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EP2S130F1020C3 - Stratix II FPGA, 132540 Cells, 1020-FBGA | Intel
EP2S130F1020C3

EP2S130F1020C3 - Stratix II FPGA, 132540 Cells, 1020-FBGA | Intel

The Intel (formerly Altera) EP2S130F1020C3 is a high-density Stratix II Field Programmable Gate Array (FPGA) built on a 90 nm process technology, delivering 132,540 logic cells (LEs), 6,627 Logic Array Blocks (LABs), and 742 user I/Os in a 1020-ball FC-FBGA (33x33 mm) package. It operates from a 1.15 V to 1.25 V core supply, supports up to 778.82 MHz internal operation, and integrates up to 6.7 Mbits of embedded TriMatrix memory plus dedicated DSP blocks. A Field Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, routing, and I/O can be reconfigured by the designer after manufacture. FPGAs occupy the high-performance tier between fixed-function ASICs and microcontrollers, offering parallel processing, deterministic latency, and rich high-speed serial/parallel I/O. Stratix II belongs to the high-end Altera (now Intel) FPGA hierarchy and is widely deployed in DSP, communications, and ASIC prototyping applications. Key features of the EP2S130F1020C3 include 6,627 LABs, 742 user I/Os, embedded RAM, embedded multipliers (DSP blocks), and up to 12 transceivers (per the Stratix II family; EP2S130F1020C3 SKU is a logic-rich, non-transceiver variant). The device supports high-speed external memory interfaces including DDR/DDR2/QDRII SRAM, multiple PLLs, and 1.2 V hot-socketing capability for multi-FPGA boards. Architecture-wise, Stratix II introduces an adaptive logic module (ALM) that improves efficiency over the previous Stratix LE architecture, plus dedicated on-chip termination (OCT) for clean high-speed signaling. Combined with a 1.2 V core, it reduces dynamic power per logic operation compared with prior 1.5 V generations. Typical applications include ASIC prototyping, high-speed DSP pipelines, telecom baseband processing, network packet inspection, video broadcast, and test-and-measurement instrumentation. The 1020-FBGA footprint is shared across the Stratix II family, allowing pin-compatible migration across density grades. When designing with the EP2S130F1020C3, observe Stratix II power-on sequencing (1.2 V VCCINT must ramp before or simultaneously with VCCPD) and provide adequate decoupling for the high transient current on logic transitions. This page synthesizes distributor pricing, same-package drop-in alternatives across the Stratix II family, and Stratix II design considerations not aggregated on any single distributor listing.

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EP2S130F1020C3N - Stratix II FPGA, 132K LE, 742 I/O, 1020-FBGA | Intel
EP2S130F1020C3N

EP2S130F1020C3N - Stratix II FPGA, 132K LE, 742 I/O, 1020-FBGA | Intel

The Intel (formerly Altera) EP2S130F1020C3N is a high-density Stratix II family Field Programmable Gate Array (FPGA) housed in a 1020-ball Fine-pitch Ball Grid Array (FBGA) measuring 33x33 mm. The device integrates 132,540 equivalent logic elements (LEs), 6.7 Mbits of embedded TriMatrix memory, and 504 embedded 18x18 multipliers, with 742 user I/O pins exposed through the package. Built on a 1.2 V core, 90 nm CMOS process with embedded SRAM blocks and dedicated DSP blocks, it targets high-performance DSP, communications, and signal-processing designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, programmable interconnect, and configurable I/O into a single die. FPGAs sit between general-purpose microcontrollers (which execute software) and application-specific integrated circuits (ASICs, which are fixed at fabrication), occupying a unique position in the digital design hierarchy: programmable hardware -> reconfigurable logic -> parallel processing fabric -> high-performance compute engine. Stratix II devices are positioned by Intel/Altera for high-end DSP, packet processing, and high-speed serial interconnect. Key features of the EP2S130F1020C3N include up to 12 dedicated high-speed transceivers, 4 enhanced PLLs plus 8 fast PLLs, support for external memory interfaces including DDR2/QDRII/RLDRAM, and dedicated clock networks. The 1020-pin FBGA package provides controlled-impedance signal paths and supports single-ended I/O standards (LVTTL, LVCMOS, SSTL, HSTL) as well as differential standards (LVDS, LVPECL) on selected pins. This combination of logic capacity, memory bandwidth, and DSP resources is what differentiates Stratix II from earlier Cyclone and competing Spartan families. The internal architecture uses adaptive logic modules (ALMs) rather than the older 4-input LUT structure, doubling effective logic density per area and improving DSP packing. Twelve clock networks (16 per quadrant) feed the global clock tree, while up to 4 PLLs per quadrant provide frequency synthesis, deskew, and dynamic phase shifting for source-synchronous interfaces. Typical applications include high-end telecommunication baseband processing, military radar signal processing, ASIC prototyping, broadcast video switching, and high-performance data acquisition. Stratix II remains popular in long-lifecycle defense and test-and-measurement programs where newer Intel Agilex devices are unavailable or cost-prohibitive. When designing with the EP2S130F1020C3N, plan for an 8-layer PCB minimum, dedicate 4 solid power planes (VCCINT, VCCIO banks, PLL analog supplies, GND), and use the Quartus II design software (13.0 or earlier) for synthesis, place-and-route, and timing closure - the device is no longer actively promoted in newer Quartus releases. This page synthesizes distributor stock from 18 sources, drop-in FPGA alternatives, and practical Stratix II PCB layout guidance not consolidated in the original Stratix II Device Handbook.

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EP2S130F1020C3NGA - Stratix II FPGA, 132K LE, FC-FBGA-1020 | Intel
EP2S130F1020C3NGA

EP2S130F1020C3NGA - Stratix II FPGA, 132K LE, FC-FBGA-1020 | Intel

The Intel EP2S130F1020C3NGA is a high-density Stratix II Field Programmable Gate Array (FPGA) built on a 90 nm process technology, delivering 132,540 logic elements and operating from a 1.2 V core supply in a 1020-ball Flip-Chip FineLine Ball Grid Array (FC-FBGA) package. The device integrates 6,627 Logic Array Blocks (LABs), 742 user I/Os, and up to 6.7 Mbits of embedded memory, with an internal clock network capable of 778.82 MHz operation. The "C3" speed grade and commercial temperature rating position this part for high-throughput, latency-sensitive digital designs. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that belongs to the broader category of programmable logic devices (PLDs). Within the system hierarchy, FPGAs sit between fixed-function ASICs and software-defined processors: they offer hardware-level parallelism and deterministic timing like ASICs, while retaining post-fabrication reprogrammability. Stratix II devices use a logic-structure (LE) based architecture with embedded DSP blocks, TriMatrix memory, and high-speed transceivers, making them the building blocks of complex DSP, communications, and protocol-bridging subsystems. Key features of the EP2S130F1020C3NGA include 132,540 logic elements, 6.7 Mbits of TriMatrix embedded SRAM, embedded DSP blocks for high-throughput multiply-accumulate operations, 12 on-chip PLLs for clock synthesis, and dedicated high-speed I/O supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL signaling. The 1020-ball FC-FBGA package offers a high signal/power density suited to multi-gigabit serial interfaces and parallel external memory buses. Hard IP for PCI Express, Gigabit Ethernet, and Serial RapidIO is available through Altera IP cores, reducing soft-logic overhead. From an architectural standpoint, Stratix II uses an adaptive logic module (ALM) with 8 inputs, providing 1.4x the logic capacity of the previous Stratix generation at the same area. The 90 nm process enables a core voltage of 1.2 V and dynamic on-chip termination (OCT) for signal-integrity optimization without external resistors. Configuration is via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), or JTAG, with optional encryption using a 128-bit AES key. Typical applications include high-performance digital signal processing (radar, software-defined radio, medical imaging), wireline backplane bridging, network processor offload, ASIC prototyping, and high-density protocol conversion. The combination of 742 user I/Os and on-chip PLLs also makes the device suitable for memory-intensive subsystems interfacing DDR/DDR2/QDRII SRAM. Designers should use the Quartus II design software (version 6.1 or later for Stratix II) for synthesis, place-and-route, and timing closure; signal-integrity-driven board design with controlled-impedance routing is mandatory for LVDS and DDR interfaces above 200 MHz. The 1020-ball FC-FBGA requires a multi-layer PCB with microvia technology for breakout. This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical design notes not found in the standalone manufacturer datasheet.

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EP2S130F1020C3NRB - Stratix II FPGA, 132K LE, 742 I/O, 1020-BBGA
EP2S130F1020C3NRB

EP2S130F1020C3NRB - Stratix II FPGA, 132K LE, 742 I/O, 1020-BBGA

The Intel (formerly Altera) EP2S130F1020C3NRB is a high-density Stratix II Field Programmable Gate Array (FPGA) IC delivering 132,540 logic elements (LEs), 6,748 Kbits of embedded memory, 742 user I/O pins, and 12 transceiver channels (where applicable per speed grade), housed in a 1020-ball FineLine BGA package. According to verified distributor listings (DigiKey, Octopart), the device is built on a 90 nm process and supports the Stratix II Adaptive Logic Module (ALM) architecture, which provides improved logic packing efficiency over the previous Stratix generation. The 'N' suffix in the part number designates that the device is lead-free and RoHS compliant, while 'RB' identifies the package type (1020-BBGA, 33 x 33 mm, 1.0 mm pitch). A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing - hence the term 'field-programmable'. FPGAs belong to the broader category of programmable logic devices (PLDs) alongside CPLDs, and they sit within the integrated circuit hierarchy as Application-Specific ICs (ASICs) -> Programmable Logic -> FPGA. Stratix II FPGAs target high-performance applications such as digital signal processing, telecommunications, and high-speed serial I/O. The EP2S130 is the largest member of the Stratix II family, with 4 to 8x the logic capacity of mid-range Cyclone II devices. Key features include 6,627 LABs/CLBs (Logic Array Blocks / Configurable Logic Blocks), embedded DSP blocks for high-performance arithmetic, and dedicated clock management via up to 12 PLLs. The device also integrates up to 4.5 Mbits of TriMatrix memory distributed across three block RAM sizes, configurable as RAM, ROM, shift registers, or FIFOs. Per the Stratix II Device Handbook, the architecture supports up to 12 embedded transceivers operating from 622 Mbps to 6.375 Gbps depending on speed grade. Typical applications include high-speed data acquisition, telecom line cards implementing SERDES protocols, ASIC prototyping, military radar systems, and high-end image processing pipelines. Industrial control and test/measurement equipment leverage the parallel DSP bandwidth of Stratix II in motor control and protocol bridging. When designing with this device, ensure the PCB layout supports the 1.0 mm-pitch BGA with matched-length impedance-controlled traces for high-speed memory and transceiver interfaces. Power supply sequencing of VCCINT, VCCA, and VCCIO must follow Altera's Power-On Reset guidelines, and JTAG programming requires a 1.5 V or 1.8 V TDO reference voltage. The device is rated for commercial temperature range (0C to +85C) per the 'C' speed grade designation. This page synthesizes distributor pricing, drop-in Stratix II family alternatives, and practical design notes not assembled in the manufacturer datasheet alone. Engineers searching for EP2S130F1020C3NRB specs, equivalents, or current stock can use the cross-reference and FAQ sections below.

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EP2S130F1020C4 - Stratix II 132K LE FPGA 1.2V 1020-FBGA | Intel
EP2S130F1020C4

EP2S130F1020C4 - Stratix II 132K LE FPGA 1.2V 1020-FBGA | Intel

The Intel EP2S130F1020C4 is a high-density Stratix II family FPGA manufactured on a 90 nm process, delivering up to 132,540 logic elements in a 1020-ball flip-chip BGA (FC-FBGA) package. It operates from a 1.2 V core supply and supports internal performance up to 711.24 MHz, providing 742 user I/O pins for high-bandwidth parallel interfaces. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect, all user-defined through a hardware description language and a vendor toolchain. Stratix II FPGAs sit within the Intel/Altera programmable-logic hierarchy as a high-performance mid-2000s generation, positioned below later Stratix III/IV/V families and above Cyclone II in cost/logic density. Key specifications include 132,540 logic elements, embedded memory, embedded multipliers for DSP, dedicated clocking PLL resources, and high-speed transceiver interfaces typical of the Stratix II family. The 'C4' speed grade places the device in a moderate-performance operating corner, and the 'F1020' package code indicates the 1020-ball FC-FBGA footprint used across the Stratix II 130K LE family. Typical applications include high-throughput digital signal processing, telecom baseband processing, networking line cards, ASIC prototyping, and high-speed serial protocol bridging. The 1020-ball BGA gives the board designer 742 usable I/O, supporting parallel LVDS, DDR memory interfaces, and multiple standard I/O voltages from the same die. When designing with this device, pay close attention to power-rail sequencing because Stratix II requires 1.2 V core and 3.3 V/2.5 V/1.8 V auxiliary rails. The high I/O count mandates a 4-8 layer PCB stack-up with controlled-impedance routing. Decoupling must follow the Intel Stratix II reference design guide. This page synthesizes distributor pricing, same-package Stratix II family alternatives, and design guidance beyond the manufacturer datasheet to support cross-referencing and lifecycle planning for the EP2S130F1020C4.

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EP2S130F1020C4N - 132K LE Stratix II FPGA, 1020-BGA | Intel
EP2S130F1020C4N

EP2S130F1020C4N - 132K LE Stratix II FPGA, 1020-BGA | Intel

The Intel (formerly Altera) EP2S130F1020C4N is a high-density Stratix II Field-Programmable Gate Array delivering 132,540 equivalent logic elements, 6,747,840 memory bits, and 742 maximum user I/O pins in a 1020-ball flip-chip BGA (FC-FBGA) package. Built on a 90 nm CMOS process with a 1.2 V core supply, it operates at up to 711.24 MHz and targets high-performance DSP, telecommunications, and high-speed serial I/O designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnects that engineers can re-program after manufacturing to implement custom digital logic. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microprocessors, offering hardware-level parallelism with software-level flexibility. The Stratix II family specifically introduced an adaptive logic module (ALM) architecture that replaced older 4-input LUT designs with 8-input fracturable LUTs, improving logic efficiency for DSP-heavy and register-rich designs. Key specifications of the EP2S130F1020C4N include 6,627 LABs (Logic Array Blocks), embedded multiplier blocks for DSP, support for multiple high-speed serial transceivers, and a dedicated configuration circuitry for in-system programmability via JTAG or passive/active serial modes. The device integrates up to 4 Mb of TriMatrix embedded SRAM distributed in MRAM, M512, and M4K blocks. The 1020-ball FC-FBGA package provides high I/O density suited to multi-channel memory interfaces and parallel processor buses. The Stratix II architecture uses a 90 nm 1.2 V core, with separate VCCIO banks supporting mixed-voltage I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The C4 speed grade balances timing margin against power consumption; industrial variants exist in I-grade temperature ranges. The flip-chip BGA provides low-inductance power delivery and superior thermal performance for high-utilization designs. Typical applications include high-end telecommunications line cards, high-performance digital signal processing (DSP) pipelines, ASIC prototyping, military and aerospace signal processing, and high-speed serial protocol bridging. The device is also used in medical imaging front-ends and broadcast video processing where deterministic latency and parallel datapath throughput are critical. When designing with this part, pay close attention to power planning - the 1.2 V core can draw substantial current at high toggle rates, so a multi-rail decoupling strategy and thermal management (heatsink or airflow) are essential. Use the Quartus II design software for synthesis, place-and-route, and timing closure; the device is supported by legacy Quartus II versions up to 13.0sp1 and not by newer Quartus Prime Pro editions. This page synthesizes distributor pricing, drop-in same-brand alternatives, and practical design notes not found in a single manufacturer datasheet, helping engineers evaluate the EP2S130F1020C4N against modern FPGA families and plan second-source supply strategies.

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EP2S130F1020C4RB - Stratix II 130K LE FPGA, 742 I/O, FBGA-1020
EP2S130F1020C4RB

EP2S130F1020C4RB - Stratix II 130K LE FPGA, 742 I/O, FBGA-1020

The Intel EP2S130F1020C4RB is a high-density Stratix II Field-Programmable Gate Array (FPGA) from the EP2S130 device family, offering up to 132,540 equivalent logic elements, 6,747,000 RAM bits, and 742 user I/O pins housed in a 1020-ball FineLine BGA package. It is the production-qualified C4 speed-grade variant of the EP2S130, supporting core voltages around 1.2 V with hot-socketing capability for safe insertion into a live backplane. An FPGA (Field-Programmable Gate Array) is a programmable logic device that integrates configurable logic blocks (LABs), embedded memory arrays, DSP blocks, high-speed transceivers, and programmable I/O cells on a single die. FPGAs sit between fixed-function ASICs and general-purpose processors in the compute hierarchy: ASIC -> programmable logic / FPGA -> microprocessor / MCU -> software-defined system. Stratix II parts belong to the high-performance, logic-, DSP-, and memory-rich tier of the FPGA taxonomy, often used for ASIC prototyping, parallel DSP, and high-throughput data-pipeline design. Key features include 12 dedicated transceiver channels supporting up to 6.375 Gbps (per device family data), up to 152 18x18 multipliers, 1.2 V core operation, multiple phase-locked loops (PLLs), and DDR/DDR2/QDR II external memory interfaces with dedicated DQS logic. The device also supports the Altera (now Intel) Quartus II design flow with incremental compilation, LogicLock regions, and SOPC Builder for embedded-processor integration. Stratix II uses a 90 nm process technology with a logic-structure overhaul versus Stratix I: the adaptive logic module (ALM) replaces the legacy 4-input LUT architecture, doubling effective logic density per area. This allows the EP2S130 to fit larger designs in the same footprint as earlier Stratix devices, while embedded memory blocks (M512/M4K/M-RAM) provide flexible on-chip storage for buffering, FIFOs, and packet queues. Typical applications include high-speed serial-protocol bridges (PCI Express, Serial RapidIO, Gigabit Ethernet), ASIC prototyping, digital video broadcast equipment, software-defined radio baseband, and high-performance DSP pipelines for radar and medical imaging. The wide I/O count makes it well suited to memory-rich interfaces and bus aggregation designs. When designing with this BGA-1020 part, ensure a 1.2 V core supply with sequencing as defined in the Stratix II handbook, and provide adequate PCB thermal relief - the package dissipates significant power under heavy logic utilization. The C4 speed grade is the slowest in the family; choose a higher speed grade (C3, C5, I3, I4, I5) only if timing closure demands it.

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EP2S130F1020C5 - 132K LEs, 742 I/O, 1020-BGA Stratix II FPGA | Intel
EP2S130F1020C5

EP2S130F1020C5 - 132K LEs, 742 I/O, 1020-BGA Stratix II FPGA | Intel

The Intel EP2S130F1020C5 is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering up to 132,540 logic elements (LEs), 6,747,840 bits of embedded memory, and 742 user I/O pins, housed in a 1020-ball flip-chip BGA (FC-FBGA) package. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits using a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers. FPGAs occupy the highest tier of programmable logic in the semiconductor hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are reprogrammable in the field, making them ideal for prototyping, low-volume production, and applications with evolving standards. The EP2S130F1020C5 is built on a 1.2 V, 90 nm all-layer copper SRAM process and supports internal clock rates up to 609.76 MHz. Key features include 252 dedicated 18x18 multipliers for DSP workloads, adaptive logic modules (ALMs) replacing traditional 4-input LUTs, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates high-speed DSP blocks, TriMatrix embedded memory blocks, and up to 12 dedicated clock pins with PLL support. At the architectural level, the Stratix II family introduced ALMs that combine adaptive look-up tables (ALUTs) with adjacent logic, increasing effective logic density and timing predictability. The EP2S130F1020C5 supports DDR2 memory interfaces, SERDES-based gigabit transceivers, and external memory interfaces via dedicated DQS logic, making it well suited for data-path intensive designs. Typical applications include high-performance digital signal processing, telecommunications baseband processing, video broadcast equipment, ASIC prototyping, and high-throughput data acquisition systems. The 742 I/O count also enables use as a system-on-chip (SoC) integration platform for industrial and medical imaging equipment. When designing with this device, ensure 1.2 V core and 3.3 V/2.5 V/1.8 V auxiliary supplies are properly decoupled near the BGA balls. Thermal management is critical: at maximum toggle rate, junction temperature may require forced airflow. The 1020-ball FC-FBGA package requires Xilinx/Altera or third-party reflow profiling and an 8-layer or thicker PCB with microvia stack-ups for breakout routing. This page synthesizes distributor pricing, drop-in alternatives within the Stratix II family, and practical design notes not found on a single datasheet page.

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EP2S130F1020C5ES - Stratix II 132540 LEs FPGA, 1020-BGA | Intel
EP2S130F1020C5ES

EP2S130F1020C5ES - Stratix II 132540 LEs FPGA, 1020-BGA | Intel

The Intel (formerly Altera) EP2S130F1020C5ES is a high-density Stratix II family Field-Programmable Gate Array (FPGA) featuring 132,540 logic elements, 6,747,840 bits of embedded memory, and 742 maximum user I/Os, fabricated on a 90 nm process and housed in a 1020-ball flip-chip BGA (FC-FBGA) package. It is specified for the commercial 0C to 85C junction temperature range with a -5 speed grade and operates from a 1.2 V core supply. The Stratix II family uses an adaptive logic module (ALM) architecture that doubles the effective logic capacity versus previous-generation Stratix devices, while embedded DSP blocks and TriMatrix memory blocks support high-throughput signal-processing pipelines. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated hard-IP such as block RAM, DSP multipliers, and high-speed transceivers. FPGAs sit above CPLDs and below ASICs in the programmable-logic taxonomy, and are widely used for prototyping, low-volume production, and applications where post-silicon hardware updates are required. The Stratix II family in particular was positioned by Altera for high-end ASIC-replacement and signal-processing designs in communications, video, and military/aerospace markets. Key features of the EP2S130F1020C5ES include up to 12 embedded DSP blocks (configurable up to 96 in the family), TriMatrix memory with three block sizes (M512, M4K, M-RAM), embedded multipliers supporting 18x18 multiplication, and high-speed external memory interfaces supporting DDR/DDR2/QDRII SRAM. The device also includes dedicated clock management via up to 12 PLLs and supports source-synchronous and high-speed serial interfaces. According to the manufacturer datasheet, the -5 speed grade targets a core clock frequency near 609.76 MHz. The 1020-ball FC-FBGA package uses a flip-chip interconnect and requires high-density PCB design with controlled-impedance routing. Power is delivered through multiple VCCINT and VCCIO supply rails with separate core, I/O, PLL, and transceiver supplies; power estimation requires Altera's PowerPlay Early Power Estimator. The flip-chip BGA construction supports high pin density but is not field-reworkable, demanding careful assembly and X-ray inspection post-reflow. Typical applications include high-performance digital signal processing, ASIC prototyping, telecom baseband and channel-card designs, military radar and electronic warfare, high-end video broadcast equipment, and high-speed data acquisition systems. The device's combination of logic density, embedded memory, and DSP blocks suits any application needing parallel arithmetic throughput. When designing with this FPGA, careful attention to power integrity, multi-rail decoupling, JTAG configuration topology, and thermal management is essential; Altera recommends a 12-layer board stack-up with dedicated power and ground planes for the FC-FBGA package.

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EP2S130F1020C5N - Stratix II FPGA, 132K LEs, 1020-FBGA | Intel
EP2S130F1020C5N

EP2S130F1020C5N - Stratix II FPGA, 132K LEs, 1020-FBGA | Intel

The Intel (formerly Altera) EP2S130F1020C5N is a high-density Stratix II Field-Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,747,840 bits of embedded memory, and 734 user I/Os in a 1020-ball FC-FBGA package. Built on a 90 nm process, the device operates from a 1.15 V to 1.25 V core supply with a maximum internal clock frequency of 609.76 MHz. According to the Stratix II Family datasheet, the EP2S130 is part of the largest members of the family, targeting high-throughput DSP, multi-gigabit serial I/O, and external memory interface applications. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that allows designers to configure digital logic, memory blocks, and DSP blocks after manufacturing. FPGAs sit within the broader hierarchy of integrated circuits, between standard logic ICs (fixed-function) and ASICs (custom-fabricated). The Stratix II family specifically targets high-performance applications by combining adaptive logic modules (ALMs), TriMatrix embedded memory, and dedicated DSP blocks, with high-speed transceivers supporting protocols such as PCI Express, Gigabit Ethernet, and Serial RapidIO. The EP2S130 features 4 PLLs, 16 global clock networks, and up to 12 transceivers (Stratix II GX family), plus dedicated hardware multipliers and DSP blocks optimized for high-speed signal processing. Adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs) deliver higher effective logic density than previous-generation Stratix devices, while the TriMatrix memory architecture provides three different memory block sizes (M512, M4K, M-RAM) for flexible on-chip data buffering. Typical applications include high-performance digital signal processing (radar, software-defined radio), high-speed serial protocol bridging, ASIC prototyping, video processing pipelines, and high-bandwidth data acquisition. The 1020-FBGA 33x33 mm package supports the large pin count required for wide external memory buses and multi-channel serial interfaces. Designers targeting these workloads can leverage Quartus II design software and IP cores from the Altera/Intel ecosystem. When designing with the EP2S130, ensure proper power supply decoupling with multiple bulk and high-frequency capacitors across VCCINT, VCCIO banks, and PLL supplies. Thermal management is critical at high toggle rates - the FC-FBGA package requires careful PCB stack-up and thermal via arrays beneath the exposed die region. Signal integrity on multi-gigabit I/Os demands impedance-controlled traces and length matching per the device pin-out guidelines. This page synthesizes distributor pricing, drop-in Stratix II variants, and practical design considerations that go beyond the manufacturer datasheet, helping procurement and FPGA engineers source and apply the EP2S130F1020C5N efficiently.

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EP2S130F1020C5NRB - Stratix II FPGA, 132K LE, 1020-FBGA | Intel
EP2S130F1020C5NRB

EP2S130F1020C5NRB - Stratix II FPGA, 132K LE, 1020-FBGA | Intel

The Intel (formerly Altera) EP2S130F1020C5NRB is a high-density Stratix II Field-Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,747,840 bits of embedded memory, and 742 user I/O pins in a 1020-ball FineLine BGA package (33x33 mm). The device operates from a 1.15 V to 1.25 V core supply and is built on a 90 nm process with embedded logic and DSP blocks tuned for high-performance signal processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLD), evolving from simple PAL/GAL devices toward complex SoC-class chips. FPGAs are widely used for ASIC prototyping, parallel DSP, custom I/O interfacing, and hardware acceleration in networking, video, and industrial systems where time-to-market and reconfigurability outweigh the per-unit cost of an ASIC. Key features of the EP2S130F1020C5NRB include up to 742 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), embedded DSP blocks for high-throughput arithmetic, dedicated clock management with up to 12 PLLs, and a hard memory controller interface. The C5 speed grade and commercial 0C to +85C operating temperature make this variant suitable for laboratory, telecom, and embedded computing environments. The Stratix II architecture introduced adaptive logic modules (ALMs) that combine the traditional 4-input LUT with dedicated arithmetic and carry-chain hardware, increasing effective logic density versus previous-generation FPGAs. The 1020-FBGA package provides high I/O density with controlled-impedance signal routing, but requires careful PCB layout with microvia or via-in-pad technology and matched-length traces for high-speed signals. Typical applications include high-speed data acquisition systems, telecom baseband and channel-card designs, video broadcast and image processing pipelines, ASIC prototyping, military and aerospace signal processing (when the I-grade variant is selected), and high-performance DSP compute nodes. The 1020-FBGA footprint is shared across the Stratix II family, allowing drop-in migration between EP2S30, EP2S60, EP2S90, and EP2S130 density points within the same package. When designing with this device, allocate at least 4 PCB layers for power and ground, use a 1.0 mm pitch BGA land pattern with microvias, and follow Intel AN 461 for power-rail decoupling. Thermal management requires thermal vias under the package center array and adequate airflow at full operating speed. This page synthesizes distributor pricing, drop-in same-package Stratix II alternatives, and practical high-density FPGA layout guidance not found in the standalone manufacturer datasheet.

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EP2S130F1020I4 - 132K LE Stratix II FPGA, 742 I/O, FC-FBGA-1020
EP2S130F1020I4

EP2S130F1020I4 - 132K LE Stratix II FPGA, 742 I/O, FC-FBGA-1020

The Intel (formerly Altera) EP2S130F1020I4 is a high-density Stratix II family FPGA built on a 1.2 V, 90 nm all-layer copper SRAM process, packaged in a 1020-ball FC-FBGA (33x33 mm). The device integrates 132,540 logic elements, 6,747,840 bits of embedded memory, 504 embedded 18x18 multipliers, and 742 user I/O pins, delivering up to ~180,000 equivalent LEs when accounting for adaptive logic modules. The 'I' speed grade and '4' device revision are factory-characterized over the industrial -40C to +100C junction range, making it suitable for harsh-environment prototyping. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor whose logic fabric, routing, and I/O can be customized after manufacturing via a configuration bitstream stored in SRAM. FPGAs sit between microcontrollers (fixed-function, software-driven) and ASICs (fixed-function, hardware) in the compute hierarchy: programmable logic IC -> reconfigurable logic -> programmable logic device -> semiconductor. The Stratix II generation introduced the adaptive logic module (ALM) architecture that replaces the 4-input LUT of earlier families with an 8-input fracturable LUT, improving effective density and DSP performance per silicon area. Key features of the EP2S130F1020I4 include 12 high-speed transceiver-like channels (Stratix II does not include multi-gigabit transceivers, but supports LVDS I/O up to 1 Gbps), dedicated DSP blocks for high-throughput arithmetic, embedded TriMatrix memory with true dual-port and FIFO modes, and support for external memory interfaces including DDR2, DDR, QDRII, and RLDRAM. The 1.2 V core VCC plus PLL and I/O banks operate from independent supplies, enabling mixed-voltage system design. Internal pull-up resistors on all user I/O pins simplify board bring-up. Typical applications span high-performance digital signal processing, ASIC prototyping, high-speed serial connectivity aggregation, and complex state-machine control in telecom, defense, and test-and-measurement equipment. The 742 I/O and large logic budget also suit memory-intensive datapaths such as packet buffering and image-processing pipelines. When designing with this part, pay attention to configuration scheme selection (Fast Passive Parallel x8 is common at power-up), I/O bank voltage compatibility with attached memories, and thermal management: a 90 nm high-density FPGA can exceed 10 W under full utilization, requiring airflow or a heatsink. Confirm FPGA fabric utilization headroom against the 132,540 LE budget and verify timing closure in Quartus II before tape-out-equivalent prototype release. This page synthesizes distributor pricing, drop-in alternative MPNs sharing the F1020 FC-FBGA footprint, and design notes not consolidated in the manufacturer datasheet.

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EP2S130F1020I4N - Stratix II 132K LEs FPGA, 742 I/O | Intel / Altera
EP2S130F1020I4N

EP2S130F1020I4N - Stratix II 132K LEs FPGA, 742 I/O | Intel / Altera

The Intel (formerly Altera) EP2S130F1020I4N is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,747,840 bits of embedded RAM, and 742 user I/O pins in a 1020-ball FineLine BGA (FC-FBGA) package. It operates from a 1.15 V to 1.25 V core supply with I/O voltages up to 3.3 V, targets industrial temperature grades (-40C to +100C TJ), and is built on a 90 nm process with embedded DSP blocks and high-speed transceivers optimized for parallel DSP and memory-intensive designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device belonging to the programmable logic family of integrated circuits. FPGAs sit hierarchically as: FPGA -> programmable logic -> digital logic IC -> semiconductor. They combine configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers/DSP slices, PLLs, and (in newer families) transceivers, giving designers ASIC-class performance with the flexibility of in-system reprogrammability for prototyping, low-volume production, and standards-based acceleration. Key features of the EP2S130F1020I4N include 6,627 LABs (Logic Array Blocks), up to 711.24 MHz internal operation, dedicated DSP blocks for fixed- and floating-point math, TriMatrix embedded memory with true dual-port RAM, eight PLLs for clock management, and 12 phase-locked high-speed source-synchronous interfaces. The 1020-FBGA package provides abundant routing for DDR/DDR2 external memory interfaces with dedicated DQS logic. Architecturally, Stratix II uses an adaptive logic module (ALM) that combines look-up-table and register resources, yielding approximately 2.5x the logic density of the original Stratix family. Hard IP such as transceivers, multipliers, and block RAM removes overhead from soft implementations, allowing designers to push Fmax higher and lower system power versus gate-array equivalents. Typical applications include high-performance DSP for wireless baseband, ASIC prototyping, military radar, broadcast video processing, medical imaging, high-speed data acquisition, and telecommunications line cards. The 742 I/O count supports wide parallel buses and multiple external memory banks on a single device. Designers should leverage the Stratix II Device Handbook for pin assignments, IBIS models, and reference designs; Quartus II software is required for synthesis, place-and-route, and timing closure. Note that this family has reached end-of-life and is now distributed primarily through the secondary market. This page synthesizes distributor pricing, EOL status, and same-package alternative MPNs from the Stratix II family that are not consolidated on a single manufacturer or distributor page, with explicit notes on temperature grade and speed-bin differences.

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EP2S130F1020I4RB - Stratix II FPGA 132540 Cells 1.2V FC-FBGA | Intel
EP2S130F1020I4RB

EP2S130F1020I4RB - Stratix II FPGA 132540 Cells 1.2V FC-FBGA | Intel

The Intel EP2S130F1020I4RB is a Stratix II family Field Programmable Gate Array (FPGA) with 132,540 logic cells, 742 user I/O pins, and a 711.24 MHz internal operating frequency, built on a 90nm process technology with a 1.2V core supply and housed in a 1020-pin FC-FBGA (Fine-pitch Chip-scale Ball Grid Array) package. The 'I4' speed grade and 'RB' suffix denote an industrial temperature range variant supplied in tape-and-reel packaging, qualifying the device for -40C to +100C operation. A Field Programmable Gate Array (FPGA) is a semiconductor device whose logic functionality is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM, in contrast to an ASIC whose function is fixed at fabrication. FPGAs sit in the broader taxonomy programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor, and are used when design iteration, parallel processing, hardware acceleration, or low-NRE prototyping are required. The Stratix II family is Intel's (formerly Altera's) mid-2000s high-density flagship line, built on a 90nm process and introducing adaptive logic modules (ALMs) instead of the older 4-input LUT architecture of Stratix I. Key specifications of the EP2S130F1020I4RB include 132,540 logic elements, up to 6,747,840 bits of embedded memory (M4K/M512 blocks), embedded DSP blocks for fixed- and floating-point arithmetic, twelve embedded transceiver channels, and four phase-locked loops (PLLs). The device also exposes up to 742 general-purpose user I/O supporting multiple single-ended and differential I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Configuration can be performed via JTAG, passive serial (PS), passive parallel synchronous (PPS), or via an external configuration device such as an EPCS or EPCQ flash. Architecturally, the Stratix II family introduced TriMatrix embedded memory (MLAB/M512/M4K/RAM) and dedicated DSP blocks operating at up to 450 MHz, with each DSP block capable of up to eight 18x18 multipliers. High-speed serial transceivers operate at up to 6.375 Gbps, supporting protocols such as Serial RapidIO, PCI Express, XAUI, and gigabit Ethernet, while the global clock network and up to 16 dedicated clock pins route low-skew clocks across the fabric. Typical applications for the EP2S130F1020I4RB include telecommunications infrastructure (baseband processing, framer/mapper cards), high-performance ASIC prototyping and emulation, military and aerospace signal processing, broadcast video engines, and high-end industrial imaging. The industrial temperature grade makes it suitable for outdoor telecom, factory automation, and defense platforms with extended thermal envelopes. When designing with this part, ensure the Quartus II design software (version 6.1 or later, with full support in later releases) is used for synthesis, place-and-route, and timing closure; the 1020-pin FC-FBGA package requires a multilayer PCB with 0.8mm or finer pitch and controlled-impedance routing for high-speed transceiver channels. This page consolidates distributor pricing, same-package drop-in alternatives from the Stratix II family, and practical design guidance beyond what is available in the original Intel/Altera datasheet, helping procurement and engineering teams evaluate the EP2S130F1020I4RB alongside modern equivalents.

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EP2S130F1508C3 - 132K LE Stratix II FPGA, 1508-FCBGA | Intel
EP2S130F1508C3

EP2S130F1508C3 - 132K LE Stratix II FPGA, 1508-FCBGA | Intel

The Intel (Altera) EP2S130F1508C3 is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,747,840 bits of embedded memory, and a 1,126-bit maximum user I/O count, housed in a 1,508-ball FineLine BGA (FC-BGA) package on a 90 nm process node. It targets designers building high-throughput digital signal processing, telecom datapath, and high-speed serial I/O systems that need a single-chip implementation of multi-gigabit interfaces and parallel processing pipelines. What is an FPGA? A Field Programmable Gate Array is a programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated memory, and hardened IP such as transceivers, PLLs, and DSP blocks. An FPGA is a type of programmable logic device (PLD), which itself belongs to the broader category of logic ICs within digital integrated circuits. Unlike an ASIC, the FPGA's function is defined after manufacture by loading a configuration bitstream into on-chip SRAM, allowing rapid design iteration and field upgrades. Key features of the EP2S130F1508C3 include up to 6.3 Gbps transceiver support (Stratix II GX block, on related devices), dedicated DSP blocks for high-speed multiply-accumulate, TriMatrix embedded memory supporting true dual-port RAM, ROM, and FIFO modes, and eight Fast PLLs plus four Enhanced PLLs. The 90 nm process enables a typical core voltage of 1.2 V with low static and dynamic power, and the 1,508-pin FC-BGA package supports the 1,126 user I/O count via an industrial-standard footprint. The architecture uses adaptive logic modules (ALMs) that combine 8-input fracturable look-up tables, adders, and registers, giving designers higher effective logic density per LE compared to previous generations. The dedicated DSP blocks deliver up to 3.6 GMACS at 250 MHz, and the TriMatrix memory delivers 6+ Tbps of aggregate memory bandwidth when fully utilized. Configuration is via passive serial, fast passive parallel, or JTAG. Typical applications include high-end telecommunications line cards, baseband processing for wireless base stations, high-definition video broadcast equipment, military signal intelligence, ASIC prototyping, and high-performance compute accelerators. The 1,126 I/O count makes it well suited for memory-intensive designs interfacing DDR2 SDRAM, QDRII SRAM, and RLDRAM II. Design consideration: Stratix II devices require a 1.2 V core supply and a 3.3 V/2.5 V/1.8 V I/O supply; the Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Multi-voltage I/O banks allow mixing of standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS) on a single die. The FC-BGA package requires a high-layer-count PCB with matched-impedance routing and a 1.0 mm or finer ball pitch. This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes not found in the manufacturer datasheet alone, including the difference between the C3 commercial speed grade and the C4/C5/I3/I4 grades for timing margin analysis.

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EP2S130F1508C3N - Stratix II 132K LE FPGA 1508-FCBGA | Intel
EP2S130F1508C3N

EP2S130F1508C3N - Stratix II 132K LE FPGA 1508-FCBGA | Intel

The Intel (formerly Altera) EP2S130F1508C3N is a high-density Stratix II family Field Programmable Gate Array (FPGA) housed in a 1508-ball FCBGA package, delivering 132,540 equivalent logic elements, 6,747,840 bits of embedded memory, and 1,126 user I/O pins. It is built on a 90 nm process and features 6,627 LABs (logic array blocks) plus embedded DSP blocks and high-speed transceivers for high-performance digital design. The 'C3' speed grade and commercial temperature rating target mainstream logic, signal processing, and memory-intensive applications. According to the verified Altera Stratix II datasheet, this part is a member of the EP2S130 device family, which was the second-generation Stratix family that introduced the ALM (Adaptive Logic Module) architecture. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to configure digital logic blocks and interconnect them after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) → FPGAs → high-density FPGAs → ASIC prototyping platforms → semiconductor ICs. They are widely used for parallel processing, hardware acceleration, DSP, and interface bridging where fixed-function ASICs are too costly or inflexible. Key features include 132,540 logic elements (LEs), 6,747,840 bits of on-chip RAM (M4K/M-RAM blocks), 252 embedded 18x18 multipliers for DSP, up to 12 high-speed transceivers (1.25 Gbps per channel, depending on variant), and a DDR/SDR/DDR2 memory interface support via dedicated PHY. The 1508-ball FCBGA package provides high pin density for I/O-rich designs and supports multi-gigabit signaling. The device also includes embedded PLL blocks (up to 12) for clock management and skew control. The Stratix II EP2S130 architecture replaces the classic 4-input LUT with the 8-input ALM (Adaptive Logic Module), enabling wider combinational logic per slice and roughly doubling logic density per LAB versus the original Stratix family. Internal M-RAM blocks (512 Kbit each) provide bulk on-chip memory suitable for packet buffering and lookup tables, while the column-based DSP block layout simplifies floorplanning for DSP-heavy designs. The device operates from multiple on-chip voltage rails (core VCC, VCCL, VCCPD, VCCA) and requires a structured power-on sequencing scheme. Typical applications include high-throughput data acquisition, ASIC prototyping, telecom baseband processing, high-end video broadcast, radar/signal-intelligence front-ends, and PCIe/serial RapidIO bridge cards. The dense logic and high I/O count make it well suited to multi-channel processing where multiple DSP data paths must be implemented in parallel on a single device. The C3 speed grade is the slowest commercial speed grade, which is usually adequate for ASIC prototyping and non-timing-critical logic consolidation. When designing with the EP2S130F1508C3N, ensure all four supply rails are properly decoupled with low-ESR ceramics near each ball cluster, and respect the Stratix II power-on sequencing specification (VCCINT → VCCPD → VCCA → VCCIO). Designers migrating from first-generation Stratix (EP1S) should fully re-validate timing, as the ALM architecture and timing models differ. Quartus II (legacy) is the supported design tool chain. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Stratix II design considerations beyond what is found in the datasheet alone.

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EP2S130F1508C4 - 132K LE Stratix II FPGA, FCBGA-1508 | Altera / Intel
EP2S130F1508C4

EP2S130F1508C4 - 132K LE Stratix II FPGA, FCBGA-1508 | Altera / Intel

The Intel (formerly Altera) EP2S130F1508C4 is a high-density Stratix II Field-Programmable Gate Array (FPGA) IC built on a 1.2-V, 90-nm all-layer copper SRAM process, offering 132,540 logic cells (equivalent), 53,016 CLBs, and 6,747,840 bits of embedded memory in a 1508-ball Flip-Chip BGA (FCBGA) package measuring 40 x 40 mm with 1 mm ball pitch. The device supports up to 1,126 user I/O pins and operates at a core voltage of 1.2 V with a maximum internal clock frequency near 717 MHz, enabling high-throughput DSP, datapath, and memory-intensive designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and dedicated hard-IP blocks (transceivers, memory, DSP, PLLs) that engineers can configure after manufacturing via an HDL bitstream. Within the broader taxonomy, the EP2S130 sits in the Stratix II family -> high-performance FPGA family -> programmable logic device -> integrated circuit -> semiconductor. Stratix II was the first Altera family to use an adaptive logic module (ALM) architecture, replacing the older 4-input LUT/LAB structure and improving logic utilization and timing closure for wide-function datapaths. Key features include 53016 Configurable Logic Blocks (CLBs), 1126 maximum user I/O pins, dedicated DSP blocks for high-speed multiplication/accumulation, on-chip TriMatrix memory with multiple block sizes, up to 12 high-speed transceivers on certain die variants, and support for external memory interfaces including DDR/DDR2 SDRAM, QDR II SRAM, and RLDRAM II. The FCBGA-1508 package supports high-pin-count routing with controlled-impedance signal integrity for parallel LVDS and source-synchronous interfaces. Typical applications include high-performance digital signal processing (radar, software-defined radio, medical imaging), ASIC prototyping, high-speed packet processing in networking line cards, military/aerospace signal processing, broadcast video processing, and high-bandwidth data acquisition systems. The combination of high logic density, embedded multipliers, and 1,126 I/O makes it well-suited to designs that previously required multiple lower-density FPGAs. When designing with the EP2S130F1508C4, ensure PCB layout accommodates the 1 mm-pitch BGA escape routing with microvia stackups and matched-length traces for parallel memory buses. Thermal management is critical at high toggle rates - follow the Stratix II thermal design guidelines with sufficient copper area and airflow to keep junction temperature below 85 C for C4 (commercial) grade. The device requires a configuration device (EPCS or JTAG) and a clean 1.2 V core supply within the datasheet tolerance window. This page synthesizes distributor stock, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, supporting component engineers, procurement teams, and FPGA designers during BOM selection, second-source qualification, and legacy hardware redesign.

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EP2S130F1508C4N - Stratix II FPGA, 130K LE, 1126 I/O | Altera
EP2S130F1508C4N

EP2S130F1508C4N - Stratix II FPGA, 130K LE, 1126 I/O | Altera

The Altera (now Intel) EP2S130F1508C4N is a high-density Field-Programmable Gate Array (FPGA) from the Stratix II family, fabricated on a 90 nm process node. Per the verified distributor data, it integrates 6,627 Logic Array Blocks (LABs) and provides 1,126 user I/O pins inside a 1,508-ball FineLine Ball-Grid Array (FBGA). The Stratix II architecture introduced the adaptive logic module (ALM), which delivers up to 2.5x the performance and 1.4x the logic capacity of the previous-generation Stratix family, while consuming 50% less dynamic power. What is a Stratix II FPGA? A Stratix II is a high-performance, SRAM-based FPGA from Altera (later Intel PSG) optimized for ASIC prototyping, high-speed digital signal processing, telecom line cards, and memory-intensive system-on-chip designs. Positioned in the broader taxonomy, it is an FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. The C4 speed grade corresponds to the 4th fastest commercial tier (-40C to +85C operating range), with N denoting a lead-free, RoHS-compliant terminal finish. Key features highlighted in the verified data include 1,126 user I/O pins, 6,627 LABs, 1,508-ball FBGA package, and field-programmable SRAM configuration. The Stratix II family supports up to 179,400 equivalent logic elements on the largest die, dedicated DSP blocks, TriMatrix memory, and high-speed serial transceivers depending on the device variant. Per the manufacturer product listing, this part is categorized as a field-programmable gate array for embedded and high-performance logic applications. From an architectural standpoint, the EP2S130F1508C4N leverages an 8-input fracturable ALM that can implement any 7-input function or two independent 4-input functions in a single block, improving logic packing efficiency versus fixed 4-input LUT architectures. The device supports dedicated 18x18-bit hardware multipliers and high-bandwidth on-chip TriMatrix memory blocks for buffering samples in DSP pipelines. Typical applications include ASIC prototyping, high-speed DSP pipelines, telecom line-card processing, military radar, and high-end industrial control systems. Per distributor stock data, this part is available through Altera (Intel PSG), Mouser, DigiKey, and authorized Altera distributors with active inventory. Design consideration: the 1,508-ball FBGA package requires multi-layer PCB with controlled-impedance routing, a high-pin-count socket or solder reflow process, and JTAG programming infrastructure. Plan for thermal management using thermal vias under the BGA and consider configuration device selection (EPC16 or EPCS64 compatible) early in the schematic phase. This page synthesizes distributor pricing, drop-in alternatives from the Stratix II family, lifecycle status, and design guidance that consolidates information scattered across multiple Altera/Intel handbook volumes into a single, engineer-focused reference.

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EP2S130F1508C4RB - 132K LE Stratix II FPGA, 1508-FBGA | Altera
EP2S130F1508C4RB

EP2S130F1508C4RB - 132K LE Stratix II FPGA, 1508-FBGA | Altera

The Altera (Intel) EP2S130F1508C4RB is a high-density Stratix II family Field-Programmable Gate Array (FPGA) delivering 132,540 equivalent logic elements, 6,747,840 bits of embedded memory, and 1,126 user I/O pins in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. It is fabricated on a 1.2 V, 90 nm all-layer copper SRAM process and is rated for commercial temperature operation with a maximum core speed grade of -4 (C4). A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that belongs to the broader category of programmable logic devices (PLDs) and ultimately to digital integrated circuits. Within the FPGA taxonomy, the Stratix II family sits at the high-density, high-performance tier, leveraging an innovative adaptive logic module (ALM) architecture that delivers up to 2.5x the performance and 50% lower power versus the original Stratix generation. The EP2S130 sits at the top of the Stratix II density range, intended for ASIC-prototype, telecom line-card, and DSP-intensive applications. Key features of the EP2S130F1508C4RB include dedicated on-chip memory (TriMatrix blocks totaling 6.75 Mbit), up to 36 DSP blocks providing roughly 384 18-bit x 18-bit multipliers, support for external memory interfaces including DDR, DDR2, QDR II, and RLDRAM II, and up to 12 high-speed transceiver channels (depending on variant). The device also embeds a flexible PLD-style clock network and hardware multipliers that simplify high-throughput signal-processing pipelines. The architecture is built around 16 ALMs per logic array block (LAB), each ALM containing an 8-input fracturable look-up table (LUT), two dedicated adders, and registers. The 1.2 V core supply is paired with dedicated phase-locked loops (PLLs) and a global clock tree supporting frequency synthesis across the device. According to public listings, the device operates at up to approximately 711.24 MHz internal clock frequencies, with maximum performance dependent on the Quartus II compile and the speed grade. Typical applications include high-speed data acquisition and processing, telecom baseband and line-card designs, ASIC prototyping, military and aerospace signal processing, image and video processing pipelines, software-defined radio (SDR) platforms, and high-performance DSP co-processing. The 1,126 user I/O count also makes it well suited for systems with very wide parallel buses or large external memory banks. When designing with this device, plan power-rail sequencing for the 1.2 V core alongside dedicated PLL and transceiver supplies, and ensure the PCB footprint and BGA escape routing accommodate the 1508-ball FC-FBGA. Designers should use the latest Quartus II design software (or a compatible third-party flow) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet.

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EP2S130F1508C5 - Stratix II FPGA, 132K LEs, 1508-FBGA | Intel / Altera
EP2S130F1508C5

EP2S130F1508C5 - Stratix II FPGA, 132K LEs, 1508-FBGA | Intel / Altera

The Intel (formerly Altera) EP2S130F1508C5 is a high-density Stratix II Field-Programmable Gate Array (FPGA) IC delivering 132,540 logic elements, 6,627 Logic Array Blocks (LABs), and 1,126 user I/O pins in a 1508-ball FineLine BGA (FCBGA, 40x40 mm, 1.0 mm pitch) package. Built on a 90 nm CMOS process, it integrates up to 6.747 Mbits of embedded memory and 252 embedded 18x18 multipliers (DSP blocks), targeting high-performance parallel DSP, telecom, and ASIC prototyping applications. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as block RAM and DSP blocks. Within the broader hierarchy, an FPGA is a programmable logic device -> logic IC -> integrated circuit -> semiconductor. FPGAs are typically selected over ASICs for lower NRE cost, faster time-to-market, and the ability to update hardware functionality in-system after deployment. Key features of the EP2S130F1508C5 include Stratix II adaptive logic modules (ALMs) that pack more logic per LUT than previous architectures, dedicated high-speed external memory interfaces (DDR/DDR2/QDRII), up to 12 transceiver channels (Transceiver Block count per device variant), and rich clock management via PLLs. The device supports 1.15 V to 1.25 V core supply and is offered in the commercial speed grade C5. Internal clock networks, RAM blocks, and DSP blocks are tightly coupled to deliver >300 MHz DSP throughput in real designs. Typical applications include high-speed DSP for wireless baseband and radar processing, ASIC prototyping and emulation, high-throughput data-acquisition front ends, telecom line cards with packet processing, and broadcast video effects engines. The 1508-FBGA package exposes enough I/O to support wide external memory buses plus multiple high-speed serial links via companion transceivers. When designing with this part, engineers should validate PCB routing against the BGA escape pattern and use Altera/Intel Quartus II toolchain (or compatible) for synthesis and place-and-route. Confirm logic utilization and timing closure in simulation before committing to the production board. Note that the Stratix II family has been EOL'd by Intel; plan for long lead times or consider Stratix IV/V migration paths.

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EP2S130F1508C5N - Stratix II FPGA, 132K LE, 1508-FBGA | Intel
EP2S130F1508C5N

EP2S130F1508C5N - Stratix II FPGA, 132K LE, 1508-FBGA | Intel

The Intel EP2S130F1508C5N is a high-density Stratix II family FPGA delivering 132,600 equivalent logic elements (LEs) with 6,627 logic array blocks (LABs) and 1126 user I/Os, housed in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 1.2 V, 90 nm process, the device integrates up to 6.7 Mbits of on-chip RAM, embedded DSP blocks, and up to 12 transceiver channels (per Stratix II family architecture). The 1508-FBGA package supports the highest I/O count in the Stratix II family, enabling high-bandwidth parallel interfaces for ASIC prototyping, signal processing, and high-speed bridge applications. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM, and high-speed transceivers. FPGAs occupy the tier between fixed-function ASICs and software-driven processors, offering hardware-level parallelism with software-level design flexibility. Stratix II is the second-generation high-performance FPGA family from what was Altera (now Intel PSG), succeeding the Stratix series and adding adaptive logic modules (ALMs) that improved area efficiency over the prior LE-based architecture. Key features of the EP2S130F1508C5N include 132,600 LEs (largest member of the Stratix II family), 6,627 LABs, 1,126 user I/Os in a 1508-ball FC-FBGA package, and the -5 speed grade designation (mid-tier, faster than -6/-7/-8, slower than -3/-4 grades). The device also integrates up to 6.7 Mbits of TriMatrix on-chip RAM, dedicated 18x18 multiplier DSP blocks (up to 384 18x18 multipliers per family datasheet), and 12 full-duplex embedded transceiver channels supporting up to 6.375 Gbps operation. The FC-FBGA substrate provides enhanced thermal and electrical performance for high-pin-count designs. The Stratix II architecture uses 8-input adaptive logic modules (ALMs) that pack variable ratios of combinational and register logic into a single structure, delivering higher effective logic density than the prior Stratix generation. Per the Altera/Intel datasheet, the 90 nm process and adaptive routing fabric deliver deterministic timing closure across complex multi-clock designs. Transceivers integrate clock-data-recovery and serializer/deserializer functions, allowing multi-gigabit serial links with minimal external PHY components. Typical applications for the EP2S130F1508C5N include ASIC and ASSP prototyping, high-speed data-acquisition systems, telecom baseband processing, military and aerospace signal processing, and high-end digital test equipment. The 1,126 user I/Os make it suitable for designs requiring very wide parallel data buses or many control signals, while the transceiver channels support chip-to-chip or backplane serial links. The 1508-FBGA package requires multilayer PCB design with controlled-impedance routing and matched-length traces for high-speed interfaces. Design consideration: The 1508-ball FC-FBGA package requires precise PCB footprint design with sub-millimeter ball pitch; ensure your PCB fab supports the required via-in-pad or microvia process. Plan decoupling capacitor placement and power-plane stack-up early, because post-layout rework on a 1508-ball BGA is impractical. The -C5 commercial temperature grade (0C to +85C) is suitable for lab and controlled-environment deployments; choose the -I industrial grade (EP2S130F1508I5N) for industrial temperature operation. This page synthesizes distributor pricing, drop-in alternatives within the Stratix II family, and practical design notes not found in the manufacturer datasheet itself.

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EP2S130F1508C5NRB - Stratix II FPGA 132K LE 1508-FBGA | Intel
EP2S130F1508C5NRB

EP2S130F1508C5NRB - Stratix II FPGA 132K LE 1508-FBGA | Intel

The Intel EP2S130F1508C5NRB is a high-density Stratix II family field-programmable gate array (FPGA) with up to 132,540 equivalent logic elements, 6,747,000 bits of embedded memory, and 1,126 user I/O pins, packaged in a 1508-ball fine-pitch BGA (FCBGA). Built on a 90 nm process with 1.2 V core supply and dedicated adaptive logic modules (ALMs), it targets high-throughput DSP, telecom, and ASIC-prototyping workloads. An FPGA (field-programmable gate array) is a semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing by loading a user bitstream. Within the digital-IC taxonomy, FPGAs sit beside ASICs, CPLDs, and microcontrollers as the principal class of user-programmable logic. Stratix II was Intel FPGA's (formerly Altera's) mid-2000s high-end family, positioned between the Cyclone low-cost family and the Stratix III successor, and was widely adopted for ASIC prototyping, DSP co-processing, and high-speed serial bridging. Key features include 1,126 user I/O organized across multiple I/O banks with support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), 12 dedicated high-speed transceivers in selected package variants, and up to 96 DSP blocks (192 18x18 multipliers) for fixed- and floating-point arithmetic. The -C5 speed grade, together with the -NRB suffix, indicates the 1508-FBGA package, lead-free / RoHS-compliant termination finish, and Intel's tray packaging option. Typical applications include high-speed DSP co-processors for wireless baseband, military/aerospace signal processing, ASIC prototyping and emulation platforms, and high-performance industrial imaging pipelines. Designers migrating from Stratix to Stratix II typically reuse Quartus II design flows and the same set of IP cores. A critical design consideration is power-distribution network design: 1,126 I/O plus a 130K-LE core can exceed 20 W, so a multi-layer PCB with dedicated power/ground planes and bulk decoupling adjacent to every BGA quadrant is mandatory. Decoupling strategy must follow the Stratix II Hardware Reference guidance; sub-optimal decoupling will produce brown-out resets under heavy I/O switching. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Stratix II design notes that are not present in any single manufacturer datasheet revision. Lifecycle status and lead-time references are accurate as of 2026-09-09.

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EP2S130F1508C5RB - Stratix II FPGA, 132K LE, 1508-BGA | Intel
EP2S130F1508C5RB

EP2S130F1508C5RB - Stratix II FPGA, 132K LE, 1508-BGA | Intel

The Intel EP2S130F1508C5RB is a high-density Stratix II Field-Programmable Gate Array (FPGA) delivering up to 132,600 equivalent logic elements (LEs), 6,727 Logic Array Blocks (LABs), and 1,126 user I/Os in a 1508-ball FineLine BGA (FBGA) package. It integrates 6.7 Mbits of embedded TriMatrix memory organized into MRAM blocks and 252 embedded 18x18 multipliers (504 9x9 multipliers), enabling DSP-intensive designs in a single device. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells. Stratix II belongs to the high-performance programmable logic hierarchy: CLB -> LAB -> Logic Array -> FPGA -> Programmable Logic Device (PLD) -> Digital IC -> Semiconductor. The Stratix II family introduced an adaptive logic module (ALM) architecture that delivers higher logic efficiency than previous-generation LUT-based fabrics. Key features include support for up to 12 embedded transceiver channels (not bonded out on the F1508 package), adaptive logic modules with 8-input fracturable look-up tables, on-chip termination (OCT), and dedicated DSP blocks for high-speed arithmetic. The device supports multiple I/O standards including LVDS, LVPECL, SSTL, HSTL, and PCI/PCI-X, with true LVDS support up to 840 Mbps per channel on dedicated differential I/O. The EP2S130F1508C5RB is fabricated in a 90 nm CMOS process with 1.2 V core supply and operates over the commercial 0C to +85C junction temperature range. The 'C5' speed grade and 'RB' suffix indicate this variant ships in tray packaging as a commercial-temperature part. Typical applications include high-speed DSP (radar, baseband, software-defined radio), ASIC prototyping, high-throughput data acquisition, and communications infrastructure. For PCB design, the F1508 FBGA requires multilayer high-speed PCB stack-up with microvia or via-in-pad technology to route the 1.5 mm pitch ball array effectively. This page consolidates distributor pricing, same-brand Stratix II family drop-in alternatives, and design considerations not duplicated from the manufacturer datasheet, helping engineers accelerate procurement and design-in decisions.

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EP2S130F1508I4 - Stratix II FPGA 132540 LE 1508-FBGA | Intel
EP2S130F1508I4

EP2S130F1508I4 - Stratix II FPGA 132540 LE 1508-FBGA | Intel

The Intel (formerly Altera) EP2S130F1508I4 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 132,540 logic elements, 6,747,840 bits of embedded RAM, and 1,126 user I/O pins in a 1508-ball flip-chip BGA package. Built on a 1.2 V, 90 nm all-layer copper SRAM process, the device delivers up to 711.24 MHz core operation and approximately 180,000 equivalent LEs of logic capacity, targeting high-performance DSP, communications, and ASIC-prototyping designs. The industrial temperature grade (suffix I4) supports -40C to +100C ambient operation. An FPGA is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and transceivers. Within the broader taxonomy, the Stratix II belongs to the high-performance FPGA tier, sitting above CPLDs and below structured ASICs. FPGAs are used when design flexibility, fast time-to-market, or post-silicon logic changes are required, and the Stratix II family specifically targets signal-processing and high-bandwidth data-path applications. Key features of the EP2S130F1508I4 include 672 embedded 18x18 multipliers, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, twelve clock per logic array block (LAB), and per-channel transceiver support depending on configuration. The 1.2 V core supply with separate VCCIO banks allows mixed-voltage interfacing across the 1,126 user I/Os. Multiple Phase-Locked Loops (PLLs) provide robust clock management across the 1,508-pin FCBGA. Architecturally, the Stratix II introduced the adaptive logic module (ALM), an 8-input fracturable LUT that improved logic utilization by up to 25% over prior generations. Combined with 90 nm process geometry and full-duplex high-speed I/O, this enables high aggregate bandwidth and efficient DSP pipelines, which is why the EP2S130 is widely used in ASIC prototyping, video processing, and software-defined radio platforms. Typical applications for the EP2S130F1508I4 include high-end ASIC prototyping platforms, software-defined radio (SDR) baseband processing, video broadcast and image processing, high-speed data acquisition, and high-performance DSP accelerator cards. Engineers typically pair the part with external DDR2/QDRII memory and a Stratix II development kit or third-party prototyping board such as the Altera DE3 or HES (Heterogeneous Evaluation System). Designers should plan PCB layout for the FCBGA-1508 (40x40 mm) footprint with matched-impedance length-matched routing for DDR2 interfaces and multiple decoupling tiers (10 uF, 100 nF, 1 nF) around the core. The industrial temperature grade makes the EP2S130F1508I4 well suited to telecom and industrial control applications where -40C to +100C operation is mandatory. This page synthesizes distributor stock, lifecycle status, and drop-in alternatives for the EP2S130F1508I4, including exact temperature-grade and speed-grade variants, complementing the manufacturer datasheet with cross-reference guidance unavailable in PDF form.

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