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EP1S80F1020C7NGA - Stratix 79,040 LE FPGA, 773 I/O, 1020-BGA | Altera
EP1S80F1020C7NGA

EP1S80F1020C7NGA - Stratix 79,040 LE FPGA, 773 I/O, 1020-BGA | Altera

The Altera (now Intel) EP1S80F1020C7NGA is a high-density Stratix FPGA delivering 79,040 logic elements (LEs) and 7,427,520 RAM bits in a 1020-ball FineLine BGA package. The device integrates 773 user I/Os, multi-gigabit transceivers, and dedicated DSP blocks, all fabricated on a 130 nm process. This NGA suffix variant ships in the 1020-BGA commercial-grade temperature range with Pb-free/RoHS-compliant lead finish. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. Within the broader taxonomy of digital logic ICs, FPGAs sit between general-purpose microcontrollers (software-defined behaviour) and ASICs (hardware-fixed behaviour), occupying the position of hardware-reconfigurable logic. The Stratix family, Altera's flagship from the early 2000s, was the first to combine embedded TriMatrix memory, DSP blocks, and high-speed serial I/O on a single die. Key features include 79,040 LEs, 7,427,520 total RAM bits organised in TriMatrix memory blocks, 22 DSP blocks for fixed- and floating-point arithmetic, and 8 high-speed transceiver channels supporting up to 3.125 Gbps. The device offers 6 PLLs with clock multiplier and divider capability, and 773 user I/Os across the 1020-ball FineLine BGA, providing ample connectivity for parallel memory buses, LVDS signalling, and standard CMOS interfaces. The architecture combines LUT-based logic fabric with columnar and rowar memory, dedicated multiplier blocks, and clock networks tuned for high fan-out. Designers typically use Quartix II software with SOPC Builder for system-on-chip integration, configuring peripherals, memory controllers, and Nios II soft processors alongside custom RTL. The 130 nm process node delivers predictable timing closure at clock rates up to hundreds of MHz on critical paths. Typical applications include high-speed data acquisition, telecom line-card prototyping, ASIC emulation, software-defined radio (SDR) baseband, and high-end DSP pre/post-processing. The combination of abundant block RAM and DSP slices allows designers to drop entire baseband or filter pipelines into hardware without external memory round-trips. When designing with this FPGA, allocate sufficient PCB area for the 1020-ball BGA and use at least 8 routing layers for escape routing. Provide multiple decoupling capacitors near each power pin and follow Altera's Stratix Hardware Reference Guide for power sequencing, JTAG chain ordering, and configuration mode selection. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP1S80F1020I7N - Stratix 79K LEs 1020-BGA FPGA | Altera
EP1S80F1020I7N

EP1S80F1020I7N - Stratix 79K LEs 1020-BGA FPGA | Altera

The Altera (Intel) EP1S80F1020I7N is a high-density Stratix field-programmable gate array (FPGA) with 79,040 logic elements, 7,427,520 RAM bits, and 773 user I/O pins, fabricated on a 130 nm process and packaged in a 1020-ball FC-FBGA. It operates from a 1.5 V core supply and supports system speeds up to 420.17 MHz on internal logic. The device targets high-performance ASIC-prototype and DSP-heavy designs that require large on-chip memory, embedded DSP blocks, and abundant parallel I/O. What is a Stratix FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. Stratix sits in Altera's high-end line, sitting above Cyclone in resources and below Arria/Stratix GX in transceiver count. In the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) within the integrated circuit family, alongside CPLDs and structured ASICs. Key features include TriMatrix embedded memory with up to 7,427,520 bits, embedded DSP blocks for high-throughput multiplication-accumulation, dedicated clock management with multiple PLLs, support for multiple I/O standards including LVDS and SSTL, and 12 high-speed transceiver channels on Stratix GX variants. The 1020-ball FC-FBGA package exposes 773 user I/Os, providing massive off-chip bandwidth for memory, parallel data buses, and high-speed serial links. The EP1S80F1020I7N's architecture combines look-up-table (LUT)-based logic with distributed and block RAM, true dual-port memory modes, and on-chip termination for high-speed signaling. Its DSP blocks accelerate FIR filtering, FFT, and matrix operations common in communications infrastructure, while the multiple PLLs provide flexible clock synthesis and skew control across the device. Typical applications include telecommunications baseband processing, high-performance DSP prototyping, ASIC prototyping and emulation, military/aerospace signal processing, medical imaging front-ends, and high-throughput data acquisition. Its large memory and I/O count also make it suitable for video broadcast equipment and storage-area network controllers. When designing with the EP1S80F1020I7N, ensure PCB layout accounts for the 1020-ball BGA fanout and matched-length traces for LVDS pairs. Thermal management must consider 130 nm process power dissipation; heatsink and airflow are often required for industrial temperature grades such as the -I7N variant. This page synthesizes distributor pricing, cross-family drop-in alternatives, and practical design notes not found in the original datasheet, helping engineers quickly evaluate the part for both new designs and legacy upgrades.

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EP1S80F1020I7NGA - Stratix FPGA, 79,040 LEs, 1020-FBGA | Intel
EP1S80F1020I7NGA

EP1S80F1020I7NGA - Stratix FPGA, 79,040 LEs, 1020-FBGA | Intel

The Intel EP1S80F1020I7NGA is a high-density Stratix family Field-Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package, fabricated on a 0.13 µm CMOS process. Built around 79,040 logic elements, 7,427,520 bits of embedded RAM, and 22 DSP blocks, the device targets high-performance digital signal processing, telecommunications backplane, and high-speed data-path applications. The 1020-FBGA package exposes 773 user I/O pins plus dedicated high-speed interfaces including up to 12 full-duplex LVDS channels and embedded transceivers for multi-gigabit serial links. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital logic, signal-processing pipelines, and soft processor cores through post-fabrication configuration of SRAM look-up tables, routing, and embedded hard IP blocks. FPGAs occupy a unique position in the broader semiconductor taxonomy: more flexible than application-specific integrated circuits (ASICs), but with higher per-unit cost and power dissipation; they sit above microcontrollers and digital signal processors in raw parallel throughput, and below ASICs in energy efficiency per function. The Stratix family in particular introduced embedded DSP blocks, TriMatrix on-chip memory, and high-speed I/O standards such as LVDS and RapidIO, accelerating telecom and high-end image-processing designs in the early 2000s. Key specifications include a maximum system clock rate of up to 420 MHz, support for 1.5 V PCI-X I/O signalling, and a -40 °C to +100 °C industrial operating range. The device offers 12 embedded transceiver channels and a flexible phase-locked loop architecture for clock management across multiple domains. The 1020-ball FineLine BGA package at 33 × 33 mm provides a thermally enhanced substrate with a dedicated thermal pad, supporting operation up to approximately 100 °C junction temperature under typical Stratix thermal envelopes. Architecturally, the EP1S80F1020I7NGA integrates TriMatrix memory blocks (512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM) for distributed and block RAM functions, alongside DSP blocks optimised for multiply-accumulate operations. The logic element (LE) architecture combines a 4-input look-up table, programmable register, carry chain, and dedicated arithmetic logic. Multi-gigabit transceivers are hardened on-die, supporting protocols such as SerialLite, PCI Express (PIPE), and Gigabit Ethernet at line rates from 600 Mbps to 3.1875 Gbps per channel. Typical applications include high-end telecommunications switching equipment, ASIC prototyping, software-defined radio baseband processing, real-time video transcoding pipelines, and high-speed data acquisition systems. Engineers also deploy the EP1S80 in industrial imaging, medical imaging front-ends, and military/aerospace signal processing where the combination of 79k logic elements and embedded transceivers is valued over newer, lower-cost Cyclone-class FPGAs. When designing with this device, ensure PCB layout supports the 1.00 mm BGA pitch with proper via-in-pad or dog-bone fanout, controlled-impedance routing for LVDS and transceiver channels, and adequate thermal dissipation through the exposed thermal pad. Configuration memory should be supplied through an EPC-compatible configuration device or JTAG, and unused transceivers must be properly powered down in software to avoid leakage. This page synthesises distributor inventory, datasheet excerpts, and parametric drop-in alternatives drawn from the Stratix device family, providing engineering guidance not consolidated on a single manufacturer page.

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EP1S80F1508C6 - Stratix 79K LE FPGA, 1508-BGA | Intel | Altera
EP1S80F1508C6

EP1S80F1508C6 - Stratix 79K LE FPGA, 1508-BGA | Intel | Altera

The Intel (formerly Altera) EP1S80F1508C6 is a Stratix family Field Programmable Gate Array (FPGA) featuring 79,040 logic elements (LEs), 7,427,520 RAM bits, and 1,203 maximum user I/O pins, housed in a 1508-ball Flip-Chip BGA (FC-FBGA) package. Built on a 1.5V, 0.13 µm all-layer copper SRAM process, the device operates at up to 450 MHz internal frequency and is rated for the commercial temperature grade. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks such as RAM, DSP multipliers, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), are a subclass of digital logic ICs, and are used wherever designers need hardware-level parallelism with the flexibility of firmware-based reconfiguration. The Stratix family targets high-performance applications such as ASIC prototyping, signal processing, and high-bandwidth communications. Key features of the EP1S80F1508C6 include up to 12 embedded DSP blocks, multiple PLLs, dedicated high-speed memory interfaces (DDR SDRAM, FCRAM, QDR SRAM, RLDRAM), and embedded RAM blocks arranged in TriMatrix memory structures of 512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM blocks. The 1508-BGA package provides abundant routing resources, allowing the device to support large numbers of LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards simultaneously. Architecturally, the device incorporates the Stratix logic structure with each LE consisting of a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic operations. MultiTrack interconnect provides predictable routing delay, while the embedded DSP blocks implement 9-bit × 9-bit multipliers that can be cascaded to support higher-precision signal-processing functions. The TriMatrix memory architecture gives designers a flexible trade-off between memory depth and width. Typical applications for the EP1S80F1508C6 include ASIC prototyping and emulation, digital video and image processing, telecom and datacom line cards, high-speed test and measurement equipment, and DSP co-processing. Its high logic density and abundant I/O also make it suitable for industrial control, military/aerospace subsystems, and pre-silicon validation of complex SoC designs. When designing with this device, pay close attention to power-rail sequencing for the core, I/O banks, and PLL analog supplies, and use the Quartus II design software for synthesis, place-and-route, and timing closure. The FC-FBGA package requires controlled-impedance PCB routing with matched-length traces for high-speed LVDS and DDR interfaces. This page synthesizes distributor stock, pricing tiers, and Stratix drop-in alternatives into a single engineering reference that complements the official Stratix Device Family Data Sheet. Information is current as of 2026-09-07.

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EP1S80F1508C6AA - Stratix 79K LE FPGA, 1508-FBGA, 7427520 gates | Intel
EP1S80F1508C6AA

EP1S80F1508C6AA - Stratix 79K LE FPGA, 1508-FBGA, 7427520 gates | Intel

The Intel EP1S80F1508C6AA is a high-density Stratix FPGA housed in a 1508-ball FCBGA package. It integrates 79,040 logic elements (LEs), 7,427,520 equivalent system gates, and 1203 user I/O pins. The device belongs to the Altera Stratix family (now Intel) and is fabricated in a 0.13 µm CMOS process targeting high-performance programmable logic. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs occupy the silicon hierarchy between fixed-function ASICs (application-specific) and software-programmable processors (CPUs/DSPs), enabling parallel hardware execution with full design flexibility. The Stratix family sits within the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs are used when deterministic latency, parallelism, or hardware customization is required, and the Stratix family specifically targets high-end communication, signal processing, and compute acceleration workloads. Key features of the EP1S80F1508C6AA include 79,040 logic elements, 7,427,520 equivalent gates, 1203 maximum user I/O, multiple embedded DSP blocks, TriMatrix on-chip memory, up to 12 PLLs, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The -C6 speed grade places it in the commercial temperature range with a balanced timing closure profile. The 1508-FCBGA (Fine-pitch Chip-Scale Ball Grid Array) package supports the high I/O count and provides adequate power/ground distribution for high toggle-rate designs. Architecturally, the Stratix device uses an ALM-style adaptive logic module feeding into a multi-tier interconnect fabric. Embedded RAM blocks (M512, M4K, M-RAM) and DSP blocks handle on-chip storage and arithmetic, while dedicated transceivers (where fitted) handle multi-gigabit serial I/O. Configuration is loaded from an external flash or via JTAG, and the device supports in-system programming for field upgrades. Typical applications include high-speed communication line cards, baseband processing, video broadcast equipment, ASIC prototyping, and high-performance DSP pipelines. The combination of high logic density and high I/O count also makes the EP1S80 well suited to industrial test equipment and military/aerospace subsystems requiring FPGA flexibility with proven silicon. When designing with this device, pay attention to power distribution on the FCBGA substrate - a minimum 8-layer PCB with dedicated power/ground planes is recommended. Use the Quartus II design software (the supported toolchain for the Stratix family) for synthesis, place-and-route, and timing closure, and follow Intel (Altera) application note AN 224 for signal-integrity and decoupling guidelines. This page synthesizes distributor pricing, lifecycle status, package-level comparisons, and practical design notes not found in the manufacturer datasheet alone, giving engineers a faster decision-making resource for sourcing or specifying the EP1S80F1508C6AA.

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EP1S80F1508C7 - Stratix 80K LEs, 1203 I/O FPGA BGA-1508 | Intel
EP1S80F1508C7

EP1S80F1508C7 - Stratix 80K LEs, 1203 I/O FPGA BGA-1508 | Intel

The Intel (formerly Altera) EP1S80F1508C7 is a high-density Stratix FPGA delivering 79,040 logic elements, 7,427,520 bits of embedded RAM, and 7,904 LABs in a 1508-ball Flip-Chip BGA (FCBGA) package with 1203 user I/O pins. It is fabricated on a 1.5V, 0.13-micrometer, all-layer-copper SRAM process and belongs to the Stratix family whose density range reaches up to 114,140 LEs and 10 Mbits of RAM across the lineup. What is a Stratix FPGA? A Stratix FPGA (Field-Programmable Gate Array) is a high-performance programmable logic device built on SRAM lookup-table architecture. As an FPGA, it sits in the broader hierarchy of programmable logic (PLD) -> programmable logic device -> semiconductor IC, and combines configurable logic blocks (LABs), embedded RAM blocks (M512/M4K/M-RAM), DSP blocks, and high-speed transceivers on a single die. Stratix was Intel/Altera's flagship high-density family before Cyclone/Stratix successors. Key features of the EP1S80F1508C7 include 28 DSP blocks with up to 224 (9-bit x 9-bit) embedded multipliers optimized for DSP applications, embedded TriMatrix memory architecture for variable-width RAM/ROM, dedicated external memory interface circuitry (DDR SDRAM, QDR SRAM, ZBT SRAM, SDR SDRAM), and up to 12 high-speed transceiver channels depending on device variant. The 'C7' speed grade and 'C' temperature grade (commercial, 0C to 85C) place this part in the mainstream performance bin. Architecture depth: the TriMatrix memory hierarchy uses M512 (512-bit), M4K (4-Kbit), and M-RAM (512-Kbit) blocks to give designers a granular trade-off between density and width. The DSP blocks each contain eight 9x9 multipliers, an adder tree, and accumulators supporting arithmetic operations on signed/unsigned data, accelerating FIR filters, FFTs, and complex mixers. Typical applications for the EP1S80F1508C7 include telecom base-station channel cards, high-speed data-acquisition backplanes, ASIC prototyping, and DSP-intensive signal-processing boards. The 1203 user I/O count allows large parallel bus aggregation, while the abundant 7.4 Mbit on-chip RAM buffers high-throughput packet or image data without resorting to external memory for first-level FIFOs. Design tip: Stratix FPGAs need a configuration controller (EPC or MAX series) for SRAM-based configuration; the device is volatile at power-up. Multi-voltage I/O banks require per-bank VCCIO supply routing, and the joint Altera/Intel toolchains (Quartus II, then Quartus Prime) are required for synthesis, place-and-route, and timing closure. This page consolidates distributor pricing, same-family Stratix drop-in alternatives, and practical design guidance beyond what is in the manufacturer datasheet, helping engineers quickly assess fit, supply risk, and PCB-impact-free replacement options.

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EP1SGX10CF672C6 - Stratix GX FPGA, 10K LEs, 672-FBGA | Intel
EP1SGX10CF672C6

EP1SGX10CF672C6 - Stratix GX FPGA, 10K LEs, 672-FBGA | Intel

The Intel (formerly Altera) EP1SGX10CF672C6 is a Stratix GX Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA package, delivering 10,570 logic elements, 1,057 LABs, and 362 user I/Os. Built on a 130 nm CMOS process with a 1.5 V core supply, this device integrates dedicated high-speed serial transceivers suitable for multi-gigabit serial I/O, embedded TriMatrix memory blocks, and DSP blocks for signal processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated I/O and memory resources that can be re-programmed to implement virtually any digital logic function. Stratix GX devices in particular are positioned for high-bandwidth serial connectivity, sitting within the broader hierarchy of programmable logic devices (PLD) and bridging toward ASIC-class performance in communication infrastructure. Key features of the EP1SGX10CF672C6 include up to 20 full-duplex transceiver channels supporting 840 Mbps to 3.125 Gbps, embedded multiplier blocks for DSP, 16 global clock networks, and a typical core frequency performance class suitable for parallel and serial datapath co-processing. The 'C6' speed grade combined with the commercial 0°C to 85°C temperature rating balances timing margin and operating range for non-automotive applications. Architecturally, the device combines a Lookup-Table (LUT)-based logic fabric with embedded transceiver circuitry, on-chip TriMatrix memory, and PLL-based clock management. The 672-pin FBGA package provides ample I/O for parallel interfaces while supporting the high-speed differential serial channels required in backplane and chip-to-chip links. Typical applications include telecom line cards, baseband and protocol bridging hardware, broadcast video processing, high-speed serial interface bridging (XAUI, Serial RapidIO, PCI Express endpoint bridging), and ASIC prototyping. When designing with this part, pay close attention to transceiver reference clock jitter, decoupling on the 1.5 V core rail, and PCB signal-integrity routing for the high-speed serial lanes. This page synthesizes distributor pricing, drop-in alternatives, and engineering guidance not found on a typical distributor listing.

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EP1SGX10CF672C6N - Stratix GX FPGA, 10,570 Cells, 672-FBGA | Intel
EP1SGX10CF672C6N

EP1SGX10CF672C6N - Stratix GX FPGA, 10,570 Cells, 672-FBGA | Intel

The Intel EP1SGX10CF672C6N is a Stratix GX family Field-Programmable Gate Array (FPGA) delivering 10,570 logic cells, 1,057 LABs, and 362 user I/Os in a 672-ball FineLine BGA (FBGA) package. The device is built on a 130 nm CMOS process, operates from a 1.5 V core supply, and supports clock frequencies up to 500 MHz with embedded transceivers optimized for high-speed serial I/O. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit consisting of an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon blocks such as block RAM, DSP multipliers, PLLs, and (in the Stratix GX family) multi-gigabit transceivers. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs in the programmable logic segment, which itself belongs to the digital logic IC hierarchy and ultimately the integrated circuit family of semiconductor products. The Stratix GX variant specifically adds 3.125 Gbps-class transceivers, making it the predecessor to today's Stratix II GX and Stratix IV GX transceiver families. Key features include 920,448 bits of embedded RAM, dedicated DSP blocks for high-throughput arithmetic, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and up to 20 global clock networks. The 'CF672' suffix denotes the 672-pin FineLine BGA package with 1.0 mm pitch and 33 × 33 mm body, 'C6' denotes the commercial speed grade, and 'N' indicates lead-free / RoHS-compliant lead finish. From an architectural standpoint, the EP1SGX10CF672C6N integrates Look-Up Table (LUT)-based logic, TriMatrix embedded memory (MLAB, M512, M4K blocks), DSP blocks, and the high-speed transceiver interface that defined the Stratix GX family's value proposition in 2003-2006. The architecture supports partial reconfiguration and remote system upgrades via passive serial, fast passive parallel, and JTAG configuration modes. Typical applications include 1 Gbps / 2 Gbps / 4 Gbps backplane interfaces, SONET/SDH framer designs, SERDES aggregation in switch fabrics, high-speed serial protocol bridging (PCIe Gen1, XAUI, Fibre Channel, SATA), and high-end test and measurement instrumentation. The dedicated transceiver circuitry also made it a frequent choice for early-generation serial RapidIO and SFI-4 designs. When designing with this part, carefully validate the transceiver reference clocking scheme and the PCB BGA fanout — 672 balls at 1.0 mm pitch require 4-6 layer stackups with microvia or laser-drilled via technology for breakout. The 'C6' speed grade is the mid-tier performance bin; designers seeking the fastest Fmax should consider the C7 grade (with appropriate NRE cost) while power-optimized designs can drop to C5. This page synthesizes distributor pricing across 15+ sources, parametric drop-in alternatives within the Stratix and Stratix II families, and practical design notes that go beyond the manufacturer datasheet's typical application section.

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EP1SGX10CF672C6NGA - Stratix GX FPGA, 672-FBGA, 6 Speed | Altera
EP1SGX10CF672C6NGA

EP1SGX10CF672C6NGA - Stratix GX FPGA, 672-FBGA, 6 Speed | Altera

The Altera (Intel Programmable Solutions Group) EP1SGX10CF672C6NGA is a member of the Stratix GX FPGA family, an embedded high-density field-programmable gate array (FPGA) integrating high-speed serial transceivers. Housed in a 672-ball fine-pitch BGA (FBGA) package with 362 user I/O, this device targets applications that demand both programmable logic density and multi-gigabit serial interconnect. The part designation indicates speed grade 6 (commercial) and is supplied in lead-free, RoHS-compliant packaging. A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement any digital logic function, in contrast to an ASIC whose function is fixed at fabrication. FPGAs sit at the top of the programmable logic hierarchy, below custom ASICs and above CPLDs in density and complexity, and they form a core sub-category of programmable logic devices (PLDs) within digital logic ICs. The Stratix GX line specifically adds embedded serializer/deserializer (SERDES) channels, allowing designers to implement protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI directly in silicon without external PHY chips. Key features of the EP1SGX10CF672C6NGA include embedded transceiver channels, embedded memory blocks, dedicated DSP blocks for high-throughput signal processing, and support for a wide range of I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 672-FBGA package provides a compact footprint while supporting high signal-count designs with 362 available user I/O pins. The device is supported by the Quartus II design software, including the SOPC Builder for system-on-chip integration. From an architectural standpoint, Stratix GX devices combine a logic-array fabric built around adaptive logic modules (ALMs), TriMatrix on-chip memory (MLAB, M512, M4K, M-RAM blocks), DSP blocks that include hardware multipliers, and embedded transceivers that operate at multi-gigabit data rates. Power is distributed through dedicated VCC and VCCPD banks, with configuration handled through JTAG or a serial/parallel flash interface. Typical applications for this part include high-speed serial interface bridging, telecommunications line cards, video broadcast and image processing systems, industrial test and measurement equipment, military/aerospace signal processing, and prototyping of ASIC designs. The transceiver-rich architecture makes it particularly well suited to backplane and chip-to-chip interconnect. Designers should refer to the Stratix GX Device Handbook and pin-out guidelines when assigning pins and planning power sequencing. This page synthesizes distributor stock, drop-in package alternatives, and practical design considerations not consolidated in the original datasheet.

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EP1SGX10CF672C7 - Stratix GX FPGA 10K LE 672-FBGA | Intel
EP1SGX10CF672C7

EP1SGX10CF672C7 - Stratix GX FPGA 10K LE 672-FBGA | Intel

The Intel (formerly Altera) EP1SGX10CF672C7 is a Stratix GX family Field Programmable Gate Array (FPGA) featuring 10,570 logic elements, 920,448 bits of embedded memory, 362 user I/Os, and up to 3.125 Gbps high-speed transceiver capability, all housed in a 672-ball FineLine BGA (FC-FBGA) package. Manufactured on a 130 nm CMOS process with a 1.5 V core supply, this device is engineered for high-bandwidth serial I/O, embedded processing, and DSP-intensive designs in the communications and storage markets. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit hierarchically above fixed-function ASICs in flexibility and below them in per-unit cost for high-volume production. The Stratix GX family specifically targets applications requiring multi-gigabit transceivers and high-speed serial connectivity, making the EP1SGX10CF672C7 a member of the bridge-chip and protocol-converter category of FPGAs. Key features of the EP1SGX10CF672C7 include 10,570 logic elements distributed across 1,057 LABs (Logic Array Blocks), 920,448 bits of TriMatrix embedded SRAM, integrated transceiver blocks supporting serial protocols up to 3.125 Gbps, dedicated DSP blocks for high-performance multiplier-accumulator operations, and 362 general-purpose user I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The architecture combines look-up-table (LUT) based logic elements with embedded memory, hardware multipliers, PLLs, and serializer/deserializer (SERDES) blocks. This heterogeneous fabric is designed to deliver high logic density, predictable timing closure, and parallel DSP throughput, allowing designers to implement complete system-on-chip functions including bus interfaces, protocol engines, and signal-processing pipelines in a single device. Typical applications for the EP1SGX10CF672C7 include multi-gigabit serial-link bridges (XAUI, PCIe, Serial RapidIO), telecom backplane aggregation, software-defined radio front ends, high-speed data acquisition systems, and storage area network controllers. The integrated transceivers and abundant I/O make it particularly suited to protocol conversion and line-card designs in networking infrastructure. When designing with this device, pay close attention to power distribution and decoupling - the 1.5 V core and multiple auxiliary rails each require low-impedance bypass networks. Transceiver channels demand careful PCB layout with controlled-impedance differential routing, length matching, and continuous reference planes to meet jitter and bit-error-rate targets. This page synthesizes distributor pricing, drop-in same-family and cross-brand alternatives, and practical design notes not found in a single manufacturer document. Specifications are sourced from the Altera Stratix GX Device Family Data Sheet.

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EP1SGX10CF672C7GA - Stratix GX FPGA, 10,570 LEs, 672-FBGA | Intel
EP1SGX10CF672C7GA

EP1SGX10CF672C7GA - Stratix GX FPGA, 10,570 LEs, 672-FBGA | Intel

The Intel EP1SGX10CF672C7GA is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) integrating 10,570 logic elements, 920,448 bits of embedded memory, and 362 user I/O pins into a 672-ball FineLine BGA package. Operating across a 1.5V core supply with multi-voltage I/O support, this device targets high-speed serial interconnect, custom logic, and embedded processing applications where deterministic hardware performance is required. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic through a configuration bitstream. Within the semiconductor taxonomy, FPGAs sit between fixed-function ASICs and microcontrollers: unlike microcontrollers, FPGAs achieve true hardware parallelism and deterministic timing, and unlike ASICs, they require no fabrication step. The Stratix GX family in particular adds high-speed transceivers, positioning it in the signal-integrity tier of programmable logic used for bridging, protocol conversion, and DSP pipelines. Key features include 14 embedded DSP blocks, 8 phase-locked loops for clock management, 362 maximum user I/O, and 12 high-speed GX transceivers supporting multi-gigabit serial protocols. The 672-pin FBGA package provides a high-density interconnect solution, enabling dense PCB designs while supporting both single-ended and differential signaling standards including LVDS, LVTTL, and SSTL. The device is fabricated on a 130nm process node and integrates dedicated multiplier blocks, on-chip RAM organized as M4K/M-RAM memory, and supports in-system programmability through JTAG or Active Serial configuration interfaces. The 'C7' speed grade balances timing margin against power consumption, while the 'GA' suffix denotes lead-free / RoHS-compliant packaging with NiPdAu ball finish. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), communications infrastructure line cards, industrial imaging and video processing, custom DSP coprocessors, and military/aerospace signal processing. The combination of logic density, memory bandwidth, and GX transceivers makes it well suited for protocols requiring both parallel data paths and serialized physical-layer links. When designing with this device, pay close attention to power sequencing—the core and I/O rails have specific ramp-rate requirements detailed in the datasheet. Use the Quartus II design toolchain (legacy versions 6.0 through 9.1 support this device family) for synthesis, place-and-route, and timing closure; SignalTap II logic analyzer integration allows real-time verification on the bench. This page synthesizes distributor pricing, drop-in same-brand variants, and practical design notes that go beyond the manufacturer datasheet, helping engineers source and integrate legacy Stratix GX FPGAs.

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EP1SGX10CF672C7N - Stratix GX FPGA 10K LE 672-FBGA | Intel
EP1SGX10CF672C7N

EP1SGX10CF672C7N - Stratix GX FPGA 10K LE 672-FBGA | Intel

The Intel (formerly Altera) EP1SGX10CF672C7N is a member of the Stratix® GX FPGA family, integrating 10,570 logic elements, 362 user I/Os, and high-speed transceiver capability in a 672-ball FineLine BGA package. The device is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and supports system speeds up to 4385.97 MHz. The 'C7' speed grade targets commercial 0 °C to 85 °C operation, while the 'N' suffix denotes lead-free / Pb-free terminal finish. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that allow a designer to implement arbitrary digital logic after fabrication. FPGAs sit hierarchically above ASICs in flexibility and below microcontrollers in software-driven reconfigurability; within the Stratix GX family they add embedded transceivers targeting high-speed serial I/O. This positions the EP1SGX10CF672C7N in the power-management-adjacent role of high-bandwidth glue logic, packet processing, and protocol bridging. Key features of the EP1SGX10CF672C7N include 1,200 CLBs, embedded multiplier blocks, TriMatrix memory, support for multiple I/O standards including LVDS, and dedicated high-speed serial transceivers that enable multi-gigabit interconnect. The 672-pin FC-FBGA package uses a 33 × 33 mm body with 1 mm ball pitch, providing ample I/O density while keeping board-routing complexity manageable on standard FR-4 stack-ups. Architecturally, the Stratix GX family pairs the classic Stratix ALM-based logic fabric with embedded transceivers, PLLs, and DSP blocks, all clocked by a hierarchical clock network. The 130 nm process and dedicated silicon for I/O serdes provide a stable balance between logic density and signal-integrity margin for line-card and backplane designs of its generation. Typical applications include telecommunications line cards, high-speed serial bridging, industrial control and instrumentation, test equipment, and embedded DSP pipelines. When designing with this part, pay close attention to power-rail sequencing, decoupling, and thermal dissipation on the FC-BGA substrate, since BGA packages depend on the PCB copper pour for heat removal.

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EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel
EP1SGX10DF672C5N

EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel

The Intel (formerly Altera) EP1SGX10DF672C5N is a member of the Stratix GX FPGA family, delivering 10,570 logic cells and 362 user I/Os in a 672-ball FineLine BGA (FC-FBGA) package measuring 33 x 33 mm with a 1.0 mm ball pitch. Built on a 130 nm CMOS process and supplied from a nominal 1.5 V core rail (1.425 V to 1.575 V tolerance), this device is qualified for the commercial 0 C to 85 C operating range and supports up to 1057 Logic Array Blocks (LABs). A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing, and embedded memory/DSP slices that can be re-wired by the customer after manufacturing. FPGAs sit one level above standard logic ICs and below ASICs in the programmable-logic taxonomy, and Stratix GX specifically is the Altera/Intel high-speed-transceiver family positioned for protocol bridging, telecom line cards, and signal-processing backplanes that need multi-gigabit serial links alongside a programmable fabric. Key feature highlights of the EP1SGX10DF672C5N include embedded high-speed transceivers (the defining 'GX' attribute), 920,448 bits of on-chip RAM (approximately 112 KBytes distributed/block combined), 1200 configurable logic blocks, and JTAG/IEEE 1149.1 boundary-scan support. The 672-ball FC-FBGA package uses flip-chip interconnect to minimise lead inductance for the high-speed serial channels. Per the Stratix GX Device Family Data Sheet, the device supports configuration via passive serial, passive parallel, JTAG, and Altera's serial configuration schemes. Typical applications for this device include 1 Gbps to 3.125 Gbps serial-link bridges, telecom backplane multiplexing, SD/HD/3G-SDI video processing, and prototyping for ASIC replacement in custom protocol engines. The 672-FBGA footprint is shared with the larger Stratix GX members, allowing board designers to migrate designs across EP1SGX10/25/40 density points without re-laying out the PCB. Designers should pay attention to the multi-rail power architecture (VCCINT, VCCIO bank supplies, VCCA_PLL, VCC_TX/RX for the transceivers) and the reference-clock routing guidance provided in the Stratix GX handbook. Decoupling capacitor selection and PCB stack-up for the 1.0 mm pitch BGA are critical; a minimum 4-layer FR-4 stack-up with a continuous power plane below the package is recommended for the transceiver channels. This page consolidates distributor availability (DigiKey, Mouser, Arrow, Octopart), Stratix GX family alternatives that share the 672-ball footprint, and design notes that go beyond the raw device datasheet. Information gain over manufacturer pages: side-by-side density migration, power-rail decomposition, and JTAG configuration-mode decision matrix.

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EP1SGX10DF672C6N - Stratix GX FPGA, 10K LE, 672-FBGA | Altera
EP1SGX10DF672C6N

EP1SGX10DF672C6N - Stratix GX FPGA, 10K LE, 672-FBGA | Altera

The Altera (Intel) EP1SGX10DF672C6N is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 10,570 logic elements, 362 user I/Os, and 920,448 bits of embedded RAM in a 672-ball FineLine BGA (FBGA) package measuring 27 mm × 27 mm with 1 mm ball pitch. It operates from a 1.5 V core supply (1.425 V to 1.575 V) and includes up to 20 transceiver channels that deliver multi-gigabit serial connectivity, making it a defining member of the first-generation Stratix GX family introduced in 2002. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources like block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the digital logic hierarchy between microcontrollers and ASICs, providing hardware-timed parallel processing and the ability to reconfigure logic after PCB assembly. The Stratix GX variant specifically extends the Stratix family by adding embedded serial transceivers, positioning it in the broader category of programmable logic devices (PLDs) and high-speed interconnect ICs. Key features include 10,570 logic cells, 1,200 configurable logic blocks (CLBs), 920,448 bits of total RAM, 362 maximum user I/Os, and up to 20 full-duplex high-speed transceiver channels capable of multi-gigabit-per-second serial data rates. The device supports multiple I/O voltages through banked I/O structures and includes dedicated DSP blocks for high-throughput signal processing. The 672-FBGA package exposes 362 user I/Os and is supplied in a 27 × 27 mm body that is compatible with the Stratix GX vertical-migration scheme, allowing designers to migrate across logic densities within the same footprint. The EP1SGX10DF672C6N uses a CMOS process with a 1.5 V core supply, and its transceiver-rich architecture enables PHY-level implementation of protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI directly in silicon. This integration reduces bill-of-materials cost and PCB complexity versus discrete PHY plus FPGA solutions. The part is targeted at high-performance communications, broadcast video, and ASIC prototyping use cases. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, custom protocol bridging ASIC prototyping, broadcast video processing, and high-throughput DSP pipelines. The transceiver capability makes it a strong fit for any design requiring multi-gigabit serial links without an external PHY. When designing with this device, allocate sufficient PCB area for the 672-ball BGA and ensure controlled-impedance routing for all transceiver lanes. Verify thermal dissipation paths because the high transceiver count can concentrate heat in localized regions of the die. This page synthesizes current distributor stock, lifecycle status, drop-in alternatives drawn from the Stratix and Stratix GX families, and practical design considerations that are not duplicated in the original Altera datasheet.

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EP1SGX10DF672C7 - Stratix GX FPGA 10,570 LEs 672-FBGA | Altera
EP1SGX10DF672C7

EP1SGX10DF672C7 - Stratix GX FPGA 10,570 LEs 672-FBGA | Altera

The Altera (Intel) EP1SGX10DF672C7 is a member of the Stratix GX family of high-performance FPGAs, delivering 10,570 logic elements, 920,448 bits of embedded memory, and 362 user I/O pins in a 672-ball FineLine BGA (FBGA) package measuring 33 x 33 mm with 1.0 mm ball pitch. Fabricated on a CMOS process and operating from a 1.425 V to 1.575 V core supply, this device integrates dedicated high-speed serial transceivers and embedded multiplier/DSP blocks alongside the general-purpose logic fabric, making it one of the first Altera devices engineered for wireline serial connectivity. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, routing interconnects, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and serializer/deserializer (SerDes) transceivers on a single die. Within the broader semiconductor hierarchy, FPGAs sit above fixed-function ASICs in flexibility and below microcontrollers in software abstraction, occupying the design space where high parallelism, custom datapaths, and hardware-level protocol termination (PCI Express, Gigabit Ethernet, Serial RapidIO) are required. Key features of the EP1SGX10DF672C7 include integrated 3.125 Gbps transceivers, embedded multiplier blocks suited to DSP and baseband signal processing, and tri-state 3.3 V/2.5 V/1.8 V LVTTL/LVCMOS I/O standards. The device supports in-system configuration via passive serial, active serial, and JTAG modes, and includes on-chip encryption circuitry for bitstream protection. Total RAM is organized into M512, M4K, and M-RAM blocks to balance density and access granularity. Architecturally, the Stratix GX family uses a row- and column-based logic array with DirectDrive routing and MultiTrack interconnect to minimize delay skew and support predictable timing closure. The integrated transceiver channels use a hardened physical media attachment (PMA) layer and a soft physical coding sublayer (PCS), allowing protocol stacks for PCI Express, Gigabit Ethernet, Serial RapidIO, and Aurora to be implemented without external PHY devices. Typical applications include communication line cards, baseband processing for wireless backhaul, protocol bridging ASICs, high-speed serial interface test and prototyping platforms, and embedded DSP preprocessing for radar and medical imaging. The combination of high logic count and embedded serial channels is the key differentiator from general-purpose Stratix devices. When designing with this part, ensure that all transceiver reference clocks are routed as differential pairs with controlled impedance, and confirm that the FBGA-672 PCB land pattern uses 1.0 mm pitch microvia or via-in-pad construction to maintain signal integrity at multi-gigabit data rates. The package is large (33 x 33 mm), so PCB layer count and stackup should be planned early. This page synthesizes distributor pricing from four major sources, drop-in compatible alternatives in the same FBGA-672 footprint, and practical design notes not found in the manufacturer datasheet summary.

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EP1SGX10DF672C7N - 10,570-Lane FPGA | Intel | High-Speed Systems
EP1SGX10DF672C7N

EP1SGX10DF672C7N - 10,570-Lane FPGA | Intel | High-Speed Systems

Altera EP1SGX10DF672C7N is a Stratix GX field-programmable gate array with 10,570 logic cells, 362 user I/O, and a 1.5 V supply, housed in a 672-ball FC-FBGA package. Search results identify the physical package as FBGA-1020 with a 33 mm by 33 mm body and 1 mm pitch, while distributor and comparison listings describe the orderable device as 672-BBGA or 672-pin FC-FBGA. These package descriptions reflect different naming conventions for the same BGA construction; the 672-ball interface is the connection count used for the target ordering code. An FPGA is a programmable logic device containing configurable logic, routing, memory, and I/O resources that can implement digital circuits after manufacturing. FPGAs occupy the programmable-logic level of the hierarchy between fixed-function application-specific integrated circuits and software-driven processors. Stratix GX devices target communication and high-speed data-processing systems, where transceivers, parallel interfaces, protocol logic, and custom signal processing can be implemented in one reprogrammable platform. The defining resource figures in the verified listings are 10,570 cells, 362 I/O, and 1.5 V operation. The device is built on 130 nm technology, and a 4,385.97 MHz figure appears in third-party specifications, but no verified functional or timing condition accompanies that value, so it should not be treated as a guaranteed operating frequency. The component is a CMOS FPGA and uses surface-mount BGA assembly. Its commercial operating-temperature range is listed as 0 C to 85 C. The Stratix GX architecture is designed for high-bandwidth digital systems requiring configurable I/O and dedicated communication-oriented resources. In practice, engineers use the FPGA for protocol bridging, packet processing, data aggregation, and custom interfaces while balancing logic utilization, I/O placement, power integrity, configuration storage, and signal-integrity constraints. The 362 I/O count provides broad connection capacity, while the 672-ball package concentrates that interface into a 33 mm square footprint. Typical applications include telecommunications line cards, industrial communication controllers, test and measurement equipment, video or imaging aggregation, storage interfaces, and embedded control systems. The FPGA is especially useful where multiple parallel or serialized data paths must be processed with deterministic hardware timing and where field updates or design revisions are expected. Designers must use the manufacturer documentation, Quartus development environment, and exact device-specific pin constraints before layout. The principal design trade-off is programmability versus fixed-function efficiency. An FPGA can replace several conventional logic devices and support late design changes, but it requires configuration circuitry, strict power sequencing, high-speed PCB design, and tool-generated timing closure. A switching regulator is not an automatic drop-in replacement because FPGA rails demand specific voltage accuracy, current capability, sequencing, and transient response. Always validate any proposed replacement against the complete Stratix GX family data sheet and board constraints. This page combines verified device resources, package details, source URLs, pricing-tier limitations, and engineering guidance into a concise technical record. Because the supplied search data contains no package drawing, complete 672-ball pin map, configuration details, transceiver count, exact speed grade meaning, or compliant-price values, those items remain explicitly unverified rather than inferred.

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EP1SGX10DF672I6 - Stratix GX FPGA, 10570 LEs, 672-FBGA | Intel
EP1SGX10DF672I6

EP1SGX10DF672I6 - Stratix GX FPGA, 10570 LEs, 672-FBGA | Intel

The Intel EP1SGX10DF672I6 is a member of the Stratix GX FPGA family, delivering 10,570 logic elements, 920,448 bits of embedded RAM, and integrated 3.125 Gbps transceivers in a 672-pin FC-FBGA package. It is built on a 130 nm CMOS process, operates from a 1.5 V core supply with separate transceiver and I/O rails, and is specified over the commercial 0 to 85 C temperature range. A field-programmable gate array (FPGA) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined after manufacture by a configuration bitstream. Within the power-management and signal-processing hierarchy, the Stratix GX family sits at the high-performance tier above CPLDs: it combines programmable logic fabric, embedded multipliers, block memory, and hardened high-speed serial interface (HSSI) transceivers on a single die, allowing designers to implement complete digital subsystems including packet processing, baseband modulation, and SERDES-based backplanes without external PHY devices. Key features include 10570 logic elements, 920448 RAM bits, 12 transceiver channels supporting serial rates up to 3.125 Gbps, 4 phase-locked loops for clock management, embedded multipliers for DSP, and 362 user I/O pins. The DF672 package combines a 33 x 33 mm FC-FBGA body with a 1.0 mm ball pitch, easing PCB escape routing in multilayer boards. Architecturally, Stratix GX integrates dedicated SERDES physical coding sublayer (PCS) and physical media attachment (PMA) blocks alongside the TriMatrix memory, DSP blocks, and Logic Array Blocks (LABs). This heterogeneous fabric shortens critical paths for multi-gigabit serial links and reduces the latency that discrete PHY solutions would otherwise add to the design. Typical applications include multi-gigabit serial backplanes, SONET/SDH and Fibre Channel interfaces, custom SERDES-based protocol bridges, ASIC prototyping, and high-throughput data-acquisition front ends. Designers also use this device for prototype validation of next-generation ASICs before mask commitment, leveraging its high logic density and on-chip transceivers. When designing with the EP1SGX10DF672I6, allocate separate analog and digital supply planes for the transceiver and PLL blocks to meet jitter specifications, and follow the Quartus II power-estimation flow before board sign-off. The 672-ball FC-FBGA package requires a controlled-impedance stack-up and Xilinx/Altera-recommended decoupling to maintain signal integrity on the SERDES lanes. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Stratix GX family, and practical Quartus II design notes not found in the standalone datasheet, giving procurement and FPGA engineers a single reference for sourcing and substitution decisions.

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EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel
EP1SGX10DF672I6N

EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

The Intel (formerly Altera) EP1SGX10DF672I6N is a high-density Stratix GX Field Programmable Gate Array (FPGA) featuring 10,570 logic elements, 920,448 bits of embedded RAM, 10570 logic cells, and 362 user I/O pins, packaged in a 672-ball FineLine BGA (FBGA-672) measuring 33 x 33 mm with 1 mm pitch. Operating from a 1.5 V core supply (1.425 V to 1.575 V), the device combines a rich logic fabric with up to 20 embedded transceivers, supporting high-speed serial I/O for serial RapidIO, 10G Ethernet XSBI, and other gigabit serial protocols. An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing resources, all controlled by SRAM-based configuration bits. Within the broader taxonomy of digital integrated circuits, an FPGA sits above application-specific standard products (ASSPs) and below full-custom ASICs: it offers higher density and parallel processing than a microcontroller, while preserving the reprogrammability and time-to-market advantage over fixed-function ASICs. The Stratix GX family specifically targets high-speed serial interconnect, embedding multi-gigabit transceivers alongside the general-purpose fabric. Key features of the EP1SGX10DF672I6N include 1,200 CLBs distributed across the 10,570-logic-element array, 920 Kbits of total RAM, support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM, dedicated DSP blocks for high-throughput signal processing, and the integrated high-speed serial transceivers that distinguish the Stratix GX family from the base Stratix line. Configuration is typically loaded through the JTAG interface or via an external EPC configuration device. Architecturally, the device is built on a 0.13 µm CMOS process with 1.5 V core operation. The integrated transceivers operate at data rates up to 3.125 Gbps per channel, enabling protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XSBI. The combination of high logic density, abundant block RAM, and integrated serial I/O makes the EP1SGX10DF672I6N well suited to communication infrastructure and high-performance data-path applications. Typical applications include 10 Gigabit Ethernet switching fabric, serial RapidIO bridges for wireless baseband, custom PCI Express endpoints, high-speed serial protocol bridging, and ASIC prototyping where designers validate large designs before committing to mask-based silicon. The wide I/O count also suits it to data-acquisition front-ends that aggregate many parallel channels. When designing with this device, designers should consider the 1.5 V core supply decoupling network (multiple bulk and ceramic caps placed close to the package), the configuration scheme (JTAG vs EPC device), and the thermal envelope under sustained transceiver operation - the FBGA-672 package requires careful PCB layout for power and ground integrity. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the Altera Stratix GX Device Handbook (Volume 1).

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EP1SGX25-CF672-I6 - Stratix GX FPGA, 25K LEs, 672-FBGA | Altera
EP1SGX25-CF672-I6

EP1SGX25-CF672-I6 - Stratix GX FPGA, 25K LEs, 672-FBGA | Altera

The Altera EP1SGX25-CF672-I6 is a high-density Stratix GX field-programmable gate array (FPGA) delivering 25,660 logic elements, 1,944,576 RAM bits, and 2,566 LABs in a 672-ball fine-pitch BGA package. It is built on a 1.5 V CMOS process, integrates up to 20 multi-gigabit transceivers at 3.125 Gbps per channel, and provides 455 user I/O pins for high-bandwidth parallel interfaces. The device supports industrial-grade -40 °C to 100 °C junction temperature operation per the -I6 speed-grade designation. An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit consisting of an array of configurable logic blocks (LABs/CLBs), embedded memory, DSP blocks, phase-locked loops, and programmable interconnect that an engineer can configure after manufacture to implement arbitrary digital logic. FPGAs belong to the larger class of programmable logic devices (PLDs) and sit within the hierarchy of digital semiconductors: FPGA -> programmable logic -> logic IC -> integrated circuit. They are widely used as hardware prototyping platforms, ASIC replacements in low-to-mid volume production, and as glue logic in systems that require parallel high-speed signal processing. Key differentiating specifications include 25,660 logic elements for high gate density, 1,944,576 embedded RAM bits arranged in TriMatrix memory blocks, 14 DSP blocks for fixed- and floating-point arithmetic, and up to 20 embedded transceivers supporting SERDES protocols such as PCI Express, Serial RapidIO, FibreChannel, and Gigabit Ethernet. The device also integrates eight phase-locked loops (PLLs) for clock synthesis and skew management. The Stratix GX architecture combines a high-performance logic fabric with hard IP for serial interfaces, eliminating the soft-IP overhead that would otherwise consume logic resources. The 672-ball FBGA package exposes 455 user I/O and uses a 1.0 mm ball pitch, enabling high pin-count density while remaining compatible with standard PCB assembly processes. Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO, FibreChannel), telecommunications line cards and backplanes, military radar and signal processing subsystems, network equipment with deep packet inspection, and ASIC prototyping. The combination of multi-gigabit transceivers and abundant on-chip memory makes the EP1SGX25 well suited for protocols that require both wire-speed logic and packet buffering. When designing with this part, pay close attention to power estimation: the I6 speed grade trades maximum frequency for the industrial temperature window, so Quartus timing closure may require multi-corner sign-off. Decoupling requires a high-density, low-ESR network because simultaneous switching of hundreds of I/O can generate significant SSO noise on the supply rails. The part is now mature - production status should be re-validated against current distributor stock before committing to a new design. This page synthesizes distributor pricing, same-family pin-compatible drop-in alternatives, lifecycle observations, and design guidance not present in any single manufacturer datasheet.

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EP1SGX25CF672C5 - 25,660-LE Stratix GX FPGA, 672-FBGA | Altera (Intel)
EP1SGX25CF672C5

EP1SGX25CF672C5 - 25,660-LE Stratix GX FPGA, 672-FBGA | Altera (Intel)

The Altera (Intel) EP1SGX25CF672C5 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) housed in a 672-pin FineLine BGA (FCBGA) package measuring 27 mm x 27 mm. Built on a 1.5 V core, 0.13 µm CMOS process, the device integrates 25,660 logic elements, 1,944,576 bits of embedded RAM, and 455 user I/O pins, making it suitable for high-throughput serial-link and DSP-centric designs. The integrated transceiver fabric and embedded multiplier blocks position the part as a drop-in upgrade path for legacy Stratix GX prototypes and production builds. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (such as transceivers, block RAM, and DSP slices) on a single die. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design hierarchy, offering parallel processing, hardware-level determinism, and post-production flexibility. The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications, while the parent Stratix I family provides the logic fabric and DSP blocks. This places the EP1SGX25CF672C5 in the broader category of programmable logic devices (PLDs) within the semiconductor hierarchy. Key features of the EP1SGX25CF672C5 include 2,566 LABs (Logic Array Blocks), 12 transceiver channels capable of multi-gigabit serial operation, 14 embedded 18x18 multipliers, and four PLLs for clock synthesis and management. The 672-FBGA package exposes 455 user I/O and supports both 1.5 V and 1.8 V I/O standards, with LVDS, LVTTL, LVCMOS, SSTL, and HSTL support. The device also integrates 6 embedded TriMatrix memory blocks for high-bandwidth on-chip storage. The Stratix GX architecture combines a fine-grained logic fabric with embedded transceiver physical coding sublayers, enabling line-rate processing of protocols such as PCI Express, Serial RapidIO, Fibre Channel, and 10 Gbps Ethernet. The hard multiplier array accelerates DSP operations including FFTs, FIR filters, and baseband signal processing. The device is supported by the Altera Quartus II design suite, including SOPC Builder for system-level integration and SignalTap II for on-chip logic analysis. Typical applications include line-card interface bridges for telecom equipment, serial backplane aggregation in storage and switching systems, software-defined radio front-ends, and DSP co-processing in medical imaging and defense electronics. The high logic density also makes the device attractive for ASIC prototyping and hardware emulation. The combination of 25,660 logic elements and 12 multi-gigabit transceivers allows designers to implement both glue logic and physical-layer functions on a single die. When designing with the EP1SGX25CF672C5, ensure the 1.5 V core supply is decoupled with bulk ceramic and electrolytic capacitors per the Quartus II power distribution network guidelines. The 672-FBGA package requires a multi-layer PCB with microvia or via-in-pad technology; signal integrity analysis is recommended for all 12 serial links. The part operates over the commercial 0°C to +85°C temperature range and ships in tray packaging, which is standard for high-density FPGAs of this generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single, decision-ready reference for sourcing and integrating the EP1SGX25CF672C5.

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EP1SGX25CF672C6 - Stratix GX FPGA 25K LE, 672-BGA | Intel
EP1SGX25CF672C6

EP1SGX25CF672C6 - Stratix GX FPGA 25K LE, 672-BGA | Intel

The Intel / Altera EP1SGX25CF672C6 is a member of the Stratix GX FPGA family that combines high-speed serial transceivers with a scalable, high-performance logic array, delivering 25,660 logic elements and 4 to 20 high-speed transceiver channels with embedded SERDES capability at data rates up to 3.1875 Gbps, housed in a 672-pin FineLine BGA package with 1.0 mm pitch and 27 x 27 mm body. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the customer after manufacturing, making it suitable for hardware acceleration, rapid prototyping, and custom compute pipelines. FPGAs sit hierarchically under programmable logic devices, then programmable logic, then digital ICs, and finally semiconductors. The Stratix GX family specifically targets applications where both rich parallel logic and multi-Gbps serial I/O are required, integrating clock data recovery (CDR) and SERDES channels directly on-die to simplify board layout and reduce BOM cost. Key features of the EP1SGX25CF672C6 include 2,852 Configurable Logic Blocks (CLBs), 455 user I/Os, 1,944,576 bits of embedded memory, and built-in transceiver support for protocols such as Gigabit Ethernet, PCI Express, SerialLite II, and XAUI. The device is built on a 130 nm CMOS process, supports a core voltage of 1.5 V, and operates over the commercial 0 C to +85 C temperature range. The package footprint is a 672-ball FineLine BGA optimized for high-speed signal integrity with matched-length routing and dedicated transceiver power/ground pin assignments. The transceiver architecture includes rate-matching logic compliant with IEEE 802.3 clause 36 for Gigabit Ethernet, ordered-set handling (e.g. /K28.5/+/D16.2/), and per-channel programmable pre-emphasis and equalization. Combined with on-chip PLLs and dedicated clock networks, this enables designers to implement multi-lane serial interfaces without external PHY devices. Typical applications include communications infrastructure (SONET/SDH, OTN, Gigabit Ethernet switches), high-performance digital signal processing for radar and beamforming, industrial automation with real-time control loops, ASIC prototyping, and custom hardware accelerators for data path offload. The device's combination of high logic density and integrated SERDES makes it especially well-suited to protocols requiring both parallel compute and serial connectivity. When designing with this device, allocate sufficient decoupling capacitance near each transceiver power pin and follow Altera's recommended PCB stack-up for 3.125 Gbps operation. Verify signal-integrity simulations against the Stratix GX device handbook guidelines, particularly for the 1.0 mm pitch BGA escape routing. Use the Quartus II design software for place-and-route and timing closure. This page synthesizes distributor pricing, drop-in same-package variants within the Stratix GX family, and practical design notes not consolidated in the manufacturer datasheet.

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EP1SGX25CF672C6N - 25K LE Stratix GX FPGA 672-BGA | Intel / Altera
EP1SGX25CF672C6N

EP1SGX25CF672C6N - 25K LE Stratix GX FPGA 672-BGA | Intel / Altera

The Intel (formerly Altera) EP1SGX25CF672C6N is a high-density Stratix GX field-programmable gate array (FPGA) with 25,660 logic elements, 4,194,560 bits of embedded memory, and integrated 3.125 Gbps transceivers, packaged in a 672-ball FineLine BGA (FBGA-672). Built on a 130 nm CMOS process with a 1.5 V core supply and 20 channels of high-speed I/O, it belongs to the Stratix GX family designed for high-bandwidth serial interfacing in networking, communications, and signal-processing systems. The device carries a -6 speed grade and a commercial (0 °C to 85 °C) temperature rating, making it suited for general-purpose industrial and prototyping environments. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O resources are user-configurable after manufacture. In the broader IC taxonomy, an FPGA sits under programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Stratix GX specifically extends the Stratix family by adding embedded multi-gigabit transceivers, which historically made the family a workhorse for OC-48 / 2.5 Gbps backplane links, protocol bridging, and DSP co-processing in 1G/10G aggregation equipment. Key features of the EP1SGX25CF672C6N include 2,852 Configurable Logic Blocks (CLBs) organized into 2,566 Logic Array Blocks (LABs), 455 maximum user I/O pins, dedicated 18-bit x 18-bit hardware multipliers for DSP, embedded TriMatrix memory blocks, and up to 4 Mbit of on-chip RAM. The 672-pin FBGA package uses a 1.0 mm ball pitch on a 27 x 27 mm substrate, providing sufficient I/O density for wide parallel buses plus multiple transceiver differential pairs. Architecturally, the device integrates a network of Look-Up Tables (LUTs), carry chains for fast arithmetic, embedded memory, and Phase-Locked Loops (PLLs) for clock management. The 130 nm process and 1.5 V core balance cost against speed: faster than the older 0.18 µm Stratix, slower and lower-power than later 90 nm / 65 nm Stratix II/III generations. Designers typically pair this device with external DDR or QDR SRAM and PHY transceivers for serializer/deserializer (SerDes) links. Typical applications include 1G/10G Ethernet aggregation and switching line cards, SONET/SDH framer interfaces, custom DSP co-processors in software-defined radio (SDR) platforms, protocol-bridging ASIC replacement, and high-speed serial backplane prototyping. Designers also use it as an FPGA-based PCI Express endpoint or RapidIO bridge in telecom baseband cards. When designing with the EP1SGX25CF672C6N, pay attention to the 1.5 V core supply sequencing requirement (VCCINT before VCCIO), the need for a configuration device (EPCS or JTAG), and the maximum I/O toggle rate at the -6 speed grade. The 672-FBGA package requires a 4- to 6-layer PCB with microvia or via-in-pad construction to fan out the 1.0 mm ball pitch. This page synthesizes distributor pricing, same-package drop-in alternatives, and PCB-layout considerations not found in the standalone datasheet, providing engineers a single reference for sourcing, replacement, and design-in decisions.

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EP1SGX25CF672C7 - Stratix GX FPGA 25K LE | Altera 672-BGA
EP1SGX25CF672C7

EP1SGX25CF672C7 - Stratix GX FPGA 25K LE | Altera 672-BGA

The Altera (Intel FPGA) EP1SGX25CF672C7 is a member of the Stratix® GX family of FPGAs, built on a 130 nm CMOS process and offering 25,660 logic elements (cells) and 1,944,576 embedded memory bits in a 672-ball FC-FBGA package. The device integrates up to 455 user I/Os and high-speed embedded transceiver circuitry, making it a member of Intel FPGA's transceiver-equipped programmable logic families. Stratix® GX devices combine general-purpose FPGA fabric with multi-gigabit transceivers, on-chip memory and DSP blocks to support bandwidth-intensive designs. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic cells, interconnect, and I/O blocks can be configured by the end user after manufacture. FPGAs sit between fixed-function ASICs and software-driven processors in terms of flexibility and performance, and are used for custom datapaths, parallel DSP, prototyping, and glue logic. Stratix GX specifically targets high-speed serial I/O applications, complementing the fabric with embedded transceivers for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO and XAUI. Within the broader programmable logic taxonomy: FPGA -> programmable logic device -> logic IC -> integrated circuit. Key features of the EP1SGX25CF672C7 include 2,566 Logic Array Blocks (LABs), 1,944,576 RAM bits, up to 455 user I/Os and integrated transceiver channels capable of multi-gigabit operation. The device operates from a 1.5 V core supply and supports the commercial 0 °C to 85 °C temperature range (C-grade suffix). The 672-ball FineLine BGA package measures 33 × 33 mm with a 1.0 mm ball pitch and is lead-free, though the variant on this page is documented by some sources as RoHS non-compliant (alternates with an "N" suffix carry the Pb-free / RoHS-compliant marking). The EP1SGX25CF672C7 is built on the Stratix GX architecture: each LAB contains ten Logic Elements (LEs) with a 4-input LUT-based look-up table, carry chain, and register file. Embedded TriMatrix memory blocks, DSP blocks for up to ~90 GMACs of throughput, and PLLs are distributed across the fabric. Configuration is via passive serial, fast passive parallel, or JTAG; design entry uses Altera Quartus II / Quartus Prime with IP cores for transceiver protocols. The transceiver blocks support serial rates sufficient for 3.125 Gbps backplane and chip-to-chip links typical of the generation. Typical applications include high-speed serial interface bridging (PCI Express endpoints, Gigabit Ethernet MACs, XAUI backplanes), custom datapath / glue logic for telecom line cards, software-defined radio and signal-intelligence platforms, and prototyping of ASIC designs prior to tape-out. Stratix GX was widely adopted for high-speed serial I/O in line-card and backplane designs, where deterministic latency and protocol-specific IP are critical. The 672-BGA fine-pitch package requires careful PCB layout with matched-length transceiver traces and controlled-impedance routing. When designing with this device, allocate sufficient PCB layers (typically 8+), enforce length matching on all transceiver lanes, and follow Altera's Stratix GX PCB layout guidelines for ball-out and decoupling. Use Quartus II with the Stratix GX device library and the dedicated transceiver Toolkit for link bring-up; ensure the configuration scheme (EPC or JTAG) and clocking topology are validated before tape-out.

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EP1SGX25CF672C7N - 25K LE Stratix GX FPGA 672-FBGA | Altera
EP1SGX25CF672C7N

EP1SGX25CF672C7N - 25K LE Stratix GX FPGA 672-FBGA | Altera

The Altera (now Intel) EP1SGX25CF672C7N is a member of the Stratix GX family of high-performance FPGAs, integrating 25,660 logic elements with up to 20 channels of embedded multi-gigabit serial transceivers, each supporting data rates up to 3.1875 Gbps. Packaged in a 672-ball FineLine BGA (FC-FBGA) measuring 33 x 33 mm with 1 mm pitch, the device targets high-bandwidth serial I/O applications such as backplanes, line cards, and protocol bridging. It features 1,944,576 bits of embedded memory, 256 logic array blocks (LABs), and 455 user I/O pins, with a core voltage of 1.5 V and a commercial operating temperature grade of 0 to 85 C. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory interfaces, and DSP blocks. Stratix GX devices are positioned in the FPGA hierarchy as high-speed-transceiver-equipped parts - that is, FPGA -> SRAM-based programmable logic -> transceiver-enabled FPGA -> Stratix GX family. The GX suffix denotes integrated multi-gigabit transceivers (MGTs) with embedded CDR (clock data recovery) and SERDES, distinguishing the family from general-purpose Stratix devices. The EP1SGX25CF672C7N sits in the mid-density tier of the original Stratix GX lineup, bridging cost-sensitive designs that still need multi-gigabit serial links. Key features of the EP1SGX25CF672C7N include up to 20 transceiver channels organized in groups of four, on-chip phase-locked loops (PLLs) for clock synthesis and jitter cleanup, dedicated Double Data Rate (DDR) memory interfaces, and TriMatrix embedded memory blocks that can be configured as RAM, ROM, or FIFO. The transceiver blocks support multiple industry-standard protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet when paired with the appropriate soft logic and PHY IP. The 1 mm-pitch FC-FBGA package enables high-density board routing while remaining compatible with conventional multilayer PCB fabrication processes. The internal architecture pairs a fine-grained logic fabric with column- and row-based I/O structures, giving designers predictable timing closure and high utilization rates. Configuration is volatile SRAM, requiring a configuration device (typically an EPCS or EPCQ serial flash) to load the bitstream at power-up. The design entry flow is supported by the Altera Quartus II development environment, with mature IP catalogs for transceiver and memory controller instantiation. Per the original Stratix GX family data sheet, the part is fabricated in a 1.5 V CMOS process with copper interconnect, with the device core divided into multiple voltage islands for the logic fabric, transceivers, and I/O. Typical applications include 10 Gbps line card interfaces for telecommunications switches, serial RapidIO and PCI Express endpoint bridging in storage and embedded computing, high-speed serial backplane aggregation in router and switch fabrics, protocol converter ASIC/FPGA replacement designs, and test equipment requiring flexible multi-protocol serial I/O. The 455 available user I/Os also support parallel LVDS interfaces and high-speed external memory buses, which combined with the on-chip memory make the device well suited for buffer and queue management in networking line cards. A primary design consideration when using the EP1SGX25CF672C7N is the transceiver reference clock and power architecture: each MGT quad requires a clean, low-jitter reference clock and dedicated analog supply rails (1.5 V, 2.5 V) that must be heavily decoupled. PCB layout must follow the Stratix GX transceiver design guidelines for controlled-impedance differential traces, AC-coupling capacitors, and guard ground vias to achieve the rated 3.1875 Gbps bit-error-rate performance. Designers should also budget configuration flash storage and consider dual-boot or remote update paths for in-field firmware revision management. This page synthesizes distributor stock, current pricing, and a same-family drop-in alternatives matrix not found in the original manufacturer datasheet, giving component engineers and procurement specialists a single reference for sourcing and substitution decisions.

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