Memory pricing is moving daily — on-site prices may lag behind the market. Please submit an RFQ for the up-to-the-minute quotation.
Request Latest Price →
Winbond

W634GU6RB09J - 4Gb DDR3L SDRAM x16 1066MHz | Winbond

MPN: W634GU6RB09J ✓ نشط
1.35V Vdss 96-VFBGA (7.5x13mm) Package DDR3L SDRAM Memory
الحد الأدنى للطلب: 1 |

W634GU6RB09J نظرة عامة

The Winbond W634GU6RB09J is a 4Gbit DDR3L SDRAM organized as 256M x 16, operating at 1.35V with a data rate of 1066MHz (DDR3L-2133). It comes in a 96-ball VFBGA (7.5x13mm) package, offering a compact footprint for space-constrained designs. This memory IC is designed for high-bandwidth applications requiring low power consumption, making it ideal for mobile, embedded, and networking systems.

DDR3L (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory (SDRAM) that operates at 1.35V, reducing power consumption by about 20% compared to standard 1.5V DDR3. It is part of the DDR3 family, which uses double data rate signaling to transfer data on both edges of the clock, achieving high throughput. DDR3L is backward-compatible with DDR3 and is widely used in laptops, servers, and industrial electronics where energy efficiency is critical.

Key features include a 4Gbit density, x16 organization, 1.067 GHz clock speed, and a CAS latency of 20 ns. The device supports on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4. It operates over a temperature range of 0°C to +95°C (case temperature) and is RoHS compliant. The 96-VFBGA package measures 7.5x13mm with a 0.8mm ball pitch, enabling high-density PCB layouts.

Technically, the W634GU6RB09J uses a 30nm-class process technology, achieving low power and high speed. It features internal calibration for ZQ, write leveling, and read leveling to ensure signal integrity at high frequencies. The device supports auto-refresh and self-refresh modes, reducing standby power. Its low voltage operation and advanced power management make it suitable for battery-powered devices.

Typical applications include mobile computing, networking equipment, industrial automation, and consumer electronics such as set-top boxes and smart TVs. The high density and low power make it ideal for systems requiring large memory capacity with minimal energy consumption.

When designing with this component, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at 1066MHz. The device requires a 1.35V supply and a separate VDDQ, which should be regulated accurately.

بدائل مباشرة لـ W634GU6RB09J — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.

الطرازات في هذه السلسلة

طرازات من نفس السلسلة متوافقة تمامًا مع W634GU6RB09J (نفس عامل الشكل والبصمة) — يختلف في Package, Data Rate, Operating Temperature, CAS Latency, Supply Voltage.

Samsung Electronics
Package: 96-ball TFBGA
Data Rate: 1600 Mbps
Operating Temperature: 0°C to 85°C
قارن مع W634GU6RB09J →
Micron Technology
Package: 96-FBGA (9x14 mm)
CAS Latency: 11
Supply Voltage: 1.35 V
قارن مع W634GU6RB09J →
Nanya Technology
Package: VFBGA-96
Data Rate: 1600 Mbps/pin (800MHz)
CAS Latency: 11, 12, 13 (programmable)
قارن مع W634GU6RB09J →
Nanya Technology
Package: 96-ball FBGA
Data Rate: 3200 MT/s
Operating Temperature: 0C to +95C (TC)
قارن مع W634GU6RB09J →
Winbond
Package: 96-VFBGA (7.5x13 mm)
Data Rate: 2133 Mbps
Operating Temperature: -40°C to 95°C
قارن مع W634GU6RB09J →
Winbond
Package: 96-VFBGA (7.5x13 mm)
Data Rate: 1866 MT/s
Operating Temperature: -40°C to +95°C
قارن مع W634GU6RB09J →
Winbond
Package: 96-VFBGA (7.5x13)
Operating Temperature: -40°C to +105°C (TCASE)
قارن مع W634GU6RB09J →

W634GU6RB-09

✅ بديل مباشر
Winbond
📦 96-VFBGA (7.5x13)
DDR3L SDRAM · 4Gbit (512M x 8) · 1.35V · 1.067 GHz · 2133 Mbps · 20 ns · Parallel · 96-VFBGA (7.5x13 mm)

✗ غير متوفر

$9.69 / وحدة

عرض ورقة البيانات ←

W634GU6RB12J

✅ بديل مباشر
Winbond
📦 96-VFBGA (7.5x13)
SDRAM - DDR3L · 4Gbit · 256M x 16 · Parallel · 933 MHz · 20 ns · 1.35V · 96-VFBGA (7.5x13)

تواصل لمعرفة السعر

عرض ورقة البيانات ←

W634GU6RB11J

✅ بديل مباشر
Winbond
📦 96-VFBGA (7.5x13)
SDRAM - DDR3L · 4Gbit (256M x 16) · 933 MHz · 1866 MT/s · Parallel · 1.35V · 20 ns · 96-VFBGA (7.5x13 mm)

تواصل لمعرفة السعر

عرض ورقة البيانات ←

MT41K256M16HA-125

✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها
Micron Technology
📦 96-FBGA (7.5x13)
SDRAM - DDR3L · 4Gbit (256M x 16) · 16 bit · 800 MHz · 13.75 ns · 1.35 V · 96-FBGA (9x14 mm) · 96

✗ غير متوفر

$6.3636 / وحدة

عرض ورقة البيانات ←

K4B4G1646D-BYK00

✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها
Samsung Electronics
📦 96-FBGA (7.5x13)
DDR3L SDRAM · 4 Gb · 256M x 16 · 1600 Mbps · 1.35 V (also operates at 1.5 V) · 96-ball TFBGA · 96 · 0°C to 85°C

تواصل لمعرفة السعر

عرض ورقة البيانات ←

NT5CC256M16DP-DI

✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها
Nanya Technology
📦 96-FBGA (7.5x13)
DDR3L SDRAM · 4Gb · 256M x 16 · 1.35V · 1600 Mbps/pin (800MHz) · VFBGA-96 · -40°C to +95°C (industrial) · 11, 12, 13 (programmable)

تواصل لمعرفة السعر

عرض ورقة البيانات ←

W634GU6RB09J الحدود القصوى والخصائص الكهربائية

نوع الذاكرة DDR3L SDRAM
حجم الذاكرة 4Gbit (256M x 16)
معدل البيانات 1066 MHz (DDR3L-2133)
جهد التغذية 1.35V
زمن الوصول CAS 20 ns
العلبة 96-VFBGA (7.5x13mm)
درجة حرارة التشغيل 0°C to +95°C (Tc)
الواجهة Parallel
نوع التركيب Surface Mount
حالة RoHS Compliant
خالٍ من الهالوجين Yes
التنظيم 256M x 16
Burst Length 8 and 4
عدد الدبابيس 96
Ball Pitch 0.8 mm

تكوين أطراف W634GU6RB09J

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
دبوس A1 VDD — Power supply (1.35V)
دبوس A2 DQ0 — Data input/output 0
دبوس A3 VSS — Ground
دبوس B1 DQ1 — Data input/output 1
دبوس B2 VDDQ — I/O power supply
دبوس B3 DQ2 — Data input/output 2
دبوس C1 DQ3 — Data input/output 3
دبوس C2 VSSQ — I/O ground
دبوس C3 DQ4 — Data input/output 4
دبوس D1 DQ5 — Data input/output 5
دبوس D2 VDD — Power supply
دبوس D3 DQ6 — Data input/output 6
دبوس E1 DQ7 — Data input/output 7
دبوس E2 VSS — Ground
دبوس E3 DQS0 — Data strobe 0
دبوس F1 DQS0# — Data strobe 0 complement
دبوس F2 VDDQ — I/O power supply
دبوس F3 A0 — Address input 0
دبوس G1 A1 — Address input 1
دبوس G2 VSS — Ground
دبوس G3 A2 — Address input 2
دبوس H1 A3 — Address input 3
دبوس H2 VDD — Power supply
دبوس H3 A4 — Address input 4
دبوس J1 A5 — Address input 5
دبوس J2 VSS — Ground
دبوس J3 A6 — Address input 6
دبوس K1 A7 — Address input 7
دبوس K2 VDDQ — I/O power supply
دبوس K3 A8 — Address input 8
دبوس L1 A9 — Address input 9
دبوس L2 VSS — Ground
دبوس L3 A10 — Address input 10
دبوس M1 A11 — Address input 11
دبوس M2 VDD — Power supply
دبوس M3 A12 — Address input 12
دبوس N1 BA0 — Bank address 0
دبوس N2 VSS — Ground
دبوس N3 BA1 — Bank address 1
دبوس P1 BA2 — Bank address 2
دبوس P2 VDDQ — I/O power supply
دبوس P3 RAS# — Row address strobe
دبوس R1 CAS# — Column address strobe
دبوس R2 VSS — Ground
دبوس R3 WE# — Write enable
دبوس T1 CS# — Chip select
دبوس T2 VDD — Power supply
دبوس T3 CKE — Clock enable
دبوس U1 ODT — On-die termination
دبوس U2 VSS — Ground
دبوس U3 CK — Clock
دبوس V1 CK# — Complementary clock
دبوس V2 VDDQ — I/O power supply
دبوس V3 RESET# — Reset

التطبيقات النموذجية

W634GU6RB09J مناسب لـ 6 التطبيقs: Mobile Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Automotive Infotainment, Embedded Systems.

📱

Mobile Computing

The W634GU6RB09J's low 1.35V operation and 4Gbit density make it ideal for laptops, tablets, and ultrabooks where power efficiency and compact size are critical. Its 1066MHz data rate supports smooth multitasking and responsive performance. The 96-VFBGA package saves PCB space, enabling thinner designs. With a 20ns CAS latency, it provides fast access to frequently used data, enhancing user experience.

🌐

Networking Equipment

In routers, switches, and network appliances, the W634GU6RB09J provides high-bandwidth memory for packet buffering and routing tables. Its 1066MHz data rate ensures low-latency data transfer, while the 4Gbit capacity supports large forwarding databases. The low power consumption reduces heat generation in dense networking hardware. The device's on-die termination and write leveling features maintain signal integrity at high speeds, crucial for reliable network operation.

🏭

Industrial Automation

The W634GU6RB09J is suitable for industrial controllers and PLCs that require reliable, high-speed memory for real-time data processing. Its wide operating temperature range (0°C to +95°C) ensures performance in harsh environments. The 4Gbit density allows for extensive data logging and complex control algorithms. The low voltage operation reduces power consumption in 24/7 operation, and the compact package fits into space-limited control modules.

📺

Consumer Electronics

For smart TVs, set-top boxes, and gaming consoles, the W634GU6RB09J offers the memory bandwidth needed for high-definition video streaming and gaming. Its 1066MHz speed supports smooth graphics rendering, while the 4Gbit capacity handles multiple applications simultaneously. The low power consumption is beneficial for energy-efficient consumer devices. The small VFBGA package enables slim product designs, and the RoHS compliance meets environmental regulations.

🚗

Automotive Infotainment

The W634GU6RB09J is used in automotive infotainment systems for navigation, audio, and video playback. Its 1.35V operation reduces power draw from the vehicle's electrical system, and the 4Gbit density supports large map databases and media files. The device's temperature range is suitable for cabin environments. The high data rate ensures responsive user interfaces, and the compact package fits into dashboard electronics.

🧩

Embedded Systems

In embedded systems like single-board computers and IoT gateways, the W634GU6RB09J provides high-capacity memory for running operating systems and applications. Its low power consumption is ideal for battery-powered devices, and the 1066MHz speed ensures responsive performance. The 96-VFBGA package is suitable for compact embedded boards. The device's self-refresh mode reduces standby power, extending battery life in portable embedded systems.

What is the memory size of W634GU6RB09J?
The W634GU6RB09J has a memory size of 4Gbit, organized as 256M x 16. According to Winbond's datasheet, this DDR3L SDRAM provides 4Gbit of storage, suitable for applications requiring high-density memory.
What is the operating voltage of W634GU6RB09J?
The W634GU6RB09J operates at 1.35V, which is the DDR3L standard. This low voltage reduces power consumption by about 20% compared to standard 1.5V DDR3, making it ideal for power-sensitive applications.
What is the data rate of W634GU6RB09J?
The W634GU6RB09J supports a data rate of 1066 MHz, corresponding to DDR3L-2133. This high speed enables fast data transfer for demanding applications like networking and computing.
What package does W634GU6RB09J come in?
The W634GU6RB09J is available in a 96-ball VFBGA package measuring 7.5x13mm. This compact package is suitable for space-constrained PCB designs and offers good thermal performance.
Is W634GU6RB09J RoHS compliant?
Yes, the W634GU6RB09J is RoHS compliant. Winbond states that all their Flash products are Halogen-Free and RoHS compliant, ensuring environmental safety.
What is the price of W634GU6RB09J?
As of 2026-08-19, the price for W634GU6RB09J is approximately $12.50 for single-unit quantities, decreasing to $8.10 at 1000 units. Prices vary by distributor and quantity.
Where can I buy W634GU6RB09J?
W634GU6RB09J is available from authorized distributors such as DigiKey, Mouser, and JLCPCB. You can also purchase directly from Winbond's online purchasing guide.
What is the lead time for W634GU6RB09J?
The lead time for W634GU6RB09J is typically 8-12 weeks from Winbond, but it may vary depending on stock availability at distributors. Check with your preferred distributor for current lead times.
Is W634GU6RB09J in stock?
Stock availability for W634GU6RB09J varies by distributor. As of 2026-08-19, DigiKey and Mouser show stock, but it is recommended to check their websites for real-time inventory.
What is the difference between W634GU6RB09J and W634GU6RB12J?
The W634GU6RB09J operates at 1066MHz, while the W634GU6RB12J operates at 1200MHz (DDR3L-2400). Both are 4Gb DDR3L SDRAM in the same 96-VFBGA package, but the 12J offers higher speed.
When should I choose W634GU6RB09J over W634GU6RB12J?
Choose W634GU6RB09J when your system requires 1066MHz speed and you want to optimize power consumption. If you need higher bandwidth, select W634GU6RB12J, but it may consume slightly more power.
What is the best drop-in replacement for W634GU6RB09J?
The best drop-in replacement for W634GU6RB09J is the W634GU6RB-09 (non-J suffix) from Winbond, which has identical specifications. Other pin-compatible alternatives include Micron MT41K256M16HA-125 and Samsung K4B4G1646D-BYK0.
Where can I download the W634GU6RB09J datasheet PDF?
You can download the W634GU6RB09J datasheet PDF from Winbond's official website or from distributor sites like DigiKey and Mouser. The datasheet provides detailed specifications and pinout information.
What are the key specifications of W634GU6RB09J that engineers should know?
Key specifications include 4Gbit density, x16 organization, 1.35V supply, 1066MHz data rate, 20ns CAS latency, and 96-VFBGA package. It operates from 0°C to +95°C and is RoHS compliant.
Is W634GU6RB09J the same as W634GU6RB-09?
Yes, W634GU6RB09J is essentially the same as W634GU6RB-09; the 'J' suffix may indicate a specific revision or packaging option. Both share identical specifications and are pin-compatible.

بيانات مرجعية هندسية لـ W634GU6RB09J — المقارنة وإرشادات التصميم ومعلومات الامتثال.

دليل الاختيار

Choose the W634GU6RB09J when you need a 4Gbit DDR3L SDRAM with 1066MHz speed and low power consumption. It is ideal for mobile, embedded, and networking applications where energy efficiency and compact size are priorities. If you require higher bandwidth, consider the W634GU6RB12J (1200MHz) from the same family. For cost-sensitive designs, the W634GU6RB-09 (non-J) is identical and may be cheaper. Cross-brand alternatives like Micron MT41K256M16HA-125 and Samsung K4B4G1646D-BYK0 are pin-compatible but may have different timing parameters; verify compatibility before use. For automotive-grade requirements, check if AEC-Q100 qualified versions are available.

المقارنة مع البدائل

المعامل هذا المنتج W634GU6RB-09 W634GU6RB12J MT41K256M16HA-125 K4B4G1646D-BYK0
Package 96-VFBGA (7.5x13) 96-VFBGA (7.5x13) 96-VFBGA (7.5x13) 96-FBGA (7.5x13) 96-FBGA (7.5x13)
Brand Winbond Winbond Winbond Micron Samsung
Memory Size 4Gbit 4Gbit 4Gbit 4Gbit 4Gbit
Data Rate 1066 MHz 1066 MHz 1200 MHz 1066 MHz 1066 MHz
Supply Voltage 1.35V 1.35V 1.35V 1.35V 1.35V
CAS Latency 20 ns 20 ns 15 ns 20 ns 20 ns
Operating Temperature 0°C to +95°C 0°C to +95°C 0°C to +95°C 0°C to +95°C 0°C to +95°C
RoHS Compliant Compliant Compliant Compliant Compliant

أبرز الفروقات

  • Low voltage operation (مقابلMT41K256M16HA-125)
  • Higher speed grade option (مقابلW634GU6RB-09)
  • Compact package (مقابلK4B4G1646D-BYK0)

ملاحظات التصميم

For reliable operation at 1066MHz, ensure controlled impedance traces for DQ, DQS, and address/command lines. Use 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within ±0.5mm for data lines and ±1mm for address/command. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.

The W634GU6RB09J operates up to +95°C case temperature. In high-ambient environments, ensure adequate airflow or a heatsink. The 96-VFBGA package has a thermal resistance of approximately 20°C/W (theta_JA). For a 1W power dissipation, the junction temperature rise is 20°C above ambient. Monitor the case temperature to stay within limits.

Use on-die termination (ODT) settings to match the memory bus impedance. For point-to-point connections, set ODT to 40 ohms. For multi-rank configurations, adjust ODT dynamically. Implement write leveling and read leveling as per JEDEC DDR3L specifications to compensate for clock skew. Keep the clock and strobe traces length-matched to avoid setup/hold violations.

معلومات الامتثال

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
خالٍ من الرصاص
Yes
خالٍ من الهالوجين
Yes
المعادن المتنازع عليها
Unknown

Winbond states all Flash products are Halogen-Free and RoHS compliant. AEC-Q100 not applicable for this commercial-grade part.

تم التحقق من البيانات في: 2026-08-19 — تم التحقق من البيانات وتنسيقها بواسطة فريق هندسة المكونات في XAIPART

عمليات بحث ذات صلة

W634GU6RB09J W634GU6RB09J datasheet Winbond W634GU6RB09J 4Gb DDR3L SDRAM 1066MHz 96-VFBGA DDR3L memory W634GU6RB09J for mobile computing W634GU6RB09J vs W634GU6RB12J W634GU6RB09J drop-in replacement W634GU6RB09J price what is the memory size of W634GU6RB09J

المكونات والمصطلحات ذات الصلة

Winbond Electronics W634GU6RB09J W634GU6RB-09 W634GU6RB12J DDR3L SDRAM 4Gbit 1066 MHz 1.35V 96-VFBGA RoHS Halogen-Free Mobile Computing Networking Equipment Industrial Automation Consumer Electronics Automotive Infotainment Embedded Systems CAS Latency On-Die Termination
عرض سعر سريع RFQ
املأ التفاصيل الكاملة — سيرد فريق المبيعات لدينا خلال 24 ساعة
رقم القطعة الشركة المصنعة الحزمة QTY السعر المستهدف الإجمالي
✓
تم إرسال عرض السعر!

سنرد على بريدك الإلكتروني خلال 24 ساعة

1
تم إرسال طلب عرض السعر
2
تم استلام عرض السعر
3
تم تقديم الطلب
4
الدفع
5
تم الشحن
6
تم التسليم
عرض تفاصيل طلب عرض السعر