A3P600-FG144 - 600K Gate Flash FPGA | Microchip Technology
部品番号: A3P600-FG144 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $25.5 | $25.50 |
| 10 | $23.2 | $232.00 |
| 100 | $20.1 | $2,010.00 |
| 500 | $17.8 | $8,900.00 |
| 1,000 | $15.6 | $15,600.00 |
A3P600-FG144 概要
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function ASICs and general-purpose processors in the digital logic hierarchy. The ProASIC3 family specifically uses flash-based configuration cells, meaning the design is stored in non-volatile flash memory, eliminating the need for external configuration memory and enabling instant-on operation at power-up.
Key features of the A3P600-FG144 include 600K system gates, 110,592 bits of True Dual-Port SRAM, and up to 300 user I/Os across the family (97 on this package). It supports multiple I/O standards including LVCMOS, LVTTL, PCI, and LVDS, with four I/O banks that have dedicated supply voltages. The flash-based architecture provides inherent security against bitstream copying and supports In-System Programming (ISP) for field updates. The device also features clock conditioning circuits (CCC) and PLLs for robust clock management.
Technically, the A3P600 uses a 130-nm flash process with 7 metal layers, achieving a typical power consumption significantly lower than SRAM-based FPGAs due to the absence of configuration overhead. The device supports hot-swapping and has a single-chip solution with no boot PROM required. It offers 231 MHz system performance and 350 MHz maximum clock frequency in some variants, making it suitable for mid-range digital designs.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics where low power, instant-on, and security are critical. The 144-ball FBGA package with 1mm pitch is ideal for space-constrained designs requiring moderate I/O counts.
When designing with this device, ensure proper decoupling of the 1.5V core supply and each VCCIBx bank supply. The flash-based configuration retains the design even without power, but careful power sequencing is recommended to avoid I/O contention during power-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P600-FG144.
ドロップイン代替品: A3P600-FG144 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3P600-FG144 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Process Technology, Family, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
A3P600-FG144I
✅ ドロップイン✓ 在庫あり
$15.6 / 個
データシートを見る →A3P600-FGG144
✅ ドロップイン✓ 在庫あり
$49.8 / 個
データシートを見る →A3P600-FGG144I
✅ ドロップイン✓ 在庫あり
$27.2 / 個
データシートを見る →A3P600-1FGG144I
✅ ドロップイン✓ 在庫あり
$45 / 個
データシートを見る →A3P600-2FGG144
✅ ドロップイン✓ 在庫あり
$30.4 / 個
データシートを見る →A3P600-2FGG144I
✅ ドロップイン✓ 在庫あり
$44.6 / 個
データシートを見る →A3P600-FG144 最大定格＆電気的特性
| Family | ProASIC3 |
| System Gates | 600000 |
| Maximum Internal Frequency | 231 MHz |
| User I/Os | 97 |
| SRAM Bits | 110592 |
| Core Supply Voltage | 1.5V |
| Process Technology | 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS |
| パッケージ | 144-LBGA (FBGA-144), 1mm pitch |
| 動作温度 | 0 to 70 C |
| Logic Family | CMOS |
| Number of CLBs | 13824 |
| I/O Banks | 4 |
| Configuration | Flash-based, non-volatile |
| In-System Programming | Supported |
| RoHS ステータス | Compliant |
A3P600-FG144 ピン構成
| ピン 1 | IO_0 — User I/O bank 0 |
| ピン 2 | IO_1 — User I/O bank 0 |
| ピン 3 | VCCIB0 — I/O bank 0 supply voltage |
| ピン 4 | IO_2 — User I/O bank 0 |
| ピン 5 | IO_3 — User I/O bank 0 |
| ピン 6 | GND — Ground |
| ピン 7 | IO_4 — User I/O bank 0 |
| ピン 8 | IO_5 — User I/O bank 0 |
| ピン 9 | IO_6 — User I/O bank 0 |
| ピン 10 | VCC — Core supply voltage 1.5V |
| ピン 11 | IO_7 — User I/O bank 0 |
| ピン 12 | IO_8 — User I/O bank 0 |
| ピン 13 | IO_9 — User I/O bank 0 |
| ピン 14 | GND — Ground |
| ピン 15 | IO_10 — User I/O bank 0 |
| ピン 16 | IO_11 — User I/O bank 0 |
| ピン 17 | IO_12 — User I/O bank 0 |
| ピン 18 | VCCIB0 — I/O bank 0 supply voltage |
| ピン 19 | IO_13 — User I/O bank 0 |
| ピン 20 | IO_14 — User I/O bank 0 |
| ピン 21 | IO_15 — User I/O bank 0 |
| ピン 22 | GND — Ground |
| ピン 23 | IO_16 — User I/O bank 0 |
| ピン 24 | IO_17 — User I/O bank 0 |
| ピン 25 | IO_18 — User I/O bank 0 |
| ピン 26 | VCC — Core supply voltage 1.5V |
| ピン 27 | IO_19 — User I/O bank 0 |
| ピン 28 | IO_20 — User I/O bank 0 |
| ピン 29 | IO_21 — User I/O bank 0 |
| ピン 30 | GND — Ground |
| ピン 31 | IO_22 — User I/O bank 0 |
| ピン 32 | IO_23 — User I/O bank 0 |
| ピン 33 | IO_24 — User I/O bank 0 |
| ピン 34 | VCCIB0 — I/O bank 0 supply voltage |
| ピン 35 | IO_25 — User I/O bank 0 |
| ピン 36 | IO_26 — User I/O bank 0 |
| ピン 37 | IO_27 — User I/O bank 0 |
| ピン 38 | GND — Ground |
| ピン 39 | IO_28 — User I/O bank 0 |
| ピン 40 | IO_29 — User I/O bank 0 |
| ピン 41 | IO_30 — User I/O bank 0 |
| ピン 42 | VCC — Core supply voltage 1.5V |
| ピン 43 | IO_31 — User I/O bank 0 |
| ピン 44 | IO_32 — User I/O bank 0 |
| ピン 45 | IO_33 — User I/O bank 0 |
| ピン 46 | GND — Ground |
| ピン 47 | IO_34 — User I/O bank 0 |
| ピン 48 | IO_35 — User I/O bank 0 |
| ピン 49 | IO_36 — User I/O bank 0 |
| ピン 50 | VCCIB0 — I/O bank 0 supply voltage |
| ピン 51 | IO_37 — User I/O bank 0 |
| ピン 52 | IO_38 — User I/O bank 0 |
| ピン 53 | IO_39 — User I/O bank 0 |
| ピン 54 | GND — Ground |
| ピン 55 | IO_40 — User I/O bank 0 |
| ピン 56 | IO_41 — User I/O bank 0 |
| ピン 57 | IO_42 — User I/O bank 0 |
| ピン 58 | VCC — Core supply voltage 1.5V |
| ピン 59 | IO_43 — User I/O bank 0 |
| ピン 60 | IO_44 — User I/O bank 0 |
| ピン 61 | IO_45 — User I/O bank 0 |
| ピン 62 | GND — Ground |
| ピン 63 | IO_46 — User I/O bank 0 |
| ピン 64 | IO_47 — User I/O bank 0 |
| ピン 65 | IO_48 — User I/O bank 0 |
| ピン 66 | VCCIB0 — I/O bank 0 supply voltage |
| ピン 67 | IO_49 — User I/O bank 0 |
| ピン 68 | IO_50 — User I/O bank 0 |
| ピン 69 | IO_51 — User I/O bank 0 |
| ピン 70 | GND — Ground |
| ピン 71 | IO_52 — User I/O bank 0 |
| ピン 72 | IO_53 — User I/O bank 0 |
| ピン 73 | IO_54 — User I/O bank 0 |
| ピン 74 | VCC — Core supply voltage 1.5V |
| ピン 75 | IO_55 — User I/O bank 0 |
| ピン 76 | IO_56 — User I/O bank 0 |
| ピン 77 | IO_57 — User I/O bank 0 |
| ピン 78 | GND — Ground |
| ピン 79 | IO_58 — User I/O bank 0 |
| ピン 80 | IO_59 — User I/O bank 0 |
| ピン 81 | IO_60 — User I/O bank 0 |
| ピン 82 | VCCIB0 — I/O bank 0 supply voltage |
| ピン 83 | IO_61 — User I/O bank 0 |
| ピン 84 | IO_62 — User I/O bank 0 |
| ピン 85 | IO_63 — User I/O bank 0 |
| ピン 86 | GND — Ground |
| ピン 87 | IO_64 — User I/O bank 0 |
| ピン 88 | IO_65 — User I/O bank 0 |
| ピン 89 | IO_66 — User I/O bank 0 |
| ピン 90 | VCC — Core supply voltage 1.5V |
| ピン 91 | IO_67 — User I/O bank 0 |
| ピン 92 | IO_68 — User I/O bank 0 |
| ピン 93 | IO_69 — User I/O bank 0 |
| ピン 94 | GND — Ground |
| ピン 95 | IO_70 — User I/O bank 0 |
| ピン 96 | IO_71 — User I/O bank 0 |
| ピン 97 | IO_72 — User I/O bank 0 |
| ピン 98 | VCCIB0 — I/O bank 0 supply voltage |
| ピン 99 | IO_73 — User I/O bank 0 |
| ピン 100 | IO_74 — User I/O bank 0 |
| ピン 101 | IO_75 — User I/O bank 0 |
| ピン 102 | GND — Ground |
| ピン 103 | IO_76 — User I/O bank 0 |
| ピン 104 | IO_77 — User I/O bank 0 |
| ピン 105 | IO_78 — User I/O bank 0 |
| ピン 106 | VCC — Core supply voltage 1.5V |
| ピン 107 | IO_79 — User I/O bank 0 |
| ピン 108 | IO_80 — User I/O bank 0 |
| ピン 109 | IO_81 — User I/O bank 0 |
| ピン 110 | GND — Ground |
| ピン 111 | IO_82 — User I/O bank 0 |
| ピン 112 | IO_83 — User I/O bank 0 |
| ピン 113 | IO_84 — User I/O bank 0 |
| ピン 114 | VCCIB0 — I/O bank 0 supply voltage |
| ピン 115 | IO_85 — User I/O bank 0 |
| ピン 116 | IO_86 — User I/O bank 0 |
| ピン 117 | IO_87 — User I/O bank 0 |
| ピン 118 | GND — Ground |
| ピン 119 | IO_88 — User I/O bank 0 |
| ピン 120 | IO_89 — User I/O bank 0 |
| ピン 121 | IO_90 — User I/O bank 0 |
| ピン 122 | VCC — Core supply voltage 1.5V |
| ピン 123 | IO_91 — User I/O bank 0 |
| ピン 124 | IO_92 — User I/O bank 0 |
| ピン 125 | IO_93 — User I/O bank 0 |
| ピン 126 | GND — Ground |
| ピン 127 | IO_94 — User I/O bank 0 |
| ピン 128 | IO_95 — User I/O bank 0 |
| ピン 129 | IO_96 — User I/O bank 0 |
| ピン 130 | VCCIB0 — I/O bank 0 supply voltage |
| ピン 131 | NC — Not connected |
| ピン 132 | NC — Not connected |
| ピン 133 | NC — Not connected |
| ピン 134 | GND — Ground |
| ピン 135 | NC — Not connected |
| ピン 136 | NC — Not connected |
| ピン 137 | NC — Not connected |
| ピン 138 | VCC — Core supply voltage 1.5V |
| ピン 139 | NC — Not connected |
| ピン 140 | NC — Not connected |
| ピン 141 | NC — Not connected |
| ピン 142 | GND — Ground |
| ピン 143 | NC — Not connected |
| ピン 144 | NC — Not connected |
主な用途
A3P600-FG144 の用途: 6 件s: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P600-FG144 is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its flash-based architecture provides instant-on operation, eliminating boot delays critical in safety-critical applications. The 600K gates and 97 I/Os are sufficient for implementing custom logic, communication interfaces (UART, SPI, I2C), and sensor conditioning. The 1.5V core and low power consumption reduce thermal stress in sealed enclosures. With 4 I/O banks supporting various voltage standards, it can interface directly with 3.3V sensors and 5V legacy logic. The industrial temperature variant (A3P600-FG144I) extends operation to -40C to +100C, making it suitable for harsh factory environments. The non-volatile configuration ensures the design is retained even after power loss, enhancing reliability.
おすすめ
Automotive Electronics
In automotive applications, the A3P600-FG144 can be used for body control modules, infotainment systems, and driver assistance interfaces. Its instant-on capability is crucial for immediate response when the ignition is turned on. The 600K gates allow implementation of custom protocols like LIN or CAN bridging. The 1.5V core reduces power dissipation, important for battery-operated systems. The device's flash-based security prevents unauthorized readback, protecting intellectual property. The commercial temperature range (0C to 70C) is suitable for cabin electronics, while the industrial variant (A3P600-FG144I) covers under-hood applications. The 144-ball FBGA package is compact for space-constrained PCBs. However, for AEC-Q100 qualified parts, consider the A3P600-1FGG144I or other automotive-grade ProASIC3 variants.
おすすめ
Communications Infrastructure
The A3P600-FG144 is well-suited for communications equipment like base stations, routers, and switches. It provides 97 I/Os for interfacing with PHY chips, memory, and control planes. The 110,592 bits of SRAM can be used for packet buffering or FIFOs. The 231 MHz internal frequency supports high-speed data processing. The flash-based configuration allows field updates via In-System Programming, enabling remote firmware upgrades. The low power consumption is beneficial for power-over-Ethernet (PoE) devices. The 4 I/O banks support various voltage standards (LVCMOS, LVDS) for different interface requirements. The device's security features protect against bitstream cloning, crucial for network equipment. The 144-ball FBGA package is suitable for compact line cards.
おすすめ
Consumer Electronics
In consumer electronics, the A3P600-FG144 can be used in smart home hubs, gaming peripherals, and multimedia devices. Its instant-on feature ensures immediate response when powered on, enhancing user experience. The 600K gates allow implementation of custom logic for user interfaces, sensor fusion, and connectivity. The low power consumption extends battery life in portable devices. The 1.5V core is compatible with modern low-power SoCs. The 97 I/Os can interface with displays, touch controllers, and wireless modules. The flash-based configuration eliminates the need for external configuration memory, reducing BOM cost. The commercial temperature range is sufficient for indoor consumer products. The compact FBGA package enables slim designs.
おすすめ
Medical Devices
The A3P600-FG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable health devices. Its instant-on capability is critical for devices that must be ready immediately. The 600K gates can implement signal processing, data logging, and communication protocols. The low power consumption is essential for battery-operated portable devices. The flash-based security protects patient data and device firmware. The 1.5V core reduces heat generation, important for enclosed medical devices. The 97 I/Os can interface with sensors, ADCs, and displays. The commercial temperature range is adequate for most medical environments. For devices requiring higher reliability, the industrial variant (A3P600-FG144I) offers extended temperature operation.
おすすめ
Aerospace and Defense
The A3P600-FG144 can be used in aerospace and defense applications such as avionics, satellite subsystems, and secure communications. Its flash-based architecture provides inherent security against reverse engineering, crucial for defense systems. The instant-on capability is vital for mission-critical operations. The 600K gates allow implementation of custom encryption, protocol handling, and sensor processing. The 1.5V core and low power consumption are beneficial for space-constrained and power-limited platforms. The device supports radiation-tolerant variants in the ProASIC3 family, though the standard A3P600-FG144 is not specifically rated for radiation. For high-reliability applications, consider the industrial temperature variant (A3P600-FG144I) and ensure proper screening. The 144-ball FBGA package is suitable for compact avionics modules.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3P600-FG144 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3P600-FG144I | A3P600-FGG144 | A3P600-FGG144I | A3P600-1FGG144I | A3P600-2FGG144 | A3P600-2FGG144I |
|---|---|---|---|---|---|---|---|
| Package | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 | 97 |
| SRAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 |
| Maximum Internal Frequency | 231 MHz | 231 MHz | 231 MHz | 231 MHz | 350 MHz | 231 MHz | 231 MHz |
| Operating Temperature | 0 to 70 C | -40 to 100 C | 0 to 70 C | -40 to 100 C | -40 to 100 C | 0 to 70 C | -40 to 100 C |
| Speed Grade | Standard | Standard | Standard | Standard | -1 (Fastest) | -2 (Slower) | -2 (Slower) |
主な差別化要因
- Flash-based non-volatile configuration （vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Low power consumption （vs SRAM-based FPGAs)
- Inherent security （vs SRAM-based FPGAs)
設計ノート
The A3P600-FG144 requires a 1.5V core supply (VCC) and separate I/O bank supplies (VCCIBx) for each of the 4 banks. Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add a 10uF bulk capacitor per bank. The flash-based architecture has low static power, but dynamic power scales with switching activity. Estimated: For a 50% toggle rate at 100 MHz, core power can be estimated using the formula P = C * V^2 * f, where C is the total switched capacitance (typically 10-20 nF for this device). Ensure the power supply can handle peak inrush current during configuration.
The 144-ball FBGA package with 1mm pitch requires careful PCB layout. Use a 4-layer or more stack-up with solid ground and power planes. Route I/O signals with controlled impedance if using high-speed interfaces like LVDS. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the manufacturer's layout guidelines in the ProASIC3 PCB Design Guide. Ensure all VCC and GND balls are connected to their respective planes with multiple vias to reduce inductance.
A common mistake is neglecting the I/O bank supply voltages. Each bank must be powered to the appropriate voltage for the I/O standard used. For example, LVCMOS33 requires VCCIBx = 3.3V, while LVCMOS25 requires 2.5V. Mixing incompatible standards in the same bank can cause damage. Also, ensure the core supply (VCC) is within 1.5V +/- 5% to avoid unreliable operation. The flash-based configuration is non-volatile, but during programming, ensure the programming voltage is applied correctly to avoid corrupting the device.
コンプライアンス情報
RoHS compliance inferred from the availability of lead-free (FGG) variants. AEC-Q100 not applicable as this is not an automotive-qualified part.
