H58G56AK6PX032 - 32Gb LPDDR5-6400 Automotive DRAM | SK Hynix
部品番号: H58G56AK6PX032 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.2 | $262.00 |
| 100 | $24.1 | $2,410.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $20.9 | $20,900.00 |
H58G56AK6PX032 概要
LPDDR5 (Low Power Double Data Rate 5) is the fifth generation of JEDEC-defined low-power DRAM, designed for battery-powered and thermally constrained systems such as smartphones, vehicles, and edge computing modules. Within the memory hierarchy, DRAM sits between non-volatile storage (NAND flash) and on-chip SRAM caches, providing high-bandwidth working memory for processors. LPDDR5 doubles effective data rate versus LPDDR4X by introducing WCK clocking, 16n/32n prefetch refinements, and per-bank refresh improvements.
Key features of the H58G56AK6PX032 include the 6400 Mbps/pin data rate, which yields up to 51.2 GB/s peak bandwidth on the x64 bus; the 32Gb density in a single package; an automotive-grade qualification level suitable for in-vehicle infotainment, ADAS and telematics platforms; and the compact 315-ball FBGA footprint that enables dense stacked or side-by-side memory arrangements next to the SoC.
Architecturally, the device uses SK Hynix advanced DRAM process technology with LPDDR5 dynamic voltage scaling across VDD2/VDD1/VDDQ rails, deep power-down and self-refresh modes to cut standby power, and link error-checking capabilities demanded by automotive safety workloads.
Typical applications include automotive infotainment head units, ADAS domain controllers, camera-surround computing modules, and high-bandwidth industrial edge platforms that require 4GB of low-power working memory.
When designing this device into a memory subsystem, pay close attention to LPDDR5 fly-by routing, VDDQ termination, and WCK signal integrity; PCB stackup and length matching are the dominant success factors at 6400 Mbps.
This page synthesizes verified distributor stock data, drop-in family alternatives, and practical design guidance not found in the manufacturer datasheet alone.
ドロップイン代替品: H58G56AK6PX032 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: H58G56AK6PX032 （同一形状・フットプリント） — 相違点: Memory Type, Organization, Density, Interface, Data Rate.
クイック比較ツール — 並列比較する代替部品を選択:
H58G56AK6PX032N
✅ ドロップイン✓ 在庫あり
$11.35 / 個
データシートを見る →H58G46AK6PX033
✅ ドロップイン✓ 在庫あり
$1 / 個
データシートを見る →H58G46AK6PX033N
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →H58G46AK6QX033
✅ ドロップイン✓ 在庫あり
$9.75 / 個
データシートを見る →H5CG46AGBDX015
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.95 / 個
データシートを見る →H58G56AK6PX032 最大定格＆電気的特性
| メモリタイプ | LPDDR5 SDRAM |
| Density | 32Gb (4GB) |
| メモリ構成 | 512M x 64 |
| データレート | 6400 Mbps/pin |
| Bus Width | x16 (x64 per datasheet listing) |
| VDD2 Supply Voltage | 1.8 V |
| VDD1 Supply Voltage | 1.05 V |
| VDDQ Supply Voltage | 0.5 V |
| パッケージ | FBGA-315 |
| 実装タイプ | Surface Mount |
| Grade | Automotive |
| Applications | Automotive infotainment, ADAS, edge computing |
| ライフサイクル状態 | Active |
H58G56AK6PX032 fbga-315 ピン配置ガイド
H58G56AK6PX032 (fbga-315 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: H58G56AK6PX032.
詳細は データシート をご参照ください。
主な用途
H58G56AK6PX032 の用途: 6 件s: Automotive ADAS Domain Controller, Automotive Infotainment Head Unit, Surround-View Camera Processing, Telematics and Connectivity Gateway, Industrial Edge AI Computing Module, Data Logging and Event Recorders.
Automotive ADAS Domain Controller
The H58G56AK6PX032's 6400 Mbps/pin LPDDR5 interface delivers approximately 51.2 GB/s of peak bandwidth on the x64 bus, which is the level demanded by modern ADAS perception stacks that must fuse surround-camera, radar, and lidar data in real time. Its 32Gb (4GB) capacity in one package provides the frame-buffer and neural-network scratch-pad memory required by sensor-fusion and object-detection workloads. The device is placed directly adjacent to the automotive SoC with short, length-matched fly-by routing to preserve signal integrity at speed. Unlike LPDDR4X, LPDDR5's WCK clocking architecture reduces clock-tree power, lowering total memory subsystem dissipation in thermally constrained engine-bay-adjacent enclosures.
おすすめ
Automotive Infotainment Head Unit
In-vehicle infotainment platforms run multi-display clusters, navigation, and voice assistants concurrently, requiring 4GB-class working memory. The H58G56AK6PX032 supplies 32Gb of LPDDR5 at 6400 Mbps/pin, giving head-unit SoCs the bandwidth to drive multiple high-resolution displays while keeping response latency low. Its automotive-grade qualification addresses the extended temperature, vibration, and lifetime requirements of cabin electronics. The three-rail power architecture (1.8V VDD2, 1.05V VDD1, 0.5V VDDQ) allows the power tree to scale VDDQ dynamically, cutting standby draw when the vehicle is parked - a key factor for battery-drain compliance in always-connected vehicles.
おすすめ
Surround-View Camera Processing
Surround-view parking and 360-degree camera systems must capture, stitch, and undistort four or more camera streams simultaneously. The H58G56AK6PX032's high data rate sustains the sustained write bandwidth of multiple concurrent video DMA streams, while its 4GB density holds multiple frames per camera plus the stitching workspace. Placed next to the camera-processing SoC, the FBGA-315 package keeps traces short, preserving eye margins at 6400 Mbps. LPDDR5's per-bank refresh reduces bus contention during isochronous video traffic, and deep power-down modes let the module meet the low quiescent draw demanded when the camera system is off.
おすすめ
Telematics and Connectivity Gateway
Connected-vehicle gateways handle LTE/5G modems, V2X radios, and edge analytics, combining bursty network traffic with sustained data processing. The H58G56AK6PX032 provides 4GB of LPDDR5 working memory whose 6400 Mbps/pin rate absorbs modem bursts and TLS session buffering without stalling the gateway CPU. Automotive qualification makes it suitable for always-powered installations where the module must survive cold-crank and load-dump supply events through the host power design. The 0.5V VDDQ rail minimizes I/O power during sustained wireless transfers, and self-refresh mode retains session state through brief host sleeps, enabling fast resume for over-the-air update windows.
おすすめ
Industrial Edge AI Computing Module
Industrial edge-AI modules for machine vision, predictive maintenance, and robotics inference need memory bandwidth comparable to automotive SoCs but in rugged fanless enclosures. The H58G56AK6PX032's 51.2 GB/s-class bandwidth feeds on-device CNN inference accelerators, while its LPDDR5 dynamic voltage scaling keeps module thermal budgets manageable without heatsinks or fans in sealed housings. Its FBGA-315 footprint supports dense memory placement beside the compute SoC on small SoM form factors. Designers should allocate PCB layers for length-matched LPDDR5 routing and use the manufacturer's layout guidelines; at 6400 Mbps, controlled-impedance stackup and reference-plane continuity are the primary determinants of pass/fail signal integrity.
おすすめ
Data Logging and Event Recorders
Event data recorders and forensic vehicle loggers must buffer high-rate sensor streams in volatile memory before committing them to NAND storage. The H58G56AK6PX032's 32Gb capacity provides seconds of full-rate buffer headroom, absorbing NAND write-latency stalls without dropping samples, and its 6400 Mbps interface keeps the buffer drain time short so the logger is ready for the next event window. Automotive-grade construction suits recorders that must operate across the full vehicle temperature envelope and retain reliability for the vehicle lifetime. Deep power-down minimizes drain on the battery-backed supply rail when the recorder is in standby.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: H58G56AK6PX032 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | H58G56AK6PX032N | H58G46AK6PX033 | H58G46AK6PX033N | H58G46AK6QX033 |
|---|---|---|---|---|---|
| Package | FBGA-315 | FBGA-315 - same | FBGA-315 - same | FBGA-315 - same | FBGA-315 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 32Gb (4GB) | 32Gb (4GB) | 16Gb (2GB) | 16Gb (2GB) | 16Gb (2GB) |
| Memory Type | LPDDR5 | LPDDR5 | LPDDR5 | LPDDR5 | LPDDR5 |
| Supply Rails | 1.8V / 1.05V / 0.5V | 1.8V / 1.05V / 0.5V | 1.8V / 1.05V / 0.5V (LPDDR5 standard) | 1.8V / 1.05V / 0.5V (LPDDR5 standard) | 1.8V / 1.05V / 0.5V (LPDDR5 standard) |
| Grade | Automotive | Automotive | Automotive | Automotive | Automotive |
主な差別化要因
- Full 32Gb (4GB) density in a single package （vs H58G46AK6PX033)
- 6400 Mbps/pin automotive LPDDR5 （vs H58G46AK6QX033)
- Identical footprint to packing-code variant （vs H58G56AK6PX032N)
設計ノート
At 6400 Mbps/pin, LPDDR5 signal integrity dominates design success. Keep CA and DQ traces length-matched within the tolerance specified in the SK Hynix LPDDR5 design guide, route over continuous reference planes, and control single-ended impedance near 40 ohms for DQ. Minimize via transitions on WCK and DQS lines; each via adds impedance discontinuity. Simulate the full channel (SoC die, package, PCB) rather than PCB-only, and follow the SoC vendor's memory-training validation plan across temperature before releasing the layout.
LPDDR5 uses three rails: VDD2 1.8V, VDD1 1.05V, and VDDQ 0.5V. The VDDQ rail carries the highest transient currents during burst writes, so place a dedicated buck converter or LDO close to the ball with bulk capacitance sized per the datasheet and local high-frequency decoupling on every supply ball. Estimated: at 6400 Mbps with sustained traffic, VDDQ transient currents can reach amperes; verify with the DRAM current-profile model from SK Hynix and ensure the regulator's load-transient response keeps VDDQ within its tolerance window.
Reserve at least two internal routing layers for the LPDDR5 bus and place the H58G56AK6PX032 within approximately 10-15 mm of the SoC to minimize fly-by skew. Follow the package pin-map breakout pattern to avoid necking traces between balls. Use ground-stitch vias along bus routing return paths and avoid splitting the reference plane under the memory bus. For automotive platforms, add the manufacturer-recommended ESD protection on externally accessible lines and review the layout against the SoC vendor's LPDDR5 reference design before fabrication.
Do not assume cross-brand LPDDR5 compatibility: Micron MT53E-series parts match performance but use different FBGA ball counts, so the footprint must be redesigned. Also confirm the N-suffixed ordering code (H58G56AK6PX032N) is covered by your controller qualification and approved-vendor list before production substitution. Finally, obtain the official RoHS/material declarations from SK Hynix under NDA - distributor pages do not carry authoritative environmental data for automotive memory.
コンプライアンス情報
Public distributor data does not state RoHS/REACH status. The device is marketed as automotive-grade per GlobalSpec listing. Obtain official material declarations from SK Hynix (IPC-1752A or equivalent) before release.
