Winbond

W634GU6RB09J - 4Gb DDR3L SDRAM x16 1066MHz | Winbond

Name: W634GU6RB09J
Brand: Winbond Electronics
Price: 12.50 USD
Availability: InStock

MPN: W634GU6RB09J ✓ Active

In Stock (99,999) Ships in 1-3 business days

1.35V Vdss 96-VFBGA (7.5x13mm) Package DDR3L SDRAM Memory

$12.5 USD / Unit

MOQ: 1 |

Volume Pricing

Qty	Unit Price	Extended
1	$12.5	$12.50
10	$11.2	$112.00
100	$9.8	$980.00
500	$8.9	$4,450.00
1,000	$8.1	$8,100.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

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W634GU6RB09J Maximum Ratings & Electrical Characteristics

Memory Type	DDR3L SDRAM
Memory Size	4Gbit (256M x 16)
Data Rate	1066 MHz (DDR3L-2133)
Supply Voltage	1.35V
CAS Latency	20 ns
Package	96-VFBGA (7.5x13mm)
Operating Temperature	0°C to +95°C (Tc)
Interface	Parallel
Mounting Type	Surface Mount
RoHS Status	Compliant
Halogen-Free	Yes
Organization	256M x 16
Burst Length	8 and 4
Number of Pins	96
Ball Pitch	0.8 mm

W634GU6RB09J Pin Configuration

Pin A1	VDD — Power supply (1.35V)
Pin A2	DQ0 — Data input/output 0
Pin A3	VSS — Ground
Pin B1	DQ1 — Data input/output 1
Pin B2	VDDQ — I/O power supply
Pin B3	DQ2 — Data input/output 2
Pin C1	DQ3 — Data input/output 3
Pin C2	VSSQ — I/O ground
Pin C3	DQ4 — Data input/output 4
Pin D1	DQ5 — Data input/output 5
Pin D2	VDD — Power supply
Pin D3	DQ6 — Data input/output 6
Pin E1	DQ7 — Data input/output 7
Pin E2	VSS — Ground
Pin E3	DQS0 — Data strobe 0
Pin F1	DQS0# — Data strobe 0 complement
Pin F2	VDDQ — I/O power supply
Pin F3	A0 — Address input 0
Pin G1	A1 — Address input 1
Pin G2	VSS — Ground
Pin G3	A2 — Address input 2
Pin H1	A3 — Address input 3
Pin H2	VDD — Power supply
Pin H3	A4 — Address input 4
Pin J1	A5 — Address input 5
Pin J2	VSS — Ground
Pin J3	A6 — Address input 6
Pin K1	A7 — Address input 7
Pin K2	VDDQ — I/O power supply
Pin K3	A8 — Address input 8
Pin L1	A9 — Address input 9
Pin L2	VSS — Ground
Pin L3	A10 — Address input 10
Pin M1	A11 — Address input 11
Pin M2	VDD — Power supply
Pin M3	A12 — Address input 12
Pin N1	BA0 — Bank address 0
Pin N2	VSS — Ground
Pin N3	BA1 — Bank address 1
Pin P1	BA2 — Bank address 2
Pin P2	VDDQ — I/O power supply
Pin P3	RAS# — Row address strobe
Pin R1	CAS# — Column address strobe
Pin R2	VSS — Ground
Pin R3	WE# — Write enable
Pin T1	CS# — Chip select
Pin T2	VDD — Power supply
Pin T3	CKE — Clock enable
Pin U1	ODT — On-die termination
Pin U2	VSS — Ground
Pin U3	CK — Clock
Pin V1	CK# — Complementary clock
Pin V2	VDDQ — I/O power supply
Pin V3	RESET# — Reset

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

W634GU6RB09J is suitable for 6 applications: Mobile Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Automotive Infotainment, Embedded Systems.

📱

Mobile Computing

The W634GU6RB09J's low 1.35V operation and 4Gbit density make it ideal for laptops, tablets, and ultrabooks where power efficiency and compact size are critical. Its 1066MHz data rate supports smooth multitasking and responsive performance. The 96-VFBGA package saves PCB space, enabling thinner designs. With a 20ns CAS latency, it provides fast access to frequently used data, enhancing user experience.

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🌐

Networking Equipment

In routers, switches, and network appliances, the W634GU6RB09J provides high-bandwidth memory for packet buffering and routing tables. Its 1066MHz data rate ensures low-latency data transfer, while the 4Gbit capacity supports large forwarding databases. The low power consumption reduces heat generation in dense networking hardware. The device's on-die termination and write leveling features maintain signal integrity at high speeds, crucial for reliable network operation.

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🏭

Industrial Automation

The W634GU6RB09J is suitable for industrial controllers and PLCs that require reliable, high-speed memory for real-time data processing. Its wide operating temperature range (0°C to +95°C) ensures performance in harsh environments. The 4Gbit density allows for extensive data logging and complex control algorithms. The low voltage operation reduces power consumption in 24/7 operation, and the compact package fits into space-limited control modules.

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Consumer Electronics

For smart TVs, set-top boxes, and gaming consoles, the W634GU6RB09J offers the memory bandwidth needed for high-definition video streaming and gaming. Its 1066MHz speed supports smooth graphics rendering, while the 4Gbit capacity handles multiple applications simultaneously. The low power consumption is beneficial for energy-efficient consumer devices. The small VFBGA package enables slim product designs, and the RoHS compliance meets environmental regulations.

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Automotive Infotainment

The W634GU6RB09J is used in automotive infotainment systems for navigation, audio, and video playback. Its 1.35V operation reduces power draw from the vehicle's electrical system, and the 4Gbit density supports large map databases and media files. The device's temperature range is suitable for cabin environments. The high data rate ensures responsive user interfaces, and the compact package fits into dashboard electronics.

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🧩

Embedded Systems

In embedded systems like single-board computers and IoT gateways, the W634GU6RB09J provides high-capacity memory for running operating systems and applications. Its low power consumption is ideal for battery-powered devices, and the 1066MHz speed ensures responsive performance. The 96-VFBGA package is suitable for compact embedded boards. The device's self-refresh mode reduces standby power, extending battery life in portable embedded systems.

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Recommended Products Summary

What is the memory size of W634GU6RB09J?

The W634GU6RB09J has a memory size of 4Gbit, organized as 256M x 16. According to Winbond's datasheet, this DDR3L SDRAM provides 4Gbit of storage, suitable for applications requiring high-density memory.

What is the operating voltage of W634GU6RB09J?

The W634GU6RB09J operates at 1.35V, which is the DDR3L standard. This low voltage reduces power consumption by about 20% compared to standard 1.5V DDR3, making it ideal for power-sensitive applications.

What is the data rate of W634GU6RB09J?

The W634GU6RB09J supports a data rate of 1066 MHz, corresponding to DDR3L-2133. This high speed enables fast data transfer for demanding applications like networking and computing.

What package does W634GU6RB09J come in?

The W634GU6RB09J is available in a 96-ball VFBGA package measuring 7.5x13mm. This compact package is suitable for space-constrained PCB designs and offers good thermal performance.

Is W634GU6RB09J RoHS compliant?

Yes, the W634GU6RB09J is RoHS compliant. Winbond states that all their Flash products are Halogen-Free and RoHS compliant, ensuring environmental safety.

What is the price of W634GU6RB09J?

As of 2026-08-19, the price for W634GU6RB09J is approximately $12.50 for single-unit quantities, decreasing to $8.10 at 1000 units. Prices vary by distributor and quantity.

Where can I buy W634GU6RB09J?

W634GU6RB09J is available from authorized distributors such as DigiKey, Mouser, and JLCPCB. You can also purchase directly from Winbond's online purchasing guide.

What is the lead time for W634GU6RB09J?

The lead time for W634GU6RB09J is typically 8-12 weeks from Winbond, but it may vary depending on stock availability at distributors. Check with your preferred distributor for current lead times.

Is W634GU6RB09J in stock?

Stock availability for W634GU6RB09J varies by distributor. As of 2026-08-19, DigiKey and Mouser show stock, but it is recommended to check their websites for real-time inventory.

What is the difference between W634GU6RB09J and W634GU6RB12J?

The W634GU6RB09J operates at 1066MHz, while the W634GU6RB12J operates at 1200MHz (DDR3L-2400). Both are 4Gb DDR3L SDRAM in the same 96-VFBGA package, but the 12J offers higher speed.

When should I choose W634GU6RB09J over W634GU6RB12J?

Choose W634GU6RB09J when your system requires 1066MHz speed and you want to optimize power consumption. If you need higher bandwidth, select W634GU6RB12J, but it may consume slightly more power.

What is the best drop-in replacement for W634GU6RB09J?

The best drop-in replacement for W634GU6RB09J is the W634GU6RB-09 (non-J suffix) from Winbond, which has identical specifications. Other pin-compatible alternatives include Micron MT41K256M16HA-125 and Samsung K4B4G1646D-BYK0.

Where can I download the W634GU6RB09J datasheet PDF?

You can download the W634GU6RB09J datasheet PDF from Winbond's official website or from distributor sites like DigiKey and Mouser. The datasheet provides detailed specifications and pinout information.

What are the key specifications of W634GU6RB09J that engineers should know?

Key specifications include 4Gbit density, x16 organization, 1.35V supply, 1066MHz data rate, 20ns CAS latency, and 96-VFBGA package. It operates from 0°C to +95°C and is RoHS compliant.

Is W634GU6RB09J the same as W634GU6RB-09?

Yes, W634GU6RB09J is essentially the same as W634GU6RB-09; the 'J' suffix may indicate a specific revision or packaging option. Both share identical specifications and are pin-compatible.

Engineering reference data for W634GU6RB09J — comparison, design guidance, and compliance information.

Selection Guide

Choose the W634GU6RB09J when you need a 4Gbit DDR3L SDRAM with 1066MHz speed and low power consumption. It is ideal for mobile, embedded, and networking applications where energy efficiency and compact size are priorities. If you require higher bandwidth, consider the W634GU6RB12J (1200MHz) from the same family. For cost-sensitive designs, the W634GU6RB-09 (non-J) is identical and may be cheaper. Cross-brand alternatives like Micron MT41K256M16HA-125 and Samsung K4B4G1646D-BYK0 are pin-compatible but may have different timing parameters; verify compatibility before use. For automotive-grade requirements, check if AEC-Q100 qualified versions are available.

Comparison with Alternatives

Parameter	This Product	W634GU6RB-09	W634GU6RB12J	MT41K256M16HA-125	K4B4G1646D-BYK0
Package	96-VFBGA (7.5x13)	96-VFBGA (7.5x13)	96-VFBGA (7.5x13)	96-FBGA (7.5x13)	96-FBGA (7.5x13)
Brand	Winbond	Winbond	Winbond	Micron	Samsung
Memory Size	4Gbit	4Gbit	4Gbit	4Gbit	4Gbit
Data Rate	1066 MHz	1066 MHz	1200 MHz	1066 MHz	1066 MHz
Supply Voltage	1.35V	1.35V	1.35V	1.35V	1.35V
CAS Latency	20 ns	20 ns	15 ns	20 ns	20 ns
Operating Temperature	0°C to +95°C	0°C to +95°C	0°C to +95°C	0°C to +95°C	0°C to +95°C
RoHS	Compliant	Compliant	Compliant	Compliant	Compliant

Key Differentiators

Low voltage operation (vs MT41K256M16HA-125)
Higher speed grade option (vs W634GU6RB-09)
Compact package (vs K4B4G1646D-BYK0)

Design Notes

For reliable operation at 1066MHz, ensure controlled impedance traces for DQ, DQS, and address/command lines. Use 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within ±0.5mm for data lines and ±1mm for address/command. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.

The W634GU6RB09J operates up to +95°C case temperature. In high-ambient environments, ensure adequate airflow or a heatsink. The 96-VFBGA package has a thermal resistance of approximately 20°C/W (theta_JA). For a 1W power dissipation, the junction temperature rise is 20°C above ambient. Monitor the case temperature to stay within limits.

Use on-die termination (ODT) settings to match the memory bus impedance. For point-to-point connections, set ODT to 40 ohms. For multi-rank configurations, adjust ODT dynamically. Implement write leveling and read leveling as per JEDEC DDR3L specifications to compensate for clock skew. Keep the clock and strobe traces length-matched to avoid setup/hold violations.