10AS057K2F35I2LG - Arria 10 SX SoC FPGA 570K LE | Intel
부품 번호: 10AS057K2F35I2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1780 | $17,800.00 |
| 100 | $1695 | $169,500.00 |
| 500 | $1610 | $805,000.00 |
| 1,000 | $1545 | $1,545,000.00 |
10AS057K2F35I2LG 개요
A SoC FPGA (System-on-Chip FPGA) is a hybrid device that pairs a hard ARM Cortex-A processor subsystem with programmable FPGA fabric, M20K memory blocks, DSP blocks, and high-speed serial transceivers. In the broader system hierarchy, the 10AS057 sits within SoC FPGA -> FPGA & CPLD -> Programmable Logic -> Integrated Circuits. The hardened ARM subsystem offloads deterministic control-plane tasks while the FPGA fabric accelerates parallel DSP, packet processing, or video pipelines, delivering lower latency and lower BOM cost than a discrete CPU+FPGA solution.
Key features of the 10AS057K2F35I2LG include 570K logic elements, 1.5 GHz HPS core clock, dual-core ARM Cortex-A9 with NEON and single/double-precision FPU, integrated CoreSight trace macrocell, multiple high-speed transceiver channels, and support for DDR3/DDR4/LPDDR3 external memory. Industrial temperature grade (-40C to +100C ambient), -I2 speed grade, and lead-free FC-FBGA packaging make it suitable for harsh-environment deployments. Connectivity includes SPI, UART/USART, EBI/EMI, USB, Gigabit Ethernet, and PCIe.
Architecturally, the device combines the Arria 10 FPGA fabric with 28nm-equivalent hardened HPS, sharing on-chip interconnect, shared SDRAM controllers, and a coherent system interconnect. This enables tight CPU-to-FPGA data movement through the FPGA-to-HPS bridge (FPGA2HPS / HPS2FPGA / ACP) without external bus bottlenecks. The 20nm process provides power efficiency improvements over older 28 nm Arria V/VII parts while preserving mainstream transceiver counts.
Typical applications include wireless baseband processing, military radar and electronic warfare, broadcast video encoders, industrial machine vision, medical imaging, and high-performance embedded computing. The 1.5 GHz dual-core ARM is sufficient for Linux-class OS hosting, RTOS control, and protocol stack offload, while the 570K-LE fabric accelerates DSP and packet pipelines.
When designing with the 10AS057K2F35I2LG, plan power delivery for the 0.9V core rail using TI or Renesas multi-phase PMBus controllers, follow Intel's PCB layout guidelines for the 1152-BGA 1.0 mm pitch footprint, and use the Quartus Prime toolchain with the Arria 10 SoC device support for synthesis and SoC EDS for HPS firmware. The exposed-die FC-FBGA package requires thermal vias and a heatsink for typical industrial workloads.
This page synthesizes distributor stock data, same-family F35 drop-in alternatives, datasheet references, and design notes for the 10AS057K2F35I2LG that complement the manufacturer datasheet.
드롭인 대체품: 10AS057K2F35I2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS057K2F35I2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Mounting Type, Process Node, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS057K2F35I1HG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3820 / 개
데이터시트 보기 →10AS057K2F35E2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3450 / 개
데이터시트 보기 →10AS057K2F35E2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2304.55 / 개
데이터시트 보기 →10AS057K1F35I1HG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5210 / 개
데이터시트 보기 →10AS048K4F35I3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2620 / 개
데이터시트 보기 →10AS048K4F35E3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3975 / 개
데이터시트 보기 →10AS057K2F35I2LG 최대 정격 & 전기적 특성
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm TSMC |
| 패키지 | 1152-pin FC-FBGA (F35), 35 x 35 mm |
| Package Code | F35 / 1152-BGA |
| Ball Pitch | 1.0 mm |
| Temperature Grade | Industrial (-40C to +100C ambient) |
| Speed Grade | -I2 |
| Supply Voltage (Core) | 0.9 V |
| Connectivity | SPI, UART/USART, EBI/EMI, USB, GbE, PCIe |
| Memory Interface | DDR3, DDR4, LPDDR3 (via HPS/FPGA controllers) |
| 실장 유형 | Surface Mount (FC-FBGA) |
| RoHS 상태 | Compliant |
10AS057K2F35I2LG f35 / 1152-bga 핀 구성 가이드
10AS057K2F35I2LG(f35 / 1152-bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS057K2F35I2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS057K2F35I2LG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Military Radar and Electronic Warfare, Broadcast Video Encoding and Processing, Industrial Machine Vision, Medical Imaging Equipment, High-Performance Embedded Computing (HPEC).
Wireless Baseband Processing
The 10AS057K2F35I2LG's 570K logic elements and integrated dual ARM Cortex-A9 HPS make it well-suited for 4G/5G small-cell baseband processing. Its 20nm process delivers the DSP throughput required for LTE PHY-layer acceleration while the 1.5 GHz HPS runs the MAC scheduler and OAM stack. The industrial temperature grade supports outdoor small-cell deployments. Multiple high-speed transceiver channels interface directly to RF front-end converters via JESD204B/C, replacing discrete FPGA+CPU designs with a single SoC.
추천
Military Radar and Electronic Warfare
Arria 10 SX devices are QML-class candidates in defense applications, and the 10AS057K2F35I2LG's combination of 570K LEs and industrial temperature grade supports phased-array radar beamforming and EW receiver processing. The HPS handles threat-library lookups and operator interfaces, while the FPGA fabric runs pulse-Doppler FFTs and direction-finding algorithms. Its transceiver density supports multi-channel digital receiver arrays without external ADC/FGPA bridges.
추천
Broadcast Video Encoding and Processing
The 570K logic elements plus hard ARM Cortex-A9 HPS enable real-time HEVC/H.265 broadcast encoder designs at 4K60 resolution. The FPGA fabric accelerates motion estimation, deblocking, and SAO filters, while the HPS manages IP transport streams (SRT, RTMP, MPEG-TS) and HTTP server interfaces. The 1152-BGA F35 package's high pin count supports multiple 12G-SDI input/output channels and HDMI 2.0 bridging.
추천
Industrial Machine Vision
The 10AS057K2F35I2LG's Coherent Accelerator Processor (ACP) bridge allows low-latency FPGA-to-CPU image sharing for line-scan and area-scan machine vision. The dual-core ARM runs the vision pipeline orchestrator and GigE Vision / Camera Link host stack, while the FPGA fabric implements Bayer demosaic, lens correction, and CNN-based defect classification. Industrial -40C to +100C operation supports factory-floor deployment without climate control.
추천
Medical Imaging Equipment
Mid-range SoC FPGAs like the 10AS057K2F35I2LG power ultrasound beamformers, CT image reconstruction, and endoscopy video processors. The dual-core ARM Cortex-A9 at 1.5 GHz runs the patient-interface touchscreen and DICOM network stack, while the FPGA fabric performs 2D/3D image reconstruction in real time. The industrial temperature range suits portable bedside ultrasound carts, and the 0.9V core rail simplifies IEC 60601-1 patient-leakage isolation design.
추천
High-Performance Embedded Computing (HPEC)
Defense and aerospace HPEC systems use Arria 10 SX SoCs to combine sensor I/O, signal processing, and command/control on a single board. The 10AS057K2F35I2LG runs a VPX/OpenVPX SBC profile with 570K LEs for FFT, crypto, and protocol bridge functions, plus the ARM HPS running Linux for situational-awareness GUIs. Its transceiver-rich I/O supports 10 Gigabit Ethernet, Serial RapidIO, and Aurora backplane fabrics.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS057K2F35I2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS057K2F35I1HG | 10AS057K2F35E2LG | 10AS057K2F35E2SG | 10AS057K1F35I1HG | 10AS048K4F35I3LG | 10AS048K4F35E3LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FC-FBGA (F35) 35x35 mm | 1152-FC-FBGA (F35) 35x35 mm - same | 1152-FC-FBGA (F35) 35x35 mm - same | 1152-FC-FBGA (F35) 35x35 mm - same | 1152-FC-FBGA (F35) 35x35 mm - same | 1152-FC-FBGA (F35) 35x35 mm - same | 1152-FC-FBGA (F35) 35x35 mm - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 | 480,000 (-15.8%) | 480,000 (-15.8%) |
| Speed Grade | -I2 (Industrial) | -I1 (Industrial, faster) | -E2 (Extended, faster) | -E2 (Extended, faster) | -I1 (Industrial, faster) | -I3 (Industrial, slower) | -E3 (Extended, fastest) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Extended (0C to +100C) | Extended (0C to +100C) | Industrial | Industrial | Extended |
| HPS Core Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Transceiver Tier | K2 (mid transceiver count) | K2 | K2 | K2 | K1 (-15% transceivers) | K4 (highest tier) | K4 (highest tier) |
| Ball Finish | LG (Pb-free) | HG (Pb-free halogen-free) | LG (Pb-free) | SG (Pb-free) | HG (Pb-free halogen-free) | LG (Pb-free) | LG (Pb-free) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Approx. Unit Price (qty 1) | $1,850 | $1,920 (+3.8%) | $1,830 (-1.1%) | $1,830 (-1.1%) | $1,720 (-7.0%) | $1,520 (-17.8%) | $1,560 (-15.7%) |
주요 차별점
- Faster industrial speed grade (-I1) available in same footprint (vs 10AS057K2F35I1HG)
- Lower-cost reduced-logic alternative in same footprint (vs 10AS048K4F35I3LG)
- Reduced-transceiver variant for cost-sensitive designs (vs 10AS057K1F35I1HG)
설계 노트
Estimated: Arria 10 SX devices in the 10AS057 density typically draw 8-15 W from the 0.9V core rail depending on utilization and clock rates. Use a 4-phase PWM controller such as the Renesas ISL6388 or TI TPS53681 with PMBus to power the VCC core. Sequence VCC (0.9V), VCC_HPS (0.9V), and VCC_IO per Intel power-up guidelines to avoid back-powering through I/O cells.
The 1152-FC-FBGA F35 package has a typical theta_JA of approximately 8 C/W with a properly designed heatsink. Estimate: at 12 W total dissipation, junction-to-ambient rise is roughly 96 C above ambient with a passive heatsink, requiring careful thermal management at industrial 85 C ambient. Use a thermal interface material (TIM) with conductivity >3 W/m-K and follow Intel's FCBGA thermal layout reference for via patterns under the die.
The 1.0 mm ball pitch and 35 x 35 mm BGA footprint require an 8-layer PCB minimum with stacked microvias (laser-drilled) and 1-oz copper inner layers. Matched-length impedance control (100 ohm differential for transceivers, 50 ohm single-ended for GPIO) is mandatory. Use Intel's Arria 10 pin connection guidelines to identify which pins require pull-ups, no-connects, or specific decoupling schemes for configuration.
Do not confuse the 'K2' transceiver tier code with the 'F35' package code when sourcing - K2 refers to mid-density transceiver count, F35 to the package outline. Also ensure the HPS boot source (MSEL pins) matches your firmware boot image - QSPI vs SD vs NAND are selected at MSEL reset, not in software. Using non-industrial-grade Arria 10 parts in outdoor deployments is a frequent qualification failure.
규정 준수 정보
RoHS compliant per Intel/Altera product page; LG ball finish indicates Pb-free. Halogen-free status not specified in verified web data for this exact variant (the 'HG' suffix variants like 10AS057K2F35I1HG explicitly claim halogen-free). AEC-Q100 not applicable - this is an industrial FPGA/SoC, not an automotive-qualified part.
