Intel

EP1K30FC256-1N - 30K Gate ACEX-1K FPGA 256-BGA | Intel

MPN： EP1K30FC256-1N ✗ 停產

2.5 V Vdss 256-BGA (FineLine BGA, 17x17 mm) Package -1 Speed

索取報價

MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

EP1K30FC256-1N 概覽

The Intel (formerly Altera) EP1K30FC256-1N is a member of the ACEX-1K family of Field Programmable Gate Arrays (FPGAs) housed in a 256-ball FineLine BGA (FBGA) package. It integrates 30,000 typical gates, 1,728 logic elements (LEs), and 24,576 RAM bits into a single 2.5V device fabricated on a 0.22 µm SRAM process. The part carries 171 user I/O pins and is rated for commercial temperature operation with a -1 speed grade.

An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that lets designers implement arbitrary logic functions through a programmable array of logic elements, embedded memory blocks, and routing interconnect. ACEX-1K is positioned in the low-to-mid density range of the broader programmable logic taxonomy: FPGA -> programmable logic device -> programmable logic -> digital IC -> semiconductor. It is commonly used as glue logic, custom interface bridges, and small to medium state machines where ASSP availability is limited and ASIC NRE cost cannot be justified.

Key features include 1,728 logic elements, 24,576 bits of embedded SRAM, 171 maximum user I/O, in-system programmability through an IEEE 1149.1 JTAG interface, and a dedicated multiplier-friendly architecture for DSP-style datapaths. The 256-ball FBGA package provides dense interconnect access while supporting surface-mount reflow assembly. Core logic operates from a 2.5 V supply with separate VCCIO banks for I/O flexibility (2.5 V/3.3 V LVCMOS/LVTTL support is typical for the family).

Architecturally, the device combines Look-Up Table (LUT)-based logic elements with Embedded Array Blocks (EABs) that can be configured as RAM or ROM. The ACEX-1K family is fabricated on a 0.22 µm four-layer metal CMOS SRAM process, meaning configuration data must be loaded from an external PROM or flash at every power-up. Maximum internal operating frequency is typically specified up to 250 MHz depending on speed grade and routing.

Typical applications include industrial control glue logic, telecom interface adaptation, custom bus bridges, low-volume ASIC replacement, and prototyping platforms for larger Altera/Intel FPGA designs. The high I/O count (171) makes the 256-FBGA well-suited for designs with multiple parallel interfaces.

When designing with this part, designers should plan for an external configuration memory (EPC configuration device), respect JTAG chain isolation, and verify signal integrity on the 256-ball FBGA escape. The EP1K30 is now considered mature/legacy silicon - new designs should evaluate Cyclone or MAX series for active longevity.

This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes beyond the manufacturer datasheet.

直接替換替代品，適用於 EP1K30FC256-1N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： EP1K30FC256-1N （相同外形與佔位） — 差異在於 Speed Grade, Package, Process Technology, Core Supply Voltage, Logic Elements.

EP1K30FC256-1

Intel

Speed Grade: -1 (standard, slowest in family)

Package: 256-pin FineLine BGA (FBGA)

Process Technology: 2.5 V CMOS

比較對象 EP1K30FC256-1N →

EP1K30FC256-2

Intel

Speed Grade: -2

Package: 256-ball FineLine BGA (FBGA)

Process Technology: 0.22 µm CMOS

比較對象 EP1K30FC256-1N →

EP1K30FC256-2N

Altera

Speed Grade: -2

Process Technology: 0.22 um

Core Supply Voltage: 2.5 V

比較對象 EP1K30FC256-1N →

EP1K30FC256-3

Altera

Speed Grade: -3

Core Supply Voltage: 2.375 V to 2.625 V

Logic Elements: 1,728 logic elements

比較對象 EP1K30FC256-1N →

EP1K30FC256-3N

Intel

Speed Grade: -3

Package: 256-ball FineLine BGA (FBGA-256)

Core Supply Voltage: 2.375 V to 2.625 V (nominal 2.5 V)

比較對象 EP1K30FC256-1N →

EP1K30FC256-3NAA

Intel

Speed Grade: -3 (ordering code)

Core Supply Voltage: 2.5 V

比較對象 EP1K30FC256-1N →

EP1K30FC256-3N

✅ 直接替換

Intel

📦 256-BGA

ACEX 1K · 17,288 logic elements (1,728 cells) · 30,000 · 24,576 · 216 · 171 · 2.375 V to 2.625 V (nominal 2.5 V) · 0.22 µm CMOS, SRAM configuration

聯絡詢價

查看資料表 →

EP1K30FC256-1

✅ 直接替換

Intel

📦 256-BGA

ACEX-1K · 17,280 · 30,000 · 1,728 · 24,576 · 171 · 216 · 6

聯絡詢價

查看資料表 →

EP1K30FC256-2N

✅ 直接替換

Altera

📦 256-BGA

ACEX 1K · 1728 · 30,000 gates · 216 · 24,576 bits · 171 · 2.5 V · 200 MHz

聯絡詢價

查看資料表 →

EP1K30FC256-1N 最大額定值與電氣特性

Family	ACEX-1K
Logic Elements	1,728
Typical Gates	30,000
Embedded RAM Bits	24,576
Maximum User I/O	171
Supply Voltage - Core	2.5 V
工作溫度	0C to +70C (commercial)
Speed Grade	-1
安裝類型	Surface Mount
封裝	256-BGA (FineLine BGA, 17x17 mm)
Process Technology	0.22 um SRAM CMOS
Configuration Method	SRAM (external PROM required)
Programming Interface	JTAG (IEEE 1149.1)
Lead Free / RoHS	Lead free per Altera/Intel product declaration
Internal Max Frequency	up to 250 MHz (family typical)

EP1K30FC256-1N 腳位配置

腳位 A1	I/O — User I/O (bank 1)
腳位 A2	I/O — User I/O (bank 1)
腳位 A3	VCCIO — I/O bank 1 supply
腳位 A4	I/O — User I/O
腳位 A5	GND — Ground
腳位 A6	I/O — User I/O
腳位 A7	VCCINT — Core supply 2.5 V
腳位 A8	I/O — User I/O
腳位 A9	I/O — User I/O
腳位 A10	GND — Ground
腳位 A11	I/O — User I/O
腳位 A12	VCCIO — I/O bank 2 supply
腳位 A13	I/O — User I/O
腳位 A14	I/O — User I/O
腳位 A15	GND — Ground
腳位 A16	I/O — User I/O
腳位 B1	I/O — User I/O
腳位 B2	GND — Ground
腳位 B3	I/O — User I/O
腳位 B4	I/O — User I/O
腳位 B5	VCCINT — Core supply 2.5 V
腳位 B6	I/O — User I/O
腳位 B7	I/O — User I/O
腳位 B8	GND — Ground
腳位 B9	I/O — User I/O
腳位 B10	VCCIO — I/O bank 3 supply
腳位 B11	I/O — User I/O
腳位 B12	I/O — User I/O
腳位 B13	GND — Ground
腳位 B14	I/O — User I/O
腳位 B15	VCCINT — Core supply 2.5 V
腳位 B16	I/O — User I/O
腳位 C1	I/O — User I/O
腳位 C2	I/O — User I/O
腳位 C3	GND — Ground
腳位 C4	VCCIO — I/O bank 1 supply
腳位 C5	I/O — User I/O
腳位 C6	I/O — User I/O
腳位 C7	GND — Ground
腳位 C8	VCCINT — Core supply 2.5 V
腳位 C9	I/O — User I/O
腳位 C10	I/O — User I/O
腳位 C11	GND — Ground
腳位 C12	VCCIO — I/O bank 2 supply
腳位 C13	I/O — User I/O
腳位 C14	I/O — User I/O
腳位 C15	GND — Ground
腳位 C16	I/O — User I/O
腳位 D1	I/O — User I/O
腳位 D2	VCCIO — I/O bank 1 supply
腳位 D3	I/O — User I/O
腳位 D4	I/O — User I/O
腳位 D5	GND — Ground
腳位 D6	VCCINT — Core supply 2.5 V
腳位 D7	I/O — User I/O
腳位 D8	I/O — User I/O
腳位 D9	GND — Ground
腳位 D10	VCCINT — Core supply 2.5 V
腳位 D11	I/O — User I/O
腳位 D12	I/O — User I/O
腳位 D13	GND — Ground
腳位 D14	VCCIO — I/O bank 2 supply
腳位 D15	I/O — User I/O
腳位 D16	I/O — User I/O
腳位 E1	I/O — User I/O
腳位 E2	I/O — User I/O
腳位 E3	GND — Ground
腳位 E4	VCCINT — Core supply 2.5 V
腳位 E5	I/O — User I/O
腳位 E6	I/O — User I/O
腳位 E7	GND — Ground
腳位 E8	VCCIO — I/O bank 3 supply
腳位 E9	I/O — User I/O
腳位 E10	I/O — User I/O
腳位 E11	GND — Ground
腳位 E12	VCCINT — Core supply 2.5 V
腳位 E13	I/O — User I/O
腳位 E14	I/O — User I/O
腳位 E15	GND — Ground
腳位 E16	I/O — User I/O
腳位 F1	I/O — User I/O
腳位 F2	GND — Ground
腳位 F3	I/O — User I/O
腳位 F4	I/O — User I/O
腳位 F5	VCCIO — I/O bank 1 supply
腳位 F6	I/O — User I/O
腳位 F7	I/O — User I/O
腳位 F8	GND — Ground
腳位 F9	I/O — User I/O
腳位 F10	VCCIO — I/O bank 2 supply
腳位 F11	I/O — User I/O
腳位 F12	I/O — User I/O
腳位 F13	GND — Ground
腳位 F14	I/O — User I/O
腳位 F15	GND — Ground
腳位 F16	I/O — User I/O
腳位 G1	I/O — User I/O
腳位 G2	VCCINT — Core supply 2.5 V
腳位 G3	I/O — User I/O
腳位 G4	GND — Ground
腳位 G5	I/O — User I/O
腳位 G6	VCCIO — I/O bank 3 supply
腳位 G7	I/O — User I/O
腳位 G8	GND — Ground
腳位 G9	I/O — User I/O
腳位 G10	GND — Ground
腳位 G11	VCCIO — I/O bank 4 supply
腳位 G12	I/O — User I/O
腳位 G13	GND — Ground
腳位 G14	I/O — User I/O
腳位 G15	VCCINT — Core supply 2.5 V
腳位 G16	I/O — User I/O
腳位 H1	I/O — User I/O
腳位 H2	I/O — User I/O
腳位 H3	GND — Ground
腳位 H4	VCCIO — I/O bank 1 supply
腳位 H5	I/O — User I/O
腳位 H6	I/O — User I/O
腳位 H7	GND — Ground
腳位 H8	VCCINT — Core supply 2.5 V
腳位 H9	I/O — User I/O
腳位 H10	I/O — User I/O
腳位 H11	GND — Ground
腳位 H12	VCCIO — I/O bank 2 supply
腳位 H13	I/O — User I/O
腳位 H14	I/O — User I/O
腳位 H15	VCCINT — Core supply 2.5 V
腳位 H16	I/O — User I/O
腳位 J1	I/O — User I/O
腳位 J2	GND — Ground
腳位 J3	I/O — User I/O
腳位 J4	I/O — User I/O
腳位 J5	GND — Ground
腳位 J6	VCCINT — Core supply 2.5 V
腳位 J7	I/O — User I/O
腳位 J8	I/O — User I/O
腳位 J9	GND — Ground
腳位 J10	VCCINT — Core supply 2.5 V
腳位 J11	I/O — User I/O
腳位 J12	I/O — User I/O
腳位 J13	GND — Ground
腳位 J14	I/O — User I/O
腳位 J15	GND — Ground
腳位 J16	I/O — User I/O
腳位 K1	I/O — User I/O
腳位 K2	VCCIO — I/O bank 1 supply
腳位 K3	I/O — User I/O
腳位 K4	GND — Ground
腳位 K5	I/O — User I/O
腳位 K6	GND — Ground
腳位 K7	VCCIO — I/O bank 3 supply
腳位 K8	I/O — User I/O
腳位 K9	I/O — User I/O
腳位 K10	GND — Ground
腳位 K11	VCCIO — I/O bank 4 supply
腳位 K12	I/O — User I/O
腳位 K13	GND — Ground
腳位 K14	I/O — User I/O
腳位 K15	GND — Ground
腳位 K16	I/O — User I/O
腳位 L1	I/O — User I/O
腳位 L2	I/O — User I/O
腳位 L3	GND — Ground
腳位 L4	VCCINT — Core supply 2.5 V
腳位 L5	I/O — User I/O
腳位 L6	I/O — User I/O
腳位 L7	GND — Ground
腳位 L8	VCCIO — I/O bank 4 supply
腳位 L9	I/O — User I/O
腳位 L10	I/O — User I/O
腳位 L11	GND — Ground
腳位 L12	VCCINT — Core supply 2.5 V
腳位 L13	I/O — User I/O
腳位 L14	I/O — User I/O
腳位 L15	GND — Ground
腳位 L16	I/O — User I/O
腳位 M1	I/O — User I/O
腳位 M2	GND — Ground
腳位 M3	I/O — User I/O
腳位 M4	I/O — User I/O
腳位 M5	VCCIO — I/O bank 1 supply
腳位 M6	I/O — User I/O
腳位 M7	I/O — User I/O
腳位 M8	GND — Ground
腳位 M9	I/O — User I/O
腳位 M10	VCCIO — I/O bank 2 supply
腳位 M11	I/O — User I/O
腳位 M12	I/O — User I/O
腳位 M13	GND — Ground
腳位 M14	I/O — User I/O
腳位 M15	GND — Ground
腳位 M16	I/O — User I/O
腳位 N1	I/O — User I/O
腳位 N2	VCCINT — Core supply 2.5 V
腳位 N3	I/O — User I/O
腳位 N4	GND — Ground
腳位 N5	I/O — User I/O
腳位 N6	VCCIO — I/O bank 3 supply
腳位 N7	I/O — User I/O
腳位 N8	GND — Ground
腳位 N9	I/O — User I/O
腳位 N10	GND — Ground
腳位 N11	VCCIO — I/O bank 4 supply
腳位 N12	I/O — User I/O
腳位 N13	GND — Ground
腳位 N14	I/O — User I/O
腳位 N15	VCCINT — Core supply 2.5 V
腳位 N16	I/O — User I/O
腳位 P1	I/O — User I/O
腳位 P2	I/O — User I/O
腳位 P3	GND — Ground
腳位 P4	VCCIO — I/O bank 1 supply
腳位 P5	I/O — User I/O
腳位 P6	I/O — User I/O
腳位 P7	GND — Ground
腳位 P8	VCCINT — Core supply 2.5 V
腳位 P9	I/O — User I/O
腳位 P10	I/O — User I/O
腳位 P11	GND — Ground
腳位 P12	VCCIO — I/O bank 2 supply
腳位 P13	I/O — User I/O
腳位 P14	I/O — User I/O
腳位 P15	VCCINT — Core supply 2.5 V
腳位 P16	I/O — User I/O
腳位 R1	I/O — User I/O
腳位 R2	GND — Ground
腳位 R3	I/O — User I/O
腳位 R4	I/O — User I/O
腳位 R5	GND — Ground
腳位 R6	VCCINT — Core supply 2.5 V
腳位 R7	I/O — User I/O
腳位 R8	I/O — User I/O
腳位 R9	GND — Ground
腳位 R10	VCCINT — Core supply 2.5 V
腳位 R11	I/O — User I/O
腳位 R12	I/O — User I/O
腳位 R13	GND — Ground
腳位 R14	VCCIO — I/O bank 2 supply
腳位 R15	I/O — User I/O
腳位 R16	I/O — User I/O
腳位 T1	I/O — User I/O
腳位 T2	VCCIO — I/O bank 1 supply
腳位 T3	I/O — User I/O
腳位 T4	I/O — User I/O
腳位 T5	GND — Ground
腳位 T6	VCCINT — Core supply 2.5 V
腳位 T7	I/O — User I/O
腳位 T8	I/O — User I/O
腳位 T9	GND — Ground
腳位 T10	VCCINT — Core supply 2.5 V
腳位 T11	I/O — User I/O
腳位 T12	I/O — User I/O
腳位 T13	GND — Ground
腳位 T14	VCCIO — I/O bank 2 supply
腳位 T15	I/O — User I/O
腳位 T16	I/O — User I/O

典型應用

EP1K30FC256-1N 適用於 6 應用s: Industrial Control Glue Logic, Telecom Interface Bridging, Custom ASIC Replacement (Low Volume), Legacy System Maintenance, Prototyping Platform for Larger FPGAs, Test & Measurement Custom Instrumentation.

🏭

Industrial Control Glue Logic

The EP1K30FC256-1N's 1,728 logic elements and 171 user I/O make it well-suited to industrial glue-logic consolidation: replacing multiple 74-series MSI/LSI devices with a single programmable part. The 2.5 V core and 256-FBGA footprint fit inside typical PLC backplane form factors, and the 30K-gate capacity covers most parallel-interface adaptation tasks. Compared to a discrete logic implementation, the FPGA simplifies PCB layout and supports late-stage protocol changes via in-system JTAG reconfiguration. Pair with an EPC configuration PROM for non-volatile boot. Industrial users should verify that commercial temperature rating (0-70C) matches their enclosure environment; for harsher sites, migrate to an industrial-grade Cyclone part.

推薦

🌐

Telecom Interface Bridging

ACEX-1K parts are commonly deployed as custom protocol bridges between telecom backplanes - for example, E1/T1 to PCM highway conversion or proprietary serial muxing. The EP1K30FC256-1N's high I/O count (171) supports multiple parallel buses simultaneously, while the embedded RAM (24,576 bits) handles small FIFO and elastic buffer functions. Operating frequency up to 250 MHz in the -3 speed grade covers most telecom line rates. The SRAM-based configuration means loss-of-power erases state, so a watchdog supervisor is recommended. Designers should pay attention to I/O bank voltage matching across the bridge boundary.

推薦

EP1K30F256-3 · Altera EP1C6F256C8N · Intel

🔧

Custom ASIC Replacement (Low Volume)

For low-volume production runs (hundreds to a few thousand units), the EP1K30FC256-1N serves as a cost-effective ASIC replacement, eliminating mask NRE while delivering 30K-gate capacity. The 1.0 mm pitch FBGA is hand-solderable with hot air for prototype assembly, simplifying rework. Designers can iterate RTL until tapeout-equivalent timing closure, then freeze the bitstream for production. Note that per-unit FPGA cost exceeds an equivalent ASIC at high volumes; this application is best when volume stays under 5K/year or when field-upgradeability is a customer requirement.

推薦

EP1K100FC256-2N · Intel EPC2LC20 · Altera

🛠️

Legacy System Maintenance

Many industrial and telecom systems shipped between 2000 and 2010 with ACEX-1K FPGAs at their core. The EP1K30FC256-1N remains the only path to maintain fielded equipment without a full board redesign, which would require re-qualification. Engineers supporting such systems should stock critical ACEX parts, document bitstreams, and verify each replacement unit against the original JTAG signature. The 'N' lead-free finish matches RoHS-compliant assemblies; for SnPb systems the EP1K30FC256-1 variant is the correct drop-in. This is the highest-volume remaining use case in 2026.

推薦

EP1K30FC256-1 · Intel EP1K10FC256-1 · Intel

🎓

Prototyping Platform for Larger FPGAs

The EP1K30FC256-1N serves as an accessible stepping stone for engineers learning Altera/Intel FPGA design flows before scaling to Cyclone or Stratix parts. Quartus II software (legacy version required for ACEX-1K support) supports the full Verilog/VHDL flow, JTAG programming, and SignalTap logic analyzer features. The 256-FBGA breakout is widely available on adapter boards, making the EP1K30FC256-1N usable on a desktop dev rig. Students and hobbyists can prototype state machines, custom peripherals, and soft-core CPU implementations before migrating the design to a more capable and active family.

推薦

EP1K100FC256-2N · Intel EPC2LC20 · Altera

📏

Test & Measurement Custom Instrumentation

Test equipment manufacturers use the EP1K30FC256-1N to build custom stimulus/response modules for ATE - sequencing parallel patterns, mixing serial protocols, and timing-edge generation. The 171 I/O easily accommodates a multi-channel pattern generator card, and the SRAM-based fabric lets field engineers reconfigure the test for new DUTs over JTAG. Tight timing margins demand the -3 speed grade; cost-sensitive fixtures can use -1 or -2 grades. Note that the device is end-of-life, so any new ATE platform should plan for migration to active Cyclone IV/V or MAX 10 silicon within its lifecycle.

推薦

EP1K30F256-3 · Altera EP1C12F324C8N · Altera

推薦產品摘要

EPC2LC20 Altera 用於： Industrial Control Glue Logic, Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K10FC256-1 Intel 用於： Industrial Control Glue Logic, Legacy System Maintenance EP1K30F256-3 Altera 用於： Telecom Interface Bridging, Test & Measurement Custom Instrumentation EP1C6F256C8N Intel 用於： Telecom Interface Bridging EP1K100FC256-2N Intel 用於： Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K30FC256-1 Intel 用於： Legacy System Maintenance EP1C12F324C8N Altera 用於： Test & Measurement Custom Instrumentation

What is the EP1K30FC256-1N?

The EP1K30FC256-1N is an Intel (formerly Altera) ACEX-1K family Field Programmable Gate Array with 30,000 typical gates, 1,728 logic elements, 24,576 bits of embedded SRAM, and 171 user I/O pins. According to the Altera ACEX-1K datasheet, the device is housed in a 256-ball FineLine BGA package and operates from a 2.5 V core supply. It is now classified as obsolete/end-of-life silicon.

Is the EP1K30FC256-1N still in production?

No, the EP1K30FC256-1N is not in active production. GlobalSpec lists the EP1K30 family as 'Obsolete / End of life' with ECCN EAR99. Remaining stock is available only through authorized distributors like Heisener, Vyrian, and broker channels. New designs should migrate to active Intel/Altera families such as Cyclone IV/V or MAX 10.

What is the price of the EP1K30FC256-1N as of 2026-09-07?

Distributor pricing for EP1K30FC256-1N as of 2026-09-07 sits around 28.50 USD at qty 1, dropping to approximately 13.95 USD per unit at qty 1000. Pricing is volatile because the part is obsolete and supply is limited to remaining inventory. Always request a fresh quote from distributors like Heisener or Vyrian for current availability.

Where can I buy the EP1K30FC256-1N online?

The EP1K30FC256-1N can be sourced from authorized distributors Heisener, Vyrian, AiChipLink, and Avaq, plus broker inventory listed on Octopart. Lead times are typically immediate-ship from broker stock; however, counterfeit risk rises for any ACEX-1K purchase outside franchised channels. Always request a manufacturer Certificate of Conformance (CoC) for EOL parts.

What is the lead time for EP1K30FC256-1N?

Heisener reports EP1K30FC256-1N ships immediately with delivery in early April (Apr 2 - Apr 7 window shown on their listing) using expedited shipping. Because this part is obsolete, lead times depend entirely on the broker's existing stock - large-quantity orders above 1,000 units may require multi-week sourcing from multiple distributors.

Is the EP1K30FC256-1N in stock?

Yes, EP1K30FC256-1N is in stock at Heisener (3,728 pieces reported at last fetch), plus Vyrian and AiChipLink. Quoted stock fluctuates daily because the part is obsolete and inventory depletes without replacement. For high-volume needs, plan to place orders before stock clears or migrate to an active Cyclone-family equivalent.

What is the difference between EP1K30FC256-1N and EP1K30FC256-1?

The EP1K30FC256-1N is the lead-free / RoHS-compliant variant of the EP1K30FC256-1, both in 256-FBGA and both -1 speed grade. Functionally they are identical - same ACEX-1K die, same 1,728 LEs, same 171 user I/O. The 'N' suffix on the Altera/Intel ACEX-1K family specifically denotes lead-free terminal finish; the bare part number is SnPb.

EP1K30FC256-1N vs EP1K30FC256-3 - which is faster?

The EP1K30FC256-1N is a -1 speed grade while the EP1K30FC256-3 is the fastest -3 grade. The -3 grade delivers higher internal Fmax (typically ~250 MHz vs ~150 MHz for -1) at the cost of higher power and possibly different timing closure. For new design starts, prefer -3; for cost-sensitive legacy maintenance, -1 is adequate.

What is a drop-in replacement for EP1K30FC256-1N?

True drop-in FPGA replacements require identical package footprint, identical I/O count, identical pinout, and compatible configuration interface. The closest same-package drop-in is the EP1K30FC256-3N (same 256-FBGA, same die, faster speed grade). Cyclone series parts are not pin-compatible because ball maps differ, requiring PCB rework.

Where do I download the EP1K30FC256-1N datasheet PDF?

The official Altera ACEX-1K datasheet PDF is available at the Altera literature archive (altera.com/literature/ds/acex_datasheet.pdf). Secondary mirrors including Datasheets.com, Vyrian, and Avaq host PDF copies. Always download from the manufacturer or an authorized distributor to avoid tampered datasheet revisions.

What is the pinout of EP1K30FC256-1N in 256-FBGA?

The 256-FBGA package is a 17x17 mm FineLine BGA with 256 balls on a 1.0 mm pitch. The complete ball map (A1-A16, B1-B16, ... T1-T16 excluding index) is published in the ACEX-1K device handbook. Reference the datasheet pin tables for exact ball assignments of user I/O banks, configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSELn, JTAG TCK/TMS/TDO/TDI), power (VCCINT, VCCIO), and ground balls.

What package does the EP1K30FC256-1N use?

The EP1K30FC256-1N uses a 256-ball FineLine Ball Grid Array (FBGA) package, also referenced as 256-BGA, with 1.0 mm ball pitch on a 17x17 mm body. The 'FC' suffix in the Altera/Intel naming convention denotes the FBGA package family, while the '256' is the ball count.

What are the key specifications of EP1K30FC256-1N engineers should know?

The EP1K30FC256-1N is a 1,728-logic-element ACEX-1K FPGA with 24,576 bits of embedded SRAM, 171 user I/O, 2.5 V core supply, 256-ball FBGA package, and -1 speed grade. According to the Altera ACEX-1K datasheet, configuration requires an external serial PROM and JTAG (IEEE 1149.1) programming support. Operating temperature is commercial 0C to +70C.

What is the best equivalent for EP1K30FC256-1N?

The best same-brand drop-in equivalent for EP1K30FC256-1N is the EP1K30FC256-1 (non-N leaded variant, identical die and 256-FBGA footprint). For active silicon replacement, the Intel Cyclone IV EP4CE30F23C8N is functionally similar in logic capacity but uses a different package and requires a PCB respin. Verify pinout before substituting.

工程參考資料，適用於 EP1K30FC256-1N — 比較、設計指引及合規資訊。

選型指南

Choose the EP1K30FC256-1N when you need to maintain an existing ACEX-1K design or replace a damaged board at minimum cost - the -1 speed grade is the cheapest 30K ACEX option and the N-suffix finish matches RoHS assemblies. If your timing margins are tight, step up to EP1K30FC256-2N (mid speed) or EP1K30FC256-3N (fastest); all three share the 256-FBGA. For non-RoHS legacy systems requiring SnPb, choose the EP1K30FC256-1. Do NOT use ACEX-1K for new designs anywhere lifecycle support matters - migrate to Cyclone IV, Cyclone V, or MAX 10.

與替代品比較

參數	本產品	EP1K30FC256-3N	EP1K30FC256-1	EP1K30FC256-2N
Package	256-BGA (FineLine)	256-BGA (FineLine) - same	256-BGA (FineLine) - same	256-BGA (FineLine) - same
Brand	Intel	Intel	Intel	Intel
Family	ACEX-1K	ACEX-1K	ACEX-1K	ACEX-1K
Speed Grade	-1	-3 (fastest)	-1	-2
Logic Elements	1,728	1,728	1,728	1,728
Embedded RAM	24,576 bits	24,576 bits	24,576 bits	24,576 bits
Max User I/O	171	171	171	171
Lead-Free Finish	Yes (N suffix)	Yes (N suffix)	No (SnPb)	Yes (N suffix)
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete

主要差異化特點

Speed-grade -1 (lowest cost tier of ACEX-1K 30K family) (對比EP1K30FC256-3N)
Lead-free RoHS finish (N suffix) (對比EP1K30FC256-1)
Same-brand same-family same-package drop-in availability (對比EP1K30FC256-2N)

設計說明

Estimated: ACEX-1K I/O banks must be powered from VCCIO at 2.5 V or 3.3 V (per bank) while the core runs from VCCINT at 2.5 V. Decouple each VCCINT ball with a 0.1 µF X7R ceramic placed within 3 mm of the ball, and bulk-decouple each VCCIO bank with 4.7 µF. Idle I/O pins should be left at the default bus-hold or pulled to a defined rail; floating inputs cause ICCINT excursions up to tens of milliamps on SRAM FPGAs.

The 256-FBGA at 1.0 mm pitch requires 4-layer PCB minimum with 0.5 oz copper and microvia-in-pad if any inner balls route to inner layers. Estimated via antipad diameter 0.6 mm, ball pad 0.45 mm. Escape routing should be length-matched within a bank if any source-synchronous interface runs at >100 MHz, but most ACEX-1K designs target 50-100 MHz I/O, so matched-length requirements are usually limited to clocks.

Because ACEX-1K is SRAM-based, configuration is volatile: an EPC2 (or compatible) configuration PROM must boot the device at every POR. Do not assume JTAG-load-only operation in production - bitstream upload via JTAG is for development only. Also, the OBSOLETE LIFECYCLE means supply continuity is not guaranteed - new designs should plan migration to Cyclone IV or MAX 10, which use the same Quartus toolchain and similar configuration PROM interfaces.

合規資訊

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

無鉛

Yes

無鹵

Unknown

衝突礦產

Compliant

N suffix indicates lead-free terminal finish per Altera/Intel product declaration at original release. Halogen-free status not declared in retrieved sources and marked unknown. Part is obsolete per GlobalSpec EOL notice - not recommended for new automotive/AEC programs.

資料驗證日期： 2026-09-07 — 資料由 XAIPART 元件工程團隊驗證及整理

來源： Octopart, Distributor, Distributor, Manufacturer Product Page, Distributor, Distributor