EPM570F100I5 - MAX II CPLD, 440 LE, 76 I/O, 100-FBGA | Intel
MPN: EPM570F100I5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.2 | $14.20 |
| 10 | $12.85 | $128.50 |
| 100 | $11.4 | $1,140.00 |
| 500 | $9.95 | $4,975.00 |
| 1,000 | $8.75 | $8,750.00 |
Drop-in alternatives for EPM570F100I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570F100C5N
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →EPM570F100C4N
✅ Drop-In✓ In Stock
$14.32 / Unit
View Datasheet →EPM570F100A5N
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EPM570M100I5N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM570GM100I5N
✅ Drop-In✓ In Stock
$8.55 / Unit
View Datasheet →EPM570F100I5 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Series | EPM570 |
| Logic Elements (LEs) | 440 |
| Macrocells | 440 |
| User I/O Pins | 76 |
| Maximum Internal Frequency | 201.1 MHz |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 µm |
| Core Voltage (VCCINT) | 2.5 V / 3.3 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Package | 100-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Configuration Memory | Non-volatile Flash (instant-on) |
| Programming Interface | JTAG (IEEE Std. 1149.1) |
| Operating Temperature | -40C to +100C (industrial grade, 'I') |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EPM570F100I5 100-ball fbga (fineline bga), 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EPM570F100I5 (100-ball fbga (fineline bga), 1.0 mm pitch package) with 76 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570F100I5.
Refer to the datasheet for full pin configuration.
Estimated pin count: 76 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570F100I5 is suitable for 6 applications: Industrial I/O Expansion & Level Translation, Bus Protocol Bridging, Power Supply Sequencing & Hot-Swap Control, JTAG TAP Multiplexing & Boundary-Scan Test, LED Display & Lighting Control Sequencing, Glue Logic Replacement in Embedded Boards.
Industrial I/O Expansion & Level Translation
The EPM570F100I5 fits industrial I/O expansion and voltage-level translation because it provides 76 user I/Os with four independent multi-voltage banks (1.5/1.8/2.5/3.3 V VCCIO) and instant-on Flash configuration that eliminates external boot PROMs. In a typical PLC backplane design, the CPLD sits between a 3.3 V SoC and 1.8 V sensors, translating 24 signal lines in a single FBGA-100 footprint while adding deterministic glue logic for interrupt steering and latch-enable generation. The 201.1 MHz internal frequency comfortably handles 50 MHz SPI or 1 MHz industrial fieldbus toggling without timing closure issues.
Recommended
Bus Protocol Bridging
The EPM570F100I5 is well suited for bus protocol bridging between asynchronous interfaces (I2C, SPI, UART, parallel GPIO) in embedded systems. Its 440 logic elements comfortably implement state-machine-based protocol converters - for example, SPI-to-I2C bridging or UART-to-Parallel - while the 8-Kbit User Flash Memory stores non-volatile configuration such as I2C slave addresses or bus timing parameters. Industrial temperature grade (-40C to +100C) makes it suitable for factory automation bridges that must operate reliably across unconditioned enclosures.
Recommended
Power Supply Sequencing & Hot-Swap Control
The EPM570F100I5's instant-on non-volatile configuration makes it ideal for processor power-rail sequencing in multi-rail systems. With deterministic single-clock-cycle propagation delays, it generates precisely timed enable signals for DC-DC converters in the correct order to satisfy core, memory, and I/O rail-up requirements of SoCs and FPGAs. The 76 user I/Os allow monitoring of PG (power-good) feedback from 6-8 rails and driving 6-8 EN lines concurrently, while the JTAG interface allows in-system reconfiguration of sequencing logic during prototyping without rework.
Recommended
JTAG TAP Multiplexing & Boundary-Scan Test
The EPM570F100I5 is commonly used to multiplex JTAG Test Access Ports (TAPs) across multiple devices on a board, allowing a single JTAG header to access several CPLDs, FPGAs, processors, and memory devices in series. Its IEEE 1149.1-compliant TAP controller and high I/O count make it ideal as a JTAG expander in production test fixtures. The non-volatile configuration ensures the multiplexer routing is set correctly from power-on, before any other device is out of reset.
Recommended
LED Display & Lighting Control Sequencing
The EPM570F100I5 handles LED matrix refresh, brightness modulation (PWM generation), and panel-sequencing tasks in commercial lighting and signage systems. With 201.1 MHz internal frequency, it can drive dozens of PWM channels at kHz rates with sub-microsecond dead-time control, eliminating flicker in architectural lighting. The 440 logic elements accommodate state-machine-based DMX512 or DALI protocol parsing on the same chip, reducing BOM cost in stage lighting fixtures.
Recommended
Glue Logic Replacement in Embedded Boards
The EPM570F100I5 consolidates 5-10 discrete 74-series glue-logic ICs into a single FBGA-100 device, reducing PCB area, BOM count, and assembly cost in complex embedded designs. Functions typically absorbed include address decoding, chip-select generation, interrupt prioritization, watchdog timers, and reset distribution. The 8-Kbit UFM stores board revision or serial number data, allowing boards to identify themselves at boot without a separate EEPROM IC.
Recommended
Recommended Products Summary
Engineering reference data for EPM570F100I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570F100C5N | EPM570F100C4N | EPM570F100A5N | EPM570M100I5N | EPM570GM100I5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FBGA-100 (1.0 mm pitch) | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Logic Elements | 440 | 440 | 440 | 440 | 440 | 440 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O | 76 | 76 | 76 | 76 | 76 | 76 |
| Core Voltage (VCCINT) | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 1.8 V |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +125C (automotive/extended) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Unit Price (qty 1, USD) | $14.20 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial-grade temperature rating matched to extended-environment designs (vs EPM570F100C5N)
- Drop-in same-footprint alternative with only the designator letter changed (vs EPM570M100I5N)
- Instant-on Flash configuration with no external boot PROM required (vs EPM570GM100I5N)
Design Notes
The FBGA-100 package has a 1.0 mm ball pitch requiring strict adherence to JEDEC BGA land pattern guidelines and Intel's recommended via escape pattern. Use microvias (laser-drilled, 0.1 mm diameter) in the inner layers for signal fan-out to avoid via stubs. The 4-6 layer stackup should allocate one continuous ground plane adjacent to the BGA signal layer to provide controlled impedance and minimize crosstalk on high-speed outputs (LVDS, SSTL).
All VCCINT pins must be tied to a single rail of either 2.5 V or 3.3 V - never a combination. For each VCCIO bank, connect decoupling capacitors (0.1 µF X7R plus 10 µF bulk) within 2 mm of the respective ball. For the EPM570GM100I5N drop-in variant, VCCINT must instead be 1.8 V, so verify core voltage before PCB swap. The flash programming supply (VCCPD) must ramp with VCCINT for reliable ISP.
Do not exceed the maximum junction temperature or operate outside the -40C to +100C industrial window. The FBGA-100 has no lead-free solder re-balling allowance - rework must follow JEDEC J-STD-020 reflow profile with peak temperature not exceeding 245C for lead-free assembly. The device requires Quartus II version 13.0 SP1 (the last MAX II-supported release); newer Quartus Prime versions drop MAX II support.
Compliance Information
RoHS and REACH compliant per Intel/Altera product page. Not AEC-Q100 qualified - use EPM570F100A5N for automotive applications requiring extended temperature. Halogen-free status not explicitly stated in the verified data.
