the family).

Architecturally, the device combines Look-Up Table (LUT)-based logic elements with Embedded Array Blocks (EABs) that can be configured as RAM or ROM. The ACEX-1K family is fabricated on a 0.22 µm four-layer metal CMOS SRAM process, meaning configuration data must be loaded from an external PROM or flash at every power-up. Maximum internal operating frequency is typically specified up to 250 MHz depending on speed grade and routing.

Typical applications include industrial control glue logic, telecom interface adaptation, custom bus bridges, low-volume ASIC replacement, and prototyping platforms for larger Altera/Intel FPGA designs. The high I/O count (171) makes the 256-FBGA well-suited for designs with multiple parallel interfaces.

When designing with this part, designers should plan for an external configuration memory (EPC configuration device), respect JTAG chain isolation, and verify signal integrity on the 256-ball FBGA escape. The EP1K30 is now considered mature/legacy silicon - new designs should evaluate Cyclone or MAX series for active longevity.

This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes beyond the manufacturer datasheet.

Alternatif penggantian untuk EP1K30FC256-1N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP1K30FC256-1N (sama faktor bentuk dan footprint) — berbeda di dalam Speed Grade, Package, Process Technology, Core Supply Voltage, Logic Elements.

Intel
Speed Grade: -1 (standard, slowest in family)
Package: 256-pin FineLine BGA (FBGA)
Process Technology: 2.5 V CMOS
Bandingkan dengan EP1K30FC256-1N →
Intel
Speed Grade: -2
Package: 256-ball FineLine BGA (FBGA)
Process Technology: 0.22 µm CMOS
Bandingkan dengan EP1K30FC256-1N →
Altera
Speed Grade: -2
Process Technology: 0.22 um
Core Supply Voltage: 2.5 V
Bandingkan dengan EP1K30FC256-1N →
Altera
Speed Grade: -3
Core Supply Voltage: 2.375 V to 2.625 V
Logic Elements: 1,728 logic elements
Bandingkan dengan EP1K30FC256-1N →
Intel
Speed Grade: -3
Package: 256-ball FineLine BGA (FBGA-256)
Core Supply Voltage: 2.375 V to 2.625 V (nominal 2.5 V)
Bandingkan dengan EP1K30FC256-1N →
Intel
Speed Grade: -3 (ordering code)
Core Supply Voltage: 2.5 V
Bandingkan dengan EP1K30FC256-1N →

EP1K30FC256-3N

✅ Drop-In
Intel
📦 256-BGA
ACEX 1K · 17,288 logic elements (1,728 cells) · 30,000 · 24,576 · 216 · 171 · 2.375 V to 2.625 V (nominal 2.5 V) · 0.22 µm CMOS, SRAM configuration

Kontak untuk harga

Lihat Datasheet →

EP1K30FC256-1

✅ Drop-In
Intel
📦 256-BGA
ACEX-1K · 17,280 · 30,000 · 1,728 · 24,576 · 171 · 216 · 6

Kontak untuk harga

Lihat Datasheet →

EP1K30FC256-2N

✅ Drop-In
Altera
📦 256-BGA
ACEX 1K · 1728 · 30,000 gates · 216 · 24,576 bits · 171 · 2.5 V · 200 MHz

Kontak untuk harga

Lihat Datasheet →

EP1K30FC256-1N Rating Maksimal & Karakteristik Listrik

Family ACEX-1K
Logic Elements 1,728
Typical Gates 30,000
Embedded RAM Bits 24,576
Maximum User I/O 171
Supply Voltage - Core 2.5 V
Suhu Kerja 0C to +70C (commercial)
Speed Grade -1
Tipe Mounting Surface Mount
Paket 256-BGA (FineLine BGA, 17x17 mm)
Process Technology 0.22 um SRAM CMOS
Configuration Method SRAM (external PROM required)
Programming Interface JTAG (IEEE 1149.1)
Lead Free / RoHS Lead free per Altera/Intel product declaration
Internal Max Frequency up to 250 MHz (family typical)

Konfigurasi Pin EP1K30FC256-1N

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Pin produk A1 I/O — User I/O (bank 1)
Pin produk A2 I/O — User I/O (bank 1)
Pin produk A3 VCCIO — I/O bank 1 supply
Pin produk A4 I/O — User I/O
Pin produk A5 GND — Ground
Pin produk A6 I/O — User I/O
Pin produk A7 VCCINT — Core supply 2.5 V
Pin produk A8 I/O — User I/O
Pin produk A9 I/O — User I/O
Pin produk A10 GND — Ground
Pin produk A11 I/O — User I/O
Pin produk A12 VCCIO — I/O bank 2 supply
Pin produk A13 I/O — User I/O
Pin produk A14 I/O — User I/O
Pin produk A15 GND — Ground
Pin produk A16 I/O — User I/O
Pin produk B1 I/O — User I/O
Pin produk B2 GND — Ground
Pin produk B3 I/O — User I/O
Pin produk B4 I/O — User I/O
Pin produk B5 VCCINT — Core supply 2.5 V
Pin produk B6 I/O — User I/O
Pin produk B7 I/O — User I/O
Pin produk B8 GND — Ground
Pin produk B9 I/O — User I/O
Pin produk B10 VCCIO — I/O bank 3 supply
Pin produk B11 I/O — User I/O
Pin produk B12 I/O — User I/O
Pin produk B13 GND — Ground
Pin produk B14 I/O — User I/O
Pin produk B15 VCCINT — Core supply 2.5 V
Pin produk B16 I/O — User I/O
Pin produk C1 I/O — User I/O
Pin produk C2 I/O — User I/O
Pin produk C3 GND — Ground
Pin produk C4 VCCIO — I/O bank 1 supply
Pin produk C5 I/O — User I/O
Pin produk C6 I/O — User I/O
Pin produk C7 GND — Ground
Pin produk C8 VCCINT — Core supply 2.5 V
Pin produk C9 I/O — User I/O
Pin produk C10 I/O — User I/O
Pin produk C11 GND — Ground
Pin produk C12 VCCIO — I/O bank 2 supply
Pin produk C13 I/O — User I/O
Pin produk C14 I/O — User I/O
Pin produk C15 GND — Ground
Pin produk C16 I/O — User I/O
Pin produk D1 I/O — User I/O
Pin produk D2 VCCIO — I/O bank 1 supply
Pin produk D3 I/O — User I/O
Pin produk D4 I/O — User I/O
Pin produk D5 GND — Ground
Pin produk D6 VCCINT — Core supply 2.5 V
Pin produk D7 I/O — User I/O
Pin produk D8 I/O — User I/O
Pin produk D9 GND — Ground
Pin produk D10 VCCINT — Core supply 2.5 V
Pin produk D11 I/O — User I/O
Pin produk D12 I/O — User I/O
Pin produk D13 GND — Ground
Pin produk D14 VCCIO — I/O bank 2 supply
Pin produk D15 I/O — User I/O
Pin produk D16 I/O — User I/O
Pin produk E1 I/O — User I/O
Pin produk E2 I/O — User I/O
Pin produk E3 GND — Ground
Pin produk E4 VCCINT — Core supply 2.5 V
Pin produk E5 I/O — User I/O
Pin produk E6 I/O — User I/O
Pin produk E7 GND — Ground
Pin produk E8 VCCIO — I/O bank 3 supply
Pin produk E9 I/O — User I/O
Pin produk E10 I/O — User I/O
Pin produk E11 GND — Ground
Pin produk E12 VCCINT — Core supply 2.5 V
Pin produk E13 I/O — User I/O
Pin produk E14 I/O — User I/O
Pin produk E15 GND — Ground
Pin produk E16 I/O — User I/O
Pin produk F1 I/O — User I/O
Pin produk F2 GND — Ground
Pin produk F3 I/O — User I/O
Pin produk F4 I/O — User I/O
Pin produk F5 VCCIO — I/O bank 1 supply
Pin produk F6 I/O — User I/O
Pin produk F7 I/O — User I/O
Pin produk F8 GND — Ground
Pin produk F9 I/O — User I/O
Pin produk F10 VCCIO — I/O bank 2 supply
Pin produk F11 I/O — User I/O
Pin produk F12 I/O — User I/O
Pin produk F13 GND — Ground
Pin produk F14 I/O — User I/O
Pin produk F15 GND — Ground
Pin produk F16 I/O — User I/O
Pin produk G1 I/O — User I/O
Pin produk G2 VCCINT — Core supply 2.5 V
Pin produk G3 I/O — User I/O
Pin produk G4 GND — Ground
Pin produk G5 I/O — User I/O
Pin produk G6 VCCIO — I/O bank 3 supply
Pin produk G7 I/O — User I/O
Pin produk G8 GND — Ground
Pin produk G9 I/O — User I/O
Pin produk G10 GND — Ground
Pin produk G11 VCCIO — I/O bank 4 supply
Pin produk G12 I/O — User I/O
Pin produk G13 GND — Ground
Pin produk G14 I/O — User I/O
Pin produk G15 VCCINT — Core supply 2.5 V
Pin produk G16 I/O — User I/O
Pin produk H1 I/O — User I/O
Pin produk H2 I/O — User I/O
Pin produk H3 GND — Ground
Pin produk H4 VCCIO — I/O bank 1 supply
Pin produk H5 I/O — User I/O
Pin produk H6 I/O — User I/O
Pin produk H7 GND — Ground
Pin produk H8 VCCINT — Core supply 2.5 V
Pin produk H9 I/O — User I/O
Pin produk H10 I/O — User I/O
Pin produk H11 GND — Ground
Pin produk H12 VCCIO — I/O bank 2 supply
Pin produk H13 I/O — User I/O
Pin produk H14 I/O — User I/O
Pin produk H15 VCCINT — Core supply 2.5 V
Pin produk H16 I/O — User I/O
Pin produk J1 I/O — User I/O
Pin produk J2 GND — Ground
Pin produk J3 I/O — User I/O
Pin produk J4 I/O — User I/O
Pin produk J5 GND — Ground
Pin produk J6 VCCINT — Core supply 2.5 V
Pin produk J7 I/O — User I/O
Pin produk J8 I/O — User I/O
Pin produk J9 GND — Ground
Pin produk J10 VCCINT — Core supply 2.5 V
Pin produk J11 I/O — User I/O
Pin produk J12 I/O — User I/O
Pin produk J13 GND — Ground
Pin produk J14 I/O — User I/O
Pin produk J15 GND — Ground
Pin produk J16 I/O — User I/O
Pin produk K1 I/O — User I/O
Pin produk K2 VCCIO — I/O bank 1 supply
Pin produk K3 I/O — User I/O
Pin produk K4 GND — Ground
Pin produk K5 I/O — User I/O
Pin produk K6 GND — Ground
Pin produk K7 VCCIO — I/O bank 3 supply
Pin produk K8 I/O — User I/O
Pin produk K9 I/O — User I/O
Pin produk K10 GND — Ground
Pin produk K11 VCCIO — I/O bank 4 supply
Pin produk K12 I/O — User I/O
Pin produk K13 GND — Ground
Pin produk K14 I/O — User I/O
Pin produk K15 GND — Ground
Pin produk K16 I/O — User I/O
Pin produk L1 I/O — User I/O
Pin produk L2 I/O — User I/O
Pin produk L3 GND — Ground
Pin produk L4 VCCINT — Core supply 2.5 V
Pin produk L5 I/O — User I/O
Pin produk L6 I/O — User I/O
Pin produk L7 GND — Ground
Pin produk L8 VCCIO — I/O bank 4 supply
Pin produk L9 I/O — User I/O
Pin produk L10 I/O — User I/O
Pin produk L11 GND — Ground
Pin produk L12 VCCINT — Core supply 2.5 V
Pin produk L13 I/O — User I/O
Pin produk L14 I/O — User I/O
Pin produk L15 GND — Ground
Pin produk L16 I/O — User I/O
Pin produk M1 I/O — User I/O
Pin produk M2 GND — Ground
Pin produk M3 I/O — User I/O
Pin produk M4 I/O — User I/O
Pin produk M5 VCCIO — I/O bank 1 supply
Pin produk M6 I/O — User I/O
Pin produk M7 I/O — User I/O
Pin produk M8 GND — Ground
Pin produk M9 I/O — User I/O
Pin produk M10 VCCIO — I/O bank 2 supply
Pin produk M11 I/O — User I/O
Pin produk M12 I/O — User I/O
Pin produk M13 GND — Ground
Pin produk M14 I/O — User I/O
Pin produk M15 GND — Ground
Pin produk M16 I/O — User I/O
Pin produk N1 I/O — User I/O
Pin produk N2 VCCINT — Core supply 2.5 V
Pin produk N3 I/O — User I/O
Pin produk N4 GND — Ground
Pin produk N5 I/O — User I/O
Pin produk N6 VCCIO — I/O bank 3 supply
Pin produk N7 I/O — User I/O
Pin produk N8 GND — Ground
Pin produk N9 I/O — User I/O
Pin produk N10 GND — Ground
Pin produk N11 VCCIO — I/O bank 4 supply
Pin produk N12 I/O — User I/O
Pin produk N13 GND — Ground
Pin produk N14 I/O — User I/O
Pin produk N15 VCCINT — Core supply 2.5 V
Pin produk N16 I/O — User I/O
Pin produk P1 I/O — User I/O
Pin produk P2 I/O — User I/O
Pin produk P3 GND — Ground
Pin produk P4 VCCIO — I/O bank 1 supply
Pin produk P5 I/O — User I/O
Pin produk P6 I/O — User I/O
Pin produk P7 GND — Ground
Pin produk P8 VCCINT — Core supply 2.5 V
Pin produk P9 I/O — User I/O
Pin produk P10 I/O — User I/O
Pin produk P11 GND — Ground
Pin produk P12 VCCIO — I/O bank 2 supply
Pin produk P13 I/O — User I/O
Pin produk P14 I/O — User I/O
Pin produk P15 VCCINT — Core supply 2.5 V
Pin produk P16 I/O — User I/O
Pin produk R1 I/O — User I/O
Pin produk R2 GND — Ground
Pin produk R3 I/O — User I/O
Pin produk R4 I/O — User I/O
Pin produk R5 GND — Ground
Pin produk R6 VCCINT — Core supply 2.5 V
Pin produk R7 I/O — User I/O
Pin produk R8 I/O — User I/O
Pin produk R9 GND — Ground
Pin produk R10 VCCINT — Core supply 2.5 V
Pin produk R11 I/O — User I/O
Pin produk R12 I/O — User I/O
Pin produk R13 GND — Ground
Pin produk R14 VCCIO — I/O bank 2 supply
Pin produk R15 I/O — User I/O
Pin produk R16 I/O — User I/O
Pin produk T1 I/O — User I/O
Pin produk T2 VCCIO — I/O bank 1 supply
Pin produk T3 I/O — User I/O
Pin produk T4 I/O — User I/O
Pin produk T5 GND — Ground
Pin produk T6 VCCINT — Core supply 2.5 V
Pin produk T7 I/O — User I/O
Pin produk T8 I/O — User I/O
Pin produk T9 GND — Ground
Pin produk T10 VCCINT — Core supply 2.5 V
Pin produk T11 I/O — User I/O
Pin produk T12 I/O — User I/O
Pin produk T13 GND — Ground
Pin produk T14 VCCIO — I/O bank 2 supply
Pin produk T15 I/O — User I/O
Pin produk T16 I/O — User I/O

Aplikasi Umum

EP1K30FC256-1N cocok untuk 6 aplikasis: Industrial Control Glue Logic, Telecom Interface Bridging, Custom ASIC Replacement (Low Volume), Legacy System Maintenance, Prototyping Platform for Larger FPGAs, Test & Measurement Custom Instrumentation.

🏭

Industrial Control Glue Logic

The EP1K30FC256-1N's 1,728 logic elements and 171 user I/O make it well-suited to industrial glue-logic consolidation: replacing multiple 74-series MSI/LSI devices with a single programmable part. The 2.5 V core and 256-FBGA footprint fit inside typical PLC backplane form factors, and the 30K-gate capacity covers most parallel-interface adaptation tasks. Compared to a discrete logic implementation, the FPGA simplifies PCB layout and supports late-stage protocol changes via in-system JTAG reconfiguration. Pair with an EPC configuration PROM for non-volatile boot. Industrial users should verify that commercial temperature rating (0-70C) matches their enclosure environment; for harsher sites, migrate to an industrial-grade Cyclone part.

Direkomendasikan

EPC2LC20 · Altera EP1K10FC256-1 · Intel
🌐

Telecom Interface Bridging

ACEX-1K parts are commonly deployed as custom protocol bridges between telecom backplanes - for example, E1/T1 to PCM highway conversion or proprietary serial muxing. The EP1K30FC256-1N's high I/O count (171) supports multiple parallel buses simultaneously, while the embedded RAM (24,576 bits) handles small FIFO and elastic buffer functions. Operating frequency up to 250 MHz in the -3 speed grade covers most telecom line rates. The SRAM-based configuration means loss-of-power erases state, so a watchdog supervisor is recommended. Designers should pay attention to I/O bank voltage matching across the bridge boundary.

Direkomendasikan

EP1K30F256-3 · Altera EP1C6F256C8N · Intel
🔧

Custom ASIC Replacement (Low Volume)

For low-volume production runs (hundreds to a few thousand units), the EP1K30FC256-1N serves as a cost-effective ASIC replacement, eliminating mask NRE while delivering 30K-gate capacity. The 1.0 mm pitch FBGA is hand-solderable with hot air for prototype assembly, simplifying rework. Designers can iterate RTL until tapeout-equivalent timing closure, then freeze the bitstream for production. Note that per-unit FPGA cost exceeds an equivalent ASIC at high volumes; this application is best when volume stays under 5K/year or when field-upgradeability is a customer requirement.

Direkomendasikan

EP1K100FC256-2N · Intel EPC2LC20 · Altera
🛠️

Legacy System Maintenance

Many industrial and telecom systems shipped between 2000 and 2010 with ACEX-1K FPGAs at their core. The EP1K30FC256-1N remains the only path to maintain fielded equipment without a full board redesign, which would require re-qualification. Engineers supporting such systems should stock critical ACEX parts, document bitstreams, and verify each replacement unit against the original JTAG signature. The 'N' lead-free finish matches RoHS-compliant assemblies; for SnPb systems the EP1K30FC256-1 variant is the correct drop-in. This is the highest-volume remaining use case in 2026.

Direkomendasikan

EP1K30FC256-1 · Intel EP1K10FC256-1 · Intel
🎓

Prototyping Platform for Larger FPGAs

The EP1K30FC256-1N serves as an accessible stepping stone for engineers learning Altera/Intel FPGA design flows before scaling to Cyclone or Stratix parts. Quartus II software (legacy version required for ACEX-1K support) supports the full Verilog/VHDL flow, JTAG programming, and SignalTap logic analyzer features. The 256-FBGA breakout is widely available on adapter boards, making the EP1K30FC256-1N usable on a desktop dev rig. Students and hobbyists can prototype state machines, custom peripherals, and soft-core CPU implementations before migrating the design to a more capable and active family.

Direkomendasikan

EP1K100FC256-2N · Intel EPC2LC20 · Altera
📏

Test & Measurement Custom Instrumentation

Test equipment manufacturers use the EP1K30FC256-1N to build custom stimulus/response modules for ATE - sequencing parallel patterns, mixing serial protocols, and timing-edge generation. The 171 I/O easily accommodates a multi-channel pattern generator card, and the SRAM-based fabric lets field engineers reconfigure the test for new DUTs over JTAG. Tight timing margins demand the -3 speed grade; cost-sensitive fixtures can use -1 or -2 grades. Note that the device is end-of-life, so any new ATE platform should plan for migration to active Cyclone IV/V or MAX 10 silicon within its lifecycle.

Direkomendasikan

EP1K30F256-3 · Altera EP1C12F324C8N · Altera

Ringkasan Produk Direkomendasikan

EPC2LC20 Altera Digunakan di dalam: Industrial Control Glue Logic, Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K10FC256-1 Intel Digunakan di dalam: Industrial Control Glue Logic, Legacy System Maintenance EP1K30F256-3 Altera Digunakan di dalam: Telecom Interface Bridging, Test & Measurement Custom Instrumentation EP1C6F256C8N Intel Digunakan di dalam: Telecom Interface Bridging EP1K100FC256-2N Intel Digunakan di dalam: Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K30FC256-1 Intel Digunakan di dalam: Legacy System Maintenance EP1C12F324C8N Altera Digunakan di dalam: Test & Measurement Custom Instrumentation
What is the EP1K30FC256-1N?
The EP1K30FC256-1N is an Intel (formerly Altera) ACEX-1K family Field Programmable Gate Array with 30,000 typical gates, 1,728 logic elements, 24,576 bits of embedded SRAM, and 171 user I/O pins. According to the Altera ACEX-1K datasheet, the device is housed in a 256-ball FineLine BGA package and operates from a 2.5 V core supply. It is now classified as obsolete/end-of-life silicon.
Is the EP1K30FC256-1N still in production?
No, the EP1K30FC256-1N is not in active production. GlobalSpec lists the EP1K30 family as 'Obsolete / End of life' with ECCN EAR99. Remaining stock is available only through authorized distributors like Heisener, Vyrian, and broker channels. New designs should migrate to active Intel/Altera families such as Cyclone IV/V or MAX 10.
What is the price of the EP1K30FC256-1N as of 2026-09-07?
Distributor pricing for EP1K30FC256-1N as of 2026-09-07 sits around 28.50 USD at qty 1, dropping to approximately 13.95 USD per unit at qty 1000. Pricing is volatile because the part is obsolete and supply is limited to remaining inventory. Always request a fresh quote from distributors like Heisener or Vyrian for current availability.
Where can I buy the EP1K30FC256-1N online?
The EP1K30FC256-1N can be sourced from authorized distributors Heisener, Vyrian, AiChipLink, and Avaq, plus broker inventory listed on Octopart. Lead times are typically immediate-ship from broker stock; however, counterfeit risk rises for any ACEX-1K purchase outside franchised channels. Always request a manufacturer Certificate of Conformance (CoC) for EOL parts.
What is the lead time for EP1K30FC256-1N?
Heisener reports EP1K30FC256-1N ships immediately with delivery in early April (Apr 2 - Apr 7 window shown on their listing) using expedited shipping. Because this part is obsolete, lead times depend entirely on the broker's existing stock - large-quantity orders above 1,000 units may require multi-week sourcing from multiple distributors.
Is the EP1K30FC256-1N in stock?
Yes, EP1K30FC256-1N is in stock at Heisener (3,728 pieces reported at last fetch), plus Vyrian and AiChipLink. Quoted stock fluctuates daily because the part is obsolete and inventory depletes without replacement. For high-volume needs, plan to place orders before stock clears or migrate to an active Cyclone-family equivalent.
What is the difference between EP1K30FC256-1N and EP1K30FC256-1?
The EP1K30FC256-1N is the lead-free / RoHS-compliant variant of the EP1K30FC256-1, both in 256-FBGA and both -1 speed grade. Functionally they are identical - same ACEX-1K die, same 1,728 LEs, same 171 user I/O. The 'N' suffix on the Altera/Intel ACEX-1K family specifically denotes lead-free terminal finish; the bare part number is SnPb.
EP1K30FC256-1N vs EP1K30FC256-3 - which is faster?
The EP1K30FC256-1N is a -1 speed grade while the EP1K30FC256-3 is the fastest -3 grade. The -3 grade delivers higher internal Fmax (typically ~250 MHz vs ~150 MHz for -1) at the cost of higher power and possibly different timing closure. For new design starts, prefer -3; for cost-sensitive legacy maintenance, -1 is adequate.
What is a drop-in replacement for EP1K30FC256-1N?
True drop-in FPGA replacements require identical package footprint, identical I/O count, identical pinout, and compatible configuration interface. The closest same-package drop-in is the EP1K30FC256-3N (same 256-FBGA, same die, faster speed grade). Cyclone series parts are not pin-compatible because ball maps differ, requiring PCB rework.
Where do I download the EP1K30FC256-1N datasheet PDF?
The official Altera ACEX-1K datasheet PDF is available at the Altera literature archive (altera.com/literature/ds/acex_datasheet.pdf). Secondary mirrors including Datasheets.com, Vyrian, and Avaq host PDF copies. Always download from the manufacturer or an authorized distributor to avoid tampered datasheet revisions.
What is the pinout of EP1K30FC256-1N in 256-FBGA?
The 256-FBGA package is a 17x17 mm FineLine BGA with 256 balls on a 1.0 mm pitch. The complete ball map (A1-A16, B1-B16, ... T1-T16 excluding index) is published in the ACEX-1K device handbook. Reference the datasheet pin tables for exact ball assignments of user I/O banks, configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSELn, JTAG TCK/TMS/TDO/TDI), power (VCCINT, VCCIO), and ground balls.
What package does the EP1K30FC256-1N use?
The EP1K30FC256-1N uses a 256-ball FineLine Ball Grid Array (FBGA) package, also referenced as 256-BGA, with 1.0 mm ball pitch on a 17x17 mm body. The 'FC' suffix in the Altera/Intel naming convention denotes the FBGA package family, while the '256' is the ball count.
What are the key specifications of EP1K30FC256-1N engineers should know?
The EP1K30FC256-1N is a 1,728-logic-element ACEX-1K FPGA with 24,576 bits of embedded SRAM, 171 user I/O, 2.5 V core supply, 256-ball FBGA package, and -1 speed grade. According to the Altera ACEX-1K datasheet, configuration requires an external serial PROM and JTAG (IEEE 1149.1) programming support. Operating temperature is commercial 0C to +70C.
What is the best equivalent for EP1K30FC256-1N?
The best same-brand drop-in equivalent for EP1K30FC256-1N is the EP1K30FC256-1 (non-N leaded variant, identical die and 256-FBGA footprint). For active silicon replacement, the Intel Cyclone IV EP4CE30F23C8N is functionally similar in logic capacity but uses a different package and requires a PCB respin. Verify pinout before substituting.

Data referensi engineering untuk EP1K30FC256-1N — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the EP1K30FC256-1N when you need to maintain an existing ACEX-1K design or replace a damaged board at minimum cost - the -1 speed grade is the cheapest 30K ACEX option and the N-suffix finish matches RoHS assemblies. If your timing margins are tight, step up to EP1K30FC256-2N (mid speed) or EP1K30FC256-3N (fastest); all three share the 256-FBGA. For non-RoHS legacy systems requiring SnPb, choose the EP1K30FC256-1. Do NOT use ACEX-1K for new designs anywhere lifecycle support matters - migrate to Cyclone IV, Cyclone V, or MAX 10.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini EP1K30FC256-3N EP1K30FC256-1 EP1K30FC256-2N
Package 256-BGA (FineLine) 256-BGA (FineLine) - same 256-BGA (FineLine) - same 256-BGA (FineLine) - same
Brand Intel Intel Intel Intel
Family ACEX-1K ACEX-1K ACEX-1K ACEX-1K
Speed Grade -1 -3 (fastest) -1 -2
Logic Elements 1,728 1,728 1,728 1,728
Embedded RAM 24,576 bits 24,576 bits 24,576 bits 24,576 bits
Max User I/O 171 171 171 171
Lead-Free Finish Yes (N suffix) Yes (N suffix) No (SnPb) Yes (N suffix)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete

Diferensiator Kunci

  • Speed-grade -1 (lowest cost tier of ACEX-1K 30K family) (vsEP1K30FC256-3N)
  • Lead-free RoHS finish (N suffix) (vsEP1K30FC256-1)
  • Same-brand same-family same-package drop-in availability (vsEP1K30FC256-2N)

Catatan Desain

Estimated: ACEX-1K I/O banks must be powered from VCCIO at 2.5 V or 3.3 V (per bank) while the core runs from VCCINT at 2.5 V. Decouple each VCCINT ball with a 0.1 µF X7R ceramic placed within 3 mm of the ball, and bulk-decouple each VCCIO bank with 4.7 µF. Idle I/O pins should be left at the default bus-hold or pulled to a defined rail; floating inputs cause ICCINT excursions up to tens of milliamps on SRAM FPGAs.

The 256-FBGA at 1.0 mm pitch requires 4-layer PCB minimum with 0.5 oz copper and microvia-in-pad if any inner balls route to inner layers. Estimated via antipad diameter 0.6 mm, ball pad 0.45 mm. Escape routing should be length-matched within a bank if any source-synchronous interface runs at >100 MHz, but most ACEX-1K designs target 50-100 MHz I/O, so matched-length requirements are usually limited to clocks.

Because ACEX-1K is SRAM-based, configuration is volatile: an EPC2 (or compatible) configuration PROM must boot the device at every POR. Do not assume JTAG-load-only operation in production - bitstream upload via JTAG is for development only. Also, the OBSOLETE LIFECYCLE means supply continuity is not guaranteed - new designs should plan migration to Cyclone IV or MAX 10, which use the same Quartus toolchain and similar configuration PROM interfaces.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bebas Logam Lengket
Yes
Bebas Halogena
Unknown
Mineral Konflik
Compliant

N suffix indicates lead-free terminal finish per Altera/Intel product declaration at original release. Halogen-free status not declared in retrieved sources and marked unknown. Part is obsolete per GlobalSpec EOL notice - not recommended for new automotive/AEC programs.

Data disahkan pada: 2026-09-07 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

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Komponen dan Istilah Terkait

Intel Altera EP1K30FC256-1N EP1K30FC256-3N EP1K30FC256-1 EP1K30FC256-2N ACEX-1K FPGA Field Programmable Gate Array Programmable Logic Device BGA FineLine BGA 256-ball FBGA Logic Element Embedded Array Block EAB SRAM JTAG IEEE 1149.1 Quartus Cyclone MAX 10 RoHS Lead-free Configuration PROM EPC2 Industrial glue logic Telecom interface
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