Intel

EPM570T144C3 - MAX II CPLD 440 LE 5.4ns TQFP-144 | Intel

Name: EPM570T144C3 - MAX II CPLD 440 LE 5.4ns TQFP-144 | Intel
Brand: Intel
SKU: EPM570T144C3

MPN: EPM570T144C3 ✓ Aktif

3.3 V (internal regulator generates 2.5 V core) Vdss 144-pin TQFP (20 mm × 20 mm × 1.4 mm) Package C3 (5.4 ns tPD1) Speed 4.0 Kbits Memory

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EPM570T144C3 Ringkasan

The Intel EPM570T144C3 is a member of the MAX II family of Complex Programmable Logic Devices (CPLDs), delivering 440 Logic Elements (LEs) in a 144-pin TQFP package with a 5.4 ns pin-to-pin propagation delay. It is built on a 0.18 µm non-volatile flash process that provides instant-on configuration, eliminating the external configuration memory required by SRAM-based FPGAs. The device operates from a 2.5 V/3.3 V mixed-voltage core with multi-voltage I/O support.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the architecture of PAL/GAL with macro-cell arrays. It belongs to the broader category of programmable logic devices (PLDs), which sit alongside FPGAs as alternatives to fixed-function ASICs for glue logic, interface bridging, and state-machine implementation. CPLDs are characterized by instant-on behavior, deterministic timing, and high fan-in macrocells, making them ideal for control-plane applications.

Key features of the EPM570T144C3 include 440 Logic Elements distributed across 8 Logic Array Blocks, 160 user I/O pins, and 4.0 Kbits of user flash memory. The device supports in-system programmability (ISP) via IEEE 1149.1 JTAG, MultiVolt I/O for interfacing between 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic domains, and operates over a commercial temperature range of 0 °C to +85 °C. The C3 speed grade provides a 5.4 ns tPD1 timing budget for high-speed control applications.

Architecturally, the EPM570T144C3 uses a non-volatile flash-based lookup table structure within each Logic Element, providing single-chip functionality without a separate boot PROM. The MultiVolt core and I/O allow mixed-voltage system integration, while the JTAG interface supports boundary-scan test and on-board reconfiguration in production environments.

Typical applications include bus interface bridging, power-up sequencing for multi-rail systems, I/O expansion and decoding logic, LED display drivers, and glue-logic replacement for discrete 74-series TTL. The wide I/O count and instant-on nature also suit industrial control and motor-drive front-end logic.

When designing with this part, ensure that the Quartus II or Intel Quartus Prime toolchain is used for synthesis and fitting; design files compiled for the MAX II device family are required. Decoupling capacitors should be placed close to all VCCINT and VCCIO pins.

This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes for the EPM570T144C3 that are not duplicated on any single manufacturer datasheet or distributor listing.

Alternatif penggantian untuk EPM570T144C3 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPM570T144C3 (sama faktor bentuk dan footprint) — berbeda di dalam Programming Interface, Operating Temperature, Package, Process Technology, Maximum User I/O Pins.

EPM570F256C3

Intel

Programming Interface: JTAG (IEEE 1149.1) - ISP

Operating Temperature: Commercial: 0 °C to +85 °C (C3 grade)

Package: 256-FBGA (FineLine BGA) 17 × 17 mm