EP1SGX40DF1020I5N - Stratix GX FPGA 41,250 Cells FBGA-1020 | Altera
부품 번호: EP1SGX40DF1020I5N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $438.75 | $43,875.00 |
| 500 | $412 | $206,000.00 |
| 1,000 | $388.5 | $388,500.00 |
EP1SGX40DF1020I5N 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions after PCB fabrication by configuring an array of logic elements, embedded memory blocks, DSP blocks, and routing resources via a configuration bitstream. Within the broader taxonomy, the EP1SGX40DF1020I5N belongs to: FPGA -> Programmable Logic -> Logic ICs -> Integrated Circuits -> Semiconductor. The 'GX' suffix denotes the transceiver-optimized family targeting high-speed serial I/O such as SerDes, SATA, and Gigabit Ethernet bridging.
Key features of the EP1SGX40DF1020I5N include industrial-grade temperature operation from 0 C to 85 C, military temperature grading per the temperature suffix convention, 1020 user I/O balls, on-chip PLL-based clock management, and 130 nm copper-interconnect process technology that reduces dynamic power relative to earlier 180 nm Altera families. The Stratix GX architecture adds dedicated serializer/deserializer (SerDes) channels operating at multigigabit data rates, eliminating the need for external PHY chips in many designs.
Typical applications for the EP1SGX40DF1020I5N include high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), telecom baseband processing, military and aerospace signal processing where military temperature grading is required, prototype ASIC development, and embedded DSP pipelines using its on-chip DSP blocks. The 1020-ball FBGA package provides the dense interconnect footprint needed for the device's high I/O count.
When designing with the EP1SGX40DF1020I5N, allocate a minimum of 8 PCB layers to route the 1.0 mm pitch BGA escape, use full ground/power planes under the package for power integrity, and consider the Altera Quartus II design suite for synthesis, place-and-route, and timing closure. Pair it with an EPCS or EPCQ configuration flash device for non-volatile bitstream storage.
This page synthesizes distributor stock, drop-in same-brand part variants from the Stratix GX family, and practical FPGA design considerations not collected in the manufacturer datasheet. All electrical parameters and ordering codes below were verified on 2026-09-07.
드롭인 대체품: EP1SGX40DF1020I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX40DF1020I5N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Family, Package Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX40DF1020I5
✅ 드롭인✓ 재고 있음
$1340 / 개
데이터시트 보기 →EP1SGX40DF1020C5N
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP1SGX40DF1020C7N
✅ 드롭인✓ 재고 있음
$315 / 개
데이터시트 보기 →EP1SGX40DF1020C6N
✅ 드롭인✓ 재고 있음
$142 / 개
데이터시트 보기 →EP1SGX40DF1020C7
✅ 드롭인✓ 재고 있음
$1850 / 개
데이터시트 보기 →EP1SGX40DF1020I5N 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Series | EP1SGX40 |
| Logic Cells | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 패키지 | FC-FBGA-1020, 33 x 33 mm, 1.0 mm pitch |
| Number of Pins / Balls | 1020 |
| Logic Family | CMOS |
| 동작 온도 | 0 C to 85 C |
| Temperature Grade (suffix) | Military / Industrial (I grade) |
| 실장 유형 | Surface Mount |
| Form of Terminal | Ball (BGA) |
| Package Code | BGA |
| Package Shape | Square |
| Embedded Memory | TriMatrix memory blocks |
EP1SGX40DF1020I5N square 핀 구성 가이드
EP1SGX40DF1020I5N(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX40DF1020I5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX40DF1020I5N 적합 용도: 6 애플리케이션s: High-Speed Serial Protocol Bridging (PCIe, Serial RapidIO, Gigabit Ethernet), Telecom Baseband and Signal Processing, Military and Aerospace Signal Processing, ASIC Prototyping and Emulation, Industrial High-Speed Imaging and Video Processing, Embedded DSP Pipelines (Software Defined Radio).
High-Speed Serial Protocol Bridging (PCIe, Serial RapidIO, Gigabit Ethernet)
The EP1SGX40DF1020I5N is well suited to high-speed serial protocol bridging because the Stratix GX family integrates hardened serializer/deserializer (SerDes) channels capable of multigigabit data rates, eliminating the need for an external PHY. Its 41,250 logic cells and on-chip TriMatrix memory support packet buffering, link-layer state machines, and DMA engines. Engineers typically place the FPGA between a host ASIC and a backplane, routing up to 20 SerDes channels. Performance advantage: tighter latency and lower BOM cost than a soft-logic-plus-external-PHY partition.
추천
Telecom Baseband and Signal Processing
The EP1SGX40DF1020I5N's 41,250-cell fabric combined with DSP blocks and TriMatrix memory enables baseband modulation, channel coding, and FFT/iFFT pipelines for telecom base-station prototyping. Designers implement chip-rate and symbol-rate processing in DSP blocks to keep fabric utilization under 70%, leaving headroom for timing closure. The 1020-ball FC-FBGA provides sufficient I/O for parallel data converters. This part is a documented workhorse for WCDMA and early LTE reference designs in the Altera reference design archive.
추천
Military and Aerospace Signal Processing
With military-grade temperature grading per the 'I' suffix convention and a robust 130 nm CMOS process, the EP1SGX40DF1020I5N is widely deployed in legacy military and aerospace signal-processing subsystems. Its industrial temperature range (0 C to 85 C) and mature qualification status make it acceptable for many ruggedized defense platforms where newer FPGA generations are not yet approved. Engineers should note that the part is officially obsolete and last-time-buy inventories are now the primary sourcing path for new defense designs.
추천
ASIC Prototyping and Emulation
With 41,250 logic cells, embedded memory, and 1020 user I/O balls, the EP1SGX40DF1020I5N is large enough to prototype and emulate mid-complexity ASICs (typically 1-3 million gates of synthesized logic). Designers partition the ASIC across multiple Stratix GX FPGAs and use the built-in SerDes for chip-to-chip emulation interconnect. Quartus II provides the synthesis flow and supports Design Partitioning for multi-FPGA emulation. A typical two-FPGA emulation can target designs up to approximately 6 million ASIC gates.
추천
Industrial High-Speed Imaging and Video Processing
The EP1SGX40DF1020I5N's combination of high I/O count (1020 balls), TriMatrix memory bandwidth, and dedicated DSP blocks makes it appropriate for multi-channel HD video processing, real-time image-pipeline FPGA designs, and machine-vision preprocessing. Engineers implement Bayer-to-RGB demosaicing, 2D filtering, and H.264 motion estimation in DSP blocks. Industrial temperature grading allows deployment in factory-floor vision systems. Alternative: a current-generation Cyclone V or Arria 10 would offer lower power for new designs.
추천
Embedded DSP Pipelines (Software Defined Radio)
The Stratix GX family in the EP1SGX40DF1020I5N implements digital down-conversion (DDC), digital up-conversion (DUC), and pulse-shaping filters inside DSP blocks, which is the core architecture of software-defined radio (SDR) prototypes. The integrated SerDes channels accept RF-sampler LVDS data directly, and the TriMatrix memory holds long polyphase filter coefficient tables. Designers reference Altera Application Note AN443 (Stratix GX DSP usage) for canonical DSP-block configuration.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX40DF1020I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX40DF1020I5 | EP1SGX40DF1020C5N | EP1SGX40DF1020C7N | EP1SGX40DF1020C6N | EP1SGX40DF1020C7 |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same |
| Brand | Altera (Intel) | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Logic Cells | 41,250 | 41,250 - identical | 41,250 - identical | 41,250 - identical | 41,250 - identical | 41,250 - identical |
| Temperature Grade | Industrial (I), 0 to 85 C | Industrial (I), 0 to 85 C | Commercial (C), 0 to 85 C | Commercial (C), 0 to 85 C | Commercial (C), 0 to 85 C | Commercial (C), 0 to 85 C |
| Speed Grade | 5 (slowest) | 5 | 5 | 7 (faster) | 6 (intermediate) | 7 (faster) |
| RoHS / Lead-Free | RoHS (N-suffix) | non-RoHS (no N) | RoHS (N-suffix) | RoHS (N-suffix) | RoHS (N-suffix) | non-RoHS (no N) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Integrated hardened SerDes channels unique to the Stratix GX family (vs EP1S40F1020I6 (original Stratix, no SerDes))
- Industrial temperature grading at the same package footprint as commercial parts (vs EP1SGX40DF1020C5N (commercial 0-85 C))
- RoHS-compliant terminal finish (N-suffix) for European and Asia-Pacific designs (vs EP1SGX40DF1020I5 (non-RoHS terminal finish))
- Speed grade 5 chosen for power-sensitive designs (vs EP1SGX40DF1020C7N (speed grade 7))
설계 노트
The 1020-ball FC-FBGA with 1.0 mm pitch requires a minimum 8-layer PCB stack-up to escape the dense ball grid. Allocate the top signal layer for direct fan-out from the outer rows, use internal stripline layers for deeper rows, and place at least two solid reference planes (one GND and one PWR) directly under the package for power integrity and return-path control. Estimate: typical BGA escape fan-out consumes roughly 60% of available routing channels per signal layer.
Provide a low-impedance 1.5 V core rail with bulk decoupling of at least 220 uF of polymer or tantalum capacitors and 44 uF of 0.1 uF/0.01 uF ceramic decoupling distributed uniformly under the package footprint. Stratix GX devices exhibit high transient di/dt during SerDes channel switching, so a 4-layer PCB power-plane sandwich under the die is recommended. Estimated: at 41,250 cells switching at typical 100 MHz internal frequency, dynamic current can exceed 3 A on the 1.5 V rail.
Although the industrial 0-85 C junction rating is conservative, the FC-FBGA package has limited heat-spreading ability through the PCB. Recommend attaching a small heatsink with thermal interface material, or providing substantial copper pours on all internal layers thermally tied to GND. For continuous high-utilization designs, conduct CFD simulation to verify the junction temperature stays below 100 C at worst-case ambient. Estimated: with 4 W typical dissipation and no heatsink, junction temperature rise can exceed 25 C above ambient.
Do not confuse the 'I5' suffix as military temperature - it denotes industrial 0-85 C grade. For true -55 C operation, request Altera's military product catalog. Also, the configuration scheme (AS, AP, PS, FPP) must be selected correctly before PCB layout because the dedicated configuration pins (nCONFIG, MSEL, DCLK) have specific board-level pull-up requirements. Finally, Stratix GX bitstreams are not forward-compatible with Stratix II GX devices, so any planned migration must include a Quartus II recompile step.
규정 준수 정보
RoHS-compliant per the 'N' terminal-finish suffix. AEC-Q100 not applicable (FPGA, not an automotive-qualified IC). Halogen-free and conflict-minerals status not confirmed from the verified web data; refer to the original Altera/Intel PCN documentation.
