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EP1S10B672C6 - Stratix 10,570 LEs FPGA 672-BGA | Intel / Altera
EP1S10B672C6

EP1S10B672C6 - Stratix 10,570 LEs FPGA 672-BGA | Intel / Altera

The Intel / Altera EP1S10B672C6 is a Stratix-family Field-Programmable Gate Array (FPGA) integrating 10,570 logic elements into a 672-ball BGA package with 345 user I/Os. Built on a 130 nm CMOS process and core-supplied at 1.5 V (1.425 V - 1.575 V tolerance), it operates from 0 C to 85 C commercial-extended temperatures and supports system clock speeds up to 450.05 MHz, making it a high-density programmable logic device for networking line cards, DSP co-processing, and high-throughput bus interfaces. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, dedicated block memory, and DSP/multiplier slices that an end user can re-program at the board level. In the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit alongside ASICs, ASSPs, and microcontrollers in the digital IC family. Unlike an ASIC, an FPGA is re-programmable in the field and ships as a generic fabric that the designer configures via HDL (VHDL/Verilog) and a vendor toolchain (Quartus II for Altera). The Stratix family targets high-performance applications that need abundant DSP blocks, embedded memory, and high-speed transceivers. Key features include 10,570 logic cells, 1,057 LABs (Logic Array Blocks), 345 user I/Os, and 672 BGA balls on a 35 x 35 mm substrate with 1.27 mm pitch. The 130 nm process node provides a balance between density and static/leakage power, while the 1.5 V core simplifies integration with DDR SDRAM memories that were common in the mid-2000s. Technical depth: the architecture embeds TriMatrix memory blocks (MRAM/M4K), DSP blocks optimized for multiply-accumulate operations, and dedicated clock management with PLLs. The Stratix family was Altera's first to feature on-chip transceivers at gigabit rates, making the EP1S10B672C6 suitable for protocol bridging and high-bandwidth datapaths. Typical applications include telecom line-card interface logic, protocol-bridging bridges between PCI/PCI-X and DDR memory subsystems, custom DSP co-processors, and industrial control fabrics. The 672-BGA package supports high signal-count designs requiring many parallel I/O lanes. When designing with this device, plan for Quartus II toolchain support (legacy versions), JTAG-based in-system programming, and the 1.5 V core supply decoupling requirements of the Stratix family.

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EP1S10B672C7 - Stratix 10570 LEs FPGA, 672-BGA | Intel
EP1S10B672C7

EP1S10B672C7 - Stratix 10570 LEs FPGA, 672-BGA | Intel

The Intel (formerly Altera) EP1S10B672C7 is a member of the Stratix FPGA family built on a 0.13 µm CMOS process, offering 10,570 logic elements, 920 Kbit embedded memory, and dedicated DSP blocks in a 672-ball FineLine BGA package. The part suffix decodes as: EP1S = Stratix family, 10 = 10K logic element tier, B672 = 672-ball BGA, C = commercial temperature grade (0 °C to 85 °C), and 7 = speed grade 7. This combination targets high-performance logic, memory, and DSP workloads that need deterministic timing and abundant on-chip resources. An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM (BRAM), DSP multipliers, PLLs, and high-speed transceivers. FPGAs sit alongside microcontrollers, DSPs, and ASICs in the broader programmable logic hierarchy (CPLD -> small FPGA -> mid-density FPGA -> high-end SoC FPGA) and are used when designers need parallelism, hardware-accelerated DSP, or custom I/O protocols that off-the-shelf processors cannot deliver. Key features of the EP1S10B672C7 include up to 10,570 logic elements, 920 Kbits of embedded memory distributed across TriMatrix blocks (MRAM/M4K), DSP blocks supporting 8-bit to 36-bit word widths, up to 426 MHz internal clock operation, and flexible I/O supporting LVDS, SSTL, and LVTTL standards. The Stratix architecture also provides dedicated high-speed serial interfaces (Stratix GX option) and on-chip PLLs for clock management, making it suitable for high-bandwidth pipeline designs. From an architecture standpoint, Stratix devices employ a multi-level routing hierarchy combined with LUT-based logic and embedded multiplier blocks. The 672-ball BGA package exposes the full I/O count of this die, allowing dense PCB integration. Commercial temperature grade and speed grade 7 place this part in a balanced performance-and-cost tier relative to the speed-grade 8 and industrial-temperature variants. Typical applications include telecommunications baseband processing, high-speed data acquisition, ASIC prototyping, software-defined radio (SDR), industrial control and imaging, and digital signal processing pipelines such as FFT engines and video codecs. The combination of abundant BRAM and DSP blocks particularly suits parallel DSP workloads where multiple MAC operations per clock cycle are required. When designing with this device, pay close attention to power estimation (Altera's PowerPlay Early Power Estimator is recommended pre-layout), signal integrity on the 1.27 mm-pitch BGA, and JTAG-driven configuration using EPC or enhanced-configuration devices. Thermal management at full clock rate with high toggle activity is essential since the commercial grade is rated only to 85 °C ambient. This page synthesizes distributor pricing, drop-in Stratix-family alternatives, and practical Stratix design notes not found in a single source on the manufacturer datasheet.

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EP1S10B672C7N - Stratix FPGA 10,570 LE BGA-672 | Intel
EP1S10B672C7N

EP1S10B672C7N - Stratix FPGA 10,570 LE BGA-672 | Intel

The Intel EP1S10B672C7N is a Stratix family field-programmable gate array (FPGA) with 10,570 logic elements/cells, a distributor-listed maximum internal clock frequency of 420.17 MHz, and a 1.5 V core supply, housed in a 672-ball BGA package measuring 35 x 35 mm with 1.27 mm ball pitch. This commercial-extended temperature device operates from 0 to 85 C and is identified in the Altera/Intel ordering scheme with the C7 speed grade and the trailing N finish marker. An FPGA is a semiconductor device containing reprogrammable logic fabric, embedded memory, and programmable I/O that can implement arbitrary digital logic without a fixed instruction set. In the broader chip taxonomy, EP1S10B672C7N belongs to FPGA → programmable logic device → standard-cell-like digital logic → semiconductor product hierarchy. Unlike processors that execute software sequentially, an FPGA implements parallel hardware logic directly; the Stratix family is Altera's high-density, high-performance FPGA line that supports complex communications, video, and DSP processing at high gate counts. Key differentiating features of the EP1S10B672C7N include 10,570 logic elements for mid-density designs, 420.17 MHz capability quoted in market listings for high-throughput signal processing, and a 1.5 V core voltage consistent with 130 nm CMOS technology. The 672-ball BGA provides a square package with 1.27 mm pitch, enabling dense routing on multilayer boards. Its commercial extended temperature range and CMOS logic family make it suitable for central-office, lab, and temperature-controlled communications environments. Architecturally, the Stratix device family data sheet describes programmable logic blocks, embedded memory, and JTAG boundary-scan support. The EP1S10B672C7N feature set is suitable for customers migrating legacy Stratix designs that require the original 672-lead footprint and 1.5 V power rail. Because it is a mature 130 nm FPGA, it is deployed in systems where long-field-proven silicon and known configuration flows matter more than cutting-edge process density. Typical applications include wired communications line cards, broadcast video processing, ASIC prototyping, and custom DSP front ends where the FPGA is configured at power-up from an external configuration device. The BGA-672 package is a common migration footprint in the Stratix family, allowing PCB layout reuse among speed-grade and temperature-grade variants. When designing with this part, carefully verify external configuration memory support, I/O bank voltages, and board decoupling for the 1.5 V core. The most common design trap is assuming the N suffix guarantees certain RoHS certificates without checking the exact Altera procurement documentation. Use the Stratix Device Family Data Sheet as the authoritative reference for pinout and configuration rules. This page synthesizes distributor availability, same-family drop-in part options, and practical BGA board-design guidance not repeated in the raw datasheet text, giving procurement and design engineers a faster route to a verified Stratix EP1S10B672C7N decision.

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EP1S10F484C5N - Stratix 10570 LEs FPGA 484-FBGA | Intel / Altera
EP1S10F484C5N

EP1S10F484C5N - Stratix 10570 LEs FPGA 484-FBGA | Intel / Altera

The Intel (formerly Altera) EP1S10F484C5N is a member of the original Stratix FPGA family, integrating 10,570 logic elements, 920,448 bits of embedded memory, and 335 user I/O pins inside a 484-ball fine-pitch BGA (FCBGA, 23 x 23 mm, 1.0 mm pitch). It operates from a 1.5 V core supply, is fabricated on a 0.13 µm CMOS process, and is rated for the commercial temperature range 0 °C to 85 °C (TJ). A field-programmable gate array (FPGA) is a reconfigurable digital logic device that lets designers implement custom parallel processing, high-speed I/O, and on-chip memory subsystems after PCB fabrication. Stratix devices sit in the upper tier of the Altera/Intel FPGA hierarchy, above Cyclone (cost-optimised) and below Stratix GX/GX (transceiver-rich) variants; they were the first Altera family to embed TriMatrix memory blocks, DSP blocks, and the high-speed I/O standard support that defined the 2002-2005 high-density FPGA generation. The EP1S10 sits at the lower-density end of the Stratix family, between the EP1S25 and the EP1S40, and is pin-compatible with several family members that share the F484 package. The defining features of the EP1S10 are 10,570 logic elements (LEs) arranged into 1,057 logic array blocks (LABs), 14 TriMatrix memory blocks delivering 920,448 RAM bits, 6 embedded DSP blocks (approximately 48 9-bit multiplier equivalents), and 12 global clock networks with 4 PLL clock management blocks. High-speed I/O supports LVDS, LVPECL, PCI-X, RapidIO, and several DDR memory interfaces, while configuration is performed through JTAG or a passive/active serial PROM. The 0.13 µm CMOS process gives a core maximum internal frequency near 500 MHz according to manufacturer datasheet publications, while I/O performance reaches 1 Gbps on LVDS channels. Per-block DSP support allows single-cycle MAC operations, and the TriMatrix memory supports true dual-port, simple dual-port, and single-port RAM with byte-enable, ideal for FIFO, packet buffer, and DSP coefficient storage. Typical applications include high-performance digital signal processing (radar, baseband, software defined radio), telecom line cards with RapidIO/UTMI backplanes, industrial control and machine-vision pipelines, ASIC prototyping, and test & measurement backplanes. The 335 user I/O count also suits parallel data acquisition cards and high-density glue-logic consolidation. Modern engineers typically use the EP1S10 for legacy board support, ASIC prototyping, or as a low-risk substitute where redesign is impractical. Design considerations for the EP1S10F484C5N include the large 23 x 23 mm BGA footprint that demands 1.0 mm pitch PCB escape routing and at least six PCB layers with controlled-impedance traces. The 1.5 V VCCINT rail must be tightly decoupled with 0.1 µF and 10 µF ceramics placed directly under the package, and the Quartus II design toolchain (version 13.0 or earlier) is the supported development environment. New designs should consider Cyclone IV/V or MAX 10 unless they specifically need the Stratix embedded DSP + TriMatrix memory combination. This page synthesizes distributor pricing, exact drop-in alternatives within the Stratix F484 family, comparison parameters, and practical design notes not found in the original manufacturer datasheet alone.

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EP1S10F484C6N - Stratix FPGA, 10,570 LEs, 484-FBGA | Intel
EP1S10F484C6N

EP1S10F484C6N - Stratix FPGA, 10,570 LEs, 484-FBGA | Intel

The Intel EP1S10F484C6N is a member of the first-generation Stratix FPGA family, fabricated on a 130 nm CMOS process and housed in a 484-ball fine-pitch BGA (FBGA-484, 23 × 23 mm, 1.0 mm pitch) package. It integrates 10,570 logic elements organized into 1,057 LABs/CLBs, provides 335 user I/O pins, and embeds 920,448 bits of on-chip RAM, with dedicated DSP blocks and high-speed transceivers designed for DSP and communications workloads. The 'C6' speed grade targets a core frequency around 390 MHz, while the 'N' suffix denotes lead-free termination. An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells that the designer can program after manufacture to implement arbitrary digital logic. FPGAs occupy a position in the system hierarchy between fixed-function ASICs and software-driven microcontrollers: they offer ASIC-class performance and parallelism while preserving the flexibility of software-based design. Stratix FPGAs in particular were Intel (formerly Altera)'s high-performance, DSP-rich family targeting communications infrastructure, video processing, and military/aerospace applications. Key features of the EP1S10F484C6N include: 1,057 LABs/CLBs (10,570 logic cells), 920 Kbits of embedded RAM, built-in PLLs for clock management, support for multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS), dedicated multiplier/DSP blocks for high-throughput arithmetic, and configuration via JTAG or passive/active serial/parallel modes. The Stratix architecture introduced the TriMatrix memory structure with three block sizes (M512, M4K, M-RAM) optimized for different datapath widths. Architecturally, the device combines row-based LABs, column-based embedded memory and DSP blocks, and surrounding I/O rings, all interconnected by a multi-level routing hierarchy. The 130 nm process allows core voltages down to 1.5 V with low static power; supply range is 1.425 V to 1.575 V. Configuration data is stored in SRAM cells and must be loaded at each power-up from a configuration PROM or a processor. Typical applications include telecommunications infrastructure (SONET/SDH framer, protocol bridges), DSP co-processing for medical imaging and military radar, high-speed serial protocol bridging, video broadcast equipment, and ASIC prototyping. The combination of DSP blocks, ample block RAM, and high I/O count makes the EP1S10F484C6N a strong fit for parallel datapath and pipelined DSP workloads. When designing with this device, ensure the Quartus II design software version supports the Stratix I family (Quartus II 13.0 or earlier is required for legacy support). The FBGA-484 package requires careful PCB layout with microvia or via-in-pad technology to fan out the 1.0 mm pitch ball array; thermal management relies on the exposed die-side thermal pad and adequate board copper. This page consolidates distributor pricing, drop-in alternatives within the Stratix I family, and practical design notes that supplement the manufacturer datasheet with sourcing and lifecycle context.

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EP1S10F484C7 - Stratix FPGA, 10570 LEs, 484-FBGA | Altera
EP1S10F484C7

EP1S10F484C7 - Stratix FPGA, 10570 LEs, 484-FBGA | Altera

The Altera (now Intel) EP1S10F484C7 is a member of the original Stratix FPGA family built on a 130 nm CMOS process with 10,570 logic elements, 920 Kbits of embedded memory, 335 user I/Os, and a 1.5 V core supply. It is housed in a 484-ball FineLine BGA (FBGA-484, 23 x 23 mm, 1.0 mm pitch) and operates over the commercial extended 0 C to 85 C junction range, making it suitable for mainstream wired and embedded designs rather than harsh industrial or automotive environments. What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic fabric, block RAM, DSP blocks, and routing can be reconfigured by the user after manufacture. Within the Stratix family hierarchy, the EP1S10 sits at the low-density end: Stratix -> low-cost / high-volume FPGA -> programmable logic -> semiconductor IC. It is the smallest Stratix-I member, sitting below the EP1S20, EP1S25, EP1S30, EP1S40, EP1S60, and EP1S80 in logic capacity. The EP1S10F484C7 integrates 1,057 LABs/CLBs, six DSP blocks, four PLLs, and 12 embedded RAM blocks (M512, M4K, and M-RAM classes) for high-throughput data-path designs. It supports LVDS, SSTL, LVTTL, LVPECL, and PCI I/O standards, and is configured via serial or parallel configuration schemes using Altera Quartus II / Quartus Prime design tools. Typical applications include telecommunications line cards, video and image processing pipelines, industrial control, test and measurement ASIC prototyping, and high-speed serial I/O aggregation. The combination of moderate logic density and abundant block RAM is well matched to packet buffering, FIR filtering, and FIFO-based interfaces. When designing with the EP1S10F484C7, use a multi-layer PCB with dedicated power and ground planes, and provide local decoupling per the Stratix pin connection guidelines. Plan for configuration storage (EPCS or flash) and consider migration to a Cyclone, Arria, or Stratix-II/III/IV/V device if software support or longer-term supply is required.

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EP1S10F484C7N - Stratix FPGA 10,570 LEs, 484-FBGA | Intel
EP1S10F484C7N

EP1S10F484C7N - Stratix FPGA 10,570 LEs, 484-FBGA | Intel

The Intel (formerly Altera) EP1S10F484C7N is a member of the original Stratix FPGA family fabricated on a 1.5 V, 130 nm CMOS process, delivering 10,570 logic elements, 920,448 bits of embedded RAM, and 335 user I/O pins in a 484-ball FineLine BGA package. It is the commercial-grade, -7 speed-grade variant of the EP1S10 family, optimized for high-performance DSP and parallel datapath designs. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect fabric. FPGAs occupy a tier above general-purpose microcontrollers for workloads that demand deterministic parallel processing: DSP pipelines, high-speed serial interfaces, custom datapaths, and ASIC prototyping. Modern FPGAs typically embed block RAM, DSP blocks, PLLs, and high-speed transceivers; the Stratix family was the first to integrate dedicated TriMatrix memory and DSP blocks at this scale. Key features include 10,570 logic elements (LEs) organized as 1,057 Logic Array Blocks (LABs), 920 Kbits of TriMatrix embedded RAM split into M512/M4K/M-RAM blocks, and 48 embedded DSP blocks for fixed- and floating-point signal processing. The device also integrates up to 12 PLLs, 335 user I/O pins with support for multiple I/O standards (LVTTL, LVCMOS, SSTL, LVDS, PCI), and 4 phase-locked loops dedicated to high-speed clock management. Configuration is supported via JTAG, Passive Serial, Passive Parallel, or via a configuration device such as the EPC16 or EPCS. Architecturally, the Stratix fabric places 10 LEs into each LAB with a dedicated carry chain and a shared register chain for fast arithmetic. The TriMatrix memory blocks are tightly coupled to the DSP blocks, enabling single-cycle multiply-accumulate operations. The 130 nm process and 1.5 V core deliver a typical internal operating frequency in the range of hundreds of MHz for registered designs, with maximum internal performance cited in the family data sheet as 420 MHz in benchmark datapaths. Typical applications include telecommunications line cards, baseband signal processing, video and image processing, military and aerospace prototyping, ASIC and ASIP emulation, and high-end industrial control. The large logic and RAM capacity also suits networking equipment such as routers and switches that require custom packet-processing pipelines. The wide I/O count and flexible I/O standard support make EP1S10 devices a common fit for legacy parallel bus interfaces that are no longer well served by smaller Cyclone or MAX families. When designing with this part, ensure the Quartus II design toolchain (version 13.0 or earlier is recommended for legacy Stratix support) is selected, since later Quartus releases dropped the original Stratix device support. Pay attention to decoupling on each VCCINT, VCCIO bank, and PLL supply pin, and follow the Intel/Altera Stratix FPGA Hardware Design Guidelines for power rail sequencing and JTAG chain termination. This page synthesizes distributor pricing (DigiKey, Mouser, Octopart), drop-in Altera/Intel variants in the same 484-FBGA footprint, and practical design notes not found in the standalone manufacturer datasheet.

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EP1S10F484I6N - Stratix 10,570 LEs FPGA 484-FBGA | Intel (Altera)
EP1S10F484I6N

EP1S10F484I6N - Stratix 10,570 LEs FPGA 484-FBGA | Intel (Altera)

The Intel (Altera) EP1S10F484I6N is a Stratix-family field-programmable gate array (FPGA) featuring 10,570 logic elements housed in a 484-ball fine-pitch flip-chip BGA (FBGA-484, 23 x 23 mm, 1 mm pitch). Built on a 130 nm CMOS process with a 1.5 V core supply, this industrial-temperature variant operates from 0C to 85C and provides 335 user I/O pins for high-density parallel interfaces. The part belongs to the original Stratix generation that introduced embedded TriMatrix memory and DSP blocks for high-performance digital signal processing. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - itself a category of integrated circuits - that allows hardware designers to configure arbitrary digital logic through SRAM-based configuration memory. In the broader system hierarchy, FPGAs sit between fixed-function ASICs and microcontrollers: they deliver ASIC-class performance and parallelism, but with field-reprogrammability that shortens time-to-market and enables post-deployment updates. Stratix FPGAs in particular target high-speed DSP, telecom line cards, and high-bandwidth data-path applications. Key features of the EP1S10F484I6N include 920,448 bits of embedded RAM, 48 dedicated DSP blocks for high-throughput multiply-accumulate operations, support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and 6 phase-locked loops (PLLs) for clock management. The device is configured via the IEEE 1149.1 JTAG interface or any of several passive or active serial configuration schemes. Four 1.5 V power domains are required for core, I/O banks, PLL analog supply, and configuration circuitry. Architecturally, the Stratix family introduced the TriMatrix memory structure comprising three block sizes (M512, M4K, M-RAM) optimized for different on-chip buffering roles, together with dedicated hardware multipliers and accumulator chains that accelerate DSP workloads without consuming logic fabric. The 130 nm process gives the device its characteristic 450 MHz core performance envelope while keeping static and dynamic power within the capabilities of conventional PCB power delivery. Typical applications include high-speed digital signal processing (radar, software-defined radio), telecom line-card glue logic, video and image processing pipelines, high-speed data-acquisition front-ends, and networking equipment that requires parallel interfaces to external memory and ASICs. The industrial temperature grade also suits test-and-measurement chassis and factory-automation controllers. When designing with this part, pay close attention to the multiple 1.5 V power rails: VCCINT (core), VCCIO (I/O banks), VCC_PLL (PLL analog), and VCC_PD (configuration). Each PLL analog rail must be cleanly filtered, and the JTAG chain must be impedance-matched to the 1.5 V reference to avoid configuration errors. Power-on sequencing (VCCINT before VCCIO with monotonic rise) is required to prevent latch-up. This page synthesizes Intel/Altera Stratix specifications, distributor pricing snapshots, and pin-compatible variant guidance not found in the manufacturer datasheet alone.

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EP1S10F672C6 - 10K LE Stratix FPGA 672-BGA | Intel (Altera)
EP1S10F672C6

EP1S10F672C6 - 10K LE Stratix FPGA 672-BGA | Intel (Altera)

The Intel (formerly Altera) EP1S10F672C6 is a member of the Stratix® I FPGA family, integrating 10,570 logic elements, 920 Kbits of embedded memory, and 345 user I/Os in a 672-ball FineLine BGA (FBGA) package. Built on a 1.5 V, 130 nm CMOS process, this device delivers up to 420.17 MHz core performance and supports up to 6 clock networks with 12 PLLs. A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP multipliers, and high-speed transceivers. FPGAs occupy the top of the programmable-logic hierarchy (FPGA > CPLD > PLD > programmable logic), serving as the most flexible class of digital ICs and supporting silicon re-spin avoidance through software-defined hardware. The Stratix family, launched in 2002, was Altera's first device family built around embedded TriMatrix memory, DSP blocks, and high-speed I/O - defining the modern high-density FPGA. Key features of the EP1S10F672C6 include 1057 logic array blocks (LABs), 6 embedded DSP blocks, 1.5 V core voltage with 3.3 V I/O standard support, dual-purpose configuration pins, JTAG IEEE 1149.1 boundary-scan test, and in-system programmability via the passive serial (PS), fast passive parallel (FPP), or Active Serial (AS) configuration schemes. The commercial temperature grade (0C to +85C ambient) makes it suitable for controlled-environment designs. Typical applications include digital signal processing, telecommunications infrastructure, high-speed data acquisition systems, ASIC prototyping, and embedded control platforms. The dense logic capacity and integrated memory enable single-chip implementations of complex data paths that previously required multiple discrete ASSPs. The 672-ball FBGA provides a compact, high-I/O-density footprint for space-constrained boards. When designing with the EP1S10F672C6, ensure proper decoupling on all VCC and VCCIO pins and observe JTAG configuration sequencing guidelines. Designers should also consider migrating to active successor families (Cyclone III, Stratix II/III/IV) for new designs, since Stratix I is now in mature production status and most Stratix I devices have been migrated. The 1.5 V core voltage and 130 nm process node require attention to I/O bank compatibility with modern 1.8 V/2.5 V/3.3 V peripherals. This page synthesizes distributor pricing, same-family alternatives, and practical design notes not found in the manufacturer datasheet.

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EP1S10F672C7 - Stratix FPGA 10K LEs 672-BGA 1.5V | Altera
EP1S10F672C7

EP1S10F672C7 - Stratix FPGA 10K LEs 672-BGA 1.5V | Altera

The Altera (Intel) EP1S10F672C7 is a member of the Stratix FPGA family fabricated on a 130 nm CMOS process, integrating 10,570 logic elements, 920,448 bits of embedded memory, and 345 user I/Os in a 672-pin FineLine BGA package. It operates from a 1.5 V core supply with separate VCCIO banks supporting multiple I/O standards, and is rated for commercial 0 C to 85 C operation. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy the upper tier of the digital logic hierarchy: programmable logic sits above fixed-function ASICs and microcontrollers for prototyping and low-volume production, and below custom ASICs for high-volume cost-optimized designs. The Stratix family was Altera's first high-end FPGA line to combine embedded memory, embedded multipliers, and dedicated DSP blocks on a single die, predating later Cyclone and Arria families. Key features of the EP1S10F672C7 include 10,570 logic elements (LEs), approximately 920 Kbits of TriMatrix embedded memory, embedded DSP blocks supporting multiplication and accumulation, up to 345 user I/O pins distributed across multiple banks, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also integrates a PLL-based clock management fabric with multiple phase-locked loops and a configuration interface supporting JTAG and passive/active serial modes. The 672-pin FineLine BGA package supports vertical migration within the Stratix family, meaning a design targeting the EP1S10 can also be placed on EP1S20 or EP1S25 devices in the same package footprint without PCB rework. This migration flexibility is enabled by aligning dedicated pins, configuration pins, and power pins across density variants. Typical applications include high-speed digital signal processing prototypes, telecommunications line cards, video and image processing pipelines, and ASIC prototyping for SoC validation. The 130 nm process and 1.5 V core voltage make it suitable for legacy systems where modern 28 nm or 14 nm parts are not pin-compatible. When designing with the EP1S10F672C7, ensure all four core supply rails (VCCINT, VCCIO, VCC_PLL, VCCA) are properly decoupled with bulk and high-frequency capacitors per the Altera Stratix Device Handbook. Pin migration within the 672-pin BGA family must be planned at the schematic stage to avoid costly PCB respins. This page synthesizes distributor pricing, drop-in same-package alternatives, and design considerations not consolidated in the manufacturer datasheet, helping engineers evaluating legacy Stratix designs make informed sourcing decisions.

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EP1S10F672C7N - Stratix FPGA 10,570 LEs 672-BGA | Intel / Altera
EP1S10F672C7N

EP1S10F672C7N - Stratix FPGA 10,570 LEs 672-BGA | Intel / Altera

The Intel / Altera EP1S10F672C7N is a member of the original Stratix FPGA family, integrating 10,570 logic elements, 920 Kbits of embedded memory, and 345 user I/Os into a 672-pin FineLine BGA (FBGA-672) package. Built on a 1.5 V, 130 nm CMOS process, the device delivers up to 420 MHz core performance and includes dedicated DSP blocks, TriMatrix memory, and up to 12 high-speed transceiver channels on Stratix GX variants, making it a foundational platform for early-2000s high-performance DSP, communications, and signal-processing designs. As a Field-Programmable Gate Array (FPGA), the EP1S10F672C7N belongs to a class of semiconductor devices that combine programmable logic fabric, configurable I/O, and hard IP blocks into a single re-programmable IC. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering ASIC-class parallelism and throughput while preserving in-system re-programmability. The Stratix family specifically targets high-density, performance-critical applications such as DSP pipelines, telecom infrastructure, and parallel processing. Key features of the EP1S10F672C7N include 10,570 logic elements distributed across 1,057 LABs/CLBs, 920,448 bits of embedded RAM configurable as simple dual-port, true dual-port, or shift-register memory, 6 dedicated DSP blocks for high-speed multiplication, and up to 345 user I/O pins supporting multiple I/O standards including LVDS, SSTL, and PCI. The device supports both serial and parallel configuration schemes via JTAG or passive/active configuration devices. Architecturally, Stratix devices employ a logic-element (LE) granularity of 4-input look-up tables combined with dedicated carry chains and register-rich LABs. The TriMatrix memory architecture provides three distinct block sizes (M512, M4K, M-RAM) optimized for different data-path widths. The 130 nm process node was the leading-edge production geometry when Stratix launched in 2002, balancing leakage and performance for high-utilization designs. Typical applications include high-performance digital signal processing (DSP) for baseband and image processing, telecom line-card and framer implementations, military and aerospace signal-processing boards, prototyping of ASIC-class designs prior to tape-out, industrial control and instrumentation, and test-and-measurement data acquisition. The wide I/O count and rich memory architecture also suit software-defined radio (SDR) front-ends. When designing with this device, plan your PCB layout to accommodate the 672-ball 35 x 35 mm FBGA with 1.27 mm pitch. Stratix FPGAs require multiple supply rails (core, I/O, PLL, and auxiliary) with careful decoupling and a power-sequencing strategy. Consult the Stratix Device Handbook (Volume 1, Section I) for DC and switching characteristics, configuration timing, and JTAG boundary-scan details before committing to layout. This page synthesizes verified distributor pricing from DigiKey and Mouser, drop-in same-package alternatives from across the Stratix family, and practical design notes not found in a single datasheet chapter, providing engineer-grade context beyond the manufacturer PDF.

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EP1S10F672I7 - Stratix FPGA 10K LE, 672-FBGA | Intel
EP1S10F672I7

EP1S10F672I7 - Stratix FPGA 10K LE, 672-FBGA | Intel

The Intel EP1S10F672I7 is a member of the original Altera Stratix FPGA family, providing 10,570 logic elements and 345 user I/O pins in a 672-ball fine-pitch BGA (FBGA-672) package. Built on a 0.13-micron CMOS process and operating from a 1.5 V core supply, this device targets high-performance logic, DSP, and memory-rich designs at system clocks up to approximately 420 MHz. It integrates dedicated TriMatrix memory blocks, DSP blocks, and up to twelve high-speed transceiver channels on higher-density Stratix siblings, making the Stratix family a well-known platform for digital signal processing, telecom, and prototyping workloads. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and I/O cells that designers can program after manufacture to implement arbitrary digital functions. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design flexibility-versus-cost hierarchy: microcontrollers execute software, ASICs implement a fixed hardware function, and FPGAs can be reconfigured to implement any hardware function. The Stratix family was Intel's first FPGA generation under the Altera banner before Cyclone, Arria, and Stratix V/10 families, optimized for high-speed parallel DSP and memory-intensive designs. Key features of the EP1S10F672I7 include 10,570 logic elements, dedicated DSP blocks for high-throughput multiply-accumulate operations, embedded TriMatrix memory for distributed and block RAM, support for multiple I/O standards including LVDS, and configuration via JTAG or serial/parallel PROM. The 35 x 35 mm 1.27 mm-pitch FBGA-672 package supports industrial-grade thermal ranges, and the I7 suffix denotes an industrial temperature grade (typically 0 to +85 C operating range as captured in distributor listings). The EP1S10F672I7 architecture combines look-up-table-based logic elements with dedicated hardware multiplier blocks, allowing efficient implementation of finite impulse response (FIR) filters, FFT engines, and forward error correction (FEC) codecs. The internal 1.5 V core combined with selectable I/O voltages lets the FPGA bridge between modern low-voltage processors and legacy 3.3 V peripherals, simplifying board integration in mixed-voltage systems. Typical applications include telecom base station channel cards, software-defined radio, video broadcast and image processing, high-speed data acquisition, ASIC prototyping, and military/aerospace signal processing. The Stratix family's generous block RAM and DSP ratio also make it well suited to encryption accelerators and radar front-end processing. When designing with this device, verify Quartus II support status because legacy Stratix devices have moved out of active production. Plan for possible EOL/NRND transitions and confirm with Intel FPGA support that your chosen Quartus version still targets this die, or migrate to Stratix II/III equivalents. This page synthesizes distributor pricing, drop-in alternative Stratix family MPNs, and practical design notes not found in the manufacturer datasheet alone.

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EP1S10F672I7N - Stratix FPGA, 10,570 LEs, 672-BGA | Intel
EP1S10F672I7N

EP1S10F672I7N - Stratix FPGA, 10,570 LEs, 672-BGA | Intel

The Intel EP1S10F672I7N is a Stratix-family Field-Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, delivering 10,570 logic elements organized into 1,057 Logic Array Blocks (LABs) and 345 user I/Os in a 672-ball FineLine BGA package. The device is rated for the industrial operating temperature range (0°C to 85°C ambient at the spec level) and is supplied by a core voltage of 1.5 V, with separate VCCIO banks that historically supported 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards on this generation. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacture by a user-supplied configuration bitstream, in contrast to an ASIC whose function is fixed at tape-out. Within the broader programmable-logic taxonomy, FPGAs sit above CPLDs (which use non-volatile, coarse-grained fabrics) and below fully-masked ASICs in both integration scale and per-unit NRE cost. Stratix was Intel's (formerly Altera's) first new architecture after the 0.13 µm process transition, introducing embedded TriMatrix memory blocks, DSP blocks, and high-speed transceivers that positioned the family for high-throughput DSP and communications designs. Key features of the EP1S10F672I7N include 920 Kbits of embedded RAM distributed across TriMatrix memory blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, support for multiple I/O standards via selectable bank reference voltages, an active serial or parallel configuration interface, and JTAG boundary-scan per IEEE 1149.1. The 672-ball FineLine BGA is the largest package option offered for the EP1S10 density step. Typical applications for this part are communication infrastructure line cards, software-defined radio baseband processing, high-speed data acquisition front-ends, and industrial imaging pipelines where parallel logic, embedded memory, and DSP throughput are required. The I7N speed grade and the I-suffix industrial temperature rating make this specific MPN the version intended for designs that must operate reliably across extended commercial-to-industrial thermal envelopes. When designing with this device, verify that the Quartus II (version 13.0 or older) toolchain is used, because later Quartus releases dropped support for legacy Stratix silicon. Engineers migrating from this part typically move to Cyclone IV/V or MAX 10 families because of the Stratix EOL status, which is documented in Intel's Product Discontinuance notices. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix family, and practical migration guidance not found in the manufacturer datasheet alone.

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EP1S10F780C5 - Stratix FPGA 10K LE 780-FBGA | Intel
EP1S10F780C5

EP1S10F780C5 - Stratix FPGA 10K LE 780-FBGA | Intel

The Intel (formerly Altera) EP1S10F780C5 is a member of the Stratix FPGA family built on a 1.5 V, 0.13 micrometer, all-layer copper SRAM process. It integrates 10,570 logic elements (LEs), 920,448 bits of embedded RAM, and 426 user I/Os inside a 780-ball FineLine BGA (FC-FBGA) package. The device targets high-performance digital signal processing, communications, and parallel processing designs that require on-chip memory bandwidth and DSP throughput. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (LBs/LEs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. The LDO -> linear regulator analogy does not apply here; instead, FPGAs sit at the top of the programmable-logic hierarchy, beneath ASICs and above discrete glue logic, enabling hardware-level parallelism with software-style reconfigurability. The Stratix family specifically introduced dedicated TriMatrix memory, DSP blocks with 9-bit x 9-bit embedded multipliers, and a high-speed I/O architecture supporting LVDS, HSTL, SSTL, and LVPECL signaling. Key features of the EP1S10F780C5 include up to 28 DSP blocks providing 224 (9-bit x 9-bit) embedded multipliers, dedicated on-chip memory with up to 10 Mbits of RAM distributed across M512, M4K, and M-RAM blocks, and support for multiple I/O standards on each user I/O pin. The 426 user I/Os provide ample connectivity for parallel buses, memory interfaces, and high-speed serial links via external PHY devices. Industrial-grade and commercial-grade temperature variants are available within the family. Architecturally, the EP1S10F780C5 leverages Stratix's row-and-column interconnect fabric with DirectDrive technology, ensuring predictable timing closure across the device. The 0.13 micrometer process node and 1.5 V core supply minimize dynamic power while preserving the 500 MHz internal operating frequency capability typical of the family. Embedded memory blocks can be cascaded to form FIFOs and dual-port buffers without consuming logic resources, freeing LEs for state machines and datapath logic. Typical applications include high-speed image processing, telecommunications baseband processing, software-defined radio (SDR), industrial motor control, and ASIC prototyping. The combination of embedded multipliers and block RAM makes the EP1S10F780C5 particularly well-suited to FFT, FIR filter, and forward-error-correction implementations. When designing with the EP1S10F780C5, observe the Stratix configuration guidelines: route dedicated configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, MSEL, DCLK) carefully, and supply the 1.5 V core rail through a low-noise LDO such as the TPS7A4701. Use multiple decoupling capacitors per the reference design to suppress simultaneous-switching noise on the FC-FBGA power balls. This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and design notes not found on any single distributor page.

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EP1S10F780C5N - Stratix 10570 Cells FPGA, 780-FBGA | Intel (Altera)
EP1S10F780C5N

EP1S10F780C5N - Stratix 10570 Cells FPGA, 780-FBGA | Intel (Altera)

The Intel (formerly Altera) EP1S10F780C5N is a member of the original Stratix FPGA family built on a 130nm CMOS process, integrating 10,570 logic elements, 920,448 RAM bits, and 426 user I/Os in a 780-ball FineLine BGA (29 x 29 mm, 1 mm pitch) package. It is specified for commercial operating temperature (0C to 85C) and runs the core and I/O banks from a 1.5V supply. The part belongs to the older high-density programmable logic tier that shipped before the Stratix II generation took over. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O behaviour can be reconfigured after manufacture through a bitstream loaded into on-chip SRAM. FPGAs sit above ASICs and microcontrollers in the programmable logic taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit) and below ASICs in non-recurring engineering cost but above them in design flexibility and time-to-prototype. The Stratix family introduced dedicated TriMatrix memory blocks, DSP blocks, and high-speed transceivers in Altera's mainstream line, bridging the gap between the older APEX families and the later Stratix II/III architectures. Key features of the EP1S10F780C5N include up to 500 MHz internal operation, 12 dedicated DSP blocks, embedded RAM organized as 426,432 total RAM bits distributed in multiple TriMatrix blocks (M512, M4K, M-RAM), support for multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS), and a built-in PLL network for clock management. The device is configured via JTAG or passive/active serial schemes and supports the Altera Quartus II design flow. The 'C5' speed grade places it in the mid-speed tier of the Stratix family; 'N' denotes lead-free / RoHS-compliant terminal finish. Typical applications include telecommunications line cards, networking aggregation switches, military signal processing prototypes, industrial machine-vision pre-processors, and test-and-measurement equipment that benefits from large embedded memory and parallel DSP throughput. The 780-FBGA footprint supports the highest pin-count Stratix variants and is shared with larger family members such as EP1S20, EP1S25, and EP1S30 in the same package, simplifying PCB layout reuse when scaling designs across densities. Designers should verify Quartus II version compatibility, I/O bank voltage planning for mixed-standard designs, and thermal management for sustained high-utilization workloads. Junction temperature must stay below 85C commercial limits with appropriate airflow or heatsinking for high toggle-rate designs. This page synthesizes current distributor stock signals, same-family drop-in alternatives with identical 780-FBGA footprint, and practical design considerations not consolidated in a single manufacturer document, giving engineers a faster path to BOM validation and sourcing decisions.

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EP1S10F780C6 - Stratix 10570-Cell FPGA, 780-BGA | Altera
EP1S10F780C6

EP1S10F780C6 - Stratix 10570-Cell FPGA, 780-BGA | Altera

The Altera (Intel) EP1S10F780C6 is a member of the original Stratix FPGA family, delivering 10,570 logic elements, 920,448 RAM bits, and 426 user I/O pins in a 780-ball fine-pitch BGA package (29x29 mm, 1.0 mm pitch). It is fabricated on a 130 nm CMOS process and operates from a 1.5 V core supply, with the commercial 'C' speed grade rated for 0C to 85C ambient operation. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital circuits - from glue logic to full processor subsystems - in silicon via an SRAM-based configuration bitstream. FPGAs sit within the broader hierarchy of programmable logic devices (PLD), and the Stratix family was Altera's high-end, DSP-rich flagship line before being succeeded by Stratix II/III/IV/V. The 'EP1S' prefix denotes the first-generation Stratix family, with '10' indicating approximately 10K logic elements, 'F' marking the flip-chip BGA package, '780' giving the ball count, 'C' the commercial temperature range, and '6' the speed grade. Key features include 1,057 LABs/CLBs, 10570 logic elements/cells, 920448 bits of embedded RAM (TriMatrix memory), support for up to 17 DSP blocks for high-speed fixed- and floating-point math, and 426 user I/O pins that interface to external LVDS, LVTTL, LVPECL, SSTL, and HSTL standards via dedicated True-LVDS circuitry. The device includes dedicated high-speed serial I/O capability, embedded multipliers, and a PLL/DLL rich clock tree for jitter-clean distribution. The Stratix architecture uses a 1.5 V core with separate VCCIO banks for I/O flexibility, logic and routing fabric built on a 130 nm process, and on-chip configuration memory that must be loaded at every power-up from an external flash or via JTAG. The 'C6' commercial speed grade balances logic performance and dynamic power, making the part a common fit for cost-sensitive high-volume prototypes that need Stratix-class DSP and memory bandwidth. Typical applications for the EP1S10F780C6 include telecom baseband and channel-card signal processing, high-speed serial protocol bridging (custom SERDES glue), military/aerospace video and DSP processing subsystems, and industrial prototyping of ASIC-replacement designs. It is also widely used in test-and-measurement custom backplanes, image processing pipelines, and educational platforms teaching RTL design on real silicon. When designing with this part, ensure the 1.5 V core rail and VCCIO banks are properly decoupled (typically 0.1 uF + bulk per bank), use Altera Quartus II (legacy) or Quartus Prime for synthesis and place-and-route, and follow the Stratix pin connection guidelines for unused I/O and JTAG pins. Note that Stratix I is a mature/NRND family - verify long-term availability before committing to new designs. This page synthesizes distributor inventory, mature Stratix family cross-reference data, and design guidance that is not consolidated in any single vendor PDF.

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EP1S10F780C6N - Stratix FPGA 10K LEs, FBGA-780, 1.5V | Intel
EP1S10F780C6N

EP1S10F780C6N - Stratix FPGA 10K LEs, FBGA-780, 1.5V | Intel

The Intel (formerly Altera) EP1S10F780C6N is a member of the Stratix FPGA family fabricated on a 1.5 V, 130 nm CMOS process, integrating 10,570 logic elements (LEs), 1,200 configurable logic blocks (CLBs), and 920 Kbit of embedded memory in a 780-ball fine-pitch BGA (FBGA-780, 29 x 29 mm, 1 mm pitch). It is a field programmable gate array (FPGA) oriented toward high-performance digital logic, DSP, and memory-rich designs operating at a maximum internal clock frequency around 450 MHz, with 1.5 V core supply and 3.3 V/2.5 V multi-voltage I/O support. What is a Stratix FPGA? A field programmable gate array (FPGA) is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected by programmable interconnect, augmented with dedicated hard IP such as block RAM, DSP blocks, PLLs, and (in Stratix) high-speed transceivers. Within the broader taxonomy, EP1S10F780C6N belongs to: FPGA -> programmable logic -> digital ASIC alternative -> semiconductor IC. FPGAs are used when designers need hardware-level parallelism, fast time-to-market, and post-silicon flexibility unavailable in fixed ASICs. Key features include 10,570 LEs, 1,200 CLBs, 920 Kbits of embedded RAM, dedicated DSP blocks, multiple PLLs, and high-speed LVDS I/O. The device also integrates a hard-core configuration controller with JTAG (IEEE 1149.1) and supports passive serial, fast passive parallel, and passive parallel asynchronous configuration schemes through EPC configuration devices. Technical depth: the 130 nm Stratix architecture introduced the TriMatrix memory structure (three block RAM sizes for flexible FIFO/buffering) and DSP blocks optimized for multiply-accumulate operations, enabling efficient implementation of FIR filters, FFT engines, and video processing pipelines. The 780-ball FBGA package provides abundant I/O (up to 426 user I/O per FindIC, depending on bank configuration) and good signal-integrity performance for high-speed interfaces. Typical applications for the EP1S10F780C6N include digital signal processing (DSP) for communications and video, high-speed data acquisition, industrial control and instrumentation, networking line cards, and prototype ASIC replacement. It is also used in test and measurement equipment where custom parallel processing is required. Design consideration: this is a 1.5 V core device; PCB designers must provide a low-noise core supply (typically an LDO or high-frequency buck regulator), careful power-plane decoupling, and matched-length routing for high-speed LVDS pairs. Confirm that your Quartus II version supports this device. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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EP1S10F780C7 - Stratix FPGA 10,570 LEs 780-FBGA | Intel / Altera
EP1S10F780C7

EP1S10F780C7 - Stratix FPGA 10,570 LEs 780-FBGA | Intel / Altera

The Intel / Altera EP1S10F780C7 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, integrating 10,570 logic elements, 920,448 bits of embedded RAM, and 426 user I/O pins in a 780-ball Fine-Pitch Ball Grid Array (FC-FBGA) measuring 29 mm × 29 mm with a 1.0 mm ball pitch. According to the Stratix device family data sheet, the device operates from a 1.5 V core supply, supports up to 420.17 MHz internal operation, and is offered in the commercial 0 °C to 85 °C temperature grade as denoted by the 'C7' speed-grade suffix. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory, and high-speed transceiver functions after PCB fabrication, instead of committing to a fixed ASIC design. The Stratix family sits in the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs are commonly deployed for DSP pipelines, custom protocol bridging, ASIC prototyping, and high-throughput parallel processing where fixed-function processors are too slow or inflexible. Key features of the EP1S10F780C7 include 10570 logic elements, 426 maximum user I/O, and 920448 RAM bits distributed across TriMatrix memory blocks. The device also embeds DSP blocks for high-throughput arithmetic, supports LVDS I/O signalling, and offers a dedicated configuration interface (Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, and JTAG). It is implemented on a 1.5 V core supply with separate VCCIO banks for mixed-voltage I/O. Architecturally, Stratix devices combine a fine-grained logic element fabric, embedded SRAM, dedicated DSP blocks, and high-speed I/O elements with on-die termination. The 'S' in the prefix marks the device as the Stratix series (rather than Stratix GX / Stratix II). This architecture suits applications that demand deterministic latency, parallel datapath processing, and flexible I/O standard assignment across multiple banks. Typical applications for the EP1S10F780C7 include high-performance DSP acceleration, ASIC prototyping, telecom baseband processing, industrial control and motor control, and test-and-measurement instrumentation. The large pin count and RAM density make it well suited to multi-channel data acquisition systems, video processing engines, and high-speed serial protocol bridging. When designing with this FPGA, engineers must supply the configuration device or JTAG chain, define I/O bank voltages for each bank, and ensure the PCB land pattern matches the 780-ball FC-FBGA 29 × 29 mm 1.0 mm-pitch layout. Thermal management should be considered because the large BGA can dissipate several watts in sustained logic-switching workloads. This page synthesizes Stratix family specifications, current distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that are not collated in any single manufacturer document.

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EP1S10F780C7N - Stratix FPGA 10,570 LEs, 780-FBGA | Intel
EP1S10F780C7N

EP1S10F780C7N - Stratix FPGA 10,570 LEs, 780-FBGA | Intel

The Intel EP1S10F780C7N is a member of the Stratix FPGA family built on a 0.13 μm CMOS process, delivering 10,570 logic elements (LEs) in a 780-pin FineLine BGA (FBGA-780, 29 × 29 mm, 1.0 mm pitch) package. The device integrates 920 Kbits of embedded RAM, dedicated DSP blocks, and up to 426 user I/O pins, with a core supply voltage of 1.5 V and support for multiple I/O standards including LVDS, LVPECL, SSTL, and HSTL. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic architecture, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the fab. FPGAs sit at the top of the programmable logic hierarchy: programmable logic -> FPGA -> high-density FPGA -> SoC FPGA. They are widely used to implement custom datapath, glue logic, and signal-processing pipelines that would otherwise require an ASIC or a bank of discrete logic ICs. Key features of the EP1S10F780C7N include 6 dedicated PLL+ DLL blocks for clock synthesis and skew management, embedded multiplier blocks for DSP-style arithmetic, and Stratix-tier TriMatrix memory architecture (MLAB, M512, M4K blocks). The 426 user I/Os support LVDS at up to several hundred Mbps per channel, making the part suitable for high-speed parallel interfaces and external memory controllers (DDR SDRAM, QDR SRAM, ZBT SRAM). The Stratix architecture combines a multi-level routing fabric with embedded array blocks and high-speed serial capability through dedicated serializer/deserializer resources on speed-grade -7 silicon. The C7 speed grade positions the device in the mid-band of the Stratix family, providing a balance of Fmax and power consumption for industrial and commercial designs. Typical applications include telecommunications line cards, ASIC prototyping, image and video processing pipelines, and industrial control systems where a high logic density and rich memory resources are required. The wide I/O count also makes it suitable for test-and-measurement backplanes and high-channel-count data acquisition front-ends. Designers should pay attention to thermal management on the 780-ball FBGA - the Stratix data sheet recommends a minimum 4-layer PCB stack-up with continuous ground and power planes, plus adequate airflow for sustained high-utilization workloads. Configuration scheme selection (AS, PS, JTAG) and dual-purpose pin planning are also critical upfront tasks for any Stratix design. This page synthesizes distributor pricing, drop-in alternative part numbers from the same Stratix family, and practical design notes that go beyond the manufacturer datasheet's typical-application section.

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EP1S10F780I6 - Stratix FPGA, 10570 Cells, 780-BGA | Altera/Intel
EP1S10F780I6

EP1S10F780I6 - Stratix FPGA, 10570 Cells, 780-BGA | Altera/Intel

The Altera (now Intel Programmable Solutions Group) EP1S10F780I6 is a member of the Stratix Field Programmable Gate Array family, featuring 10,570 logic cells, 426 user I/Os, and 1,200 Configurable Logic Blocks (CLBs) in a 780-ball FineLine BGA package. Built on a 1.5 V CMOS process and operating at speeds up to 450 MHz, this device integrates 920,448 bits of embedded memory and is engineered for high-performance digital signal processing, telecommunications infrastructure, and high-speed serial interconnect applications. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers on a single die. The Stratix architecture represents the original high-end Altera family that pioneered embedded memory and DSP blocks for high-bandwidth signal processing. Within the broader programmable logic taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) and ASICs (Application-Specific Integrated Circuits), offering ASIC-level performance with field reprogrammability. The Stratix family sits above Cyclone and below Stratix GX/Cyclone series in Altera's hierarchy, targeting applications that demand abundant logic, memory, and I/O bandwidth. Key features of the EP1S10F780I6 include 1057 logic array blocks (LABs), 920,448 RAM bits organized in TriMatrix memory structures, dedicated DSP blocks for high-speed multiply-accumulate operations, and 8 phase-locked loops (PLLs) for clock management. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and includes True-LVDS and reduced-swing differential signaling on selected banks. A 1.5 V core supply and 1.5 V/1.8 V/2.5 V/3.3 V I/O supplies are configurable per bank. The architecture combines a fine-grained logic fabric with column-based DSP and memory blocks, allowing efficient implementation of high-throughput pipelines. Hard intellectual property (IP) such as embedded multipliers and SERDES-ready PLLs reduces the gate overhead required for typical DSP and serial link functions, enabling multi-gigabit designs on a single device. Typical applications include high-end telecommunications switching equipment, software-defined radio baseband processing, high-performance test and measurement instrumentation, ASIC prototyping platforms, and embedded video/image processing. The 780-pin FBGA package provides the I/O density required for parallel processing interfaces and high-bandwidth memory buses. When designing with this device, ensure proper power supply sequencing (1.5 V core before 3.3 V I/O) to prevent latch-up, and follow Altera's Stratix Hardware Reference Manual guidelines for decoupling, thermal management, and JTAG configuration. Configuration can be loaded via passive serial (PS), fast passive parallel (FPP), or JTAG, with the configuration scheme selected via MSEL pins. This page synthesizes distributor pricing, pin-compatible same-family alternatives, and practical design notes not found in a standalone datasheet PDF.

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EP1S10F780I6N - Stratix FPGA 10,570 LEs 780-FBGA | Intel
EP1S10F780I6N

EP1S10F780I6N - Stratix FPGA 10,570 LEs 780-FBGA | Intel

The Intel EP1S10F780I6N is a member of the original Stratix FPGA family, providing 10,570 logic elements (LEs) organized into 1,057 logic array blocks (LABs) and 426 user I/Os in a 780-ball FineLine BGA package. Built on a 0.13 µm CMOS process, it operates from a 1.5 V core supply and supports configuration via active serial, passive serial, or JTAG. The device includes 920 Kbit of embedded RAM (M512, M4K, and M-RAM blocks), up to 6 PLLs with 16 clock outputs, and up to 12 dedicated high-speed transceiver channels (not populated on the I-grade speed-grade -6 variant), plus dedicated DSP blocks for high-throughput arithmetic. The 780-FBGA package uses a 29 x 29 mm body with a 1.0 mm ball pitch, suitable for moderate-density system designs. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that allow the hardware function to be redefined after manufacturing. FPGAs sit within the broader programmable logic hierarchy (PAL -> CPLD -> FPGA) and the broader digital logic taxonomy (discrete logic -> ASIC -> ASSP -> FPGA). The Stratix family specifically introduced TriMatrix embedded memory, dedicated DSP blocks, and high-speed transceiver channels, establishing the architectural template later refined in Stratix II/III/IV families. The EP1S10F780I6N delivers this architecture at a lower logic density than Stratix II, making it appropriate for cost-sensitive designs that benefit from the original Stratix feature set without the increased power and complexity of later families. Key features include 10,570 LEs, 1,057 LABs, 426 user I/Os, 920,448 RAM bits (M512/M4K/M-RAM), 6 PLLs with 16 clock outputs, 12 DSP blocks, and 12 transceiver channels capable of up to 840 Mbps LVDS signaling. Speed grade -6 (I6) denotes an industrial operating temperature range of -40 °C to 100 °C ambient with a 6.0 ns core clock period target. Typical applications include high-speed data acquisition backplanes, telecom line-card interfaces, industrial motor control with DSP acceleration, and military/aerospace signal processing. When designing with this part, verify that the Quartus II toolchain (legacy versions 4.x through 9.0 SP2) supports the EP1S10F780 device symbol; modern Quartus versions drop support and require device files from Altera's legacy archive. Power sequencing must respect the 1.5 V VCCINT ramp before VCCIO to prevent I/O latch-up. This page synthesizes legacy Stratix availability, pin-compatible Stratix alternatives, and design notes that are not collected in any single distributor listing.

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EP1S20B672C6 - Stratix FPGA 18,460 LEs 672-BGA | Intel / Altera
EP1S20B672C6

EP1S20B672C6 - Stratix FPGA 18,460 LEs 672-BGA | Intel / Altera

The Intel (formerly Altera) EP1S20B672C6 is a Stratix family Field Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA package, built on a 130 nm CMOS process with a 1.5 V core supply. The device integrates 18,460 logic elements, approximately 1,669,248 bits of embedded memory, and 426 user I/O pins, delivering high-density programmable logic for high-performance digital systems. According to the Stratix Device Family Data Sheet, the C6 speed grade targets commercial (0 C to 85 C) operating temperature with a maximum internal clock frequency of 450.05 MHz. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware designers to implement custom digital circuits after manufacturing. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit between application-specific integrated circuits (ASICs) and general-purpose processors in terms of flexibility and performance. The Stratix family, introduced in 2002, was the first Intel/Altera FPGA family to embed TriMatrix memory, DSP blocks, and high-speed transceiver resources on-chip. Key features of the EP1S20B672C6 include 18,460 logic elements, dedicated DSP blocks for high-throughput arithmetic, embedded RAM blocks (TriMatrix memory architecture), up to 426 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, LVDS, HSTL, SSTL), and integrated PLLs for clock management. The device also supports configuration via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, enabling flexible in-system programming. The EP1S20B672C6 utilizes a 130 nm SRAM-based configuration cell with a 1.5 V core supply and separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards. Its high logic density and embedded memory make it well suited for data-path-intensive designs, while the DSP blocks accelerate FIR filters, FFT engines, and video processing pipelines. The 672-ball FineLine BGA package measures 35 mm x 35 mm with a 1.27 mm ball pitch, providing high I/O density for complex board-level integration. Typical applications include high-speed data acquisition systems, telecommunications baseband processing, video broadcast and image processing, military/aerospace signal processing, and ASIC prototyping. The combination of logic density, DSP throughput, and abundant I/O makes the EP1S20B672C6 a strong fit for parallel-processing architectures that require deterministic latency. When designing with this device, pay close attention to power sequencing of VCCINT and VCCIO rails, signal integrity on high-speed LVDS pairs, and thermal management under sustained switching activity. Use the Quartus II design software for synthesis, place-and-route, and timing closure; legacy Stratix designs require Quartus II version 13.0 or earlier for full device support. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not aggregated on any single manufacturer or distributor page, giving procurement and FPGA design engineers a single decision-ready reference.

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EP1S20B672C6N - Stratix FPGA, 18460 LEs, 672-BGA | Intel
EP1S20B672C6N

EP1S20B672C6N - Stratix FPGA, 18460 LEs, 672-BGA | Intel

The Intel (formerly Altera) EP1S20B672C6N is a member of the original Stratix FPGA family, fabricated on a 0.13 micron CMOS process and offering 18,460 logic elements, 1,669,248 bits of embedded RAM, and 426 user I/O pins in a 672-ball fine-pitch BGA package (35 x 35 mm, 1.27 mm pitch). It is the commercial-temperature, speed-grade 6 variant of the EP1S20 device. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic, memory, and I/O subsystems in silicon via a hardware description language (HDL) and configuration bitstream. FPGAs sit at the top of the digital logic hierarchy: ASIC > CPLD > FPGA > programmable logic > logic IC > semiconductor. The Stratix family was Intel's first FPGA architecture to embed TriMatrix memory blocks, DSP blocks, and high-speed transceivers together, targeting high-performance DSP, telecom, and data-path designs. Key features of the EP1S20B672C6N include 1,846 Logic Array Blocks (LABs), 1,669,248 bits of embedded SRAM organized as TriMatrix memory (M512, M4K, M-RAM blocks), dedicated DSP blocks for high-speed multiplication, and support for multiple I/O standards including LVDS, SSTL, and HSTL. The device supports core voltage of 1.5 V and I/O voltages configurable per bank. Speed grade 6 is the slowest of the Stratix family grades but offers the lowest cost. Architecture-wise, the Stratix family introduced the Logic Element (LE) as a 4-input LUT-based structure with adjacent register and arithmetic capability, and incorporated dedicated high-speed I/O serdes and PLLs for clock management. The 672-BGA package provides 426 user I/O pins, which can be configured as single-ended or differential pairs, and includes dedicated clock and configuration pins. Typical applications include high-speed digital signal processing, telecommunications line cards, video and image processing pipelines, network switches and routers, and ASIC prototyping. The combination of embedded DSP blocks and large TriMatrix memory makes the EP1S20B672C6N well suited to FIR filters, FFT engines, and protocol bridging designs. When designing with the EP1S20B672C6N, ensure the Quartus II design tool (version supporting Stratix) is used, the configuration scheme (Passive Serial, Fast Passive Parallel, or JTAG) is correctly chosen, and the device's thermal envelope is respected - the BGA package has a fine pitch that demands controlled-impedance PCB layout and adequate cooling for high toggle-rate designs. This page synthesizes distributor pricing, drop-in alternative listings (including same-speed-grade and faster variants), and Stratix-specific design notes not found in the standalone datasheet.

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EP1S20B672C7N - Stratix FPGA, 18,460 LEs, 672-BGA | Intel
EP1S20B672C7N

EP1S20B672C7N - Stratix FPGA, 18,460 LEs, 672-BGA | Intel

The Intel (formerly Altera) EP1S20B672C7N is a member of the original Stratix FPGA family, fabricated on a 0.13 µm CMOS process and housed in a 672-ball BGA package (35 × 35 mm, 1.27 mm pitch). It integrates 18,460 logic elements across 1,846 LABs/CLBs, 1,669,248 bits of embedded memory, and 426 user I/O pins, providing a high-density programmable platform for ASIC prototyping, communications infrastructure, and signal-processing pipelines. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs sit in the programmable logic tier of the digital hierarchy, between fixed-function ASICs and software-driven processors, and are valued for parallel computation, deterministic latency, and in-field reconfigurability. Key features of the EP1S20B672C7N include 1,669,248 RAM bits distributed across TriMatrix memory blocks (true dual-port RAM up to 512 Kbits per block), dedicated DSP blocks for high-speed multiply-accumulate operations, and up to 12 embedded PLLs per device for clock synthesis. The device supports 426 user I/Os across multiple I/O banks with selectable LVDS, LVCMOS, SSTL, and HSTL standards, and offers dedicated 1.5 V core supply operation. Architecturally, the Stratix family introduced the LUT-based logic element, the TriMatrix hierarchical memory architecture, and embedded DSP blocks with hardware multipliers - innovations that defined subsequent Cyclone and Arria lines. The C7N speed/temperature grade indicates a -40 °C to 85 °C commercial-extended operating range with a -7 speed bin, balancing timing margin against density. Typical applications include ASIC prototyping, software-defined radio, digital video and image processing, telecom line-card packet processing, and high-speed serial interface bridging. Engineers also deploy EP1S20B672C7N in industrial motion control and military/aerospace systems where MIL-STD-810 qualification of equivalent Stratix variants is desirable. When designing with this part, ensure robust thermal management for the 35 × 35 mm BGA - theta-JA values for large BGA packages typically require forced airflow or large ground-plane copper pours to stay within the 0 °C to 85 °C junction range. Power sequencing of the 1.5 V core, auxiliary supplies, and I/O bank VCCIO rails must follow the Stratix handbook reference to avoid in-rush latch-up. This page synthesizes distributor pricing, drop-in alternative sourcing, and PCB-layout guidance beyond what the manufacturer datasheet alone provides.

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