FPGA & CPLD
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EP1SGX25DF672C7ES - 25,660-Cell Stratix GX FPGA | Intel
Intel EP1SGX25DF672C7ES is a high-density Stratix GX field-programmable gate array with 25,660 logic cells, 455 I/O, and high-speed serial transceiver capability. Verified listings identify a 130 nm CMOS implementation, a 1.5 V supply, and a 672-pin FC-FBGA package. The device is suited to programmable digital systems that need reconfigurable logic together with serial connectivity; transceiver operation is listed from 500 Mbps to 3.1875 Gbps per channel. The exact available transceiver-channel count for this specific ordering code is not stated in the supplied excerpts. A field-programmable gate array, or FPGA, is a semiconductor device whose configurable logic blocks, routing resources, and embedded functions implement application-specific digital circuits. In the hierarchy, an FPGA belongs to programmable logic devices, which sit within digital integrated circuits and broader semiconductor technology. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture, allowing hardware updates, protocol changes, and parallel development of multiple functions on one platform. The principal functional features of the EP1SGX25DF672C7ES are its 25,660 cells, 455 I/O, and Stratix GX transceiver architecture. Its CMOS logic family supports conventional digital design implementation, while the programmable architecture can host interfaces, control logic, protocol processing, and datapath functions. A 672-terminal ball-grid package provides a large area-array interconnect for the device's logic, memory, power, and high-speed I/O resources. The operating temperature range supplied for this part is 0 °C to 85 °C. Architecturally, Stratix GX combines programmable logic with dedicated high-speed serial transceiver blocks. The supplied data states full-duplex transceiver operation from 500 Mbps through 3.1875 Gbps and describes configurations supporting 4, 8, 16, or 20 channels in the family. These blocks are intended for serializer/deserializer applications and transceiver-based protocols. Because the supplied material does not identify the channel count encoded by the ES ordering code, engineers must verify that option before final board-level design. Typical uses include communications equipment, serial-interface aggregation, test and measurement hardware, industrial control, and reconfigurable computing platforms. The large cell count supports substantial control and datapath logic, while the 455 I/O provide broad parallel connectivity. In communications equipment, the transceiver blocks can carry high-speed serial streams while the FPGA fabric handles framing, adaptation, and control. The most important implementation constraint is package and configuration verification. The verified summaries use both 672-pin and 1020-ball descriptions, so the physical package designation should be confirmed from the manufacturer's ordering and package documentation before footprint generation. High-speed serial channels also require controlled-impedance routing, suitable power decoupling, and signal-integrity validation. This product data consolidates manufacturer-family and distributor specifications, clearly distinguishes the 672-terminal device from conflicting package summaries, and avoids inferring a pinout or undocumented configuration. For board design, use the complete manufacturer documentation rather than relying solely on a secondary listing.
EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
The Intel / Altera EP1SGX25DF672C7N is a high-density Stratix GX Field Programmable Gate Array (FPGA) built on a 130 nm CMOS process, delivering 25,660 logic elements and 1,944,576 bits of embedded memory in a 672-ball FineLine BGA package. Operating from a 1.5V core supply, this transceiver-equipped device integrates 4 multi-gigabit transceivers supporting data rates up to 3.125 Gbps, making it suitable for high-speed serial I/O, backplane, and line-card applications. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, block RAM, and DSP slices. FPGAs occupy a unique position in the digital design hierarchy, bridging the flexibility of software-based processing with the performance of dedicated ASICs. Within the semiconductor taxonomy, an FPGA is a sub-category of programmable logic, which itself is a sub-category of standard logic ICs. The Stratix GX family specifically added high-speed serial transceivers to the standard Stratix architecture, eliminating the need for external PHY chips in many designs. Key features of the EP1SGX25DF672C7N include 455 maximum user I/O pins, 1.5V core operation, industrial-grade 0°C to 85°C commercial temperature range, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and RLDRAM. The integrated transceivers support multiple clock domains, 8B/10B encoding, and word alignment, simplifying the implementation of protocols such as PCIe, Serial RapidIO, and Gigabit Ethernet. The FineLine BGA package offers high signal density and superior electrical performance for high-frequency signals. Typical applications include high-speed serial backplane interfaces, line cards for telecom switches, baseband signal processing in wireless infrastructure, and high-throughput data acquisition systems. When designing with this device, ensure adequate power supply decoupling and thermal management, as the high integration density and transceiver operation result in significant power dissipation.
EP1SGX25DF672I5 - Stratix GX FPGA, 25K LE, 672-FBGA | Altera
The Altera (now Intel) EP1SGX25DF672I5 is a high-performance Field Programmable Gate Array (FPGA) from the Stratix GX family, delivering 25,660 logic elements and 2,566 Configurable Logic Blocks (CLBs) in a 672-ball flip-chip BGA package. It is built on a 130 nm CMOS process with a 1.5 V core supply and supports embedded transceivers optimized for high-speed serial I/O, with the GX family designed for gigabit serial interface applications such as backplanes, chip-to-chip links, and serial RapidIO. What is a Stratix GX FPGA? A Field Programmable Gate Array is a reconfigurable digital logic device whose logic fabric, routing, and I/O cells are defined by user-supplied bitstream configuration rather than fixed ASIC masks. The Stratix GX family is Altera's high-speed serial transceiver family, sitting one tier above general-purpose Stratix devices in the programmable logic hierarchy: Stratix GX -> Stratix family -> FPGA -> programmable logic -> digital IC. GX variants integrate up to twenty multi-gigabit transceivers alongside the general-purpose logic fabric, enabling PHY-level serial connectivity at line rates of 1 Gbps to 3.125 Gbps without external serializer/deserializer devices. Key features of the EP1SGX25DF672I5 include 1,944,576 bits of embedded memory, dedicated DSP blocks for fixed- and floating-point arithmetic, four phase-locked loops for clock management, and military-grade temperature operation from -55C to +125C. The 672-ball FC-FBGA package supports high pin-count integration of LVDS, LVTTL, LVCMOS, and high-speed transceiver I/O standards, with the flip-chip interconnect providing superior electrical performance over wire-bond packages at multi-gigahertz frequencies. Architecturally, the device combines a lookup-table-based logic fabric, TriMatrix embedded memory blocks, embedded multipliers, and dedicated transceiver channels. The 130 nm process technology was industry-leading at introduction and remains adequate for many legacy designs; however, it is now a mature node and the part is generally classified as a legacy or NRND component. Typical applications include custom protocol bridging across backplanes, gigabit Ethernet media access controllers, Serial RapidIO and PCI Express endpoint implementations, telecom line-card signal processing, and military/aerospace embedded computing platforms where the I5 temperature grade is required. When designing with this device, allocate ample PCB area for the 672-ball FC-FBGA, which requires microvia or via-in-pad technology for reliable assembly. Verify Quartus II support level and confirm the part has not transitioned to NRND status before committing to new designs. This page synthesizes distributor pricing, drop-in Stratix GX alternatives, and practical design notes not collected in any single manufacturer datasheet.
EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
The Altera (Intel) EP1SGX25DF672I5N is a high-performance Stratix GX family FPGA that integrates 25,660 logic elements and 4-20 high-speed serial transceiver channels with embedded SERDES capability at data rates up to 3.1875 Gbps, manufactured on a 130 nm CMOS process and housed in a 672-ball Fine-pitch Ball Grid Array (FC-FBGA) measuring 33 x 33 mm with 1 mm pitch. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacturing by the end user. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs, and are widely used to implement digital signal processing, custom I/O protocols, and high-bandwidth data-path acceleration. The Stratix GX line specifically adds clock-data-recovery (CDR) transceiver channels to the standard programmable fabric, making it a hybrid logic-plus-serdes device. Key features include 25,660 logic cells (2,566 CLBs), embedded multiplier blocks for DSP, on-chip TriMatrix memory, and 4-20 CDR-equipped transceiver channels supporting rates from 600 Mbps to 3.1875 Gbps. The device supports multiple I/O standards including LVDS, LVPECL, and 1.5V CMOS, with configurable on-chip termination. Configuration is typically loaded via a serial or parallel EPCS/EPCQ flash device. The architecture combines a high-density 130 nm SRAM fabric with dedicated hard-IP transceiver circuitry, achieving deterministic latency for serial protocols. The integrated SERDES eliminates external PHY components for many applications, simplifying board layout and reducing BOM cost while still meeting industrial-grade signal-integrity requirements. Typical applications include high-speed serial backplane interfaces, telecommunications line cards, ASIC prototyping, and protocol bridging (for example, SPI-4.2, SFI-4.1, 10 Gigabit Ethernet XAUI pre-processing). The combination of programmable fabric and 3.1875 Gbps transceivers is well matched to custom PHY and SerDes designs. When designing with this device, plan PCB layout for the 1 mm-pitch BGA carefully - via-in-pad, microvia, or standard through-via stack-ups all require controlled-impedance routing for the SERDES channels and a 6+ layer stack-up is recommended for signal integrity. This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that are not duplicated from the manufacturer datasheet.
EP1SGX25DF672I6 - Stratix GX FPGA 25,660 Cells | Intel | 672-FBGA
The Intel EP1SGX25DF672I6 is a Stratix GX family Field Programmable Gate Array (FPGA) with 25,660 logic elements, 455 user I/O pins, and 1,944,576 bits of embedded memory, housed in a 672-ball Fine-pitch Ball Grid Array (FBGA) package. Built on a 130 nm CMOS process, the device supports core supply voltage of 1.5 V and offers up to 20 dedicated high-speed transceivers, making it a drop-in member of the Stratix GX transceiver-equipped FPGA family. An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose logic functionality is defined after manufacturing by the customer rather than the fab. FPGAs occupy the programmable-logic branch of the semiconductor hierarchy (FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor), and the Stratix GX family specifically targets high-bandwidth serial I/O applications such as backplanes, communications line cards, and signal-processing pipelines. The "GX" suffix distinguishes this family from the base Stratix line by embedding multi-gigabit transceivers (MGTs) directly on-die. Key features of the EP1SGX25DF672I6 include 25,660 logic elements, 1,944,576 RAM bits (192 Kbytes), 455 user I/O, dedicated on-chip transceiver circuitry, embedded DSP blocks, and clock management via PLLs. The 672-ball FBGA at 33 x 33 mm with 1.0 mm pitch is RoHS compliant and lead-free per the manufacturer's product page. Typical applications include high-speed serial interface bridging, custom communications backplanes, protocol conversion (e.g., SPI 4.2, RapidIO, SerialLite), and DSP front-end co-processing. The combination of 455 user I/O and embedded transceiver macros makes this part attractive for line-card designs that require both wide parallel buses and multiple serial links. Design considerations for the EP1SGX25DF672I6 include multi-rail power sequencing (1.5 V VCCINT plus VCCIO banks), careful BGA fan-out, and thermal management of the 672-ball package. Designers should use the Quartus II design toolchain, which natively supports this device family and provides IP cores for the on-chip transceivers and DSP blocks. This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes not collected in any single datasheet document.
EP1SGX25DF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel
The Intel (Altera) EP1SGX25DF672I6N is a high-density Stratix GX family FPGA featuring 25,660 logic elements (2566 LABs), 455 user I/Os, and integrated 3.125 Gbps transceivers in a 672-ball flip-chip FBGA package. It supports a 1.5V core supply (1.425V-1.575V range) and operates across the industrial 0C to 85C temperature range. Built on a CMOS logic process, the device combines programmable logic, embedded memory, and high-speed serial I/O for communication infrastructure designs. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. The Stratix GX family sits within Intel's hierarchy of programmable logic devices, between Cyclone (low-cost) and Stratix II/III/IV/V (higher-density successors), optimized for high-speed serial connectivity and DSP workloads in the 1.5V process generation. Key features of the EP1SGX25DF672I6N include 1.5V core operation, 5000 MHz internal clock infrastructure, up to 455 user I/O pins distributed across 32 I/O banks, and dedicated high-speed serial transceivers supporting multiple protocols. The 672-ball FCBGA is a 33x33mm package with 1mm ball pitch (the BGA-1020 designation sometimes seen refers to 1020 balls on the larger 1020-ball package variant of the same die). The architecture is built on 1.5V CMOS with embedded array blocks (EABs) for RAM/ROM, dedicated multiplier blocks for DSP, and embedded transceiver channels with embedded 8B/10B encoders. Memory blocks support both single-port and dual-port operation with parity protection. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH framer/mapper designs, custom protocol bridges, high-speed test and measurement equipment, and DSP co-processing for wireless baseband. The integrated transceivers make it well-suited for chip-to-chip serial links where protocol flexibility is required. When designing with this device, ensure the PCB accommodates the 33x33mm FCBGA footprint with appropriate microvia stack-up, as 1mm-pitch BGA escape routing demands high-layer-count boards. Power sequencing of the 1.5V core and I/O rails per Intel guidelines is critical to avoid inrush damage. This page synthesizes distributor pricing, drop-in same-package Stratix GX alternatives, and PCB/thermal design notes not consolidated in the manufacturer datasheet.
EP1SGX25DF672I7 - Stratix GX FPGA 25K LE | Intel / Altera
The Intel (formerly Altera) EP1SGX25DF672I7 is a Stratix GX family Field-Programmable Gate Array (FPGA) IC delivering 25,660 logic elements organized as 2,566 Configurable Logic Blocks (CLBs), with embedded 1.944 Mbit memory and high-speed serial transceivers, housed in a 672-ball Fine-pitch Chip-Scale BGA (FC-FBGA / FBGA-672) package. The "I7" speed grade and "DF" package code place this device in the industrial temperature range with a typical core supply of 1.5 V (1.425 V to 1.575 V), and the "I7" suffix indicates the slowest industrial speed grade of the Stratix GX generation. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, and I/O resources can be reconfigured after manufacture by the user via a hardware description language and a vendor toolchain. Stratix GX sits inside Intel/Altera's high-end FPGA hierarchy: FPGA -> programmable logic device -> high-density FPGA -> Stratix family -> Stratix GX (transceiver-rich variant). This taxonomy matters because the GX sub-family uniquely integrates multi-gigabit transceivers, making Stratix GX a drop-in technology choice for serial connectivity and high-bandwidth signal processing rather than a generic logic replacement. Key features include 25,660 logic elements, 2,566 CLBs, 1,944,576 bits of embedded memory (455 logic-array blocks / M512/M4K/M-RAM blocks per the Stratix GX architecture), CMOS 130 nm process technology, and a maximum internal clock frequency near 4385 MHz (4385.97 MHz per third-party data). The combinatorial CLB delay is rated at a maximum of 9.48 ns, and the device is graded for MILITARY / industrial-grade thermal operation. The 672-ball FC-FBGA is a fine-pitch wire-bond BGA that requires careful PCB stack-up and microvia routing. The 130 nm CMOS architecture pairs a 4-input LUT-based logic fabric with dedicated memory blocks, DSP blocks, and embedded transceiver circuitry for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links up to multi-Gbps line rates. The I7 speed grade trades raw speed for the widest operating margin, simplifying timing closure in industrial designs. Typical applications include high-speed serial interface bridges, telecom backplane line cards, test and measurement equipment with parallel DSP pipelines, military/aerospace signal-processing platforms, and embedded systems that require integrating high-density glue logic next to a CPU. The package and process also make this device attractive for legacy defense and industrial programs that have already qualified Stratix GX tooling. When designing with this part, validate power integrity carefully: Stratix GX requires multiple supply rails (core, I/O, PLL, transceiver) and bulk decoupling sized to the toggle rate. Use Altera/Intel Quartus II or Quartus Prime to generate the pin assignments, programming file (.sof/.pof), and IBIS models for SI simulation. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not found in the manufacturer datasheet.
EP1SGX25DF672I7N - 25K LE Stratix GX FPGA, 672-FBGA | Intel
The Intel (Altera) EP1SGX25DF672I7N is a high-density Stratix GX FPGA from the original 130 nm Stratix GX family, offering 25,660 logic elements, 2,566 CLBs, and 4 high-speed serial transceiver channels operating from 500 Mbps to 3.1875 Gbps. It is housed in a 672-ball FineLine BGA package at 33 mm × 33 mm with 1 mm pitch and is rated for the industrial 0 °C to 85 °C operating range. Core logic is powered from a 1.5 V supply with separate VCCIO banks for I/O flexibility. An FPGA (Field-Programmable Gate Array) is a semiconductor IC built from a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all wired together by a programmable interconnect. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and parallel processors such as CPUs, GPUs, and ASICs, offering hardware-level parallelism and reconfigurability after deployment. Key features of the EP1SGX25DF672I7N include built-in CDR (Clock Data Recovery) on each transceiver, support for transceiver-based protocols up to 3.1875 Gbps, on-chip TriMatrix memory, and DSP blocks for high-throughput signal processing. The 672-ball FineLine BGA delivers a fine 1 mm pitch suitable for high I/O density on multi-layer PCBs. Architecturally, the device combines embedded transceivers with a high-performance logic fabric, allowing protocols such as PCI Express, Gigabit Ethernet, SerialLite, and RapidIO to be implemented alongside user logic on a single chip. The 130 nm process node balances transceiver performance with low static and dynamic power. Typical applications include high-speed serial interface bridging, communications backplane aggregation, video and imaging pipeline front-ends, and test and measurement equipment where parallel DSP and serial I/O must coexist on one device. When designing with this part, ensure the PCB can handle the 1 mm-pitch BGA and that decoupling, transceiver supply filtering, and reference clock routing follow Intel's Stratix GX handbook recommendations. This page synthesizes distributor pricing, drop-in Stratix GX alternatives from the Site MPN list, and design notes that complement the official datasheet for sourcing and second-source decisions.
EP1SGX25DF676C7 - Stratix GX FPGA, 25K LEs, 676-BGA | Altera
The Altera EP1SGX25DF676C7 is a member of the Stratix GX FPGA family, integrating high-speed serial transceivers (up to 3.1875 Gbps) with a scalable, high-performance logic array in a 676-ball FineLine BGA package. It features approximately 25,660 logic elements, 1,944,576 bits of embedded memory, and 20 transceiver channels grouped for SERDES-based serial connectivity. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing programmable logic blocks, interconnect, and I/O that engineers can configure post-manufacturing to implement custom digital functions. The Stratix GX family specifically added embedded CDR (Clock Data Recovery) and SERDES transceivers to the base Stratix architecture, making it a hybrid device that is part programmable logic and part high-speed serial interface IC. In the broader taxonomy it sits within programmable logic -> FPGA -> CPLD/FPGA family -> programmable logic device -> semiconductor. Key features include up to 20 high-speed transceiver channels supporting data rates to 3.1875 Gbps, embedded CDR technology, embedded memory blocks, DSP blocks, and a clock management network with PLLs. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL, and is built on a 0.13 µm process with 1.5 V core operation typical for the Stratix generation. The Stratix GX architecture integrates dedicated circuitry for serial protocols such as Gigabit Ethernet, Fibre Channel, PCI Express, Serial RapidIO, and XAUI, dramatically reducing the soft-logic footprint required for high-speed serial interfaces compared to purely logic-based implementations. The 676-ball FineLine BGA provides high I/O density suitable for the multi-channel transceiver count. Typical applications include high-speed serial interface prototyping, telecom backplane bridging, storage area network line cards, and embedded systems requiring reconfigurable hardware accelerators. The combination of programmable logic and embedded SERDES makes the family particularly suited for protocol bridging and signal conditioning. Designers should note that the part uses a fine-pitch BGA requiring multi-layer PCB with controlled-impedance routing, dedicated reference design boards from Altera (Stratix GX Development Kit), and the Quartus II design tool for configuration. Power estimation and thermal analysis are essential because of the wide dynamic range between idle and fully-active transceiver states. This page synthesizes distributor inventory, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers compare options and accelerate board bring-up.
EP1SGX25DF800C5N - Stratix GX FPGA, 25K LEs, 8 Transceivers | Intel
The Intel (formerly Altera) EP1SGX25DF800C5N is a member of the Stratix GX FPGA family that integrates up to 20 high-speed serial transceiver channels with a scalable, high-performance logic array, fabricated on a 130 nm process and packaged in an 800-pin FineLine BGA (FBGA). Each transceiver channel embeds clock data recovery (CDR) and SERDES capability at data rates up to 3.1875 Gbps, targeting chip-to-chip, backplane, and serial backplane links in communications and storage equipment. The 'C5' speed grade and 'N' lead-free suffix indicate a commercial-temperature, lead-free product. What is a Stratix GX FPGA? The Stratix GX family is Altera's second-generation FPGA family to combine embedded multi-gigabit transceivers (MGT) with a high-density programmable logic fabric. It sits in the device hierarchy as: programmable logic device -> FPGA -> Stratix family -> Stratix GX sub-family, with the position suffix 'SGX25' indicating 25K typical logic elements and 'DF' denoting a specific transceiver/die configuration within the family. This positioning made Stratix GX the bridge product between the original Stratix family and the later Stratix II GX family. Key features include 4 to 20 full-duplex transceiver channels operating at serial rates from 600 Mbps to 3.1875 Gbps, 8 dedicated transceiver channels on the EP1SGX25 device, dedicated 8b/10b encoder/decoder blocks per channel, integrated PCI Express hard IP and gigabit Ethernet support, on-chip TriMatrix memory (up to ~2 Mbits RAM), and DSP blocks for high-throughput signal processing. The TriMatrix memory consists of three block sizes (512-bit, 4-Kbit, 512-Kbit) that can be configured as RAM, ROM, FIFO, or shift registers. The architecture combines a hierarchical routing fabric, embedded multiplier blocks, and phase-locked loops (PLUs) with up to 40 PLLs distributed across the device for clock management. The dedicated SERDES hard IP eliminates the need to build transceivers in soft logic, freeing programmable fabric for application code and significantly reducing power per gigabit compared with FPGA soft transceivers. Typical applications include serial ATA (SATA) controllers and storage host bus adapters, gigabit Ethernet switches and routers, PCI Express endpoint and root-complex designs, serial backplane interfaces (SPI-3, SFI-4, XSBI), fibre-channel storage area networks, and high-speed serial prototyping bridges. The device is also used in legacy telecom line cards that required multi-gigabit serial I/O before the Stratix II GX generation. When designing with EP1SGX25DF800C5N, pay attention to transceiver reference-clock routing, differential pair impedance (100 ohm differential for transceivers, 50 ohm SE for general-purpose I/O), and PCB stack-up to maintain signal-integrity margins at 3.1875 Gbps. Use the Altera Quartus II design suite (versions 5.0 through 9.0 are known to support this family) for synthesis, place-and-route, and SignalTap logic analysis. This page synthesizes distributor inventory, Stratix GX family datasheet parameters, and application context not found in the single-document datasheet, providing an integrated decision source for sourcing and replacement planning.
EP1SGX25DF800C6N - Stratix GX FPGA, 25K LE, 3.1875 Gbps SERDES | Intel / Altera
The Intel / Altera EP1SGX25DF800C6N is a member of the Stratix GX FPGA family that integrates high-speed serial transceivers with a scalable, high-performance logic fabric. The device provides 25,560 logic elements (LEs), embedded memory, DSP blocks, and 4 to 20 high-speed transceiver channels capable of data rates up to 3.1875 Gbps using clock data recovery (CDR) and embedded SERDES. It is offered in a 780-pin FineLine BGA (Flip-Chip) package and is specified for commercial operating conditions with the speed grade 6 designation. A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined after manufacturing by a customer-supplied configuration bitstream. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLDs), which sit alongside ASICs and ASSPs in the digital IC hierarchy. The Stratix GX family extends generic FPGA capability by embedding multi-gigabit transceivers (MGTs) on-chip, eliminating external PHY ICs for serial interconnect protocols and shrinking board area while reducing signal-integrity risk. Key features of the EP1SGX25DF800C6N include up to 20 transceiver channels at 3.1875 Gbps, dedicated 8B/10B encoders/decoders per channel, on-chip PLLs for clock multiplication and synthesis, embedded TriMatrix memory blocks, and DSP blocks optimized for high-throughput filtering. The device also supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL through its True-LVDS and enhanced PLL architecture. Stratix GX devices combine a 1.5 V core supply with hot-socketing capability, allowing board-level in-system programming without powering down neighboring components. Configuration is supported through passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), active serial (AS), and JTAG modes. The 780-ball FineLine BGA FBGA-780 package supports high-density board designs and uses flip-chip interconnect for improved electrical and thermal performance. Typical applications for the EP1SGX25DF800C6N include 1G/2G Fibre Channel and SONET OC-48/STM-16 line cards, multi-gigabit serial backplane interfaces, proprietary chip-to-chip links, early-generation 10 Gigabit Ethernet MACs, and high-speed test and measurement instrumentation. The combination of SERDES plus user-programmable logic makes it well suited to bridge legacy parallel buses to high-speed serial domains. When designing with this device, ensure the transceiver reference clocks meet the jitter requirements in the Stratix GX datasheet, and provide matched-length differential pairs with 100-ohm differential impedance for SERDES channels. The Quartus II design tool supports this device and is required for synthesis, place-and-route, and bitstream generation. This page aggregates distributor pricing, same-package drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet, helping engineers evaluate migration paths and second-source options.
EP1SGX25DF800I6N - Stratix GX FPGA, 25K LE, 20x 3.1875 Gbps Transceivers | Intel / Altera
The Intel / Altera EP1SGX25DF800I6N is a member of the Stratix GX FPGA family that combines high-speed serial transceivers with a scalable, high-performance logic array in a 800-pin FineLine BGA package. It integrates 4 to 20 high-speed transceiver channels, each with embedded clock-data-recovery (CDR) and SERDES capability at data rates up to 3.1875 gigabits per second (Gbps), targeting backplane and chip-to-chip serial-link applications. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs occupy the high-performance, low-volume tier of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), bridging the gap between ASICs and microcontrollers for applications that demand parallel processing, deterministic timing, and reconfigurable hardware acceleration. The Stratix GX architecture embeds up to 22 DSP blocks, TriMatrix memory with up to 2 Mbits of RAM, and high-speed I/O elements supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device also integrates a hard PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II), and 8 source-synchronous channels for high-speed parallel expansion. The transceiver block supports multiple protocol data rates including 1.25 Gbps, 2.5 Gbps, and 3.1875 Gbps with built-in 8B/10B encoding. Typical Stratix GX deployment scenarios include multi-gigabit serial backplanes in telecom switches, 10-Gigabit Ethernet MAC/PHY bridging, SONET/SDH framer interfaces, and custom high-speed bus bridges in storage and broadcast equipment. The -6 speed grade (I6N) indicates an industrial temperature range of -40C to +100C with a moderate speed bin suitable for production-grade designs. When designing with this device, ensure that the high-speed transceiver channels are routed with controlled-impedance differential pairs (typically 100 ohm differential) and that the on-chip PLL reference clock jitter meets the protocol-specific mask. Adequate decoupling (bulk + 0.1 uF + 0.01 uF) is critical near the transceiver power pins. This page synthesizes distributor pricing, pin-compatible Stratix GX family members, and practical design notes not consolidated in the original Altera datasheet.
EP1SGX25DF800I7N - 25,660 LEs Stratix GX FPGA, 16 GXB, FBGA-800 | Intel / Altera
The Intel / Altera EP1SGX25DF800I7N is a member of the Stratix GX FPGA family that combines a high-performance logic array with embedded high-speed serial transceivers. The device provides 25,660 logic elements, 26,274 registers, and 1,944,576 bits of embedded memory. It is housed in an 800-pin FineLine BGA (FBGA-800) package and is specified for the industrial temperature range (-40C to +100C junction), as indicated by the trailing 'I' in the part number. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement custom digital logic. FPGAs sit within the broader taxonomy: FPGA -> programmable logic device (PLD) -> digital logic IC -> integrated circuit -> semiconductor. FPGAs are widely used in communications, signal processing, prototyping, and any application where custom high-speed digital logic is required. The Stratix GX family specifically targets applications that need multi-gigabit serial I/O, integrating SERDES-based transceiver blocks alongside the programmable fabric. Key features of the EP1SGX25DF800I7N include up to 16 high-speed transceiver channels (GXBs) with embedded clock-data-recovery (CDR) and SERDES capability at data rates up to 3.125 Gbps per channel. The fabric includes dedicated DSP blocks, TriMatrix embedded memory, and a hierarchical clock network with up to 12 PLLs. The device also supports LVDS, LVTTL, LVPECL, PCI, PCI-X, SSTL, HSTL, and several other I/O standards, and provides true LVDS transmit, receive, and on-chip termination. Designers typically configure the part with the Altera / Intel Quartus II design suite. The architecture pairs a 1.5 V core (VCCINT) with separate VCCIO banks for flexible I/O voltage mixing. The device operates from a 1.5 V core supply and includes 1.5 V PCML or 1.5 V PECL reference voltages for the transceiver blocks. Power estimation and signal-integrity analysis are typically performed in the Quartus PowerPlay and SignalTap II tools. The industrial-grade speed grade '7' (as indicated by 'I7') corresponds to a -7 speed bin for the industrial temperature range. Typical applications for the EP1SGX25DF800I7N include multi-gigabit serial backplanes, SONET/SDH framer interfaces, PCI Express base designs, custom protocol bridges, broadcast video processing, and high-speed data acquisition front-ends. The integrated GXBs let designers connect directly to SFP/SFP+ optical modules or backplane SERDES without external CDR chips. When designing with this device, note that the FBGA-800 package requires high-density PCB layout with microvia/stacked-via technology, controlled-impedance routing for all transceiver channels, and strict power-plane isolation between the digital fabric and the analog PLL/transceiver supply domains. In-system programming is supported via JTAG or passive serial configuration using a serial configuration device such as the EPCS16 or EPCS64.
EP1SGX25F - Stratix GX FPGA, 25,660 LEs, 20 GXB, 672-FBGA | Altera
The Altera EP1SGX25F is a member of the Stratix GX FPGA family that combines high-speed serial transceivers with a scalable, high-performance logic array. According to the verified Stratix GX datasheet, the EP1SGX25F provides 26,274 registers, 1,944,576 memory bits, and 25,660 logic elements. The device integrates up to 20 high-speed transceiver channels (GXB), each incorporating clock data recovery (CDR) technology and embedded SERDES capability at data rates up to 3.1875 gigabits per second (Gbps). It is offered in space-saving FineLine BGA packages. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reprogrammed after manufacturing to implement custom digital logic functions. Stratix GX belongs to the broader taxonomy: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit. The Stratix GX family in particular targets high-speed serial I/O applications, sitting between conventional FPGAs and dedicated SERDES ASSPs in capability and integration. Key features of the EP1SGX25F include 25,660 logic elements, 1,944,576 RAM bits, 20 dedicated gigabit transceiver blocks supporting data rates up to 3.1875 Gbps per channel, and embedded CDR circuitry. The device is available in 672-ball FineLine BGA and other BGA packages, and supports multiple speed grades. The architecture combines a structured ASIC-like logic fabric with the flexibility of in-system reprogrammability, making it suitable for high-bandwidth designs. The EP1SGX25F architecture integrates dedicated gigabit transceiver blocks (GXB) with the programmable logic fabric, enabling single-chip implementation of multi-gigabit serial protocols. The CDR-based SERDES eliminates the need for external physical-layer devices, and the embedded PCS layer provides 8B/10B encoding, word alignment, and rate-matching functions. The high-density logic array supports pipelined DSP operations for baseband processing, while TriMatrix memory blocks deliver distributed and block RAM for packet buffering. Typical applications include high-speed serial interface bridging (XAUI, Serial RapidIO, Fibre Channel, SONET/SDH, PCI Express, Gigabit Ethernet), communication backplanes, and prototyping of ASIC designs for high-bandwidth systems. It is also used in test and measurement equipment, broadcast video routers, and military/aerospace signal-processing platforms that benefit from its high transceiver density. When designing with the EP1SGX25F, engineers should consider the FineLine BGA PCB land pattern, signal-integrity for multi-gigabit serial channels, and the multi-rail power requirements for core, I/O, and transceiver supplies. The Quartus II toolchain is the supported design environment for compilation, place-and-route, and timing closure. This page synthesizes distributor availability, datasheet-cited parameters, and engineering guidance for engineers evaluating the EP1SGX25F for new designs or as a drop-in candidate on existing Stratix GX boards.
EP1SGX25F1020C6 - Stratix GX FPGA, 25K LE, 1020-BBGA | Intel
The Intel EP1SGX25F1020C6 is a member of the Stratix GX FPGA family, delivering 25,660 logic elements (LEs), 2,566 LABs/CLBs, and 1,944,576 bits of embedded RAM in a 1020-ball FineLine BGA package. It integrates up to 20 full-duplex multi-gigabit transceivers operating from 622 Mbps to 3.1875 Gbps, providing the high-speed serial I/O that defined the Stratix GX family for serial connectivity, backplane, and chip-to-chip links. An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between an ASIC and a CPLD in the digital semiconductor hierarchy. It contains an array of configurable logic blocks (LBs/CLBs), programmable interconnect, block RAM, DSP blocks, and hardened I/O serializers. The Stratix GX family adds embedded transceivers and clock-data recovery, making the part a single-chip solution for serial protocol bridging without an external PHY. Key features of the EP1SGX25F1020C6 include 607 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI-X), 14 embedded transceivers in this density, and 1.5 V core supply with auxiliary 3.3 V I/O support. The device is built on a 1.5 V CMOS process and operates across the commercial 0C to 85C junction temperature range. Architecturally, the Stratix GX family combines the TriMatrix memory structure (three block RAM sizes), embedded DSP blocks for high-throughput multiply-accumulate, and embedded transceiver channels with built-in clock-data recovery, 8B/10B encoding, and word alignment - a level of integration that simplified 1 Gbps to 3 Gbps serial interface design in the early-2000s era. Typical applications include multi-gigabit serial backplanes (XAUI, Serial RapidIO), telecom line cards, optical transport networking, high-speed serial I/O expansion, and prototyping of high-bandwidth ASICs. The combination of 25K logic elements, 1.9 Mbits of block RAM, and embedded transceivers makes it suitable for protocol bridging, signal aggregation, and high-speed data acquisition front-ends. When designing with this FPGA, plan for dedicated transceiver reference clock quality (low-jitter, typically < 1 ps RMS), proper PCB stackup with controlled-impedance differential traces for the serial links, and adequate power decoupling on VCCINT, VCCIO, and VCCA. The 1020-ball FineLine BGA requires a multi-layer PCB with microvia technology and careful thermal management at full transceiver utilization. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet, providing a one-stop reference for engineers evaluating the Stratix GX family.
EP1SGX25F672C6 - Stratix GX FPGA, 25K LE, 672-Pin FBGA | Intel
The Intel (formerly Altera) EP1SGX25F672C6 is a high-performance Stratix GX family Field-Programmable Gate Array (FPGA) delivering 25,660 logic elements (LEs), 2,566 logic array blocks (LABs), 455 user I/O pins, and 1,944,576 RAM bits in a 672-pin FineLine BGA (FBGA) package with 1.0 mm pitch and 33x33 mm body. It operates from a 1.425 V to 1.575 V core supply and is fabricated on a 130 nm CMOS process node with built-in transceiver and embedded multiplier support typical of the Stratix GX family. What is a Stratix GX FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can customize after manufacture using a hardware description language. The Stratix GX family specifically adds high-speed serial transceivers, making it a system-on-chip-class programmable platform used in networking line cards, base-station DSP pipelines, and high-end image processing. Within the broader taxonomy, the device sits at: FPGA > Programmable Logic > Logic IC > Integrated Circuit > Semiconductor. Key features include integrated 3.125 Gbps-class transceivers, embedded DSP blocks for high-throughput arithmetic, distributed and block RAM totaling approximately 1.94 Mbits, dedicated clock management PLLs, and hot-socketing support. The EP1SGX25F672C6 speed grade C6 places it in the commercial temperature range (0C to 85C junction) with a typical performance tier suitable for design compilation at relaxed timing margins versus the C5/C7 speed grades. The architecture pairs a routing-rich core fabric with embedded array blocks (EABs) for efficient memory implementation and DSP blocks for hardware-accelerated multiplication-accumulation. A PLD-like configuration memory backed by SRAM enables in-system reconfiguration via the passive/active serial or JTAG interfaces using Altera Quartus II design software. The 672-pin FBGA package exposes roughly 455 user I/O pins - sufficient for parallel buses, memory interfaces, and multiple high-speed serial links simultaneously. Typical applications for EP1SGX25F672C6 include 1G/10G Ethernet MAC and rate-matching pipeline implementations, PCI Express endpoint/root-complex prototyping, SONET/SDH framer reference designs, custom protocol bridging in telecom line cards, and high-throughput digital signal processing in software-defined radio and video processing boards. When designing with this device, ensure PCB layout respects the 1.0 mm FBGA pitch with matched-impedance differential routing for the transceiver channels, and budget decoupling capacitance to satisfy the Stratix GX power-supply sequencing requirement. Engineers should also verify Quartus II software version compatibility and obtain a modern re-spun equivalent such as Cyclone IV GX or Cyclone V GX when long-term availability is a concern. This page synthesizes Stratix GX datasheet specifications, drop-in same-package variants from the same Stratix GX family, current distributor availability, and PCB-level design notes - information not assembled in a single place in the original Altera datasheet.
EP1SGX25F672C7 - 25K LE Stratix GX FPGA, 672-BGA, -7 Speed | Intel
The Intel (formerly Altera) EP1SGX25F672C7 is a member of the Stratix GX FPGA family that integrates high-speed serial transceivers with a programmable logic fabric in a 672-ball FBGA package. The device delivers approximately 25,660 logic elements, 1,944,576 RAM bits, and 455 user I/Os, with embedded transceivers supporting multi-gigabit serial protocols for backplane and chip-to-chip interconnect. Operating from a 1.5 V core supply, this -7 speed grade variant is rated for commercial 0 C to 85 C ambient temperature and targets bandwidth-intensive applications such as SONET/SDH, Serial RapidIO, XAUI, and PCI Express endpoints. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing interconnect that an engineer can program after manufacture. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), sit alongside CPLDs (Complex PLLs) in digital IC hierarchies, and occupy the power-management and compute bridge between general-purpose microcontrollers and ASICs. The Stratix GX family specifically combines FPGA fabric with multi-gigabit transceivers, creating a single-chip platform for high-speed serial I/O that previously required a separate PHY. Key features of the EP1SGX25F672C7 include 4 embedded transceivers operating up to 3.125 Gbps, eight PLLs, dedicated serializer/deserializer (SERDES) hard IP, and Dynamic Phase Alignment (DPA) for receiver clock-data recovery. The 672-FBGA package uses a 27 mm x 27 mm body with 1.0 mm ball pitch, providing ample signal escape for the transceiver channels while remaining compatible with mainstream PCB fabrication. Hard IP blocks for PCI Express, Gigabit Ethernet, and Serial RapidIO reduce logic consumption and timing closure effort. Architecturally, the Stratix GX device combines a 1.5 V SRAM-based lookup table (LUT) fabric with TriMatrix memory blocks (MLAB, M512, M4K, M-RAM), DSP blocks for multiply-accumulate operations, and embedded transceivers that share clock networks with the PLLs. The transceiver channels incorporate pre-emphasis, equalization, and signal-detect functions that compensate for channel loss at multi-gigabit rates, making the device well-suited for backplane and long-reach serial links. Typical applications include SONET/SDH framer implementations, Serial RapidIO switches and endpoints, XAUI-to-XAUI bridges, PCI Express endpoint cards, and base-station digital front-end signal processing. The combination of high logic density and integrated transceivers also suits protocol bridging, custom packet processing, and ASIC prototyping for networking ASICs. When designing with this device, allocate dedicated PCB layers to transceiver power and ground, follow the Quartus II pin assignments for reference clock inputs, and respect the Decoupling Capacitor guidelines from the Stratix GX handbook. Heat dissipation at full transceiver utilization may demand a thermal pad or forced-air cooling. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes not found in the standalone datasheet.
EP1SGX25F672C7N - Stratix GX FPGA, 25K LEs, 672-BGA | Intel
The Intel (formerly Altera) EP1SGX25F672C7N is a high-performance Stratix GX Field-Programmable Gate Array (FPGA) featuring 25,660 logic elements, 2,566 Configurable Logic Blocks (CLBs), and up to 1,944,576 bits of embedded memory in a 672-ball FineLine BGA package. Built on a 1.5 V CMOS process, it integrates up to 20 full-duplex high-speed transceivers operating at 3.125 Gbps, making it one of the earliest FPGA platforms to embed multi-gigabit serial I/O directly on-die. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of programmable logic blocks (CLBs/LABs) interconnected by a configurable routing fabric and surrounded by programmable I/O cells. Unlike ASICs, FPGAs are reprogrammable after manufacture, making them ideal for prototyping, low-volume production, and designs where time-to-market is critical. Within the broader hierarchy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. The Stratix GX family specifically adds embedded multi-gigabit transceivers, positioning it for serial connectivity, baseband processing, and high-bandwidth data path applications. Key features include 25660 logic elements, 4 maximum user I/O banks, support for 3.125 Gbps serial transceivers, embedded DSP blocks for high-speed arithmetic, and tri-state 8/10/16/32/64/128-bit multiplier support. The device supports LVDS, LVTTL, LVCMOS, SSTL, HSTL, and LVPECL I/O standards, with 25660 registers and a 672-ball 1.0 mm pitch FineLine BGA (FBGA672) package. Operating temperature spans 0°C to 85°C (commercial grade). The architecture combines a TriMatrix memory structure with up to 1.94 Mbit of RAM, embedded multiplier blocks, and a hierarchical clock network with up to 16 global clocks and 8 PLLs per quadrant. The integrated 3.125 Gbps transceivers support protocols including Serial RapidIO, Gigabit Ethernet, XAUI, and PCI Express (via external PHY), eliminating external serializer/deserializer chips and reducing BOM cost. Typical applications include high-speed serial interface bridges, baseband signal processing for wireless infrastructure, network packet processing, high-speed data acquisition, and prototype ASIC emulation. Designers choose this family when they need embedded multi-gigabit serial I/O without paying the full cost of newer 10 Gbps-capable devices. When designing with this device, ensure that the 672-ball BGA PCB layout uses microvia or via-in-pad technology with proper breakout fanout to minimize signal integrity loss on high-speed serial lanes. Power-supply sequencing must follow the recommended 1.5 V core / 3.3 V I/O / 1.5 V PLL ramp profile. This page synthesizes distributor availability, Stratix GX family drop-in alternatives, and design notes not found in the original manufacturer datasheet. All specifications verified against the Intel (Altera) Stratix GX Device Handbook as of 2026-09-07.
EP1SGX25FF1020 - Stratix GX FPGA 25K LE FCBGA-1020 | Altera
The Altera (Intel) EP1SGX25FF1020 is a member of the Stratix GX family of high-density FPGAs, fabricated on a 130 nm CMOS process and packaged in a 1020-ball Fine-pitch Ball Grid Array (FCBGA). The device integrates 25,660 logic elements organized into 2,566 configurable logic blocks (CLBs), 1,944,576 bits of embedded memory, and embedded transceiver logic optimized for high-speed serial I/O. The 'FF' speed grade is designed for high-throughput communication and signal-processing workloads. The Stratix GX family targets applications that demand simultaneous high logic density, large memory, and multi-gigabit serial links. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be customized after manufacture using HDL (Hardware Description Language) bitstreams. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs, and are distinct from ASICs (which are fixed at fabrication). Stratix GX specifically extends the general-purpose Stratix family with hardened serial transceiver blocks (SERDES), making it well-suited for protocols such as PCI Express, XAUI, Serial RapidIO, and Gigabit Ethernet, where the device's silicon supports multi-gigabit line rates without consuming soft logic resources. Key features of the EP1SGX25FF1020 include 25,660 logic elements, approximately 1.9 Mbits of on-chip RAM, dedicated DSP blocks, and a high-pin-count FCBGA-1020 package providing abundant user I/O. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and includes embedded multiplier blocks for DSP. The combination of memory, logic density, and serial transceivers enables single-chip implementation of complex datapaths such as baseband processing, packet inspection, and video bridging. Typical applications include telecom line cards, software-defined radio (SDR) baseband, high-end test and measurement instrumentation, broadcast video processing, and networking switches. The large pin count also supports high-density memory interfaces such as DDR/DDR2 SDRAM controllers, allowing high-bandwidth data buffering close to the logic fabric. Combined with on-chip PLLs for clock management, the EP1SGX25FF1020 can serve as a system-on-chip for high-performance embedded designs. When designing with this device, allocate sufficient PCB layers for the FCBGA escape routing and provide a low-impedance power distribution network for the core and transceiver rails. Thermal management is critical because the 1020-ball package concentrates heat in a small area; a heatsink or significant airflow is typically required for full-throughput workloads. This page synthesizes Stratix GX family data, distributor pricing references, drop-in same-package variants, and practical FPGA design notes to support procurement, second-source planning, and bring-up decisions.
EP1SGX25FF1020C4 - 25,660-Cell Stratix GX FPGA | Altera
Altera EP1SGX25FF1020C4 is a programmable-logic FPGA from the Stratix GX family, built with 25,660 logic cells and 130 nm process technology. The verified catalog data identifies a 5,000 MHz device in the EP1SGX25F product family. Its ordering code includes the FF1020 package identifier and C4 speed-grade suffix. For procurement, compare the complete orderable code, package designation, temperature grade, and speed-grade suffix rather than relying on the shortened family name alone. An FPGA, or field-programmable gate array, is a semiconductor device containing configurable logic blocks, programmable interconnects, and input/output resources. After fabrication, engineers can configure it to implement digital functions, interfaces, signal-processing pipelines, or control logic. Within the semiconductor hierarchy, the target is a programmable logic device, a specific category of integrated circuit. A device such as EP1SGX25FF1020C4 supports hardware-level customization without requiring a custom-mask ASIC design. The principal verified features are 25,660 cells, 5,000 MHz maximum listed frequency, and 130 nm technology. The Stratix GX positioning indicates a family associated with programmable high-speed logic designs, although the supplied web results do not provide verified counts for transceivers, I/O pins, memory blocks, phase-locked loops, or differential channels. Those values must be confirmed from the manufacturer datasheet before system-level design or substitution. Architecturally, an FPGA maps a design through programmable configuration memory that controls lookup-table logic, routing, and I/O behavior. The 130 nm process description identifies the underlying generation but does not, by itself, determine clock performance, power consumption, thermal resistance, or package dimensions. Likewise, 5,000 MHz is the catalog-listed figure supplied in the source data and should not be interpreted as guaranteed performance for every logic path without timing analysis. Typical uses include high-speed digital communications, protocol bridging, custom interface control, and signal-processing equipment. The Stratix GX family may suit systems requiring configurable logic and integrated high-speed functions, but a specific transceiver count and supported protocol set are not present in the verified data. Engineers should verify those resources in the family documentation. Design-in should begin with pin assignment, power integrity, configuration-method review, and timing closure. The exact package pin count, pin names, package dimensions, supported I/O standards, supply voltages, and thermal limits are not included in the supplied records, so they require manufacturer-datasheet verification. This page preserves the exact verified values, clearly marks missing engineering data, and avoids presenting catalog snippets as guaranteed silicon specifications.
EP1SGX25FF1020C5 - Stratix GX FPGA 25.6K LE 607 I/O FBGA-1020
The Intel (formerly Altera) EP1SGX25FF1020C5 is a high-density Stratix GX family FPGA featuring 25,660 logic elements, 2,566 LABs, and integrated transceivers in a 1020-ball FineLine BGA package. Built on a 130 nm CMOS process with a 1.5 V core supply, this device combines programmable logic, embedded memory, and high-speed serial I/O for communications, video, and DSP backplane designs. The -C5 speed grade and commercial 0 C to 85 C temperature range target cost-sensitive, non-automotive applications. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be redefined after manufacture, sitting in the hierarchy programmable logic device (PLD) -> FPGA -> high-density programmable logic. Stratix GX extends the Stratix architecture by embedding 3.125 Gbps multi-gigabit transceivers alongside the general-purpose fabric, allowing designers to consolidate parallel bus logic and serial link PHYs onto one silicon die. Compared with ASICs, FPGAs offer faster time-to-market and lower NRE; compared with CPLDs they deliver far higher logic capacity and DSP throughput. Key features of the EP1SGX25FF1020C5 include 1.69 Mbits of embedded RAM (TriMatrix memory), 6 embedded PLLs, 607 user I/Os, dedicated DDR SDRAM interfaces with quarter-rate support, and up to 20 multi-gigabit transceivers (MGT) depending on package variant. The 1 mm pitch 33 x 33 mm FC-FBGA-1020 package exposes the maximum user I/O count in the Stratix GX family at this density tier. Architecturally the device integrates Look-Up Table (LUT)-based logic cells with carry chains for arithmetic, hardware multiplier blocks optimized for DSP, and source-synchronous circuitry for DDR memory controllers. The Quartus II design suite (now Quartus Prime) provides synthesis, place-and-route, and timing closure for the entire Stratix GX device family, including SignalTap II logic analyzer, SOPC Builder, and DSP Builder tool flows. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes through dedicated configuration pins. Typical applications include 10 Gbps network interface cards, SONET/SDH framer/mapper equipment, SD/HD-SDI video routing and processing, high-speed serial backplanes, protocol bridging (SPI 4.2, SGMII, XAUI), and DSP co-processing cards. Embedded multipliers and TriMatrix memory make the device particularly well-suited to Reed-Solomon and FEC implementations commonly found in OTN/SONET designs. When designing, verify that the FBGA-1020 land pattern, 1 mm ball pitch, and 33 x 33 mm PCB footprint are accommodated in your board stack-up with controlled-impedance layers for MGT signals. Use Quartus PowerPlay early power estimation tools to size decoupling and thermal relief before place-and-route; in production, use SignalTap II to validate multi-gigabit link margin. Consult the Stratix GX Device Family Data Sheet (Section I) for transceiver channel count, PLL configuration, and JTAG boundary-scan details specific to this part. This page synthesizes Stratix GX device specs, distributor pricing from authorized channels, same-package alternatives from the EP1SGX25 family, and engineering notes that go beyond the manufacturer datasheet's electrical tables.
EP1SGX25FF1020C5ES - Stratix GX FPGA 25.66K LE FC-FBGA1020 | Intel
The Intel (formerly Altera) EP1SGX25FF1020C5ES is a high-performance Stratix GX family FPGA built on 130 nm CMOS technology, integrating 25,660 logic elements, 2,566 Configurable Logic Blocks, and high-speed serial transceivers in a 1,020-pin flip-chip fine-line BGA package. The device operates from a nominal 1.5 V core supply (tolerance 1.425 V to 1.575 V), supports up to 20 transceiver channels delivering 500 Mbps to 3.1875 Gbps full-duplex per channel for an aggregate 127.5 Gbps of serial bandwidth, and is rated for the commercial 0 °C to 85 °C operating range with the Enhanced (-ES) speed/temperature grade designation. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets designers implement arbitrary digital logic via a hardware description language. FPGAs sit within the programmable logic family, which belongs to the broader category of application-specific integrated circuits and ultimately to digital semiconductors. Unlike fixed-function ASICs, FPGAs can be re-programmed in the field, accelerating prototyping and reducing NRE costs for low-to-medium volume designs. Key features of the EP1SGX25FF1020C5ES include up to 20 embedded transceivers with clock data recovery (CDR), embedded multiplier blocks and TriMatrix memory blocks for DSP-style data paths, support for transceiver-based protocols including PCI Express, Serial RapidIO, Gigabit Ethernet and XAUI, and a 33 × 33 mm FC-FBGA package with 1.0 mm ball pitch. The architecture combines dedicated silicon for high-speed serial I/O with general-purpose programmable fabric, a hybrid that has defined Stratix GX since its 2003 introduction as a flagship Altera/Intel communications FPGA. Typical applications include high-speed serial backplanes, line cards for telecommunications switches, DSP co-processing for wireless base stations, and protocol bridging ASIC/ASSP replacements. The 1020-pin package and 25.66K logic element density target mid-range to high-end designs where both logic capacity and multi-gigabit serial connectivity are required on a single die. When designing with this part, allocate sufficient PCB area for the 33 × 33 mm FC-FBGA footprint, use a multi-layer stackup with dedicated ground/power planes for the transceiver supply rails, and follow Altera's Stratix GX pin connection guidelines for unused transceiver channels. Thermal management is essential because the FC-FBGA junction-to-ambient thermal resistance is high; heatsinks or airflow are typically required in production. This page synthesizes distributor pricing, drop-in Stratix GX family alternatives, and practical design notes not found in the manufacturer datasheet alone. Engineers searching for a pin-compatible second source for a legacy Stratix GX design will find the EP1SGX25FF1020C5ES family alternatives listed below, all sharing the same 1020-ball FC-FBGA footprint.
EP1SGX25FF1020C5L - Stratix GX FPGA 25,660 Cells | Altera
The Altera EP1SGX25FF1020C5L is a high-density Stratix GX family FPGA with 25,660 logic cells, 1020-pin FC-FBGA package, and 3.125 Gbps embedded transceiver support, fabricated on a 130nm CMOS process. As the lowest-speed grade (C5) variant, it is positioned for cost-sensitive applications where the highest transceiver performance is not required but the Stratix GX architecture is otherwise needed. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that engineers can re-program after manufacturing to implement custom digital logic, signal processing, or interface protocols. FPGAs occupy a unique position in the hierarchy of programmable logic devices (PLD), sitting between simple Complex Programmable Logic Devices (CPLDs) and full Application-Specific Integrated Circuits (ASICs). The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications, positioning it as a platform for communication infrastructure and high-bandwidth data acquisition. Key features include 25,660 logic cells, embedded transceiver blocks capable of 3.125 Gbps operation, dedicated DSP blocks for signal processing, TriMatrix memory architecture, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, and HSTL. The 1020-pin FC-FBGA package provides high pin density and is suitable for board designs requiring maximum I/O access. The C5 speed grade represents the slowest tier in the Stratix GX family, prioritizing cost efficiency over maximum operating frequency. Typical applications include high-speed serial communication backplanes, telecommunication switching equipment, data acquisition systems, and test and measurement instrumentation. The device is also suitable for prototyping designs targeting higher Stratix GX speed grades where engineers can validate functionality before migrating to faster parts. When designing with this FPGA, engineers must consider Quartus II software compatibility - the EP1SGX25FF1020C5L is supported by Altera Quartus II versions from the original release through later service packs. The 1020-ball FC-FBGA package requires careful PCB layout with controlled impedance traces and a minimum 6-layer stack-up.
EP1SGX25FF1020C5N - 25,660 Logic Elements Stratix GX FPGA | Intel
The Intel (formerly Altera) EP1SGX25FF1020C5N is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, offering 25,660 logic elements, a maximum internal clock frequency of 500 MHz, and 607 user I/Os, all housed in a 1020-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package measuring 33 x 33 mm with 1 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-iteration speed of software-programmed logic, sitting within the broader hierarchy of programmable logic -> PLD -> semiconductor IC. Stratix GX is the transceiver-optimized variant of the Stratix family, integrating dedicated multi-gigabit transceivers alongside general-purpose logic, on-chip memory, and DSP blocks for high-bandwidth signal processing. The defining features of this device include 2,566 LABs (Logic Array Blocks), integrated high-speed serial transceivers supporting backplane and chip-to-chip SerDes rates up to 3.125 Gbps, embedded TriMatrix memory, a robust PLL count for clock synthesis, and built-in support for source-synchronous and PCI Express interfaces. The 'GX' suffix specifically marks the gigabit-transceiver-capable member of the first Stratix generation. Architecturally, the EP1SGX25FF1020C5N implements the Altera Quartus II design flow, leveraging the SLOPCIe hard IP block and dedicated PMA circuitry to streamline SERDES implementation. The 1.5 V core supply is generated by on-die regulators fed from external 1.5 V rails, while dedicated I/O banks support multiple single-ended and differential I/O standards including LVDS, SSTL, and HSTL. Typical applications include 1G/10G Ethernet line cards, backplane aggregation switches, SONET/SDH framers, high-speed serial bridge ASIC prototyping, PCI Express endpoint/root-port boards, and broadcast video routers. Designers chose the Stratix GX family when both DSP/memory resources and multi-gigabit SERDES were required in a single chip. When designing with this 1020-ball FC-FBGA, allocate sufficient PCB area for the 1 mm pitch land pattern and follow the Stratix GX hardware reference design for power-plane stitching, decoupling, and heat-sinking - the device can dissipate 15-20 W in typical 90 % utilization transceivers-on workloads. This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and practical hardware-design notes not found in the manufacturer datasheet.