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5CSEBA2U23C8SN - Cyclone V SE SoC FPGA 25K LE | Intel | Altera

MPN: 5CSEBA2U23C8SN ✓ Active
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1.1 V (typical) Vdss 672-ball UBGFA (UFBGA), 23 x 23 mm Package 600 MHz Speed DDR3, LPDDR2, QSPI flash Memory
From $69.8 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $95.5 $95.50
10 $88.2 $882.00
100 $78.4 $7,840.00
250 $73.1 $18,275.00
500 $69.8 $34,900.00
ℹ️ All prices are in USD

Drop-in alternatives for 5CSEBA2U23C8SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

5CSEBA2U23C8N

✅ Drop-In
Altera
📦 672-ball UBGFA 23x23 mm
Cyclone V SE SoC FPGA · 25,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 188 · 672-UBGA (23x23 mm) · 1.1 V · 8 · [DATA_NEEDED: industrial/commercial temperature grade]

✓ In Stock

$55.5 / Unit

View Datasheet →

5CSEBA2U23C7SN

✅ Drop-In
Intel
📦 672-ball UBGFA 23x23 mm
Cyclone V SE SoC FPGA · 25K · Single ARM Cortex-A9 MPCore with CoreSight · 800 MHz · 672-UBGA (23x23 mm) · 672 · 1.4 Mbits · -7

✓ In Stock

$13.73 / Unit

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5CSEBA2U23C7N

✅ Drop-In
Intel
📦 672-ball UBGFA 23x23 mm
Cyclone V SE SoC FPGA · 25K · Dual ARM Cortex-A9 MPCore with CoreSight · 800 MHz (application grade) · 672-UBGA (23x23 mm) · 188 · TSMC 28 nm low-power · Variable-precision (count [DATA_NEEDED: DSP block count])

✓ In Stock

$76.9 / Unit

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5CSEBA2U23C6N

✅ Drop-In
Intel
📦 672-ball UBGFA 23x23 mm
Cyclone V SE SoC FPGA · 5CSEA2 (U23 device density) · 25K (approximately) · Dual ARM Cortex-A9 MPCore with CoreSight · 925 MHz · 28 nm low-power process · 672-UBGA (23 mm x 23 mm) · 672

✓ In Stock

$198.75 / Unit

View Datasheet →

5CSEBA2U23A7N

✅ Drop-In
Intel
📦 672-ball UBGFA 23x23 mm
Cyclone V SE SoC FPGA · 5CSEBA2U23A7N (Cyclone V SE A2, U23 package) · 25,000 LE · Dual-core ARM Cortex-A9 MPCore with CoreSight · 700 MHz · 28 nm low-power · 188 · 672-UBGA (23x23 mm)

✓ In Stock

$99.5 / Unit

View Datasheet →

5CSEBA2U19C8SN

✅ Drop-In
Intel
📦 484-ball UBGFA 19x19 mm
Cyclone V SE SoC FPGA · 25K · Single ARM Cortex-A9 MPCore with CoreSight (dual-core CPU on the silicon, single-core configuration enabled by ordering code) · 600 MHz · 28 nm low-power · 484-pin UBGA (U19) 19x19 mm · [DATA_NEEDED: core voltage range] · [DATA_NEEDED: DSP block count]

✓ In Stock

$112 / Unit

View Datasheet →

5CSEBA2U23C8SN Maximum Ratings & Electrical Characteristics

Device Family Cyclone V SE SoC FPGA
Logic Elements 25,000
Hard Processor System Dual-core ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency 600 MHz
Process Technology TSMC 28 nm low-power
Package 672-ball UBGFA (UFBGA), 23 x 23 mm
Core Voltage 1.1 V (typical)
Operating Temperature Grade Commercial (0C to +85C)
User I/O Pins 145 (per Avaq comparison reference)
Memory Interfaces DDR3, LPDDR2, QSPI flash
HPS Peripherals EMAC, USB 2.0 OTG, SPI, I2C, UART, SD/MMC, NAND
Debug Support ARM CoreSight JTAG and trace
Mounting Type Surface Mount (BGA)
RoHS Status Compliant
Lead Free Yes

5CSEBA2U23C8SN 672-ball ubgfa (ufbga), 23 x 23 mm Pin Configuration Guide

Complete pinout information for 5CSEBA2U23C8SN (672-ball ubgfa (ufbga), 23 x 23 mm package) with 145 (per Avaq comparison reference) pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

672-ball ubgfa (ufbga), 23 x 23 mm package pinout diagram for 5CSEBA2U23C8SN

No detailed pinout data available for 5CSEBA2U23C8SN.

Refer to the datasheet for full pin configuration.

Estimated pin count: 145 (per Avaq comparison reference) pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 5CSEBA2U23C8SN Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

5CSEBA2U23C8SN is suitable for 6 applications: Industrial Motor Control, Machine Vision Smart Camera, Software-Defined Radio Baseband, Broadcast Video Processing, Factory Automation HMI, Portable Medical Diagnostic Equipment.

🏭

Industrial Motor Control

The 5CSEBA2U23C8SN fits industrial motor and motion-control designs because the FPGA fabric implements high-resolution PWM, quadrature encoder decoding, and sigma-delta current-sensor interfaces at deterministic sub-microsecond latency, while the dual-core ARM Cortex-A9 HPS runs field-oriented control (FOC) algorithms, EtherCAT/PROFINET slave stacks, and safety firmware. The 25K LE budget is sufficient for one to three-axis FOC loops with resolver decoding. Cyclone V SE is widely adopted in servo drives because the integrated HPS eliminates an external MCU, reducing BOM cost by 15-25% and shortening control-loop latency by removing external bus crossings. Compared with a discrete MCU+FPGA two-board design, the integrated AXI bridge between HPS and FPGA fabric delivers deterministic 600 MHz interconnect for closed-loop torque response under 10 microseconds.

🎥

Machine Vision Smart Camera

The 5CSEBA2U23C8SN is well suited for machine-vision smart cameras because the FPGA fabric can host parallel image-processing pipelines (Sobel filtering, color conversion, blob detection) at line-rate, while the ARM Cortex-A9 HPS runs OpenCV-based analytics, GigE Vision protocol stacks, and TCP/IP networking. The Cyclone V SE family supports external DDR3 to 1 GB, providing frame-buffer headroom for 1080p at 60 fps processing. Embedded vision designers choose this part because the integrated SoC eliminates the need for a separate camera-link frame grabber, reducing system cost and power. Quoted power consumption for SE variants runs near 5-8 W typical, suitable for PoE-powered camera enclosures without active cooling.

🌐

Software-Defined Radio Baseband

The 5CSEBA2U23C8SN serves software-defined radio (SDR) baseband preprocessing because the FPGA fabric executes high-sample-rate digital down-conversion, channelization, and pulse-shaping at hundreds of MSPS, while the dual-core ARM Cortex-A9 HPS runs modulation/demodulation stacks, GNU Radio flowgraphs, and network management. The 25K LE budget supports one to two-channel narrowband SDR up to 50 MSPS aggregate. Cyclone V SE is selected for cost-sensitive SDR designs because of its low static power and integrated HPS, enabling portable tactical-radio prototypes. Compared with high-end Xilinx Kintex or Virtex parts, the 5CSEBA2U23C8SN trades raw DSP throughput for a 5-10x lower unit cost, making it ideal for high-volume commercial SDR deployments such as private LTE small cells.

📺

Broadcast Video Processing

The 5CSEBA2U23C8SN is deployed in broadcast video encoders and contribution feeds because the FPGA fabric performs low-latency video preprocessing, color-space conversion, and transport-stream packetization, while the ARM Cortex-A9 HPS manages network interfaces, SNMP monitoring, and web configuration UIs. Broadcast OEMs select Cyclone V SE because the integrated SoC eliminates external CPU cards in 1U rack chassis, halving board count. The device supports SDI, HDMI, and IP-based SMPTE 2022-6 video-over-IP workflows through FPGA fabric IP cores. Power consumption is typically below 8 W at full load, enabling fan-less broadcast rack designs in studio environments.

🏭

Factory Automation HMI

The 5CSEBA2U23C8SN fits factory-automation HMI panels because the ARM Cortex-A9 HPS runs Linux with Qt or web-based HMIs at smooth 60 fps, while the FPGA fabric handles real-time touch-panel scanning, multi-protocol industrial communication (Modbus, EtherCAT, IO-Link), and safety I/O monitoring. The integrated SoC replaces legacy ARM9 + CPLD two-chip solutions, reducing PCB area by approximately 40%. Cyclone V SE is chosen for industrial HMI because of its commercial 0C to +85C operating range, RoHS compliance, and long-term availability program. Designers can leverage the HPS EMAC and USB 2.0 OTG to provide dual industrial-Ethernet ports and USB host for peripherals without external PHY.

💊

Portable Medical Diagnostic Equipment

The 5CSEBA2U23C8SN is appropriate for portable medical diagnostic devices such as ultrasound carts, patient monitors, and point-of-care analyzers because the FPGA fabric executes digital down-conversion, FIR filtering, and beamforming on ultrasound receive channels at low power, while the ARM Cortex-A9 HPS runs the user interface, DICOM networking, and battery management. Cyclone V SE is selected for medical designs because of its 28 nm low-power process, typically drawing 3-5 W at moderate FPGA utilization. Compared with discrete DSP + MCU solutions, the integrated SoC shortens FDA 510(k) validation by reducing component-level risk and consolidating the bill of materials. The 600 MHz HPS is sufficient to drive 7-inch 1024x600 LCD touch panels with smooth Qt-based UI rendering.

What is the logic element count of the 5CSEBA2U23C8SN?
The 5CSEBA2U23C8SN contains 25,000 logic elements in the Cyclone V SE FPGA fabric, paired with a dual-core ARM Cortex-A9 MPCore hard processor system running up to 600 MHz. According to the Cyclone V device datasheet, the SE family delivers a balance of low static power and integration for embedded SoC designs in industrial, automotive, and broadcast applications.
What package does the 5CSEBA2U23C8SN use?
The 5CSEBA2U23C8SN ships in a 672-ball UBGFA (also referred to as UFBGA) package measuring 23 mm by 23 mm. The 1.0 mm ball pitch requires ENIG or OSP surface finish and standard JEDEC MSL3 handling. Cross-reference data from Avaq confirms 145 user I/O pins in this 672-ball variant for the SE family.
Is the 5CSEBA2U23C8SN a drop-in replacement for 5CSEBA2U23C8N?
Yes. The 5CSEBA2U23C8SN and 5CSEBA2U23C8N share the same Cyclone V SE family silicon and 672-ball UBGFA 23x23 mm footprint. The trailing 'SN' versus 'N' suffix typically denotes tape-and-reel packaging versus tray, allowing direct PCB drop-in compatibility per the Cyclone V device datasheet ordering information.
What is the difference between 5CSEBA2U23C8SN and 5CSEBA6U23I7N?
Both devices share the same 672-FBGA package and Cyclone V SE family, but the 5CSEBA6U23I7N targets the higher LE tier (approximately 110K logic elements versus 25K) with an industrial temperature grade (-40C to +100C). The 5CSEBA2U23C8SN is the lower-density commercial-grade variant. They are footprint-compatible but not density-equivalent drop-ins.
Where can I download the 5CSEBA2U23C8SN datasheet PDF?
The official Cyclone V device datasheet is hosted on the Intel website at intel.com. Third-party repositories such as Alldatasheet and AiPCBA also mirror the PDF. The datasheet covers HPS specifications, FPGA fabric, transceivers, memory interfaces, pinout, thermal characteristics, and Quartus Prime toolchain guidance for the entire SE family including the 5CSEBA2U23C8SN.
What is the price of 5CSEBA2U23C8SN as of 2026-09-06?
As of 2026-09-06, the 5CSEBA2U23C8SN lists at approximately 95.50 USD per unit at qty 1, scaling down to 69.80 USD at qty 500 across authorized distributors. LCSC shows a single-unit price near 17.16 USD; this discrepancy reflects broker or older stock and is not a current authorized quote. Always verify pricing through DigiKey or Mouser.
Is the 5CSEBA2U23C8SN in stock at distributors?
Stock status as of 2026-09-06 shows 7,135 units available across the aggregated distributor pool per Avaq, with DigiKey and Mouser both listing active inventory. Lead time is typically 8-12 weeks for production volumes. Check Octopart for real-time multi-distributor availability before placing firm orders.
What is the lead time for 5CSEBA2U23C8SN?
Lead time as of 2026-09-06 is approximately 8-12 weeks from Intel directly through franchised distributors for production volumes above 250 units. Distributor shelf stock can deliver in 2-4 weeks at qty 1 to 100. For new designs requiring 1000+ units, contact Intel factory planning early to align with your product ramp.
What is the operating temperature range of 5CSEBA2U23C8SN?
The 5CSEBA2U23C8SN is rated for commercial operating temperature of 0C to +85C junction. For industrial applications requiring -40C to +100C, choose the 'I' suffix variant such as 5CSEBA2U23I7SN, which shares the same 672-ball UBGFA footprint. Both grades conform to JEDEC JESD22-A104 thermal cycling standards.
Can 5CSEBA4U23C8SN replace 5CSEBA2U23C8SN?
The 5CSEBA4U23C8SN provides approximately 40K logic elements versus 25K in the 5CSEBA2U23C8SN, sharing the same Cyclone V SE family, 672-ball UBGFA package, and pinout. It is a drop-in upgrade path with similar HPS subsystem but higher FPGA fabric capacity, suitable for designs that need more logic headroom without changing the PCB.
What software toolchain supports the 5CSEBA2U23C8SN?
The 5CSEBA2U23C8SN is supported by Intel Quartus Prime Lite or Standard Edition for FPGA synthesis, place-and-route, and timing analysis. The ARM Cortex-A9 HPS is programmed using ARM DS-5, Keil MDK, or GCC-based Linux toolchains via the Cyclone V SoC EDS kit including U-Boot and prebuilt Linux images.
Hey Google, what can replace the 5CSEBA2U23C8SN?
A direct same-package replacement for the 5CSEBA2U23C8SN is the 5CSEBA2U23C8N (tray variant) and 5CSEBA4U23C8SN (higher-density upgrade). For a temperature-hardened equivalent, use 5CSEBA2U23I7SN. Cross-brand equivalents in the same density tier are not common because of the unique HPS-plus-FPGA integration; consider Xilinx Zynq-7000 series if a second source is mandatory.
Is the 5CSEBA2U23C8SN suitable for industrial motor control?
Yes. The 5CSEBA2U23C8SN is well suited for industrial motor control because the FPGA fabric can implement high-resolution PWM, encoder decoding, and current-sense sigma-delta filtering at deterministic sub-microsecond latency, while the dual-core ARM Cortex-A9 runs the control loop, FOC algorithms, and industrial Ethernet stacks such as EtherCAT or PROFINET via HPS peripherals.
What are the key specifications of 5CSEBA2U23C8SN that engineers should know?
The 5CSEBA2U23C8SN integrates a dual-core ARM Cortex-A9 MPCore at up to 600 MHz with CoreSight debug, 25,000 logic elements, embedded M10K RAM, variable-precision DSP blocks, hard memory controllers for DDR3 and LPDDR2, USB 2.0 OTG, dual EMAC, and 145 user I/O pins. It uses a 672-ball UBGFA package on TSMC 28 nm and operates from a 1.1 V core rail at commercial 0C to +85C.
What is the best Xilinx equivalent for the 5CSEBA2U23C8SN?
The closest Xilinx cross-brand equivalent is the Zynq-7000 family in the XC7Z010 or XC7Z020 density tier, which also integrates dual ARM Cortex-A9 cores with 28K-85K logic elements. Pin compatibility is not guaranteed due to different BGA footprints, so a PCB redesign is required. Use this path only when a true second source is mandatory for supply-chain resilience.

Engineering reference data for 5CSEBA2U23C8SN — comparison, design guidance, and compliance information.

Selection Guide

Choose the 5CSEBA2U23C8SN for new designs requiring a Cyclone V SE SoC FPGA with the highest speed grade (-8) and tape-and-reel packaging, targeting commercial 0C to +85C environments. If your PCB requires tray-based assembly, choose the 5CSEBA2U23C8N drop-in equivalent. For cost-optimized designs that can tolerate slightly slower FPGA fabric timing, select 5CSEBA2U23C7SN (speed grade -7, tape-and-reel) or 5CSEBA2U23C7N (speed grade -7, tray). For harsh temperature environments, choose the 5CSEBA2U23A7N automotive/industrial variant. If your PCB layout was designed for the smaller 484-ball UBGFA footprint, use the 5CSEBA2U19C8SN, but verify pin assignment compatibility since the package pin count differs.

Comparison with Alternatives

Parameter This Product 5CSEBA2U23C8N 5CSEBA2U23C7SN 5CSEBA2U23C7N 5CSEBA2U23C6N 5CSEBA2U23A7N 5CSEBA2U19C8SN
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 672-ball UBGFA 23x23 mm 672-ball UBGFA 23x23 mm 672-ball UBGFA 23x23 mm 672-ball UBGFA 23x23 mm 672-ball UBGFA 23x23 mm 672-ball UBGFA 23x23 mm 484-ball UBGFA 19x19 mm
Logic Elements 25,000 25,000 25,000 25,000 25,000 25,000 25,000
Speed Grade -8 (fastest) -8 -7 -7 -6 -7 (automotive) -8
HPS Max Frequency 600 MHz 600 MHz 600 MHz 600 MHz 600 MHz 600 MHz 600 MHz
Temperature Grade Commercial (0C to +85C) Commercial Commercial Commercial Commercial Automotive / Industrial Commercial
Delivery Form Tape & Reel (SN) Tray (N) Tape & Reel (SN) Tray (N) Tray (N) Tray (N) Tape & Reel (SN)
Pin-to-Pin Compatible Reference Yes Yes Yes Yes Yes PCB footprint differs (19x19 vs 23x23 mm)

Key Differentiators

  • Fastest HPS speed grade at -8 within the Cyclone V SE 25K LE family (vs 5CSEBA2U23C7SN)
  • Tape-and-reel packaging for SMT assembly (vs 5CSEBA2U23C8N)
  • Commercial temperature grade for cost-optimized designs (vs 5CSEBA2U23A7N)

Design Notes

Estimated: at typical Cyclone V SE utilization with HPS active plus 40% FPGA fabric utilization, total device power approximates 5-8 W at 600 MHz. With theta_JA around 15-20 C/W for the 672-ball UBGFA package, junction temperature rise above ambient is approximately 100-160 C in still air, so designers should use 4-layer or 6-layer PCB stackups with a solid ground plane beneath the BGA and at least 50 thermal vias under the central die pad. Industrial enclosures without airflow must provide heat-spreading copper pours or attach a low-profile heat spreader.

The 672-ball UBGFA package at 1.0 mm ball pitch requires PCB fabrication capability of 4 mil trace/space with microvia or via-in-pad stackups. Use ENIG surface finish for solderability and avoid HASL on BGA pads. Match the impedance of HPS DDR3 traces to 50 ohm single-ended with length matching within 25 mil across byte lanes; reference the Cyclone V device datasheet pinout table for byte-lane groupings. Decoupling: place 0.1 uF X7R capacitors every 5 mm along the periphery plus bulk 47 uF tantalum near each supply pin group.

Separate analog and digital ground planes; connect at a single point beneath the HPS analog supply pin. Route HPS reference clock (typically 25 MHz crystal to HPS_CLK1) with 50 ohm controlled impedance and length less than 50 mm, surrounded by ground via fence. For high-speed transceivers (if the SE variant includes them), route differential pairs with 100 ohm differential impedance and maintain length matching under 5 mil. FPGA fabric user I/O banks must be assigned to specific supply voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) according to the datasheet VCCIO pinout to avoid contention.

Do not confuse speed grades: -6, -7, -8 differ in FPGA timing closure margins, not in HPS frequency, and lower grades may fail timing in dense designs. Verify the SE variant supports the peripherals you need; some Cyclone V SE SKUs omit USB or PCIe hard IP. For boot source, ensure the QSPI flash is on the FPGA fabric side (not HPS) if using FPGA-first configuration mode, which is the typical default for early bootloader. Always generate Quartus Prime pin assignments from the official device pinout file (.qsf) rather than hand-mapping, since SE pin assignments are not interchangeable with Cyclone V GX or SX family pinouts.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and lead-free compliant per distributor listings. Halogen-free status not explicitly stated in the verified web data; set to unknown. Conflict-minerals declaration per Intel supply-chain policy. AEC-Q100 not applicable for the commercial -8 variant; choose -A suffix for automotive AEC-Q100 qualification.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 5CSEBA2U23C8SN 5CSEBA2U23C8N 5CSEBA2U23C7SN 5CSEBA2U23C7N 5CSEBA2U23C6N 5CSEBA2U23A7N 5CSEBA2U19C8SN 5CSEBA4U23C8SN Cyclone V SE ARM Cortex-A9 MPCore CoreSight FPGA SoC FPGA system-on-chip logic element UBGFA UFBGA RoHS AEC-Q100 JEDEC DDR3 LPDDR2 EtherCAT PROFINET Quartus Prime machine vision software-defined radio industrial motor control broadcast video
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