H58G46AK6QX033 - LPDDR5-6400 2GB Automotive DRAM | SK Hynix
部品番号: H58G46AK6QX033 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.2 | $132.00 |
| 100 | $11.8 | $1,180.00 |
| 500 | $10.6 | $5,300.00 |
| 1,000 | $9.75 | $9,750.00 |
H58G46AK6QX033 概要
LPDDR5 (Low Power Double Data Rate 5) is the fifth generation of JEDEC-defined low-power synchronous DRAM technology, optimized for mobile, edge computing, and automotive systems that require high memory bandwidth with strict power budgets. Within the memory hierarchy, LPDDR5 sits under the broader categories of DRAM, synchronous memory, and semiconductor memory ICs, and is distinguished from DDR5 DIMM memory by its soldered-down BGA mounting, lower operating voltages, and deep power-down states.
Key features of the H58G46AK6QX033 include its 6400 Mbps peak data rate, 16-bit (x16) bus organization, 16Gb per-die density class, and automotive qualification targeting extended temperature and reliability requirements for vehicle platforms. The 16Gb organization allows a single package to provide 2GB of main memory, reducing board area compared with stacking multiple lower-density packages.
Architecturally, LPDDR5 introduces bank groups, WCK clocking, and features such as DVFS (dynamic voltage frequency scaling) and deep-sleep modes that let the memory controller trade bandwidth for power in real time. At 6400 Mbps the interface supplies up to 12.8 GB/s of peak bandwidth on a single x16 channel, sufficient for ADAS perception stacks, infotainment, and domain controllers.
Typical applications include automotive ADAS domain controllers, digital cockpits and infotainment SoCs, telematics gateways, and high-reliability industrial computing modules where low-power soldered memory is required.
Design consideration: LPDDR5 signal integrity at 6400 Mbps demands careful length-matched routing, reference plane continuity, and SoC memory-controller training; always verify the SoC's LPDDR5 speed-grade support and follow the platform vendor's layout guidelines.
This page synthesizes distributor stock data, drop-in alternative candidates, and procurement guidance not found in the manufacturer datasheet, with pricing verified as of 2026-09-05.
ドロップイン代替品: H58G46AK6QX033 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: H58G46AK6QX033 （同一形状・フットプリント） — 相違点: Memory Type, Organization, Density, Application Domain, Interface.
クイック比較ツール — 並列比較する代替部品を選択:
H58G46AK6PX033
✅ ドロップイン✓ 在庫あり
$1 / 個
データシートを見る →H58G46AK6PX033N
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価格はお問い合わせください
データシートを見る →H58G46AK6QX033 仕様
| メモリタイプ | LPDDR5 (Low Power Double Data Rate 5) SDRAM |
| Density | 16Gb (2 GB) |
| メモリ構成 | x16 |
| データレート | 6400 Mbps per pin |
| Peak Bandwidth | 12.8 GB/s (x16 channel) |
| インターフェース | LPDDR5 (JEDEC) |
| Grade | Automotive |
| Package Type | FBGA (ball grid array) |
| 実装タイプ | Surface Mount (soldered BGA) |
| Application Domain | Automotive ADAS, infotainment, industrial computing |
H58G46AK6QX033 fbga (ball grid array) ピン配置ガイド
H58G46AK6QX033 (fbga (ball grid array) パッケージ) のピン配置。 ピン番号、機能、接続図はメーカーのデータシートで定義されています。正確なフットプリントとはんだ付けのガイドラインについては、データシートを参照してください。
詳細なピン配置データはありません: H58G46AK6QX033.
詳細は データシート をご参照ください。
主な用途
H58G46AK6QX033 の用途: 6 件s: Automotive ADAS Domain Controllers, Digital Cockpit and Infotainment, Telematics and Gateway ECUs, Industrial Edge-AI Computing Modules, High-Performance Embedded Logging and Firmware Boot, Automotive Replacement Sourcing and Second Source.
Automotive ADAS Domain Controllers
The H58G46AK6QX033 fits ADAS domain controllers because its LPDDR5-6400 x16 configuration delivers up to 12.8 GB/s of peak bandwidth from a single soldered package, matching the memory demands of camera, radar, and lidar sensor-fusion workloads that stream multi-Gbps of raw data into perception accelerators. Its automotive qualification targets the extended temperature, reliability, and traceability requirements of vehicle ECU programs. In the memory subsystem, the package is placed directly beneath or beside the SoC on a point-to-point LPDDR5 channel with length-matched routing and controller training compensating residual skew. Using one 2 GB (16Gb) package instead of two smaller dies reduces ball-map complexity, trace count, and board area, and the LPDDR5 deep-sleep and DVFS features let the domain controller cut memory power during parking or standby states without losing context.
おすすめ
Digital Cockpit and Infotainment
Digital cockpits combine 3D instrument clusters, navigation, and multi-display output, all of which are bandwidth-hungry frame-buffer workloads. The H58G46AK6QX033's 6400 Mbps per-pin rate provides the sustained throughput needed to refresh multiple high-resolution displays while the SoC runs map rendering and voice processing, and its 2 GB x16 organization simplifies the memory rail design in space-constrained head units. The automotive grade designation aligns with the quality expectations of Tier-1 infotainment platforms. On the PCB, the LPDDR5 package mounts within the SoC's reference-design keep-out, using WCK clocking and on-die termination to maintain signal integrity at speed. DVFS allows the cockpit SoC to throttle memory frequency during audio-only modes, reducing EMI and heat inside the dashboard enclosure - a quantified benefit over fixed-frequency LPDDR4X designs.
おすすめ
Telematics and Gateway ECUs
Telematics gateways and connected-car ECUs aggregate cellular, V2X, CAN, and Ethernet traffic, buffering bursts of payload and running cybersecurity stacks that benefit from the H58G46AK6QX033's 2 GB of main memory and 12.8 GB/s peak bandwidth. Although these ECUs are less bandwidth-bound than ADAS controllers, the LPDDR5 package's low operating voltage and deep power-down modes suit always-on, ignition-off duty cycles where quiescent battery drain is tightly budgeted. The soldered FBGA format withstands automotive vibration better than socketed memory alternatives. In the design, the memory operates at reduced LPDDR5 frequencies most of the time via DVFS, scaling up only during OTA update downloads or map synchronization, which lowers average power and radio-front-end noise coupling on the shared board.
おすすめ
Industrial Edge-AI Computing Modules
Edge-AI modules for machine vision, robotics, and predictive maintenance need dense, low-power soldered DRAM to feed NPUs and GPU clusters. The H58G46AK6QX033 is cited in its product overview for industrial controllers and computing modules, and its 16Gb density in a single package keeps COM (computer-on-module) footprints compact while the LPDDR5-6400 rate sustains real-time inference pipelines. The x16 organization matches many embedded SoC memory controllers natively, avoiding width-conversion overhead. Designers should confirm the industrial ambient temperature against the datasheet's rated range, since the part is binned for automotive platforms. On the module, the FBGA die sits on the primary LPDDR5 channel with 0.5 V-class VDDQ rails; the low-voltage signaling shortens rise times, so strict length matching and uninterrupted reference planes are required to hold the 6400 Mbps eye at production yield.
おすすめ
High-Performance Embedded Logging and Firmware Boot
Data loggers, event recorders, and secure boot platforms use DRAM as a high-speed staging buffer between non-volatile storage and the processor. The H58G46AK6QX033's 12.8 GB/s peak bandwidth lets an embedded system snapshot sensor streams or decrypt firmware images far faster than LPDDR4-class memory, shortening boot and logging-latency budgets. The overview explicitly lists embedded logging and firmware boot among its use cases. In these designs, the LPDDR5 package holds the working set while flash (e.g., SK hynix or Micron NAND/NOR) provides persistence; the DRAM's deep-sleep state keeps residual power near zero between events. Automotive qualification is valuable for vehicle event-data recorders, where memory must survive extended temperature swings and power interruptions without corruption of in-flight buffers.
おすすめ
Automotive Replacement Sourcing and Second Source
For procurement teams managing long-life automotive programs, the H58G46AK6QX033 serves as a replacement-sourcing target when original memory line items face allocation or EOL risk. With 43,650 pieces listed in stock at Wolfchip (as of Aug 05, 2026) and additional inventory at independent distributors, supply is currently available outside franchise channels. The same SK hynix family parts H58G46AK6PX033 and H58G46AK6PX033N provide binning-level second sources on the identical footprint, allowing qualification with only speed-grade re-verification rather than a PCB respin. Buyers should demand date-code traceability, authenticity inspection, and conformity certificates when purchasing automotive memory through independent distribution, and should file both QX and PX bins on the AVL (approved vendor list) to hedge future market shortages.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: H58G46AK6QX033 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | H58G46AK6PX033 | H58G46AK6PX033N |
|---|---|---|---|
| Package | FBGA | FBGA - same | FBGA - same |
| Brand | SK Hynix | SK Hynix | SK Hynix |
| Memory Type | LPDDR5 | LPDDR5 | LPDDR5 |
| Density | 16Gb (2 GB) | 16Gb (2 GB) | 16Gb (2 GB) |
| Organization | x16 | x16 | x16 |
| Automotive Grade | Yes | Yes | Yes |
主な差別化要因
- 6400 Mbps speed bin in automotive LPDDR5 （vs H58G46AK6PX033)
- Single-package 2 GB (16Gb) density on x16 （vs two-package 8Gb solutions)
- Automotive qualification tier （vs consumer LPDDR5 (e.g., standard MT53E series))
設計ノート
At 6400 Mbps, LPDDR5 signaling leaves little timing margin. Route CA and DQ buses with tightly controlled lengths per the SoC vendor's LPDDR5 layout guide, maintain continuous reference planes under every byte lane, and match intra-byte skew within the window the controller's training algorithm can absorb. Keep the DRAM within the maximum fly-by/point-to-point trace length budget specified for the speed grade; exceeding it typically forces derating below 6400 Mbps.
LPDDR5 uses low-voltage rails (VDDQ in the 0.5 V class and VDD2 around 1.05 V per the JEDEC generation) with strict ripple tolerances. Estimated: even a 2% rail error on a 0.5 V VDDQ is 10 mV, which can approach the AC noise margin at 6400 Mbps, so use a dedicated PMIC LPDDR5 rail (such as an automotive-grade buck with DDR tracking) and verify sequencing order per the SK hynix datasheet before power-rail sign-off.
Do not assume LPDDR5 packages with equal density are interchangeable across vendors: ball maps and die-revision-specific training requirements differ, and a wrong-ball-map substitution will not boot. Also confirm the SoC memory controller supports the exact speed bin (QX vs PX coding in the H58G46AK6 family) in its verified timing table; using a faster bin than the controller validates only guarantees the controller's lower supported rate, wasting bandwidth headroom.
コンプライアンス情報
Public overview data does not state RoHS/REACH/AEC-Q100 status. Automotive designation is stated in the product overview; formal AEC-Q100 qualification level must be requested from SK hynix.
