Microchip Technology
A3PE3000L-FG896M - 3M-Gate Low-Power Flash FPGA | Microchip
料号： A3PE3000L-FG896M ✓ 量产中
有现货
1-3 个工作日内发货
1.2 V / 1.5 V Vdss
896-ball FBGA (FG896) Package
On-chip flash (nonvolatile, single-chip) Memory
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询价
最小起订量： 1 |
价格更新于： 2026-09-02
批量定价
| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
ℹ️ 所有价格均以 USD 计价
A3PE3000L-FG896M 概述
The Microchip (formerly Microsemi/Actel) A3PE3000L-FG896M is a 3-million-gate ProASIC3L low-power flash FPGA with 75,264 logic cells and 620 user I/O, fabricated on a 130nm CMOS flash process and housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.2V/1.5V core supply.
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.
Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.
Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.
Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.
Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.
Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.
Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.
Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.
Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3PE3000L-FG896M ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE3000L-FG896M （相同外形与封装尺寸） ——差异在于 Family, Package, Configuration Memory, Process Technology, RoHS Status.
Microchip Technology
Family: ProASIC3E
Package: 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch)
Configuration Memory: On-chip Flash (non-volatile, single chip)
对比 A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3E
Package: 896-BGA (FBGA)
Configuration Memory: Flash (non-volatile, reprogrammable)
对比 A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L (Flash FPGA)
Package: 896-ball FBGA
Process Technology: 130 nm Flash
对比 A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L
Package: 896-ball FBGA
Configuration Memory: Nonvolatile flash (single-chip, Instant On)
对比 A3PE3000L-FG896M →
快速对比工具——选择替代料号进行并排对比：
该产品暂无直接替换替代料。
请求替代料A3PE3000L-FG896M 最大额定值与电气特性
| Family | ProASIC3L (ProASIC3EL) |
| Equivalent Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/O | 620 |
| Process Technology | 130 nm CMOS flash |
| Core Voltage | 1.2 V / 1.5 V |
| 封装 | 896-ball FBGA (FG896) |
| 安装类型 | Surface Mount |
| Configuration Memory | On-chip flash (nonvolatile, single-chip) |
| Low-Power Technology | Flash*Freeze |
| JTAG Boundary Scan | IEEE 1149.1 |
| Input Type Option | Schmitt trigger on single-ended inputs |
| Pull Resistors | Weak pull-up / pull-down |
| Temperature Grade | M (military screening per suffix) |
A3PE3000L-FG896M 896-ball fbga (fg896) 引脚配置指南
A3PE3000L-FG896M（896-ball fbga (fg896) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE3000L-FG896M.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE3000L-FG896M 适用于 3 应用s: 嵌入式系统, 物联网设备, 工业控制.
嵌入式系统
使用 A3PE3000L-FG896M 在嵌入式应用中进行核心处理。
物联网设备
由 A3PE3000L-FG896M 驱动的智能联网设备。
工业控制
使用 A3PE3000L-FG896M 的自动化和控制系统。
该产品暂无常见问题。
工程参考数据： A3PE3000L-FG896M ——对比、设计指导和合规信息。
合规信息
RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown
Compliance data not present in the provided web data.
数据核验日期： 2026-09-02
——数据由 XAIPART 元器件工程团队核验和整理
相关元器件 & 术语
Microchip Technology
Actel Corporation
Microsemi Corporation
A3PE3000L-FG896M
ProASIC3L
flash FPGA
field-programmable gate array
Flash*Freeze technology
896-ball FBGA
IEEE 1149.1 JTAG
130nm CMOS
SRAM FPGA
low-power FPGA
military FPGA
boundary scan
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