FPGA & CPLD
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EP1SGX40DF1020C5 - Stratix GX FPGA, 41,250 LE, 624 I/O, FBGA-1020 | Intel
The Intel (formerly Altera) EP1SGX40DF1020C5 is a high-density Stratix GX Field-Programmable Gate Array (FPGA) integrating 41,250 logic elements, 4,125 LABs, and 624 user I/O pins in a 1020-ball FC-FBGA package (33 x 33 mm, 1.0 mm pitch). It is built on a 130 nm CMOS process, operates from a 1.5 V core supply, and is qualified for the commercial 0 °C to 85 °C temperature range. An FPGA is a reconfigurable semiconductor device whose logic function is defined by user-programmed configuration bitstreams, rather than fixed at the fab. FPGAs sit above fixed-function ASICs and microcontrollers in the programmable-logic hierarchy, and are used to accelerate parallel workloads, prototype ASICs, and integrate high-speed serial interfaces. The Stratix GX family specifically targets high-bandwidth serial I/O (multi-gigabit transceivers), making it a bridge between FPGA fabric and standards such as PCI Express, Serial RapidIO, and Gigabit Ethernet. Key features include 3,423,744 bits of embedded memory, embedded multiplier blocks for DSP, dedicated high-speed transceiver channels supporting multi-gigabit serial connectivity, and the configurable Logic Array Blocks (LABs) that compose the user-programmable fabric. The part ships in tray packaging and is part of the broader EP1SGX family, with the 'C5' suffix indicating the speed grade (5) and commercial temperature range. Typical applications include high-throughput serial backplanes, base-station signal processing, ASIC prototyping, telecom line-card designs, and test & measurement platforms. The 33 x 33 mm FBGA-1020 package provides the high pin count required for parallel interfaces plus the signal integrity demanded by multi-gigabit serial links. When designing with this device, plan for the high pin-count BGA fanout, multi-rail power sequencing (core, I/O, PLL, transceiver supplies), and an FPGA configuration scheme (JTAG, AS, or PS) suitable for the production flow. Reference the Stratix GX Device Family Data Sheet for pinout, transceiver parameters, and Quartus-II device support. This page synthesizes distributor pricing, parametric cross-references, and practical design notes not found in the manufacturer datasheet alone. The Stratix GX family is now mature - engineers specifying new designs should evaluate whether a Cyclone, Arria, or Stratix V/10 device is more appropriate for long-term availability.
EP1SGX40DF1020C5ES - 41,250-Cell Stratix GX FPGA | Intel
The Intel/Altera EP1SGX40DF1020C5ES is a high-density CMOS field-programmable gate array (FPGA) from the Stratix GX family, integrating 41,250 logic cells, operating from a 1.5 V supply, and supporting a reported 5,000 MHz maximum frequency. It is offered in a 1,020-pin FC-FBGA package measuring 33 mm by 33 mm with a 1 mm ball pitch. The device also contains 4,125 logic array blocks and up to 624 configurable I/O connections, making it a large platform for digital logic, embedded processing, memory interfaces, and communications-oriented designs. A field-programmable gate array is a semiconductor device whose logic functions are defined through programmable configuration rather than fixed interconnect. Within the programmable-logic hierarchy, an FPGA sits between conventional logic ICs and more specialized processors or application-specific integrated circuits. Designers implement parallel datapaths, control logic, interfaces, and complete systems-on-chip by configuring logic elements, routing resources, and dedicated functional blocks. This flexibility shortens development cycles and enables field updates without changing the physical PCB. The EP1SGX40DF1020C5ES is distinguished by 41,250 logic cells, 4,125 LABs, 1.5 V operation, and 1,020 package terminals. Its 624-I/O capability can support high-pin-count buses and multiple peripheral interfaces, although the exact usable I/O count depends on the device configuration, reference design, package assignment, and signal-integrity constraints. The reported 5,000 MHz figure should be treated as a catalog characteristic rather than a guaranteed system clock, because actual performance depends on implemented logic, routing depth, I/O standards, power settings, and timing closure. The Stratix GX architecture combines programmable logic fabric with resources intended for demanding digital systems. A third-party listing reports a maximum CLB combinatorial delay of 7.49 ns, while another listing describes a maximum clock frequency of 6 MHz; these conflicting values were not used as definitive performance specifications. The 130 nm CMOS process generation places the part in the historical Stratix GX family, and engineering teams should rely on the complete manufacturer datasheet for architecture, configuration, electrical, and timing details. Typical uses include communications infrastructure, high-speed industrial controllers, test and measurement equipment, and parallel digital signal-processing platforms. The large logic capacity can consolidate functions that might otherwise require several conventional ICs. When planning a new design, treat the 33 mm by 33 mm BGA footprint as a board-layout commitment and verify all balls, power planes, decoupling, configuration circuitry, and high-speed routing against the official family documentation. This page combines exact supplied specifications, practical engineering guidance, availability context, and verified cross-reference results while clearly flagging values that remain unverified.
EP1SGX40DF1020C5N - Stratix GX FPGA 41,250 LEs | Altera / Intel
The Altera (now Intel) EP1SGX40DF1020C5N is a high-density Stratix GX FPGA with 41,250 logic elements, 4,125 LABs, and 3,423,744 memory bits in a 1020-pin FC-FBGA package. It integrates up to 20 transceiver channels supporting multi-gigabit serial I/O and runs on a 1.5V core supply with a 130nm CMOS process, targeting high-bandwidth communications and DSP-intensive designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device from the broader semiconductor category that lets engineers implement arbitrary digital logic after PCB assembly. FPGAs sit at the same hierarchy level as microcontrollers and DSPs but offer higher logic density, parallel datapaths, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP multipliers. The Stratix family is positioned at the high-performance end of the Altera/Intel portfolio, with Stratix GX adding embedded serial transceivers for protocols like PCI Express, RapidIO, SerialLite, and custom serial interfaces. Key features of the EP1SGX40DF1020C5N include 624 user I/O pins, embedded transceiver blocks capable of multi-gigabit operation, on-chip RAM up to 3,423,744 bits, DSP blocks for fixed- and floating-point acceleration, and a configurable Logic Array Block (LAB) architecture. The 'C5' speed grade and 'N' suffix denote the commercial temperature range (0C to 85C) and lead-free / RoHS-compliant packaging. The 33 x 33 mm FC-FBGA with 1 mm ball pitch is one of the largest Stratix GX packages, enabling maximum logic density and pin count. This part is designed for applications requiring both high logic capacity and high-speed serial I/O, including telecom line cards, serial RapidIO backplanes, and PCI Express endpoint/root-complex designs. Its commercial temperature grade suits indoor communications, video processing, and test equipment rather than automotive or industrial extended-temperature deployments. A key design consideration is PCB complexity: the 1020-ball FC-FBGA requires multilayer PCB fabrication, controlled-impedance routing for the serial links, and careful power-rail decoupling across multiple supply domains (VCCINT, VCCIO, VCCA, VCCP, transceiver supplies). Engineers migrating to this part should plan for Stratix GX configuration scheme (EPCS or JTAG), Quartus II software support, and thermal analysis because a populated FPGA at full utilization can dissipate tens of watts. This page consolidates datasheet citations, drop-in family alternatives, and design guidance beyond the manufacturer datasheet to accelerate Stratix GX design-in and obsolescence planning. A migration note: the Stratix GX family is now mature legacy, with Altera/Intel steering new designs toward Stratix IV/V and Cyclone 10 families. EP1SGX40DF1020C5N is well supported by last-time-buy and authorized-stock channels but engineers should plan replacement parts for new designs.
EP1SGX40DF1020C6 - Stratix GX 41,250 Cells FPGA, 624 I/O | Altera
The Altera (Intel) EP1SGX40DF1020C6 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) featuring 41,250 logic cells, 4,125 LABs/CLBs, and 624 user I/O pins, fabricated on a 130 nm CMOS process and housed in a 1020-ball Fine-pitch Chip-Scale BGA (FC-FBGA, 33 mm x 33 mm with 1 mm ball pitch). It operates from a 1.5 V core supply (1.425 V to 1.575 V), supports up to 5000 MHz internal performance, and is rated for the commercial 0C to 85C operating range, making it suitable for high-throughput, transceiver-rich designs. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded hard IP such as transceivers, DSP blocks, and memory. Within the broader taxonomy, an FPGA sits under programmable logic, then logic ICs, then integrated circuits. The Stratix GX family adds up to 20 full-duplex high-speed transceiver channels, enabling multi-gigabit serial I/O for communications and storage systems. The EP1SGX40 sits at the top of the Stratix GX density range, designed for line-card aggregation, baseband processing, and protocol bridging applications. Key features of this part include 41,250 logic cells across 4,125 LABs/CLBs, embedded transceiver macros supporting standards such as PCI Express, Gigabit Ethernet, SerialLite II, and XAUI, dedicated on-chip memory, and DSP blocks for high-performance signal processing. The 1020-ball FC-FBGA package with exposed die top allows direct heat-sink attachment for thermal management at full transceiver utilization. Configuration is supported through JTAG, Passive Serial, Fast Passive Parallel, and Active Serial modes, with built-in CRC error detection and decompression for fast SRAM-based configuration images. Architecturally, the device combines a four-input look-up-table (LUT) logic fabric, TriMatrix on-chip memory (MLAB, M512, M4K blocks), embedded 18x18 multipliers, and high-speed PLLs. Transceivers run at data rates up to 3.125 Gbps per channel, delivering up to 62.5 Gbps of aggregate serial bandwidth. The device is configured using SRAM cells, requiring a configuration ROM or download controller at every power-up. Typical applications include high-speed serial interface bridging in telecom line cards, protocol offload engines for storage area networks, baseband and radio card signal processing, and high-throughput data acquisition systems. Designers choose this part when they need maximum logic density combined with multi-gigabit transceivers in a single silicon device. When designing with this FPGA, plan power sequencing carefully: the 1.5 V VCCINT, VCCIO banks, and PLL/Transceiver analog supplies (VCCA, VCCH) must ramp in the order specified in the Altera Stratix GX device handbook to avoid latch-up. Use at least 12 layers on the PCB with dedicated ground planes for the transceiver analog supply to meet jitter and EMI compliance.
EP1SGX40DF1020C6BN - Stratix GX FPGA 41K LE 624 I/O 1020-FBGA | Intel
The Intel (formerly Altera) EP1SGX40DF1020C6BN is a high-density Stratix GX family FPGA IC delivering 41,250 logic elements (3,423,744 total memory bits) across 4,125 LABs/CLBs in a 1020-ball FineLine BGA package. Per the manufacturer datasheet, the device integrates up to 624 user I/Os, embedded multiplier blocks, and Stratix GX transceiver resources, and is rated for commercial operating conditions at the speed grade 6 timing bin. This member of the EP1SGX40D density tier targets high-bandwidth serial-interface applications where integrated transceivers simplify board-level design. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device in which the logic fabric, interconnect, and I/O behavior are defined by user-supplied configuration bitstreams rather than by fixed mask layers. FPGAs sit at the top of the programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The Stratix GX family specifically adds multi-gigabit transceivers (MGTs) alongside the general-purpose logic, making the category hypernym a "transceiver-equipped FPGA" or "high-speed serial FPGA." Key differentiating features include 4,125 LABs/CLBs, 41,250 logic elements, dedicated 18x18 multiplier blocks for DSP pipelines, Stratix GX multi-gigabit transceivers supporting backplane and chip-to-chip serial links, 3,423,744 bits of embedded RAM, and 624 general-purpose I/O pins. The 1020-ball FBGA package exposes the full user-I/O complement and integrates dedicated clock-management circuitry, including PLLs and a global clock network. The architecture combines a logic-array block (LAB) fabric built from 4-input look-up tables (LUTs), embedded TriMatrix memory blocks, DSP blocks, and high-speed transceivers. Configuration is stored in SRAM cells, requiring a configuration device or controller for bitstream loading on power-up. JTAG (IEEE 1149.1) boundary-scan and configuration interfaces are exposed as standard I/O banks. Typical applications include 10 Gbps backplane interfaces, SONET/SDH framer designs, multi-gigabit serial-link aggregation, high-speed test and measurement instrumentation, and protocol-bridge ASIC replacements. Engineers select this device when they need integrated multi-gigabit transceivers and high logic density on a single die. When designing with this part, plan the PCB for the 1020-ball FBGA land pattern with controlled-impedance transceiver lanes, match-length differential pairs, and a robust decoupling network near each power pin. The Altera/Intel Quartus II design suite is required for synthesis, place-and-route, and bitstream generation; legacy project archives may need migration to Quartus II service packs still available on the Intel FPGA legacy support portal. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Stratix GX design notes that are not consolidated in any single manufacturer document.
EP1SGX40DF1020C6ES - 41,250-Cell Stratix GX FPGA | Intel
Intel EP1SGX40DF1020C6ES is a high-density Stratix GX field-programmable gate array with 41,250 logic cells, 130 nm CMOS technology, and a 1.5 V supply, housed in a 1020-ball FC-FBGA package. Its 33 mm by 33 mm body and 1.00 mm terminal pitch suit large, high-I/O designs that require substantial programmable logic capacity and controlled high-speed signal integration. The available data identifies up to 624 inputs and 624 outputs and references a maximum frequency value of 5,000 MHz, which should be interpreted according to the manufacturer’s original device-family documentation rather than assumed to represent a general-purpose clock frequency. A field-programmable gate array is a programmable logic device whose configurable logic blocks, routing resources, and input/output elements implement digital circuits after manufacturing. An FPGA occupies the broader hierarchy of semiconductor, programmable logic, and digital integrated circuit products. Unlike a fixed-function application-specific integrated circuit, the same FPGA can be configured for interfaces, protocol processing, control, digital filtering, and other parallel functions. Stratix GX devices are associated with high-density programmable logic and integrated transceiver-oriented system designs. The headline parameters are 41,250 cells, 4,125 logic array blocks or configurable logic blocks as separately described by the retrieved sources, and a 1020-ball package. The device uses CMOS logic and a 130 nm process technology. It operates from a 1.5 V supply and is specified for an ambient operating range of 0 °C to 85 °C. The package’s 1.00 mm pitch supports a substantial ball grid while still requiring a controlled surface-mount assembly process. Architecturally, the part combines programmable logic with configurable routing and I/O resources, allowing parallel datapaths and interface logic to be customized for a target system. The supplied results also characterize the package as 1020-ball PBGA with JESD-30 code S-PBGA-B1020, while other results identify FC-FBGA. Engineering review should therefore use the complete ordering information and the manufacturer family datasheet to resolve package nomenclature and confirm the exact pin and ball assignments before layout release. Typical applications include communications equipment, high-throughput digital systems, protocol bridging, and industrial processing platforms requiring many programmable logic resources. The device can host parallel control and data-path functions, while its high pin count provides broad physical connectivity for multi-bank designs. Suitability depends on the exact configuration, I/O standards, power integrity, timing constraints, and transceiver support verified in the original family documentation. Designers should preserve continuous power and ground references, follow the family datasheet decoupling and ball-map guidance, and validate all high-speed routes against the selected I/O standard. Because the target is a 1020-ball BGA, assembly, via-in-pad policy, solder-mask definition, escape routing, and inspection must be agreed with the PCB fabricator before production. A 5,000 MHz figure appears in search metadata, but no device-wide operating-frequency conclusion should be drawn without the relevant manufacturer timing definition. This product record consolidates verified package, process, density, temperature, and supply information, while marking unsupported electrical and lifecycle fields instead of guessing. It also distinguishes confirmed device facts from package-label terminology and cross-reference-search results that did not establish any verified drop-in replacement.
EP1SGX40DF1020C6N - Stratix GX FPGA, 41,250 LEs, 1020-FBGA | Intel
The Intel EP1SGX40DF1020C6N is a member of the Stratix GX family of field-programmable gate arrays (FPGAs), delivering 41,250 logic elements in a 1,020-ball fine-pitch BGA package operating at 5000 MHz on a 1.5 V core supply with 130 nm process technology. It integrates 4,697 CLBs / 4,125 LABs, 3,423,744 bits of embedded RAM, and 624 user I/Os, packaged in a 33 x 33 mm FC-FBGA (flip-chip fine-pitch BGA) with 1 mm ball pitch for high-density board integration. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing engineers to implement arbitrary digital logic, signal processing, and memory functions in silicon without a custom ASIC tape-out. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA) and are widely used for prototyping, low-volume production, and applications where post-silicon logic updates are required. The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications such as communications infrastructure, broadcast video, and defense signal processing. Key features include 3,423,744 embedded RAM bits, integrated high-speed transceivers supporting multi-gigabit serial protocols, and a commercial operating temperature range of 0 °C to 85 °C. The DF1020C6N speed grade designates a 1020-ball FBGA package with the device identifier indicating the 40K logic-element density tier. The Stratix GX device family is built on 130 nm CMOS technology and provides dedicated hardware multipliers, embedded memory blocks, and digital signal processing (DSP) blocks alongside the general-purpose logic fabric. Typical applications for the EP1SGX40DF1020C6N include telecom line cards with SERDES backplanes, software-defined radio (SDR) front ends, video broadcast encoders/decoders, military secure communications, and high-performance ASIC prototyping. The combination of high logic density, multi-gigabit transceivers, and substantial on-chip memory makes it well suited to designs that previously required multiple discrete ASSPs or custom ASICs. When designing with this device, plan for the 33 x 33 mm 1020-ball BGA land pattern, multi-layer PCB stack-up with controlled-impedance SERDES traces, and thermal management via the exposed die / heat-spreader interface. Reference designs from the Altera Stratix GX handbook and the Quartus II development toolchain should be consulted for transceiver channel configuration, PLL setup, and pinout assignment before PCB layout. This page synthesizes distributor pricing, drop-in replacement parts from the same Stratix GX family, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX40DF1020C7 - 41.25K LE Stratix GX FPGA, 624 I/O, FC-FBGA-1020
The Altera (now Intel) EP1SGX40DF1020C7 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process, integrating 41,250 logic elements (LEs) and 624 user I/Os in a 1020-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package measuring 33 x 33 mm with 1.0 mm ball pitch. It operates from a 1.425 V to 1.575 V (nominal 1.5 V) supply and is rated for the commercial 0 C to 85 C temperature range (C7 speed grade). An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can program post-manufacture to implement custom digital logic, DSP, or interface functions. Stratix GX sits within the broader hierarchy: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. The 'GX' suffix denotes the integrated high-speed serial transceiver capability that distinguishes Stratix GX from the base Stratix family, targeting applications such as backplane serialization, chip-to-chip links, and early-generation multi-gigabit serial I/O. Key specifications include 4,125 LABs (Logic Array Blocks), embedded multiplier blocks, TriMatrix memory, support for multiple I/O standards including LVDS and LVTTL, and dedicated high-speed transceiver channels suitable for protocols such as SerialLite, Gigabit Ethernet, and Fibre Channel. The architecture combines logic, memory, and serial transceivers on a single die, reducing board complexity and BOM cost in multi-gigabit designs. The 130 nm process technology balances logic capacity, power dissipation, and transceiver performance. Embedded transceiver circuitry supports serializer/deserializer (SERDES) functionality with embedded clock-data recovery (CDR), 8b/10b encoding, and word alignment. The TriMatrix memory subsystem provides three memory block sizes (512-bit, 4 Kbit, and 512 Kbit) that can be cascaded for flexible on-chip buffering. Typical applications include telecom base-station backhaul links, broadband aggregation routers, high-speed serial bridge chips between processors and backplanes, prototype ASIC emulation, and test-and-measurement instrumentation with multi-channel serial capture. The integrated transceivers also suit defence, broadcast video transport, and medical imaging data links. When designing with this FPGA, plan FPGA fabric utilization at 70-80% of available LEs and LABs to leave headroom for routing congestion and timing closure. Use Altera Quartus II (or later Quartus Prime) software for synthesis, place-and-route, and timing analysis. PCB layout must enforce 1.0 mm BGA pitch routing with matched-length differential pairs for all transceiver channels; refer to the Stratix GX Device Family Data Sheet for transceiver reference clock and power-rail decoupling guidance. This page synthesizes distributor stock and pricing signals, same-brand speed-grade drop-in alternatives drawn from the Site MPN list, and practical Quartus design notes that are not consolidated in any single manufacturer document.
EP1SGX40DF1020C7ES - Stratix GX FPGA, 41.25K Cells, FBGA-1020 | Altera
The Altera EP1SGX40DF1020C7ES is a high-density Stratix GX family field-programmable gate array (FPGA) fabricated on a 130 nm CMOS process and housed in a 1020-ball fine-pitch BGA (FBGA-1020, 33 x 33 mm, 1.0 mm pitch). The device integrates 41,250 logic cells (LEs), embedded memory, DSP blocks, MultiTrack interconnect, and up to 20 high-speed transceivers, targeting line-card, communications, and high-speed serial I/O designs. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LEs), programmable interconnect, and I/O cells that can be electrically reconfigured after manufacturing to implement custom digital logic, DSP pipelines, or interface protocols. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy: faster and more parallel than microcontrollers, lower NRE cost than ASICs, and ideal for prototyping, low-volume production, and applications requiring hardware-level latency. Stratix GX is a transceiver-rich sub-family optimized for multi-gigabit serial protocols. Key features highlighted in the Stratix GX Device Family Data Sheet include 41,250 logic elements, dedicated DSP blocks, TriMatrix embedded memory, MultiTrack interconnect for predictable timing closure, and differential I/O standards including LVDS and HSTL. Speed-grade C7 denotes a commercial operating profile, with an operating temperature range of 0 C to 85 C (32 F to 185 F). The 130 nm process node and MultiTrack architecture deliver deterministic routing delays and high utilization rates for memory-intensive and DSP-heavy designs. Embedded SERDES channels support multi-gigabit serial protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet, eliminating external PHY components and reducing BOM cost. Typical applications include broadband line-card backplanes, SONET/SDH framer/mapper ASIC replacement, military secure communications, high-performance ASIC prototyping, and image-processing pipelines. The transceiver channels make it especially suitable for serial backplane aggregation. When designing with this part, ensure the PCB has matched-impedance routing for the high-speed serial channels and a sufficient thermal dissipation path; the 33 x 33 mm FBGA-1020 package requires a multilayer PCB with microvia technology and controlled-impedance stack-up for full-speed SERDES operation. This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet. Lifecycle status reflects Altera's (now Intel PSG) NRND/EOL trajectory for the Stratix GX family.
EP1SGX40DF1020C7N - 41,250-Cell Stratix GX FPGA | Altera/Intel
The Intel/Altera EP1SGX40DF1020C7N is a high-density Stratix GX family FPGA with 41,250 logic cells, 624 user I/Os, and integrated transceiver support, housed in a 1020-pin flip-chip FBGA (33x33 mm, 1.0 mm pitch) package. It operates at a core supply of 1.5 V and supports commercial-temperature 0C to +85C operation. The device is built on a 130 nm CMOS process and targets high-bandwidth serial I/O and DSP-intensive applications. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital logic, memory blocks, DSP pipelines, and high-speed serial interfaces in a single chip. FPGAs sit between fixed-function ASICs and software-programmable processors: unlike ASICs they are reconfigurable after fabrication, and unlike processors they achieve deterministic, parallel hardware performance. The Stratix GX family in particular adds multi-gigabit transceivers and dedicated SERDES blocks, positioning it as a programmable alternative to custom silicon for wired communications and high-performance DSP. Key features of the EP1SGX40DF1020C7N include 4,697 Configurable Logic Blocks (CLBs), built-in clock management, embedded memory, and DSP blocks. It supports the Quartus II design flow (legacy versions of Quartus Prime are also backward-compatible). The 1020-pin FC-FBGA package provides the high pin density required for 624 user I/Os plus transceiver and global clock pins. According to the Stratix GX Family Data Sheet, the device supports multi-gigabit transceivers operating in the hundreds-of-MHz to multi-Gbps range, making it suitable for protocols such as SPI-4.2, RapidIO, and 10 Gigabit Ethernet PHY interfaces. Typical applications include telecom line cards, baseband processing, high-speed serial bridging, video processing, and ASIC prototyping. Designers choose this device when they need a balance of logic density, embedded memory/DSP, and high-speed serial I/O without migrating to a fully custom ASIC. Note that the Stratix GX family is mature/last-time-buy; new designs should evaluate Cyclone, Arria, or Stratix V families unless legacy compatibility is required. When designing with this FPGA, plan the PCB for the 33x33 mm BGA with 1.0 mm pitch: use 0.8 mm via-in-pad or microvia stackups with ENIG or ENEPIG surface finish for reliable BGA assembly, and provide at least 6 signal layers with controlled-impedance routing for the transceiver lanes. Decouple every VCC/VCCINT/VCCIO ball with 0.1 uF plus bulk capacitance per the Stratix GX pin connection guidelines.
EP1SGX40DF1020I5 - Stratix GX FPGA 41,250 LEs 1020-BGA | Altera
The Altera (Intel PSG) EP1SGX40DF1020I5 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) delivering 41,250 logic elements organized as 4,125 Configurable Logic Blocks (CLBs), housed in a 1020-ball FC-FBGA package and fabricated on a 130 nm CMOS process. The device operates from a nominal 1.5 V core supply (1.425 V min, 1.575 V max) and supports industrial/military temperature grade operation, with built-in high-speed serial transceivers targeting multi-gigabit serial I/O applications. The 1020-ball BGA is a 1.00 mm pitch flip-chip fine-pitch BGA package optimized for high signal-integrity designs with abundant I/O. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks (M4K/M512), DSP blocks, and programmable routing. Within the broader taxonomy FPGAs sit alongside ASICs and CPLDs as programmable logic devices, and Stratix GX specifically targets designs that require embedded multi-gigabit transceivers (MGTs) for protocols such as PCI Express, Serial RapidIO, XAUI, and 1/2/4 Gbps Fibre Channel. By integrating hard serial-deserializer (SerDes) blocks, Stratix GX removes the need for external PHY chips. Key features include embedded transceiver channels with data rates up to 3.1875 Gbps, TriMatrix on-chip memory, dedicated DSP blocks for high-throughput arithmetic, and Quartus II / Quartus Prime software support. The 1020-ball FBGA delivers ample user I/O and differential pairs needed for parallel memory buses and high-speed serial links. Industrial-grade temperature operation and the military screening grade make this part attractive to defense, aerospace, and high-reliability industrial customers. Architecturally, the EP1SGX40DF1020I5 combines a fine-grained logic fabric with embedded MGTs, PLLs, and on-chip memory; this heterogeneous mix allows designers to consolidate what would otherwise require a discrete SerDes, an FPGA, and glue logic onto a single die. The 130 nm process node places this device in the legacy Stratix GX generation, which is widely understood and supported by mature toolchains. Typical applications include high-speed serial interface bridging, custom telecom backplane aggregation, defense radar signal processing, test & measurement instrumentation with embedded SERDES, and industrial control backplanes. The wide I/O count and on-chip transceivers make it a strong fit for protocol bridging and aggregation designs. When designing with this part, verify that the 1020-ball FBGA land pattern, power-rail decoupling scheme, and MGT reference-clock architecture match your board; Quartus II toolchain support is required. The 'I5' speed-grade and 'I' temperature-grade suffix indicate industrial temperature and a specific speed bin. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing and selection.
EP1SGX40DF1020I5N - Stratix GX FPGA 41,250 Cells FBGA-1020 | Altera
The Intel (formerly Altera) EP1SGX40DF1020I5N is a high-density Stratix GX family Field Programmable Gate Array built on a 130 nm CMOS process, delivering 41,250 logic cells organized as 4,125 Configurable Logic Blocks (CLBs) in a 1020-ball FC-FBGA package measuring 33 x 33 mm with 1.0 mm ball pitch. It operates from a 1.5 V core supply, supports an internal maximum clock frequency of up to 5000 MHz equivalent in logic performance, and integrates 3.75 Mbits of embedded TriMatrix memory alongside dedicated high-speed serial transceiver channels characteristic of the Stratix GX line. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions after PCB fabrication by configuring an array of logic elements, embedded memory blocks, DSP blocks, and routing resources via a configuration bitstream. Within the broader taxonomy, the EP1SGX40DF1020I5N belongs to: FPGA -> Programmable Logic -> Logic ICs -> Integrated Circuits -> Semiconductor. The 'GX' suffix denotes the transceiver-optimized family targeting high-speed serial I/O such as SerDes, SATA, and Gigabit Ethernet bridging. Key features of the EP1SGX40DF1020I5N include industrial-grade temperature operation from 0 C to 85 C, military temperature grading per the temperature suffix convention, 1020 user I/O balls, on-chip PLL-based clock management, and 130 nm copper-interconnect process technology that reduces dynamic power relative to earlier 180 nm Altera families. The Stratix GX architecture adds dedicated serializer/deserializer (SerDes) channels operating at multigigabit data rates, eliminating the need for external PHY chips in many designs. Typical applications for the EP1SGX40DF1020I5N include high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), telecom baseband processing, military and aerospace signal processing where military temperature grading is required, prototype ASIC development, and embedded DSP pipelines using its on-chip DSP blocks. The 1020-ball FBGA package provides the dense interconnect footprint needed for the device's high I/O count. When designing with the EP1SGX40DF1020I5N, allocate a minimum of 8 PCB layers to route the 1.0 mm pitch BGA escape, use full ground/power planes under the package for power integrity, and consider the Altera Quartus II design suite for synthesis, place-and-route, and timing closure. Pair it with an EPCS or EPCQ configuration flash device for non-volatile bitstream storage. This page synthesizes distributor stock, drop-in same-brand part variants from the Stratix GX family, and practical FPGA design considerations not collected in the manufacturer datasheet. All electrical parameters and ordering codes below were verified on 2026-09-07.
EP1SGX40DF1020I6 - Stratix GX FPGA 41,250 Cells 1020-FBGA | Intel
The Intel EP1SGX40DF1020I6 is a high-performance Field Programmable Gate Array from the Stratix GX family, integrating 41,250 logic elements and 4,125 Configurable Logic Blocks (CLBs) into a 1020-ball FC-FBGA package. Built on a 130 nm CMOS process and operating at 1.5 V core with industrial temperature grade (I6), the device delivers up to 3.423 million bits of embedded memory and supports user I/O counts in the 600+ range, enabling high-throughput serial interface and parallel processing designs. A Field Programmable Gate Array (FPGA) is a semiconductor device based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the programmable logic device (PLD) hierarchy -> PLD -> FPGA -> high-density FPGA, bridging the gap between fixed-function ASICs and software-driven processors. The Stratix GX family extends the generic Stratix architecture by adding embedded transceivers for multi-gigabit serial I/O, making the EP1SGX40DF1020I6 well-suited for communication, signal-processing, and high-bandwidth data-pipeline designs. Key differentiating features include 624 maximum user I/Os, 41250 logic elements, 3423744 embedded RAM bits, embedded high-speed transceivers (Stratix GX feature), and an operating temperature range suitable for industrial environments. The 1020-ball Fine-pitch Ball Grid Array (FC-FBGA) provides high-density interconnect at 1.0 mm pitch, supporting complex pinout requirements while occupying less board area than equivalent QFP packages. Architecturally, the EP1SGX40DF1020I6 combines LUT-based logic, TriMatrix embedded memory blocks, DSP blocks for signal processing, and dedicated high-speed transceiver channels. The 130 nm process balances logic density with low static power, while the I6 speed grade provides a tested timing margin consistent with industrial deployment. Typical applications include high-speed serial interface cards, baseband signal processing, industrial imaging pipelines, networking line cards, and protocol bridging between legacy and modern buses. The combination of high logic density and embedded transceivers makes the part especially attractive in telecom backplane and test equipment designs. When designing with this device, ensure power sequencing and decoupling follow Intel/Altera Stratix GX hardware reference design guidelines, and verify Quartus II device support before committing to layout.
EP1SGX40DF1020I6N - Stratix GX FPGA, 41.25K LEs, 1020-FBGA | Intel
The Intel (formerly Altera) EP1SGX40DF1020I6N is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 41,250 logic elements, 3,423,744 RAM bits, and high-speed serial transceivers in a 1020-ball FineLine BGA (FBGA) package measuring 33 x 33 mm with 1.0 mm pitch. The 'I6' speed grade and industrial temperature rating (-40C to 85C junction, 0C to 85C case) position this device for mainstream wired-communication, signal-processing, and embedded-protocol applications where deterministic timing and serial-link throughput matter more than absolute power efficiency. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, interconnect, I/O cells, and embedded memory/blocks can be reconfigured by the end user after manufacture. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: they offer ASIC-class parallelism and deterministic latency while retaining the programmability of software-defined hardware. The Stratix GX family specifically adds hardened multi-gigabit transceivers, making it a sub-class often referred to as an FPGA with SerDes or a communications-grade FPGA, distinguishing it from lower-cost Cyclone families and from non-transceiver Stratix variants. Key features of the EP1SGX40DF1020I6N include 624 maximum user I/O pins, 4,125 LABs (Logic Array Blocks), 3,423,744 embedded RAM bits, embedded DSP blocks for fixed- and floating-point arithmetic, and 1.5V core supply operation. The 'GX' designation indicates integrated high-speed serial transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet, freeing the user from building serializer/deserializer (SerDes) logic in soft fabric. The 1020-ball FBGA package exposes all transceivers, I/O, configuration, and clock signals while providing excellent signal-integrity characteristics for multi-gigabit signalling. Typical applications include telecommunications line cards, military/aerospace signal processing, ASIC prototyping, high-speed data-acquisition front-ends, and embedded digital-signal-processing systems. Industrial-grade temperature screening and legacy process maturity make it a long-life-cycle component for OEM programs that must run for 10-15 years. When designing with this device, ensure your power architecture can supply the 1.5V core rail with sufficient decoupling, and validate pin-out against the 1020-BGA land pattern before PCB fabrication. Configuration is handled via the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) - consult the Stratix GX device family datasheet for the supported configuration schemes (Passive Serial, Fast Passive Parallel, JTAG, etc.).
EP1SGX40DF1020I7 - 41,250 LEs Stratix GX FPGA, 1.5V FC-FBGA-1020 | Altera
The Altera EP1SGX40DF1020I7 is a high-density Stratix GX family field-programmable gate array (FPGA) housed in a 1020-ball Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) package. Built on a 130 nm CMOS process, it integrates 41,250 logic elements organized into 4,125 configurable logic blocks (CLBs), and operates from a nominal 1.5 V core supply (1.425 V to 1.575 V). The Stratix GX variant adds up to 20 full-duplex embedded transceivers supporting serial protocols up to 3.125 Gbps, making the part a workhorse for high-speed serial I/O designs. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured by the end user after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), alongside CPLDs, and occupy the highest-density tier used for ASIC prototyping, signal processing, and high-bandwidth interface bridging. The Stratix GX family specifically targets applications where embedded multi-gigabit transceivers (EMGTs) and DSP blocks need to coexist with a large general-purpose logic array on a single die. Key features of the EP1SGX40DF1020I7 include approximately 3.4 Mbits of embedded TriMatrix memory, embedded multipliers, and a military-grade operating temperature rating per the I7 speed/temperature grade. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards and offers dedicated hardware for clock management (PLLs), allowing multiple frequency domains within a single design. The combination of high logic density and embedded transceivers enables system designers to consolidate what would otherwise require an FPGA plus a separate PHY device. Typical applications include high-speed serial protocol bridging (PCI Express, Gigabit Ethernet, Serial RapidIO), telecom line cards, military and aerospace signal processing, ASIC prototyping, and test & measurement instrumentation where deterministic timing and reconfigurable logic are required. The wide temperature grade also makes the I7 variant suitable for ruggedized and outdoor-deployed equipment. When designing with the EP1SGX40DF1020I7, pay close attention to PCB routing of the FC-FBGA-1020 footprint: at roughly 33 mm x 33 mm with a 1.0 mm ball pitch, the part demands high-density interconnect (HDI) stack-up with microvias and a controlled-impedance layer stack for the transceiver channels. Decoupling, power-plane segmentation, and JTAG access must be planned around the ball map from the Stratix GX Device Family Data Sheet.
EP1SGX40DF1020I7N - 41,250 Logic Cells Stratix GX FPGA | Intel
The Intel EP1SGX40DF1020I7N is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) featuring 41,250 logic cells, 4,125 Configurable Logic Blocks (CLBs), and embedded high-speed transceivers, fabricated on a 130 nm CMOS process and housed in a 1020-ball FC-FBGA package with 1 mm ball pitch and 33 x 33 mm body. It operates from a nominal 1.5 V core supply (1.425 V to 1.575 V) and is specified across the commercial 0 C to 85 C temperature range, with industrial-grade variants in the same family. The device integrates dedicated serializer/deserializer (SerDes) channels and high-speed I/O supporting backplane and chip-to-chip serial interconnect at multi-gigabit data rates, making it well suited to communications and signal-processing designs that previously required discrete PHYs. What is a Stratix GX FPGA? The Stratix GX is an FPGA product family from Altera (now Intel) that augments a general-purpose logic fabric with hard multi-gigabit transceivers and rich embedded memory. In the taxonomy of programmable logic devices, FPGAs sit alongside CPLDs as the dominant class of user-configurable silicon; within FPGAs, Stratix GX belongs to the high-end transceiver-equipped tier that preceded the Stratix II/III/IV/V generations. Compared with non-transceiver FPGAs, GX devices eliminate external PHY chips, reduce board area, and simplify timing closure for serial protocols such as PCI Express, Serial RapidIO, XAUI, and custom backplanes. Key features include 41,250 logic cells organized as 4,125 CLBs, embedded transceiver channels capable of multi-gigabit operation, a maximum operating frequency of 4385.97 MHz per the manufacturer characterization, and configurable I/O standards supporting LVDS, LVTTL, LVCMOS, and HSTL. The device incorporates dedicated on-chip memory blocks and DSP blocks for high-throughput signal processing, plus configuration circuitry that supports both JTAG and serial/parallel configuration modes. The 1020-ball FC-FBGA package provides high-density interconnect suitable for I/O-rich designs. The architecture combines a programmable logic fabric with hard IP blocks: transceiver macro cells, TriMatrix embedded memory, and DSP blocks. By absorbing PHY functionality into silicon, the EP1SGX40 reduces latency, jitter, and power relative to FPGA-plus-external-PHY implementations. Designers targeting this part typically leverage the Altera (Intel) Quartus II design suite for synthesis, place-and-route, and timing closure. Typical applications include communications infrastructure such as SONET/SDH line cards and backplane aggregation, serial-protocol bridging (PCI Express, Serial RapidIO, XAUI, Fibre Channel), test and measurement instrumentation with embedded signal processing, high-performance DSP front ends, and legacy networking line cards transitioning from discrete PHYs to integrated transceivers. When designing with this device, ensure that the PCB BGA breakout accommodates 1 mm pitch balls, provide clean multi-phase power for the 1.5 V core with adequate decoupling, and verify thermal headroom against the application's continuous operating duty cycle. Designers should also validate configuration mode (JTAG, passive serial, fast passive parallel) against the production programming flow. This page synthesizes distributor pricing, drop-in equivalents within the Stratix GX family, and practical design notes not consolidated in the manufacturer datasheet, enabling faster selection and risk assessment for engineers evaluating transceiver-equipped FPGAs.
EP1SGX40F1020 - 40kLE Stratix GX FPGA w/ 20 Transceivers | Altera
The Altera EP1SGX40F1020 is a member of the Stratix® GX FPGA family, integrating 41,250 logic elements and 20 high-speed serial transceivers in a 1020-ball FineLine BGA package. As Altera's second-generation FPGA to combine multi-gigabit transceivers with a high-performance logic fabric, it targets protocols such as PCI Express, Serial RapidIO, XAUI, and SATA through embedded physical coding sublayers. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic elements, routing interconnects, embedded memory blocks, and dedicated I/O resources. Within the broader integrated-circuit hierarchy, an FPGA sits between general-purpose microcontrollers and application-specific integrated circuits (ASICs): it provides hardware-level parallelism and deterministic timing that microcontrollers cannot match, while preserving post-fabrication reprogrammability that ASICs do not offer. The Stratix GX family extends this concept by adding multi-gigabit transceivers, making the FPGA a true system-on-chip for high-speed serial I/O. Key features of the EP1SGX40F1020 include 3,423,744 bits of embedded RAM distributed across TriMatrix memory blocks, 624 user I/O pins, dedicated DSP blocks for high-throughput signal processing, and embedded hard IP for PCI Express ×8 and Serial RapidIO. The device supports configuration via SRAM-based LUTs, allowing in-system reprogramming and remote field upgrades. Its transceiver channels operate from 600 Mbps to 3.1875 Gbps per channel, depending on speed grade, and support both chip-to-chip and backplane signalling. The architecture combines a high-performance adaptive logic module (ALM) fabric with embedded memory, multipliers, and phase-locked loops (PLLs). This heterogeneous mix enables the device to handle packet processing, encryption, video bridging, and baseband functions on a single die while sustaining line-rate throughput on its serial links. Typical applications include high-end communications infrastructure (10 GbE line cards, ATCA backplanes), broadcast and video processing, military signal intelligence, medical imaging accelerators, and ASIC prototyping. The combination of transceivers and dense logic also makes it suitable for test-and-measurement instrumentation where custom signal-conditioning pipelines are required. When designing with this device, careful attention to transceiver power-supply decoupling, channel-bonded clock distribution, and PCB stack-up for 3+ Gbps signalling is critical. JTAG boundary-scan and the active serial configuration scheme simplify board bring-up, but the 1020-ball FineLine BGA demands advanced PCB fabrication and assembly capability. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX40F1020C5N - Stratix GX FPGA 40K LE 3.4Mbit 624 I/O | Intel
The Intel (formerly Altera) EP1SGX40F1020C5N is a high-performance Stratix GX FPGA combining a 41,250 logic-element fabric with 3,423,744 bits of embedded memory and 624 user I/Os, housed in a 1020-ball flip-chip BGA (FCBGA) package. It is part of Altera's second-generation FPGA family to integrate multi-gigabit transceivers with a scalable, high-performance logic array. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP blocks. Within the broader component taxonomy, FPGAs sit under programmable logic devices (PLDs), which are a category of integrated circuits (ICs), which in turn are a category of semiconductors. Stratix GX specifically targets high-speed serial I/O applications where transceivers, not just logic density, drive system performance. Key features of the EP1SGX40F1020C5N include up to 20 full-duplex high-speed serial transceiver channels, support for multiple protocols including PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI, embedded RAM of approximately 3.4 Mbit distributed across M512 and M4K memory blocks, and a 1.5 V core voltage. The device supports the LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across 624 user I/Os, with up to 24 dedicated clock pins. Architecturally, the Stratix GX family combines a 1.5 V Stratix-style fabric with embedded transceivers that operate from 600 Mbps to 3.1875 Gbps depending on the speed grade. The "C5" speed grade designation places this device in Altera's commercial speed bin, while the "F1020" suffix denotes the 1020-pin FBGA package and "N" indicates lead-free / Pb-free termination. The high transceiver count and large logic capacity make this device particularly suited to backplane aggregation, line-card bridging, and protocol-bridge ASIC replacement. Typical applications include high-speed serial backplane interfaces, telecommunications line cards, ASIC prototyping for multi-gigabit serial designs, SONET/SDH framer interfacing, and embedded computing platforms where both logic density and high-bandwidth I/O are required. The 1020-BBGA package offers substantial thermal headroom but requires careful PCB layout with controlled-impedance traces. When integrating the EP1SGX40F1020C5N, plan for JTAG configuration storage, multiple decoupling capacitor values (0.1 µF, 0.01 µF, and bulk), and a multi-layer PCB with continuous power and ground planes. The transceiver channels demand strict impedance control (typically 50 Ω differential) and length matching within the limits specified in the Stratix GX handbook. This page synthesizes distributor stock data, drop-in alternatives from the Stratix GX family, and practical layout guidance beyond what the manufacturer datasheet alone provides, giving both procurement and hardware engineers a single source for evaluation.
EP1SGX40F1020C6 - Stratix GX 41,250 LEs FPGA, 1020-BGA | Altera
The Altera (Intel) EP1SGX40F1020C6 is a member of the Stratix GX family of high-performance FPGAs with embedded transceivers, delivering 41,250 logic elements, 4,125 CLBs, and 3,423,744 bits of embedded memory in a 1020-ball FineLine BGA package (33 x 33 mm, 1 mm pitch). The device integrates up to 20 high-speed transceivers supporting multi-gigabit serial I/O and provides a rich fabric of logic, memory, and DSP resources for high-bandwidth signal processing applications. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic function is defined by user-programmed configuration memory rather than fixed mask layers. FPGAs sit at the top of the programmable-logic taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor) and provide hardware-timed parallel processing, in contrast to sequential microcontrollers or fixed-function ASICs. The Stratix GX family specifically targets applications that combine parallel processing with multi-gigabit serial I/O, eliminating the need for external PHY devices. Key features of the EP1SGX40F1020C6 include a 1.5 V core supply (with multiple I/O bank voltages), high-speed transceiver support up to 3.1875 Gbps per channel, dedicated DSP blocks for high-throughput multiply-accumulate operations, TriMatrix embedded memory with 3,423,744 total RAM bits, and configuration via SRAM-based LUT cells. The 1020-BGA package supports high-density board designs with controlled-impedance routing and exposes sufficient I/O pins for parallel interfaces, memory buses, and serial links. The architecture combines a logic array with embedded transceivers, PLLs, and block RAM, allowing single-chip implementation of protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and custom high-speed serial links. The hardwired PHY blocks significantly reduce logic resource consumption and simplify timing closure for serial channels. The 1.5 V internal core voltage (VCCINT) is supplied separately from VCCIO bank voltages to optimize power versus performance trade-offs. Typical applications include high-end telecom line cards, multi-gigabit serial backplane interfaces, video broadcasting equipment, signal intelligence platforms, and high-performance computing accelerator boards. The combination of embedded transceivers and substantial logic density also makes the device suitable for prototyping ASIC functionality before tape-out. When designing with this device, ensure that all VCCINT, VCCIO, VCCA, and transceiver supply rails are properly decoupled per the Stratix GX handbook, and that PCB layer stack-up provides continuous reference planes for the 1 mm-pitch BGA escape. Engineers should also confirm Quartus II version support for this legacy silicon before committing to new designs.
EP1SGX40FF1020C5 - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Intel
The Intel EP1SGX40FF1020C5 is a high-density Stratix GX field-programmable gate array (FPGA) delivering 41,250 equivalent logic elements (LEs), 4,125 configurable logic blocks (CLBs), and integrated 3.125 Gbps multi-gigabit transceivers in a 1020-ball flip-chip BGA package. Built on a 1.5 V core CMOS process, this device combines high-speed serial I/O with a scalable logic fabric, targeting communication infrastructure, high-end test equipment, and signal-processing designs. A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose processors (CPUs/MCUs) and application-specific integrated circuits (ASICs): they offer ASIC-class parallelism and throughput while remaining reprogrammable, making them ideal for low-to-medium-volume designs, rapid prototyping, and designs whose algorithms evolve over the product lifecycle. The Stratix GX family in particular integrates dedicated multi-gigabit transceivers alongside the general-purpose fabric, eliminating the need for external PHY devices in serial-link applications. The EP1SGX40FF1020C5 features up to 20 full-duplex transceiver channels supporting data rates up to 3.125 Gbps, embedded RAM blocks totaling approximately 3.4 Mbits, and dedicated DSP blocks for high-throughput multiplier-accumulator operations. The device is offered in a 1020-ball flip-chip BGA with 1.00 mm ball pitch and a seated height of 3.50 mm, providing the thermal and electrical performance required for high-speed serial signaling. Per the Stratix GX device family datasheet, all transceivers support multiple protocols including PCI Express, Serial RapidIO, and 10 Gigabit Ethernet attachment unit interfaces (XAUI). Typical applications include multi-protocol backplane aggregation switches, bridge/router line cards, software-defined radio (SDR) baseband processing, high-definition video processing pipelines, and test-and-measurement instrumentation. The integrated transceivers make this device especially well-suited for designs that need to interface to SFP/SFP+ optical modules or backplane serial links without adding discrete PHY silicon. The 1.5 V core (1.425 V to 1.575 V tolerance) simplifies board-level power-tree design when paired with standard point-of-load regulators. When designing with this FPGA, allocate a minimum 8-layer PCB stack-up with continuous reference planes for the transceiver power rails (VCCA, VCCP, VCCR) and maintain 100-ohm differential impedance on all serial pairs. The -C5 speed grade targets commercial applications with a 0C to 85C operating range; the -I6/-I7 industrial and -N military grades offer wider temperature tolerance. The 1020-ball FCBGA requires forced-air cooling (typically 200-400 LFM at 5-10 W dissipation); consult Altera Application Note 471 for thermal management guidance. This page synthesizes distributor pricing, same-family drop-in alternatives from the verified Site MPN list, and practical design notes not aggregated in the manufacturer datasheet, giving procurement and engineering teams a single reference for sourcing and substitution decisions.
EP1SGX40FF1020C6 - 41,250 LEs Stratix GX FPGA | Altera / Intel
The Intel (formerly Altera) EP1SGX40FF1020C6 is a high-density Stratix GX Field-Programmable Gate Array (FPGA) from the EP1SGX40 family, housed in a 1020-ball Plastic Ball Grid Array (PBGA / FBGA-1020) package with a 1.00 mm terminal pitch. The device integrates 41,250 logic elements (LEs), 4,125 Configurable Logic Blocks (CLBs), and approximately 3,423,744 bits of embedded SRAM, giving system architects substantial programmable logic capacity and on-chip memory bandwidth for complex digital signal processing and high-speed serial designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks, embedded memory, DSP blocks, and high-speed I/O, all interconnected by a programmable routing fabric. FPGAs sit at the top of the programmable logic hierarchy (PAL/CPLD -> FPGA -> SoC FPGA), and the Stratix GX family specifically targets designs requiring multi-gigabit transceivers and high-throughput parallel interfaces. SRAM-based LUT devices like this part are configured at power-up from an external flash or configuration device. Key features of the EP1SGX40FF1020C6 include up to 20 high-speed transceiver channels (Stratix GX transceivers supporting gigabit serial I/O), embedded multiplier blocks and DSP elements for high-performance arithmetic, dedicated external memory interface circuitry supporting DDR SDRAM and other high-bandwidth memories, and configurable I/O standards including LVDS and HSTL. The 'C6' speed grade balances performance and power, while the 'FF' fine-line BGA package maximizes signal integrity for the dense 1020-ball interface. Built on a 1.5 V core CMOS process with on-chip voltage regulation, the device consumes moderate static power and supports both commercial (0 C to 85 C) operation. Typical applications include high-speed serial protocol bridging (Serial RapidIO, XAUI, Gigabit Ethernet, PCI Express endpoints), DSP co-processing for wireless baseband and video imaging, telecom line-card packet processing, and military/aerospace signal intelligence platforms. The wide transceiver count and large SRAM block make the EP1SGX40 suitable for designs previously requiring multiple ASSPs plus glue logic. When designing with this device, plan for a JTAG-based or passive-serial configuration source, multi-layer PCB with continuous reference planes for the BGA, and a thermal management strategy sized for the largest expected logic utilization. Engineers should consult the Stratix GX Device Family Data Sheet for pin assignments, transceiver channel mapping, and Quartus II device-fit guidance. This page synthesizes the manufacturer datasheet headline specs, distributor availability, same-package drop-in alternatives, and practical design notes not collated in the original PDF, with values verified as of 2026-09-07.
EP1SGX40FF1020C7 - Stratix GX FPGA 41,250 LE | Intel | 1020-BGA
The Intel (formerly Altera) EP1SGX40FF1020C7 is a high-density Stratix GX field-programmable gate array (FPGA) that integrates up to 20 full-duplex 3.125 Gbps transceivers with a scalable logic fabric, packaged in a 1020-ball flip-chip BGA (FC-FBGA). It contains 41,250 logic elements, 4,125 CLBs (configurable logic blocks), 3,423,744 bits of embedded RAM, and 624 user I/O pins, with a commercial speed grade of 7 (-7, mid-speed). The device is built on a 1.5 V CMOS process and supports core supply voltages of 1.425 V to 1.575 V, with hot-socketing and PCI Express (PIPE) hardened IP blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic fabric, interconnect, and I/O cells are configured by the user after manufacture. Within the broader taxonomy, an FPGA belongs to the programmable logic device family, sitting alongside CPLDs (complex programmable logic devices); high-end FPGAs such as the Stratix GX family additionally integrate dedicated hard IP such as transceivers, DSP blocks, and embedded memory controllers. The 'GX' suffix indicates the transceiver-rich variant, optimized for serial connectivity in communication, broadcast, and storage systems. Key features of the EP1SGX40FF1020C7 include: 20 full-duplex 3.1875 Gbps transceiver channels supporting CPRI, OBSAI, XAUI, SerialLite II, PCI Express, and Serial RapidIO protocols; 14 dedicated full-duplex 1.25 Gbps channels on the same fabric; 4 PLL-per-transceiver block plus 8 enhanced PLLs; 176 9-bit DSP blocks; and embedded memory with true dual-port RAM, FIFO, and shift-register modes. The 1020-pin FC-FBGA package has a 1.00 mm ball pitch, ~33 mm × 33 mm body, and supports commercial-grade 0°C to 85°C junction operation. The architecture combines a TriMatrix memory hierarchy (MLABs, M512, M4K, M-RAM blocks) with row- and column-based I/O structures (Banks 1-12), four enhanced PLLs for clock management, and a configuration controller supporting passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), JTAG, and active serial (AS) modes. Hard PCI Express PIPE endpoints and external memory interfaces (DDR/DDR2/QDRII/QDRII+SRAM/RLDRAM II) make it well-suited for high-throughput bridging applications. Typical applications include: (1) base-station protocol bridging between CPRI/OBSAI fronthaul and Ethernet backhaul; (2) broadcast video routers and cross-point switches using Serial RapidIO or XAUI; (3) high-speed test and measurement equipment with multi-channel serial capture; (4) defence and radar signal preprocessing using embedded DSP blocks; (5) storage controllers aggregating Fibre Channel or SATA links. Its combination of 20 fast transceivers and 624 user I/O enables single-chip aggregation of multiple serial lanes plus parallel control-plane logic. When designing with this device, pay close attention to PCB power integrity: the FC-FBGA requires a multi-layer stack-up with continuous VCC, VTT, and GND planes, plus extensive decoupling per the Stratix GX PowerPlay early-power estimator. Transceiver channels need 100 Ω differential routing with controlled 100 Ω ± 10% impedance and length matching of ± 0.13 mm (5 mil) within a pair. Use the Altera Quartus II (now Intel Quartus Prime) design suite for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternatives, parametric comparisons and practical PCB-layout guidance not found in the manufacturer datasheet alone, helping procurement engineers and FPGA designers evaluate the EP1SGX40FF1020C7 against modern alternatives.
EP1SGX40FF1020I5 - Stratix GX FPGA, 41,250 LEs | Intel
The Intel (formerly Altera) EP1SGX40FF1020I5 is a high-performance Stratix GX family Field-Programmable Gate Array (FPGA) featuring 41,250 logic elements, 4,125 Configurable Logic Blocks (CLBs), and integrated 3.125 Gbps transceivers, housed in a 1020-ball FineLine BGA (FF1020) package with 1.0 mm ball pitch. It is a CMOS, SRAM-based LUT device fabricated on a 130 nm process and operates from a nominal 1.5 V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP blocks. FPGAs sit within the broader hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field via SRAM-based configuration bitstreams, which makes them ideal for prototyping, low-volume production, and applications requiring hardware-level parallelism. Key features include dedicated full-duplex transceivers supporting CPRI, OBSAI, GigE, SerialLite, and PCI Express, embedded tri-matrix memory for distributed RAM/ROM, a robust PLL and clock network, and support for high-speed external memory interfaces such as DDR SDRAM, QDR SRAM, and RLDRAM. The 1020-ball FineLine BGA package provides a 1.0 mm pitch, optimizing signal integrity while keeping board area manageable for high-I/O designs. Architecturally, the Stratix GX family integrates hardened transceiver channels with the programmable fabric, dramatically reducing logic utilization for serial I/O and lowering latency compared to soft IP implementations. The 130 nm CMOS process enables a balance of density, performance, and power efficiency suited to telecom, networking, and high-end signal-processing designs. Typical applications include 10 Gbps telecom backhaul, multi-gigabit serial interface bridging, baseband processing, test and measurement instrumentation, and high-speed data acquisition. The hardened transceivers are particularly valuable where deterministic latency and protocol compliance (such as CPRI/OBSAI in wireless base stations) are required. When designing with this device, pay careful attention to PCB layout for the 1.0 mm-pitch BGA: matched-length routing, controlled impedance (typically 50 ohm differential for transceivers), and adequate thermal management are essential. Power sequencing must follow the Stratix GX guidelines to avoid latch-up or in-rush damage during configuration. This page synthesizes distributor pricing, verified drop-in alternatives from the Stratix GX family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a one-stop reference for sourcing and applying this legacy high-performance FPGA.
EP1SGX40FF1020I6 - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Altera
The Altera (now Intel) EP1SGX40FF1020I6 is a high-performance Stratix® GX Field Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package, offering 41,250 logic elements and 3,423,744 bits of embedded memory. It belongs to Altera's second-generation FPGA family to combine high-speed serial transceivers with a scalable, high-performance logic array, supporting 4 to 20 high-speed transceiver channels with embedded CDR-based SERDES at data rates up to 3.1875 Gbps. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O and memory resources. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> logic IC -> integrated circuit, and they enable hardware-level parallelism for compute-intensive tasks that CPUs and DSPs handle sequentially. Key features include 624 user I/Os, 41250 logic elements organized into Logic Array Blocks (LABs), 3.423 Mbits of TriMatrix embedded memory, and an industrial operating temperature grade (-40 °C to +100 °C). The device supports a nominal core supply voltage of 1.5 V with ±0.15 V tolerance, and on-die termination (OCT) for source-synchronous memory and high-speed serial interfaces. The Stratix GX architecture integrates a hardened Physical Coding Sublayer (PCS), serializer/deserializer (SERDES), and clock data recovery (CDR) blocks on-chip, dramatically simplifying high-speed serial channel design. This hard-IP approach reduces logic consumption, frees up LUTs for application code, and improves timing closure versus soft SERDES implementations. Combined with dedicated PLLs and routing resources, the device targets protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. Typical applications include high-speed serial backplanes, network switch line cards, base-station protocol bridging, RAID controllers, and high-end test & measurement instrumentation. The high SERDES density also makes it well-suited for video broadcast routing, defense signal processing, and DSP co-processing in wireline infrastructure. The wide I/O count supports multiple parallel memory buses and external PHY interfaces on a single device. A key design consideration is signal integrity at the 1020-ball BGA breakout: power decoupling must be planned per Stratix GX pin connection guidelines and the device's PowerPlay early power estimator should be run during architecture exploration to balance logic utilization against thermal envelope. Pin-compatible migration within the EP1SGX40 family allows designers to move between density variants (FF/GF/DF/CF) on the same footprint for cost or feature optimization. This page synthesizes distributor pricing, drop-in alternatives within the EP1SGX40 family, and practical design notes not found in the manufacturer datasheet.