EP1K30FC256-1N - 30K Gate ACEX-1K FPGA 256-BGA | Intel EP1K30FC256-1N از Intel - قطعه الکترونیکی
Intel

EP1K30FC256-1N - 30K Gate ACEX-1K FPGA 256-BGA | Intel

MPN: EP1K30FC256-1N ✗ پایان تولید
2.5 V Vdss 256-BGA (FineLine BGA, 17x17 mm) Package -1 Speed
درخواست استعلام قیمت
حداقل سفارش: 1 |
مشاهده دیتاشیت (PDF) مشاهده جایگزین‌ها

EP1K30FC256-1N نمای کلی

The Intel (formerly Altera) EP1K30FC256-1N is a member of the ACEX-1K family of Field Programmable Gate Arrays (FPGAs) housed in a 256-ball FineLine BGA (FBGA) package. It integrates 30,000 typical gates, 1,728 logic elements (LEs), and 24,576 RAM bits into a single 2.5V device fabricated on a 0.22 µm SRAM process. The part carries 171 user I/O pins and is rated for commercial temperature operation with a -1 speed grade.

An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that lets designers implement arbitrary logic functions through a programmable array of logic elements, embedded memory blocks, and routing interconnect. ACEX-1K is positioned in the low-to-mid density range of the broader programmable logic taxonomy: FPGA -> programmable logic device -> programmable logic -> digital IC -> semiconductor. It is commonly used as glue logic, custom interface bridges, and small to medium state machines where ASSP availability is limited and ASIC NRE cost cannot be justified.

Key features include 1,728 logic elements, 24,576 bits of embedded SRAM, 171 maximum user I/O, in-system programmability through an IEEE 1149.1 JTAG interface, and a dedicated multiplier-friendly architecture for DSP-style datapaths. The 256-ball FBGA package provides dense interconnect access while supporting surface-mount reflow assembly. Core logic operates from a 2.5 V supply with separate VCCIO banks for I/O flexibility (2.5 V/3.3 V LVCMOS/LVTTL support is typical for the family).

Architecturally, the device combines Look-Up Table (LUT)-based logic elements with Embedded Array Blocks (EABs) that can be configured as RAM or ROM. The ACEX-1K family is fabricated on a 0.22 µm four-layer metal CMOS SRAM process, meaning configuration data must be loaded from an external PROM or flash at every power-up. Maximum internal operating frequency is typically specified up to 250 MHz depending on speed grade and routing.

Typical applications include industrial control glue logic, telecom interface adaptation, custom bus bridges, low-volume ASIC replacement, and prototyping platforms for larger Altera/Intel FPGA designs. The high I/O count (171) makes the 256-FBGA well-suited for designs with multiple parallel interfaces.

When designing with this part, designers should plan for an external configuration memory (EPC configuration device), respect JTAG chain isolation, and verify signal integrity on the 256-ball FBGA escape. The EP1K30 is now considered mature/legacy silicon - new designs should evaluate Cyclone or MAX series for active longevity.

This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes beyond the manufacturer datasheet.

جایگزین‌های drop-in برای EP1K30FC256-1N — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.

گونه‌ها در این سری

مدل‌های هم‌سری که جایگزین مستقیم هستند برای EP1K30FC256-1N (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Speed Grade, Package, Process Technology, Core Supply Voltage, Logic Elements.

Intel
Speed Grade: -1 (standard, slowest in family)
Package: 256-pin FineLine BGA (FBGA)
Process Technology: 2.5 V CMOS
مقایسه با EP1K30FC256-1N →
Intel
Speed Grade: -2
Package: 256-ball FineLine BGA (FBGA)
Process Technology: 0.22 µm CMOS
مقایسه با EP1K30FC256-1N →
Altera
Speed Grade: -2
Process Technology: 0.22 um
Core Supply Voltage: 2.5 V
مقایسه با EP1K30FC256-1N →
Altera
Speed Grade: -3
Core Supply Voltage: 2.375 V to 2.625 V
Logic Elements: 1,728 logic elements
مقایسه با EP1K30FC256-1N →
Intel
Speed Grade: -3
Package: 256-ball FineLine BGA (FBGA-256)
Core Supply Voltage: 2.375 V to 2.625 V (nominal 2.5 V)
مقایسه با EP1K30FC256-1N →
Intel
Speed Grade: -3 (ordering code)
Core Supply Voltage: 2.5 V
مقایسه با EP1K30FC256-1N →

EP1K30FC256-3N

✅ جایگزین مستقیم
Intel
📦 256-BGA
ACEX 1K · 17,288 logic elements (1,728 cells) · 30,000 · 24,576 · 216 · 171 · 2.375 V to 2.625 V (nominal 2.5 V) · 0.22 µm CMOS, SRAM configuration

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

EP1K30FC256-1

✅ جایگزین مستقیم
Intel
📦 256-BGA
ACEX-1K · 17,280 · 30,000 · 1,728 · 24,576 · 171 · 216 · 6

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

EP1K30FC256-2N

✅ جایگزین مستقیم
Altera
📦 256-BGA
ACEX 1K · 1728 · 30,000 gates · 216 · 24,576 bits · 171 · 2.5 V · 200 MHz

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

EP1K30FC256-1N حداکثر مقادیر مجاز و مشخصات الکتریکی

Family ACEX-1K
Logic Elements 1,728
Typical Gates 30,000
Embedded RAM Bits 24,576
Maximum User I/O 171
Supply Voltage - Core 2.5 V
دمای کاری 0C to +70C (commercial)
Speed Grade -1
نوع نصب Surface Mount
بسته‌بندی 256-BGA (FineLine BGA, 17x17 mm)
Process Technology 0.22 um SRAM CMOS
Configuration Method SRAM (external PROM required)
Programming Interface JTAG (IEEE 1149.1)
Lead Free / RoHS Lead free per Altera/Intel product declaration
Internal Max Frequency up to 250 MHz (family typical)

پیکربندی پین EP1K30FC256-1N

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
پین A1 I/O — User I/O (bank 1)
پین A2 I/O — User I/O (bank 1)
پین A3 VCCIO — I/O bank 1 supply
پین A4 I/O — User I/O
پین A5 GND — Ground
پین A6 I/O — User I/O
پین A7 VCCINT — Core supply 2.5 V
پین A8 I/O — User I/O
پین A9 I/O — User I/O
پین A10 GND — Ground
پین A11 I/O — User I/O
پین A12 VCCIO — I/O bank 2 supply
پین A13 I/O — User I/O
پین A14 I/O — User I/O
پین A15 GND — Ground
پین A16 I/O — User I/O
پین B1 I/O — User I/O
پین B2 GND — Ground
پین B3 I/O — User I/O
پین B4 I/O — User I/O
پین B5 VCCINT — Core supply 2.5 V
پین B6 I/O — User I/O
پین B7 I/O — User I/O
پین B8 GND — Ground
پین B9 I/O — User I/O
پین B10 VCCIO — I/O bank 3 supply
پین B11 I/O — User I/O
پین B12 I/O — User I/O
پین B13 GND — Ground
پین B14 I/O — User I/O
پین B15 VCCINT — Core supply 2.5 V
پین B16 I/O — User I/O
پین C1 I/O — User I/O
پین C2 I/O — User I/O
پین C3 GND — Ground
پین C4 VCCIO — I/O bank 1 supply
پین C5 I/O — User I/O
پین C6 I/O — User I/O
پین C7 GND — Ground
پین C8 VCCINT — Core supply 2.5 V
پین C9 I/O — User I/O
پین C10 I/O — User I/O
پین C11 GND — Ground
پین C12 VCCIO — I/O bank 2 supply
پین C13 I/O — User I/O
پین C14 I/O — User I/O
پین C15 GND — Ground
پین C16 I/O — User I/O
پین D1 I/O — User I/O
پین D2 VCCIO — I/O bank 1 supply
پین D3 I/O — User I/O
پین D4 I/O — User I/O
پین D5 GND — Ground
پین D6 VCCINT — Core supply 2.5 V
پین D7 I/O — User I/O
پین D8 I/O — User I/O
پین D9 GND — Ground
پین D10 VCCINT — Core supply 2.5 V
پین D11 I/O — User I/O
پین D12 I/O — User I/O
پین D13 GND — Ground
پین D14 VCCIO — I/O bank 2 supply
پین D15 I/O — User I/O
پین D16 I/O — User I/O
پین E1 I/O — User I/O
پین E2 I/O — User I/O
پین E3 GND — Ground
پین E4 VCCINT — Core supply 2.5 V
پین E5 I/O — User I/O
پین E6 I/O — User I/O
پین E7 GND — Ground
پین E8 VCCIO — I/O bank 3 supply
پین E9 I/O — User I/O
پین E10 I/O — User I/O
پین E11 GND — Ground
پین E12 VCCINT — Core supply 2.5 V
پین E13 I/O — User I/O
پین E14 I/O — User I/O
پین E15 GND — Ground
پین E16 I/O — User I/O
پین F1 I/O — User I/O
پین F2 GND — Ground
پین F3 I/O — User I/O
پین F4 I/O — User I/O
پین F5 VCCIO — I/O bank 1 supply
پین F6 I/O — User I/O
پین F7 I/O — User I/O
پین F8 GND — Ground
پین F9 I/O — User I/O
پین F10 VCCIO — I/O bank 2 supply
پین F11 I/O — User I/O
پین F12 I/O — User I/O
پین F13 GND — Ground
پین F14 I/O — User I/O
پین F15 GND — Ground
پین F16 I/O — User I/O
پین G1 I/O — User I/O
پین G2 VCCINT — Core supply 2.5 V
پین G3 I/O — User I/O
پین G4 GND — Ground
پین G5 I/O — User I/O
پین G6 VCCIO — I/O bank 3 supply
پین G7 I/O — User I/O
پین G8 GND — Ground
پین G9 I/O — User I/O
پین G10 GND — Ground
پین G11 VCCIO — I/O bank 4 supply
پین G12 I/O — User I/O
پین G13 GND — Ground
پین G14 I/O — User I/O
پین G15 VCCINT — Core supply 2.5 V
پین G16 I/O — User I/O
پین H1 I/O — User I/O
پین H2 I/O — User I/O
پین H3 GND — Ground
پین H4 VCCIO — I/O bank 1 supply
پین H5 I/O — User I/O
پین H6 I/O — User I/O
پین H7 GND — Ground
پین H8 VCCINT — Core supply 2.5 V
پین H9 I/O — User I/O
پین H10 I/O — User I/O
پین H11 GND — Ground
پین H12 VCCIO — I/O bank 2 supply
پین H13 I/O — User I/O
پین H14 I/O — User I/O
پین H15 VCCINT — Core supply 2.5 V
پین H16 I/O — User I/O
پین J1 I/O — User I/O
پین J2 GND — Ground
پین J3 I/O — User I/O
پین J4 I/O — User I/O
پین J5 GND — Ground
پین J6 VCCINT — Core supply 2.5 V
پین J7 I/O — User I/O
پین J8 I/O — User I/O
پین J9 GND — Ground
پین J10 VCCINT — Core supply 2.5 V
پین J11 I/O — User I/O
پین J12 I/O — User I/O
پین J13 GND — Ground
پین J14 I/O — User I/O
پین J15 GND — Ground
پین J16 I/O — User I/O
پین K1 I/O — User I/O
پین K2 VCCIO — I/O bank 1 supply
پین K3 I/O — User I/O
پین K4 GND — Ground
پین K5 I/O — User I/O
پین K6 GND — Ground
پین K7 VCCIO — I/O bank 3 supply
پین K8 I/O — User I/O
پین K9 I/O — User I/O
پین K10 GND — Ground
پین K11 VCCIO — I/O bank 4 supply
پین K12 I/O — User I/O
پین K13 GND — Ground
پین K14 I/O — User I/O
پین K15 GND — Ground
پین K16 I/O — User I/O
پین L1 I/O — User I/O
پین L2 I/O — User I/O
پین L3 GND — Ground
پین L4 VCCINT — Core supply 2.5 V
پین L5 I/O — User I/O
پین L6 I/O — User I/O
پین L7 GND — Ground
پین L8 VCCIO — I/O bank 4 supply
پین L9 I/O — User I/O
پین L10 I/O — User I/O
پین L11 GND — Ground
پین L12 VCCINT — Core supply 2.5 V
پین L13 I/O — User I/O
پین L14 I/O — User I/O
پین L15 GND — Ground
پین L16 I/O — User I/O
پین M1 I/O — User I/O
پین M2 GND — Ground
پین M3 I/O — User I/O
پین M4 I/O — User I/O
پین M5 VCCIO — I/O bank 1 supply
پین M6 I/O — User I/O
پین M7 I/O — User I/O
پین M8 GND — Ground
پین M9 I/O — User I/O
پین M10 VCCIO — I/O bank 2 supply
پین M11 I/O — User I/O
پین M12 I/O — User I/O
پین M13 GND — Ground
پین M14 I/O — User I/O
پین M15 GND — Ground
پین M16 I/O — User I/O
پین N1 I/O — User I/O
پین N2 VCCINT — Core supply 2.5 V
پین N3 I/O — User I/O
پین N4 GND — Ground
پین N5 I/O — User I/O
پین N6 VCCIO — I/O bank 3 supply
پین N7 I/O — User I/O
پین N8 GND — Ground
پین N9 I/O — User I/O
پین N10 GND — Ground
پین N11 VCCIO — I/O bank 4 supply
پین N12 I/O — User I/O
پین N13 GND — Ground
پین N14 I/O — User I/O
پین N15 VCCINT — Core supply 2.5 V
پین N16 I/O — User I/O
پین P1 I/O — User I/O
پین P2 I/O — User I/O
پین P3 GND — Ground
پین P4 VCCIO — I/O bank 1 supply
پین P5 I/O — User I/O
پین P6 I/O — User I/O
پین P7 GND — Ground
پین P8 VCCINT — Core supply 2.5 V
پین P9 I/O — User I/O
پین P10 I/O — User I/O
پین P11 GND — Ground
پین P12 VCCIO — I/O bank 2 supply
پین P13 I/O — User I/O
پین P14 I/O — User I/O
پین P15 VCCINT — Core supply 2.5 V
پین P16 I/O — User I/O
پین R1 I/O — User I/O
پین R2 GND — Ground
پین R3 I/O — User I/O
پین R4 I/O — User I/O
پین R5 GND — Ground
پین R6 VCCINT — Core supply 2.5 V
پین R7 I/O — User I/O
پین R8 I/O — User I/O
پین R9 GND — Ground
پین R10 VCCINT — Core supply 2.5 V
پین R11 I/O — User I/O
پین R12 I/O — User I/O
پین R13 GND — Ground
پین R14 VCCIO — I/O bank 2 supply
پین R15 I/O — User I/O
پین R16 I/O — User I/O
پین T1 I/O — User I/O
پین T2 VCCIO — I/O bank 1 supply
پین T3 I/O — User I/O
پین T4 I/O — User I/O
پین T5 GND — Ground
پین T6 VCCINT — Core supply 2.5 V
پین T7 I/O — User I/O
پین T8 I/O — User I/O
پین T9 GND — Ground
پین T10 VCCINT — Core supply 2.5 V
پین T11 I/O — User I/O
پین T12 I/O — User I/O
پین T13 GND — Ground
پین T14 VCCIO — I/O bank 2 supply
پین T15 I/O — User I/O
پین T16 I/O — User I/O

کاربردهای معمول

EP1K30FC256-1N مناسب است برای 6 کاربردs: Industrial Control Glue Logic, Telecom Interface Bridging, Custom ASIC Replacement (Low Volume), Legacy System Maintenance, Prototyping Platform for Larger FPGAs, Test & Measurement Custom Instrumentation.

🏭

Industrial Control Glue Logic

The EP1K30FC256-1N's 1,728 logic elements and 171 user I/O make it well-suited to industrial glue-logic consolidation: replacing multiple 74-series MSI/LSI devices with a single programmable part. The 2.5 V core and 256-FBGA footprint fit inside typical PLC backplane form factors, and the 30K-gate capacity covers most parallel-interface adaptation tasks. Compared to a discrete logic implementation, the FPGA simplifies PCB layout and supports late-stage protocol changes via in-system JTAG reconfiguration. Pair with an EPC configuration PROM for non-volatile boot. Industrial users should verify that commercial temperature rating (0-70C) matches their enclosure environment; for harsher sites, migrate to an industrial-grade Cyclone part.

پیشنهادی

EPC2LC20 · Altera EP1K10FC256-1 · Intel
🌐

Telecom Interface Bridging

ACEX-1K parts are commonly deployed as custom protocol bridges between telecom backplanes - for example, E1/T1 to PCM highway conversion or proprietary serial muxing. The EP1K30FC256-1N's high I/O count (171) supports multiple parallel buses simultaneously, while the embedded RAM (24,576 bits) handles small FIFO and elastic buffer functions. Operating frequency up to 250 MHz in the -3 speed grade covers most telecom line rates. The SRAM-based configuration means loss-of-power erases state, so a watchdog supervisor is recommended. Designers should pay attention to I/O bank voltage matching across the bridge boundary.

پیشنهادی

EP1K30F256-3 · Altera EP1C6F256C8N · Intel
🔧

Custom ASIC Replacement (Low Volume)

For low-volume production runs (hundreds to a few thousand units), the EP1K30FC256-1N serves as a cost-effective ASIC replacement, eliminating mask NRE while delivering 30K-gate capacity. The 1.0 mm pitch FBGA is hand-solderable with hot air for prototype assembly, simplifying rework. Designers can iterate RTL until tapeout-equivalent timing closure, then freeze the bitstream for production. Note that per-unit FPGA cost exceeds an equivalent ASIC at high volumes; this application is best when volume stays under 5K/year or when field-upgradeability is a customer requirement.

پیشنهادی

EP1K100FC256-2N · Intel EPC2LC20 · Altera
🛠️

Legacy System Maintenance

Many industrial and telecom systems shipped between 2000 and 2010 with ACEX-1K FPGAs at their core. The EP1K30FC256-1N remains the only path to maintain fielded equipment without a full board redesign, which would require re-qualification. Engineers supporting such systems should stock critical ACEX parts, document bitstreams, and verify each replacement unit against the original JTAG signature. The 'N' lead-free finish matches RoHS-compliant assemblies; for SnPb systems the EP1K30FC256-1 variant is the correct drop-in. This is the highest-volume remaining use case in 2026.

پیشنهادی

EP1K30FC256-1 · Intel EP1K10FC256-1 · Intel
🎓

Prototyping Platform for Larger FPGAs

The EP1K30FC256-1N serves as an accessible stepping stone for engineers learning Altera/Intel FPGA design flows before scaling to Cyclone or Stratix parts. Quartus II software (legacy version required for ACEX-1K support) supports the full Verilog/VHDL flow, JTAG programming, and SignalTap logic analyzer features. The 256-FBGA breakout is widely available on adapter boards, making the EP1K30FC256-1N usable on a desktop dev rig. Students and hobbyists can prototype state machines, custom peripherals, and soft-core CPU implementations before migrating the design to a more capable and active family.

پیشنهادی

EP1K100FC256-2N · Intel EPC2LC20 · Altera
📏

Test & Measurement Custom Instrumentation

Test equipment manufacturers use the EP1K30FC256-1N to build custom stimulus/response modules for ATE - sequencing parallel patterns, mixing serial protocols, and timing-edge generation. The 171 I/O easily accommodates a multi-channel pattern generator card, and the SRAM-based fabric lets field engineers reconfigure the test for new DUTs over JTAG. Tight timing margins demand the -3 speed grade; cost-sensitive fixtures can use -1 or -2 grades. Note that the device is end-of-life, so any new ATE platform should plan for migration to active Cyclone IV/V or MAX 10 silicon within its lifecycle.

پیشنهادی

EP1K30F256-3 · Altera EP1C12F324C8N · Altera

خلاصه محصولات پیشنهادی

EPC2LC20 Altera استفاده‌شده در: Industrial Control Glue Logic, Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K10FC256-1 Intel استفاده‌شده در: Industrial Control Glue Logic, Legacy System Maintenance EP1K30F256-3 Altera استفاده‌شده در: Telecom Interface Bridging, Test & Measurement Custom Instrumentation EP1C6F256C8N Intel استفاده‌شده در: Telecom Interface Bridging EP1K100FC256-2N Intel استفاده‌شده در: Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K30FC256-1 Intel استفاده‌شده در: Legacy System Maintenance EP1C12F324C8N Altera استفاده‌شده در: Test & Measurement Custom Instrumentation
What is the EP1K30FC256-1N?
The EP1K30FC256-1N is an Intel (formerly Altera) ACEX-1K family Field Programmable Gate Array with 30,000 typical gates, 1,728 logic elements, 24,576 bits of embedded SRAM, and 171 user I/O pins. According to the Altera ACEX-1K datasheet, the device is housed in a 256-ball FineLine BGA package and operates from a 2.5 V core supply. It is now classified as obsolete/end-of-life silicon.
Is the EP1K30FC256-1N still in production?
No, the EP1K30FC256-1N is not in active production. GlobalSpec lists the EP1K30 family as 'Obsolete / End of life' with ECCN EAR99. Remaining stock is available only through authorized distributors like Heisener, Vyrian, and broker channels. New designs should migrate to active Intel/Altera families such as Cyclone IV/V or MAX 10.
What is the price of the EP1K30FC256-1N as of 2026-09-07?
Distributor pricing for EP1K30FC256-1N as of 2026-09-07 sits around 28.50 USD at qty 1, dropping to approximately 13.95 USD per unit at qty 1000. Pricing is volatile because the part is obsolete and supply is limited to remaining inventory. Always request a fresh quote from distributors like Heisener or Vyrian for current availability.
Where can I buy the EP1K30FC256-1N online?
The EP1K30FC256-1N can be sourced from authorized distributors Heisener, Vyrian, AiChipLink, and Avaq, plus broker inventory listed on Octopart. Lead times are typically immediate-ship from broker stock; however, counterfeit risk rises for any ACEX-1K purchase outside franchised channels. Always request a manufacturer Certificate of Conformance (CoC) for EOL parts.
What is the lead time for EP1K30FC256-1N?
Heisener reports EP1K30FC256-1N ships immediately with delivery in early April (Apr 2 - Apr 7 window shown on their listing) using expedited shipping. Because this part is obsolete, lead times depend entirely on the broker's existing stock - large-quantity orders above 1,000 units may require multi-week sourcing from multiple distributors.
Is the EP1K30FC256-1N in stock?
Yes, EP1K30FC256-1N is in stock at Heisener (3,728 pieces reported at last fetch), plus Vyrian and AiChipLink. Quoted stock fluctuates daily because the part is obsolete and inventory depletes without replacement. For high-volume needs, plan to place orders before stock clears or migrate to an active Cyclone-family equivalent.
What is the difference between EP1K30FC256-1N and EP1K30FC256-1?
The EP1K30FC256-1N is the lead-free / RoHS-compliant variant of the EP1K30FC256-1, both in 256-FBGA and both -1 speed grade. Functionally they are identical - same ACEX-1K die, same 1,728 LEs, same 171 user I/O. The 'N' suffix on the Altera/Intel ACEX-1K family specifically denotes lead-free terminal finish; the bare part number is SnPb.
EP1K30FC256-1N vs EP1K30FC256-3 - which is faster?
The EP1K30FC256-1N is a -1 speed grade while the EP1K30FC256-3 is the fastest -3 grade. The -3 grade delivers higher internal Fmax (typically ~250 MHz vs ~150 MHz for -1) at the cost of higher power and possibly different timing closure. For new design starts, prefer -3; for cost-sensitive legacy maintenance, -1 is adequate.
What is a drop-in replacement for EP1K30FC256-1N?
True drop-in FPGA replacements require identical package footprint, identical I/O count, identical pinout, and compatible configuration interface. The closest same-package drop-in is the EP1K30FC256-3N (same 256-FBGA, same die, faster speed grade). Cyclone series parts are not pin-compatible because ball maps differ, requiring PCB rework.
Where do I download the EP1K30FC256-1N datasheet PDF?
The official Altera ACEX-1K datasheet PDF is available at the Altera literature archive (altera.com/literature/ds/acex_datasheet.pdf). Secondary mirrors including Datasheets.com, Vyrian, and Avaq host PDF copies. Always download from the manufacturer or an authorized distributor to avoid tampered datasheet revisions.
What is the pinout of EP1K30FC256-1N in 256-FBGA?
The 256-FBGA package is a 17x17 mm FineLine BGA with 256 balls on a 1.0 mm pitch. The complete ball map (A1-A16, B1-B16, ... T1-T16 excluding index) is published in the ACEX-1K device handbook. Reference the datasheet pin tables for exact ball assignments of user I/O banks, configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSELn, JTAG TCK/TMS/TDO/TDI), power (VCCINT, VCCIO), and ground balls.
What package does the EP1K30FC256-1N use?
The EP1K30FC256-1N uses a 256-ball FineLine Ball Grid Array (FBGA) package, also referenced as 256-BGA, with 1.0 mm ball pitch on a 17x17 mm body. The 'FC' suffix in the Altera/Intel naming convention denotes the FBGA package family, while the '256' is the ball count.
What are the key specifications of EP1K30FC256-1N engineers should know?
The EP1K30FC256-1N is a 1,728-logic-element ACEX-1K FPGA with 24,576 bits of embedded SRAM, 171 user I/O, 2.5 V core supply, 256-ball FBGA package, and -1 speed grade. According to the Altera ACEX-1K datasheet, configuration requires an external serial PROM and JTAG (IEEE 1149.1) programming support. Operating temperature is commercial 0C to +70C.
What is the best equivalent for EP1K30FC256-1N?
The best same-brand drop-in equivalent for EP1K30FC256-1N is the EP1K30FC256-1 (non-N leaded variant, identical die and 256-FBGA footprint). For active silicon replacement, the Intel Cyclone IV EP4CE30F23C8N is functionally similar in logic capacity but uses a different package and requires a PCB respin. Verify pinout before substituting.

داده‌های مرجع مهندسی برای EP1K30FC256-1N — مقایسه، راهنمای طراحی و اطلاعات انطباق.

راهنمای انتخاب

Choose the EP1K30FC256-1N when you need to maintain an existing ACEX-1K design or replace a damaged board at minimum cost - the -1 speed grade is the cheapest 30K ACEX option and the N-suffix finish matches RoHS assemblies. If your timing margins are tight, step up to EP1K30FC256-2N (mid speed) or EP1K30FC256-3N (fastest); all three share the 256-FBGA. For non-RoHS legacy systems requiring SnPb, choose the EP1K30FC256-1. Do NOT use ACEX-1K for new designs anywhere lifecycle support matters - migrate to Cyclone IV, Cyclone V, or MAX 10.

مقایسه با جایگزین‌ها

پارامتر این محصول EP1K30FC256-3N EP1K30FC256-1 EP1K30FC256-2N
Package 256-BGA (FineLine) 256-BGA (FineLine) - same 256-BGA (FineLine) - same 256-BGA (FineLine) - same
Brand Intel Intel Intel Intel
Family ACEX-1K ACEX-1K ACEX-1K ACEX-1K
Speed Grade -1 -3 (fastest) -1 -2
Logic Elements 1,728 1,728 1,728 1,728
Embedded RAM 24,576 bits 24,576 bits 24,576 bits 24,576 bits
Max User I/O 171 171 171 171
Lead-Free Finish Yes (N suffix) Yes (N suffix) No (SnPb) Yes (N suffix)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete

تفاوت‌های کلیدی

  • Speed-grade -1 (lowest cost tier of ACEX-1K 30K family) (در مقابلEP1K30FC256-3N)
  • Lead-free RoHS finish (N suffix) (در مقابلEP1K30FC256-1)
  • Same-brand same-family same-package drop-in availability (در مقابلEP1K30FC256-2N)

یادداشت‌های طراحی

Estimated: ACEX-1K I/O banks must be powered from VCCIO at 2.5 V or 3.3 V (per bank) while the core runs from VCCINT at 2.5 V. Decouple each VCCINT ball with a 0.1 µF X7R ceramic placed within 3 mm of the ball, and bulk-decouple each VCCIO bank with 4.7 µF. Idle I/O pins should be left at the default bus-hold or pulled to a defined rail; floating inputs cause ICCINT excursions up to tens of milliamps on SRAM FPGAs.

The 256-FBGA at 1.0 mm pitch requires 4-layer PCB minimum with 0.5 oz copper and microvia-in-pad if any inner balls route to inner layers. Estimated via antipad diameter 0.6 mm, ball pad 0.45 mm. Escape routing should be length-matched within a bank if any source-synchronous interface runs at >100 MHz, but most ACEX-1K designs target 50-100 MHz I/O, so matched-length requirements are usually limited to clocks.

Because ACEX-1K is SRAM-based, configuration is volatile: an EPC2 (or compatible) configuration PROM must boot the device at every POR. Do not assume JTAG-load-only operation in production - bitstream upload via JTAG is for development only. Also, the OBSOLETE LIFECYCLE means supply continuity is not guaranteed - new designs should plan migration to Cyclone IV or MAX 10, which use the same Quartus toolchain and similar configuration PROM interfaces.

اطلاعات انطباق

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
بدون سرب
Yes
بدون هالوژن
Unknown
مواد معدنی درگیری
Compliant

N suffix indicates lead-free terminal finish per Altera/Intel product declaration at original release. Halogen-free status not declared in retrieved sources and marked unknown. Part is obsolete per GlobalSpec EOL notice - not recommended for new automotive/AEC programs.

تاریخ تأیید داده‌ها: 2026-09-07 — داده‌ها توسط تیم مهندسی قطعات XAIPART تأیید و گردآوری شده است

جستجوهای مرتبط

EP1K30FC256-1N EP1K30FC256-1N datasheet Altera EP1K30FC256-1N Intel ACEX-1K FPGA 256-BGA ACEX-1K 30K gate FPGA EP1K30FC256-1N obsolete replacement EP1K30FC256-1N vs EP1K30FC256-3N EP1K30FC256-1N pinout 256-FBGA buy EP1K30FC256-1N EP1K30 lead-free RoHS ACEX-1K configuration PROM EPC2 EP1K30FC256-1N industrial control Cyclone IV replacement ACEX-1K what is EP1K30FC256-1N EP1K30FC256-1N price 1000

قطعات و اصطلاحات مرتبط

Intel Altera EP1K30FC256-1N EP1K30FC256-3N EP1K30FC256-1 EP1K30FC256-2N ACEX-1K FPGA Field Programmable Gate Array Programmable Logic Device BGA FineLine BGA 256-ball FBGA Logic Element Embedded Array Block EAB SRAM JTAG IEEE 1149.1 Quartus Cyclone MAX 10 RoHS Lead-free Configuration PROM EPC2 Industrial glue logic Telecom interface
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