5CSEBA6U23C8SN - Cyclone V SE SoC FPGA, 110K LE, ARM Cortex-A9 | Intel
MPN: 5CSEBA6U23C8SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 250 | $1495 | $373,750.00 |
| 500 | $1420 | $710,000.00 |
Drop-in alternatives for 5CSEBA6U23C8SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA6U23C8N
✅ Drop-In✓ In Stock
$132 / Unit
View Datasheet →5CSEBA6U23C7SN
✅ Drop-In✓ In Stock
$410 / Unit
View Datasheet →5CSEBA6U23C7N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →5CSEBA5U23C8SN
✅ Drop-In✓ In Stock
$198.5 / Unit
View Datasheet →5CSEBA4U23C8SN
✅ Drop-In✓ In Stock
$15.95 / Unit
View Datasheet →5CSEBA2U23C8SN
✅ Drop-In✓ In Stock
$69.8 / Unit
View Datasheet →5CSEBA6U19C8SN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$205 / Unit
View Datasheet →5CSEBA6U23C8SN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Device Designator | 5CSEBA6 (U23 speed grade, 8 speed) |
| Logic Elements | 110,000 |
| HPS Processor | Single ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz |
| DSP Blocks | 224 (18x18 multipliers) |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | DDR2/DDR3 with ECC (HPS) |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, NAND, SD/MMC, I2C, SPI, UART |
| LVDS Channels | Up to 17 (875 Mbps) |
| Process Technology | TSMC 28 nm low-power |
| Package | 672-ball UBGA (23x23 mm) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5CSEBA6U23C8SN 672-ball ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA6U23C8SN (672-ball ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U23C8SN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA6U23C8SN is suitable for 6 applications: Industrial Machine Vision Systems, Motor Control and Drive Systems, Broadcast Video Processing Equipment, Factory Automation Controllers, Portable Medical Instrumentation, Automotive Infotainment and ADAS Prototypes.
Industrial Machine Vision Systems
The 5CSEBA6U23C8SN fits industrial machine vision systems because its single ARM Cortex-A9 MPCore at 600 MHz runs Linux with image processing stacks (OpenCV) while the 110K LE FPGA fabric accelerates Bayer demosaicing, edge extraction, and HDR pixel pipelines. The HPS Gigabit Ethernet MAC supports GigE Vision camera interfaces at wire speed, and the USB 2.0 OTG enables flash or Wi-Fi dongle connectivity. With 224 DSP blocks, the FPGA can implement real-time convolution kernels at 1080p60 frame rates. Hardened DDR3 with ECC memory controller handles 4 GB of frame buffers without FPGA fabric overhead, and 4.45 Mbits embedded memory supports line buffers for multi-tap filters. Industrial camera OEMs benefit from BOM reduction by replacing MCU + FPGA dual-chip designs with a single SoC FPGA.
Recommended
Motor Control and Drive Systems
The 5CSEBA6U23C8SN is well suited for AC induction, BLDC, and servo motor control drives because the ARM Cortex-A9 HPS executes the velocity/torque control loops while the FPGA fabric implements deterministic PWM generation, encoder decoding (QEP, SSI, EnDat), and field-oriented control (FOC) math. The HPS floating-point NEON media engine accelerates Park/Clarke transforms, and 224 DSP blocks enable 50 kHz current loop rates with sub-microsecond latency. Hardened peripherals (CAN, SPI, I2C, UART) integrate directly with industrial networking stacks (CANopen, EtherCAT slave) and the dual-port Ethernet MAC supports EtherCAT with external PHY. The 28 nm low-power process keeps drive inverter enclosures below thermal limits, critical for IPM-mounted designs.
Recommended
Broadcast Video Processing Equipment
The 5CSEBA6U23C8SN supports broadcast video processing applications including HDMI switching, video scaling, and broadcast format conversion. The FPGA fabric implements 3G-SDI/HD-SDI transceivers via LVDS channels (up to 17 LVDS pairs at 875 Mbps), color space conversion, and deinterlacing at full 1080p60. The HPS runs a Linux media stack handling HDMI-CEC, HDCP authentication, and audio mixing via I2S. The 4.45 Mbits embedded memory serves as line buffers for scaling, and 224 DSP blocks accelerate 2D FIR filters for chroma upsampling. Single-Cyclone-V BOM replaces discrete FPGA + host MCU + HDMI bridge chips, reducing board area and BOM cost in professional AV rack equipment.
Recommended
Factory Automation Controllers
The 5CSEBA6U23C8SN drives factory automation controllers because the single ARM Cortex-A9 HPS runs a real-time Linux or RTOS (FreeRTOS, VxWorks) handling Modbus/TCP, OPC-UA, and PROFINET slave stacks, while the FPGA fabric implements deterministic glue logic, multi-axis PWM, and safety interlocks. The hardened peripherals (CAN, SPI, I2C, UART) interface directly to industrial sensors and actuators. 17 LVDS channels support high-speed industrial cameras, and 224 DSP blocks accelerate vibration analysis FFTs at 50 kHz sample rates for predictive maintenance. DDR3 with ECC provides radiation-tolerant memory for harsh factory environments with electrical noise, and 28 nm low-power process enables fanless DIN-rail mounted controller designs.
Recommended
Portable Medical Instrumentation
The 5CSEBA6U23C8SN suits portable medical devices such as patient monitors, ultrasound beamformers, and point-of-care diagnostic analyzers because the ARM Cortex-A9 HPS runs the GUI and connectivity stack (Wi-Fi, BLE, USB) while the FPGA fabric performs signal acquisition, digital filtering, and DSP at deterministic latency. The 4.45 Mbits embedded memory buffers ADC samples before DMA to DDR, and 224 DSP blocks accelerate FIR decimation filters for ECG, EMG, or pulse oximetry front-ends. Low static power from the 28 nm process extends battery life in handheld designs, and the small 672-ball UBGA footprint fits compact portable enclosures. Hardened USB 2.0 OTG enables direct connection to hospital EMR systems for bedside data upload.
Recommended
Automotive Infotainment and ADAS Prototypes
The 5CSEBA6U23C8SN powers automotive infotainment prototypes and pre-production ADAS sensor-fusion platforms because the single ARM Cortex-A9 MPCore runs QNX or Linux with full instrument-cluster graphics stacks, while the FPGA fabric implements MIPI-CSI2 camera aggregation (up to 17 LVDS channels), surround-view stitching, and lane-detection algorithms in DSP blocks. The HPS CAN interfaces integrate with vehicle bus networks, and 224 DSP blocks accelerate 360-degree video stitching at 30 fps. For pre-production prototypes, this SoC FPGA delivers the deterministic real-time processing required for ADAS before committing to an ASIC. Designers should note the SE class is not AEC-Q100 qualified - production vehicles require ASIL-rated automotive processors.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U23C8SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U23C8N | 5CSEBA6U23C7SN | 5CSEBA5U23C8SN | 5CSEBA4U23C8SN |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball UBGA (23x23, U23) | 672-ball UBGA (23x23, U23) - same | 672-ball UBGA (23x23, U23) - same | 672-ball UBGA (23x23, U23) - same | 672-ball UBGA (23x23, U23) - same |
| Logic Elements | 110,000 | 110,000 | 110,000 | 85,000 | 49,000 |
| DSP Blocks | 224 | 224 | 224 | 156 | 116 |
| Embedded Memory (Mbits) | 4.45 | 4.45 | 4.45 | 3.97 | 3.16 |
| HPS Processor | Single ARM Cortex-A9 600 MHz | Single ARM Cortex-A9 600 MHz | Single ARM Cortex-A9 600 MHz | Single ARM Cortex-A9 600 MHz | Single ARM Cortex-A9 600 MHz |
| Speed Grade | 8 (commercial) | 8 (commercial) | 7 (commercial) | 8 (commercial) | 8 (commercial) |
| RoHS Compliance | Yes (leaded, SN suffix) | Yes (lead-free, N suffix) | Yes (leaded, SN suffix) | Yes (leaded, SN suffix) | Yes (leaded, SN suffix) |
Key Differentiators
- Highest logic element count in Cyclone V SE SoC family (vs 5CSEBA5U23C8SN)
- Highest DSP block count among 5CSEBAx variants (vs 5CSEBA4U23C8SN)
- Speed grade 8 provides the highest performance in the family (vs 5CSEBA6U23C7SN)
Design Notes
The Cyclone V SE SoC FPGA requires a multi-rail power supply: VCCINT (1.1V core for FPGA fabric and HPS), VCCPD (2.5V/3.3V I/O pre-drivers), VCCIO (1.2V-3.3V I/O banks), and HPS-specific VCC_HPS (1.1V core) plus HPS_VCCIO. Use a dedicated sequencing controller such as the TPS3808 or LTC3026 to enforce power-up sequencing. Estimated: typical total board power is 5-10W depending on fabric utilization and HPS workload; HPS-only idle draws approximately 1.5W, while full utilization (HPS + 110K LE @ 60% toggle rate) draws 8-12W. Decoupling: place 0402 ceramic capacitors every 20 balls with 1 uF near each supply pin and 100 nF bulk caps at supply entry points.
The 672-ball UBGA package has theta_JA of approximately 14 C/W with standard JEDEC 2s2p PCB. At 8W dissipation, the junction-to-ambient temperature rise is approximately 112C, which will exceed the 100C commercial limit. For designs exceeding 5W, use a 4-layer PCB with continuous inner ground planes, multiple thermal vias under the package center, and consider a heatsink or active airflow. Cyclone V SE supports thermal diode output for in-system monitoring via the HPS temperature sensor. Estimated: junction temperature at 8W with standard 4-layer PCB is approximately TJ = TA + 8W * 14 C/W = TA + 112C; ensure TA < 88C for commercial grade operation.
BGA fanout strategy: use microvia (laser-drilled, 0.1 mm pitch) stackup with 1-2 signal layers per BGA row. Avoid via-in-pad unless assembly supports it (ENIG + gold plating). Differential pair routing (LVDS, USB, Ethernet) must maintain 100 ohm differential impedance with length matching within 150 mil. DDR3 routing requires fly-by topology for address/command signals with series termination at the controller; data byte lanes must be length-matched within 50 mil. Quartus Prime DDR3 IP provides PCB guidelines; otherwise follow JEDEC JESD79-3.
Common pitfalls: (1) HPS ball functions are fixed - attempting to repurpose them as FPGA I/O causes configuration failure; consult the pin tables before layout. (2) JTAG chain - always include a 10-pin Cortex Debug + Altera JTAG header for development; production boards should populate a JTAG header only on validation units. (3) Configuration scheme - selecting AS (active serial) mode requires a valid EPCQ flash; do not boot from JTAG only in production. (4) SE class SoC FPGA does NOT include transceivers - for serial protocols above 1 Gbps, choose SX or ST variants.
Use Quartus Prime pin planner early in the design to assign FPGA ball functions and validate against HPS fixed pinout. Bank voltage selection (VCCIO 1.2V, 1.5V, 1.8V, 2.5V, 3.3V) must match your external logic; mixing voltages within a bank is not supported. Clock routing: place dedicated clock input pins near the FPGA corner to minimize jitter from CLK skew. The HPS has dedicated clock pins (HPS_CLK1, HPS_CLK2) that should be driven from low-jitter crystal oscillators rather than the FPGA fabric. Reference Intel Cyclone V Device Handbook pin tables for recommended pin assignments.
Compliance Information
RoHS compliant per Intel product page. The 'SN' suffix denotes leaded finish; the 'N' suffix variant is lead-free. The Cyclone V SE SoC family is not AEC-Q100 qualified - production automotive designs must use qualified processors such as TDA2x or ASIL-rated components.
