W634GU6RB09J - 4Gb DDR3L SDRAM x16 1066MHz | Winbond
MPN: W634GU6RB09J ✓ AktifW634GU6RB09J Ringkasan
DDR3L (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory (SDRAM) that operates at 1.35V, reducing power consumption by about 20% compared to standard 1.5V DDR3. It is part of the DDR3 family, which uses double data rate signaling to transfer data on both edges of the clock, achieving high throughput. DDR3L is backward-compatible with DDR3 and is widely used in laptops, servers, and industrial electronics where energy efficiency is critical.
Key features include a 4Gbit density, x16 organization, 1.067 GHz clock speed, and a CAS latency of 20 ns. The device supports on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4. It operates over a temperature range of 0°C to +95°C (case temperature) and is RoHS compliant. The 96-VFBGA package measures 7.5x13mm with a 0.8mm ball pitch, enabling high-density PCB layouts.
Technically, the W634GU6RB09J uses a 30nm-class process technology, achieving low power and high speed. It features internal calibration for ZQ, write leveling, and read leveling to ensure signal integrity at high frequencies. The device supports auto-refresh and self-refresh modes, reducing standby power. Its low voltage operation and advanced power management make it suitable for battery-powered devices.
Typical applications include mobile computing, networking equipment, industrial automation, and consumer electronics such as set-top boxes and smart TVs. The high density and low power make it ideal for systems requiring large memory capacity with minimal energy consumption.
When designing with this component, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at 1066MHz. The device requires a 1.35V supply and a separate VDDQ, which should be regulated accurately.
Alternatif penggantian untuk W634GU6RB09J — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian W634GU6RB09J (sama faktor bentuk dan footprint) — berbeda di dalam Package, Data Rate, Operating Temperature, CAS Latency, Supply Voltage.
W634GU6RB-09
✅ Drop-In✗ Habis Stok
$9.69 / Satuan
Lihat Datasheet →W634GU6RB12J
✅ Drop-InKontak untuk harga
Lihat Datasheet →W634GU6RB11J
✅ Drop-InKontak untuk harga
Lihat Datasheet →MT41K256M16HA-125
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan✗ Habis Stok
$6.3636 / Satuan
Lihat Datasheet →K4B4G1646D-BYK00
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →NT5CC256M16DP-DI
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →W634GU6RB09J Rating Maksimal & Karakteristik Listrik
| Tipe Memori | DDR3L SDRAM |
| Ukuran Memori | 4Gbit (256M x 16) |
| Laju Data | 1066 MHz (DDR3L-2133) |
| Tegangan Pemuat | 1.35V |
| Latensi CAS | 20 ns |
| Paket | 96-VFBGA (7.5x13mm) |
| Suhu Kerja | 0°C to +95°C (Tc) |
| Antarmuka | Parallel |
| Tipe Mounting | Surface Mount |
| Status RoHS | Compliant |
| Bebas Halogen | Yes |
| Organisasi | 256M x 16 |
| Burst Length | 8 and 4 |
| Jumlah Pin | 96 |
| Ball Pitch | 0.8 mm |
Konfigurasi Pin W634GU6RB09J
| Pin produk A1 | VDD — Power supply (1.35V) |
| Pin produk A2 | DQ0 — Data input/output 0 |
| Pin produk A3 | VSS — Ground |
| Pin produk B1 | DQ1 — Data input/output 1 |
| Pin produk B2 | VDDQ — I/O power supply |
| Pin produk B3 | DQ2 — Data input/output 2 |
| Pin produk C1 | DQ3 — Data input/output 3 |
| Pin produk C2 | VSSQ — I/O ground |
| Pin produk C3 | DQ4 — Data input/output 4 |
| Pin produk D1 | DQ5 — Data input/output 5 |
| Pin produk D2 | VDD — Power supply |
| Pin produk D3 | DQ6 — Data input/output 6 |
| Pin produk E1 | DQ7 — Data input/output 7 |
| Pin produk E2 | VSS — Ground |
| Pin produk E3 | DQS0 — Data strobe 0 |
| Pin produk F1 | DQS0# — Data strobe 0 complement |
| Pin produk F2 | VDDQ — I/O power supply |
| Pin produk F3 | A0 — Address input 0 |
| Pin produk G1 | A1 — Address input 1 |
| Pin produk G2 | VSS — Ground |
| Pin produk G3 | A2 — Address input 2 |
| Pin produk H1 | A3 — Address input 3 |
| Pin produk H2 | VDD — Power supply |
| Pin produk H3 | A4 — Address input 4 |
| Pin produk J1 | A5 — Address input 5 |
| Pin produk J2 | VSS — Ground |
| Pin produk J3 | A6 — Address input 6 |
| Pin produk K1 | A7 — Address input 7 |
| Pin produk K2 | VDDQ — I/O power supply |
| Pin produk K3 | A8 — Address input 8 |
| Pin produk L1 | A9 — Address input 9 |
| Pin produk L2 | VSS — Ground |
| Pin produk L3 | A10 — Address input 10 |
| Pin produk M1 | A11 — Address input 11 |
| Pin produk M2 | VDD — Power supply |
| Pin produk M3 | A12 — Address input 12 |
| Pin produk N1 | BA0 — Bank address 0 |
| Pin produk N2 | VSS — Ground |
| Pin produk N3 | BA1 — Bank address 1 |
| Pin produk P1 | BA2 — Bank address 2 |
| Pin produk P2 | VDDQ — I/O power supply |
| Pin produk P3 | RAS# — Row address strobe |
| Pin produk R1 | CAS# — Column address strobe |
| Pin produk R2 | VSS — Ground |
| Pin produk R3 | WE# — Write enable |
| Pin produk T1 | CS# — Chip select |
| Pin produk T2 | VDD — Power supply |
| Pin produk T3 | CKE — Clock enable |
| Pin produk U1 | ODT — On-die termination |
| Pin produk U2 | VSS — Ground |
| Pin produk U3 | CK — Clock |
| Pin produk V1 | CK# — Complementary clock |
| Pin produk V2 | VDDQ — I/O power supply |
| Pin produk V3 | RESET# — Reset |
Aplikasi Umum
W634GU6RB09J cocok untuk 6 aplikasis: Mobile Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Automotive Infotainment, Embedded Systems.
Mobile Computing
The W634GU6RB09J's low 1.35V operation and 4Gbit density make it ideal for laptops, tablets, and ultrabooks where power efficiency and compact size are critical. Its 1066MHz data rate supports smooth multitasking and responsive performance. The 96-VFBGA package saves PCB space, enabling thinner designs. With a 20ns CAS latency, it provides fast access to frequently used data, enhancing user experience.
Direkomendasikan
Networking Equipment
In routers, switches, and network appliances, the W634GU6RB09J provides high-bandwidth memory for packet buffering and routing tables. Its 1066MHz data rate ensures low-latency data transfer, while the 4Gbit capacity supports large forwarding databases. The low power consumption reduces heat generation in dense networking hardware. The device's on-die termination and write leveling features maintain signal integrity at high speeds, crucial for reliable network operation.
Direkomendasikan
Industrial Automation
The W634GU6RB09J is suitable for industrial controllers and PLCs that require reliable, high-speed memory for real-time data processing. Its wide operating temperature range (0°C to +95°C) ensures performance in harsh environments. The 4Gbit density allows for extensive data logging and complex control algorithms. The low voltage operation reduces power consumption in 24/7 operation, and the compact package fits into space-limited control modules.
Direkomendasikan
Consumer Electronics
For smart TVs, set-top boxes, and gaming consoles, the W634GU6RB09J offers the memory bandwidth needed for high-definition video streaming and gaming. Its 1066MHz speed supports smooth graphics rendering, while the 4Gbit capacity handles multiple applications simultaneously. The low power consumption is beneficial for energy-efficient consumer devices. The small VFBGA package enables slim product designs, and the RoHS compliance meets environmental regulations.
Direkomendasikan
Automotive Infotainment
The W634GU6RB09J is used in automotive infotainment systems for navigation, audio, and video playback. Its 1.35V operation reduces power draw from the vehicle's electrical system, and the 4Gbit density supports large map databases and media files. The device's temperature range is suitable for cabin environments. The high data rate ensures responsive user interfaces, and the compact package fits into dashboard electronics.
Direkomendasikan
Embedded Systems
In embedded systems like single-board computers and IoT gateways, the W634GU6RB09J provides high-capacity memory for running operating systems and applications. Its low power consumption is ideal for battery-powered devices, and the 1066MHz speed ensures responsive performance. The 96-VFBGA package is suitable for compact embedded boards. The device's self-refresh mode reduces standby power, extending battery life in portable embedded systems.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk W634GU6RB09J — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | W634GU6RB-09 | W634GU6RB12J | MT41K256M16HA-125 | K4B4G1646D-BYK0 |
|---|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Winbond | Winbond | Winbond | Micron | Samsung |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Data Rate | 1066 MHz | 1066 MHz | 1200 MHz | 1066 MHz | 1066 MHz |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| CAS Latency | 20 ns | 20 ns | 15 ns | 20 ns | 20 ns |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Diferensiator Kunci
- Low voltage operation (vsMT41K256M16HA-125)
- Higher speed grade option (vsW634GU6RB-09)
- Compact package (vsK4B4G1646D-BYK0)
Catatan Desain
For reliable operation at 1066MHz, ensure controlled impedance traces for DQ, DQS, and address/command lines. Use 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within ±0.5mm for data lines and ±1mm for address/command. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.
The W634GU6RB09J operates up to +95°C case temperature. In high-ambient environments, ensure adequate airflow or a heatsink. The 96-VFBGA package has a thermal resistance of approximately 20°C/W (theta_JA). For a 1W power dissipation, the junction temperature rise is 20°C above ambient. Monitor the case temperature to stay within limits.
Use on-die termination (ODT) settings to match the memory bus impedance. For point-to-point connections, set ODT to 40 ohms. For multi-rank configurations, adjust ODT dynamically. Implement write leveling and read leveling as per JEDEC DDR3L specifications to compensate for clock skew. Keep the clock and strobe traces length-matched to avoid setup/hold violations.
Informasi Konformitas
Winbond states all Flash products are Halogen-Free and RoHS compliant. AEC-Q100 not applicable for this commercial-grade part.
