10AS057K2F35I2LG - Arria 10 SX SoC FPGA 570K LE | Intel
料号： 10AS057K2F35I2LG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1780 | $17,800.00 |
| 100 | $1695 | $169,500.00 |
| 500 | $1610 | $805,000.00 |
| 1,000 | $1545 | $1,545,000.00 |
10AS057K2F35I2LG 概述
A SoC FPGA (System-on-Chip FPGA) is a hybrid device that pairs a hard ARM Cortex-A processor subsystem with programmable FPGA fabric, M20K memory blocks, DSP blocks, and high-speed serial transceivers. In the broader system hierarchy, the 10AS057 sits within SoC FPGA -> FPGA & CPLD -> Programmable Logic -> Integrated Circuits. The hardened ARM subsystem offloads deterministic control-plane tasks while the FPGA fabric accelerates parallel DSP, packet processing, or video pipelines, delivering lower latency and lower BOM cost than a discrete CPU+FPGA solution.
Key features of the 10AS057K2F35I2LG include 570K logic elements, 1.5 GHz HPS core clock, dual-core ARM Cortex-A9 with NEON and single/double-precision FPU, integrated CoreSight trace macrocell, multiple high-speed transceiver channels, and support for DDR3/DDR4/LPDDR3 external memory. Industrial temperature grade (-40C to +100C ambient), -I2 speed grade, and lead-free FC-FBGA packaging make it suitable for harsh-environment deployments. Connectivity includes SPI, UART/USART, EBI/EMI, USB, Gigabit Ethernet, and PCIe.
Architecturally, the device combines the Arria 10 FPGA fabric with 28nm-equivalent hardened HPS, sharing on-chip interconnect, shared SDRAM controllers, and a coherent system interconnect. This enables tight CPU-to-FPGA data movement through the FPGA-to-HPS bridge (FPGA2HPS / HPS2FPGA / ACP) without external bus bottlenecks. The 20nm process provides power efficiency improvements over older 28 nm Arria V/VII parts while preserving mainstream transceiver counts.
Typical applications include wireless baseband processing, military radar and electronic warfare, broadcast video encoders, industrial machine vision, medical imaging, and high-performance embedded computing. The 1.5 GHz dual-core ARM is sufficient for Linux-class OS hosting, RTOS control, and protocol stack offload, while the 570K-LE fabric accelerates DSP and packet pipelines.
When designing with the 10AS057K2F35I2LG, plan power delivery for the 0.9V core rail using TI or Renesas multi-phase PMBus controllers, follow Intel's PCB layout guidelines for the 1152-BGA 1.0 mm pitch footprint, and use the Quartus Prime toolchain with the Arria 10 SoC device support for synthesis and SoC EDS for HPS firmware. The exposed-die FC-FBGA package requires thermal vias and a heatsink for typical industrial workloads.
This page synthesizes distributor stock data, same-family F35 drop-in alternatives, datasheet references, and design notes for the 10AS057K2F35I2LG that complement the manufacturer datasheet.
直接替换替代料： 10AS057K2F35I2LG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AS057K2F35I2LG （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Mounting Type, Process Node, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
10AS057K2F35I1HG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3820 / 个
查看数据手册 →10AS057K2F35E2LG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3450 / 个
查看数据手册 →10AS057K2F35E2SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2304.55 / 个
查看数据手册 →10AS057K1F35I1HG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5210 / 个
查看数据手册 →10AS048K4F35I3LG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2620 / 个
查看数据手册 →10AS048K4F35E3LG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3975 / 个
查看数据手册 →10AS057K2F35I2LG 最大额定值与电气特性
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm TSMC |
| 封装 | 1152-pin FC-FBGA (F35), 35 x 35 mm |
| Package Code | F35 / 1152-BGA |
| Ball Pitch | 1.0 mm |
| Temperature Grade | Industrial (-40C to +100C ambient) |
| Speed Grade | -I2 |
| Supply Voltage (Core) | 0.9 V |
| Connectivity | SPI, UART/USART, EBI/EMI, USB, GbE, PCIe |
| Memory Interface | DDR3, DDR4, LPDDR3 (via HPS/FPGA controllers) |
| 安装类型 | Surface Mount (FC-FBGA) |
| RoHS 状态 | Compliant |
10AS057K2F35I2LG f35 / 1152-bga 引脚配置指南
10AS057K2F35I2LG（f35 / 1152-bga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AS057K2F35I2LG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AS057K2F35I2LG 适用于 6 应用s: Wireless Baseband Processing, Military Radar and Electronic Warfare, Broadcast Video Encoding and Processing, Industrial Machine Vision, Medical Imaging Equipment, High-Performance Embedded Computing (HPEC).
Wireless Baseband Processing
The 10AS057K2F35I2LG's 570K logic elements and integrated dual ARM Cortex-A9 HPS make it well-suited for 4G/5G small-cell baseband processing. Its 20nm process delivers the DSP throughput required for LTE PHY-layer acceleration while the 1.5 GHz HPS runs the MAC scheduler and OAM stack. The industrial temperature grade supports outdoor small-cell deployments. Multiple high-speed transceiver channels interface directly to RF front-end converters via JESD204B/C, replacing discrete FPGA+CPU designs with a single SoC.
推荐
Military Radar and Electronic Warfare
Arria 10 SX devices are QML-class candidates in defense applications, and the 10AS057K2F35I2LG's combination of 570K LEs and industrial temperature grade supports phased-array radar beamforming and EW receiver processing. The HPS handles threat-library lookups and operator interfaces, while the FPGA fabric runs pulse-Doppler FFTs and direction-finding algorithms. Its transceiver density supports multi-channel digital receiver arrays without external ADC/FGPA bridges.
推荐
Broadcast Video Encoding and Processing
The 570K logic elements plus hard ARM Cortex-A9 HPS enable real-time HEVC/H.265 broadcast encoder designs at 4K60 resolution. The FPGA fabric accelerates motion estimation, deblocking, and SAO filters, while the HPS manages IP transport streams (SRT, RTMP, MPEG-TS) and HTTP server interfaces. The 1152-BGA F35 package's high pin count supports multiple 12G-SDI input/output channels and HDMI 2.0 bridging.
推荐
Industrial Machine Vision
The 10AS057K2F35I2LG's Coherent Accelerator Processor (ACP) bridge allows low-latency FPGA-to-CPU image sharing for line-scan and area-scan machine vision. The dual-core ARM runs the vision pipeline orchestrator and GigE Vision / Camera Link host stack, while the FPGA fabric implements Bayer demosaic, lens correction, and CNN-based defect classification. Industrial -40C to +100C operation supports factory-floor deployment without climate control.
推荐
Medical Imaging Equipment
Mid-range SoC FPGAs like the 10AS057K2F35I2LG power ultrasound beamformers, CT image reconstruction, and endoscopy video processors. The dual-core ARM Cortex-A9 at 1.5 GHz runs the patient-interface touchscreen and DICOM network stack, while the FPGA fabric performs 2D/3D image reconstruction in real time. The industrial temperature range suits portable bedside ultrasound carts, and the 0.9V core rail simplifies IEC 60601-1 patient-leakage isolation design.
推荐
High-Performance Embedded Computing (HPEC)
Defense and aerospace HPEC systems use Arria 10 SX SoCs to combine sensor I/O, signal processing, and command/control on a single board. The 10AS057K2F35I2LG runs a VPX/OpenVPX SBC profile with 570K LEs for FFT, crypto, and protocol bridge functions, plus the ARM HPS running Linux for situational-awareness GUIs. Its transceiver-rich I/O supports 10 Gigabit Ethernet, Serial RapidIO, and Aurora backplane fabrics.
推荐
推荐产品汇总
工程参考数据： 10AS057K2F35I2LG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AS057K2F35I1HG | 10AS057K2F35E2LG | 10AS057K2F35E2SG | 10AS057K1F35I1HG | 10AS048K4F35I3LG | 10AS048K4F35E3LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FC-FBGA (F35) 35x35 mm | 1152-FC-FBGA (F35) 35x35 mm - same | 1152-FC-FBGA (F35) 35x35 mm - same | 1152-FC-FBGA (F35) 35x35 mm - same | 1152-FC-FBGA (F35) 35x35 mm - same | 1152-FC-FBGA (F35) 35x35 mm - same | 1152-FC-FBGA (F35) 35x35 mm - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 | 480,000 (-15.8%) | 480,000 (-15.8%) |
| Speed Grade | -I2 (Industrial) | -I1 (Industrial, faster) | -E2 (Extended, faster) | -E2 (Extended, faster) | -I1 (Industrial, faster) | -I3 (Industrial, slower) | -E3 (Extended, fastest) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Extended (0C to +100C) | Extended (0C to +100C) | Industrial | Industrial | Extended |
| HPS Core Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Transceiver Tier | K2 (mid transceiver count) | K2 | K2 | K2 | K1 (-15% transceivers) | K4 (highest tier) | K4 (highest tier) |
| Ball Finish | LG (Pb-free) | HG (Pb-free halogen-free) | LG (Pb-free) | SG (Pb-free) | HG (Pb-free halogen-free) | LG (Pb-free) | LG (Pb-free) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Approx. Unit Price (qty 1) | $1,850 | $1,920 (+3.8%) | $1,830 (-1.1%) | $1,830 (-1.1%) | $1,720 (-7.0%) | $1,520 (-17.8%) | $1,560 (-15.7%) |
关键差异点
- Faster industrial speed grade (-I1) available in same footprint （对比 10AS057K2F35I1HG)
- Lower-cost reduced-logic alternative in same footprint （对比 10AS048K4F35I3LG)
- Reduced-transceiver variant for cost-sensitive designs （对比 10AS057K1F35I1HG)
设计说明
Estimated: Arria 10 SX devices in the 10AS057 density typically draw 8-15 W from the 0.9V core rail depending on utilization and clock rates. Use a 4-phase PWM controller such as the Renesas ISL6388 or TI TPS53681 with PMBus to power the VCC core. Sequence VCC (0.9V), VCC_HPS (0.9V), and VCC_IO per Intel power-up guidelines to avoid back-powering through I/O cells.
The 1152-FC-FBGA F35 package has a typical theta_JA of approximately 8 C/W with a properly designed heatsink. Estimate: at 12 W total dissipation, junction-to-ambient rise is roughly 96 C above ambient with a passive heatsink, requiring careful thermal management at industrial 85 C ambient. Use a thermal interface material (TIM) with conductivity >3 W/m-K and follow Intel's FCBGA thermal layout reference for via patterns under the die.
The 1.0 mm ball pitch and 35 x 35 mm BGA footprint require an 8-layer PCB minimum with stacked microvias (laser-drilled) and 1-oz copper inner layers. Matched-length impedance control (100 ohm differential for transceivers, 50 ohm single-ended for GPIO) is mandatory. Use Intel's Arria 10 pin connection guidelines to identify which pins require pull-ups, no-connects, or specific decoupling schemes for configuration.
Do not confuse the 'K2' transceiver tier code with the 'F35' package code when sourcing - K2 refers to mid-density transceiver count, F35 to the package outline. Also ensure the HPS boot source (MSEL pins) matches your firmware boot image - QSPI vs SD vs NAND are selected at MSEL reset, not in software. Using non-industrial-grade Arria 10 parts in outdoor deployments is a frequent qualification failure.
合规信息
RoHS compliant per Intel/Altera product page; LG ball finish indicates Pb-free. Halogen-free status not specified in verified web data for this exact variant (the 'HG' suffix variants like 10AS057K2F35I1HG explicitly claim halogen-free). AEC-Q100 not applicable - this is an industrial FPGA/SoC, not an automotive-qualified part.
