10AS057K3F35I2SG - Arria 10 SX 570K LE SoC FPGA | Intel
부품 번호: 10AS057K3F35I2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3566.65 | $3,566.65 |
| 10 | $3388.32 | $33,883.20 |
| 100 | $3210 | $321,000.00 |
| 500 | $3031.65 | $1,515,825.00 |
| 1,000 | $2853.32 | $2,853,320.00 |
10AS057K3F35I2SG 개요
What is a SoC FPGA? A System-on-Chip FPGA is a hybrid device that merges a hard processor subsystem (typically ARM Cortex-A cores) with programmable logic on a single die. This architecture provides deterministic real-time performance of FPGA fabric alongside the flexibility of a software-programmable application processor, eliminating inter-chip interconnects and reducing BOM and latency. The Arria 10 SX family extends this concept to mid-range high-performance applications.
Key features of the 10AS057K3F35I2SG include 570K logic elements, 1.5 GHz dual-core ARM Cortex-A9 MPCore with NEON and CoreSight debug, 396 user I/O pins, integrated transceivers supporting multi-gigabit serial interfaces, and hard IP blocks for DDR3/4 memory controllers. The device supports the industrial temperature range (-40C to +100C junction for the I2SG speed grade) and is built on Intel's 20nm process technology optimized for low-power mid-range FPGA designs.
The 570K logic element fabric provides ample capacity for high-throughput DSP pipelines, video processing, and protocol bridging, while the HPS enables Linux/RTOS application execution, peripheral management (USB, Ethernet, I2C, SPI, UART), and secure boot flows. The 'K3' speed grade balances performance and power for typical commercial and industrial workloads. The 35x35 mm FCBGA package supports the high pin count and signal-integrity requirements of multi-gigabit transceiver lanes.
Typical applications include industrial machine vision and video processing, software-defined radio and baseband acceleration, medical imaging systems, military/aerospace signal processing, and high-performance embedded computing platforms. The combination of HPS plus FPGA makes this part ideal for designs that require both deterministic hardware acceleration and a rich operating system environment.
When designing with this device, allocate PCB layers to maintain signal integrity on the high-speed transceivers and DDR3/4 interfaces, and ensure proper thermal management because the 35x35 mm BGA can dissipate significant power under sustained fabric utilization. Use the Intel Quartus Prime design suite for synthesis, place-and-route, and HPS firmware development.
드롭인 대체품: 10AS057K3F35I2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS057K3F35I2SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Mounting Type, RoHS Status, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS057K3F35I2LG
✅ 드롭인✓ 재고 있음
$3200 / 개
데이터시트 보기 →10AS057K3F35E2SG
✅ 드롭인✓ 재고 있음
$3740 / 개
데이터시트 보기 →10AS057K2F35I2SG
✅ 드롭인✓ 재고 있음
$3198.4 / 개
데이터시트 보기 →10AS057K2F35I2LG
✅ 드롭인✓ 재고 있음
$1545 / 개
데이터시트 보기 →10AS057K2F35I1HG
✅ 드롭인✓ 재고 있음
$3820 / 개
데이터시트 보기 →10AS057K2F35E2SG
✅ 드롭인✓ 재고 있음
$2304.55 / 개
데이터시트 보기 →10AS057K2F35E2LG
✅ 드롭인✓ 재고 있음
$3450 / 개
데이터시트 보기 →10AS057K2F35E1HG
✅ 드롭인✓ 재고 있음
$1995 / 개
데이터시트 보기 →10AS057K3F35I2SG 최대 정격 & 전기적 특성
| Family | Arria 10 SX |
| Device Variant | 10AS057 |
| Logic Elements | 570K |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| User I/O Count | 396 |
| 패키지 | 1152-FBGA, FC (35x35 mm) |
| Speed Grade | K3 |
| 동작 온도 | -40C to +100C (Industrial, I2) |
| Process Technology | 20nm |
| Memory Controller | Hard DDR3/4 controller in HPS and FPGA fabric |
| Transceivers | Multi-gigabit transceivers (per Arria 10 SX family datasheet) |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| RoHS 상태 | Compliant (per Altera product page) |
| Product Type | SoC FPGA - Embedded System on Chip |
10AS057K3F35I2SG 1152-fbga, fc (35x35 mm) 핀 구성 가이드
10AS057K3F35I2SG(1152-fbga, fc (35x35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS057K3F35I2SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS057K3F35I2SG 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Software Defined Radio (SDR) Baseband, Medical Imaging Systems, Military and Aerospace Signal Processing, Video Broadcast Processing, High-Performance Embedded Computing.
Industrial Machine Vision
The 10AS057K3F35I2SG's 570K logic elements and 396 user I/O pins make it well suited for multi-camera machine vision systems where deterministic frame processing is required. The dual-core ARM Cortex-A9 HPS at 1.5 GHz runs the Linux-based vision stack, OpenCV pipelines, and GigE Vision/USB3 camera management, while the FPGA fabric accelerates Bayer demosaicing, lens distortion correction, and CNN inference at line rate. The 1152-FBGA package supports the multi-gigabit transceivers needed for CoaXPress or 10 GigE camera links. Industrial temperature grade (-40C to +100C) ensures reliable operation on factory floors.
추천
Software Defined Radio (SDR) Baseband
The 10AS057K3F35I2SG integrates the high DSP block count and multi-gigabit transceivers required for SDR baseband processing. The FPGA fabric implements wideband digital down-conversion, channelization, and modulation/demodulation in real time, while the Cortex-A9 HPS handles the MAC layer, network stack, and configuration management. The 1.5 GHz HPS frequency supports LTE and 5G NR L2/L3 processing for small-cell and tactical radio applications. Industrial temperature operation suits outdoor base station and military radio deployments.
추천
Medical Imaging Systems
The 10AS057K3F35I2SG's combination of 570K logic elements, dual ARM Cortex-A9 cores, and 396 user I/O makes it a strong fit for ultrasound, CT, and MRI front-end processing. The FPGA fabric performs beamforming, FFT-based image reconstruction, and real-time filtering on high-channel-count data streams, while the HPS runs the user interface, DICOM stack, and patient database connectivity. The Arria 10 SX 20nm process provides the thermal headroom needed for fan-less medical enclosures, and the industrial temperature rating supports clinical environments.
추천
Military and Aerospace Signal Processing
The 10AS057K3F35I2SG meets industrial temperature range requirements for military signal processing applications including electronic warfare, radar front-end processing, and avionics display systems. The 570K LE fabric implements high-throughput FFT, pulse compression, and digital beamforming for phased-array radar, while the Cortex-A9 HPS runs mission software and sensor fusion. The ruggedized 1152-FBGA flip-chip BGA package withstands vibration and thermal cycling typical of aerospace platforms.
추천
Video Broadcast Processing
The 10AS057K3F35I2SG's 570K logic elements and multi-gigabit transceivers support professional video broadcast workflows including 4K/UHD HEVC encoding, HDR processing, and SDI/HDMI bridging. The FPGA fabric handles real-time video scaling, color space conversion, and overlay composition, while the Cortex-A9 HPS manages IP streaming, SNMP, and front-panel control. The 396 user I/O provides the high pin count needed for parallel video interfaces, 12G-SDI transceivers, and PCIe Gen2/3 host connectivity in broadcast studio equipment.
추천
High-Performance Embedded Computing
The 10AS057K3F35I2SG is well matched to high-performance embedded computing platforms such as VPX, OpenVPX, and CompactPCI Serial cards where deterministic FPGA acceleration plus a Linux-capable host processor are required. The dual-core ARM Cortex-A9 at 1.5 GHz provides ample headroom for payload software, while the 570K LE fabric accelerates sensor I/O, protocol termination, and DSP. The 1152-FBGA package and industrial temperature rating suit deployed embedded systems in transportation, energy, and industrial automation.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS057K3F35I2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS057K3F35I2LG | 10AS057K3F35E2SG | 10AS057K2F35I2SG | 10AS057K2F35I1HG | 10AS057K2F35E1HG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | K3 | K3 | K3 | K2 (slower) | K2 (slower) | K2 (slower) |
| Temperature Grade | Industrial I2 (-40C to +100C) | Industrial I2 | Commercial E2 (0C to +100C) | Industrial I2 | Industrial I1 | Commercial E1 |
| Logic Elements | 570K | 570K | 570K | 570K | 570K | 570K |
| HPS Core | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| User I/O | 396 | 396 | 396 | 396 | 396 | 396 |
| Lead-Free | Yes (per SG suffix convention) | Yes (LG suffix) | Yes (SG suffix) | Yes (SG suffix) | Yes (HG suffix) | Yes (HG suffix) |
주요 차별점
- K3 speed grade balances performance and power for mid-range embedded designs (vs 10AS057K2F35I2SG)
- Industrial -40C to +100C temperature range (vs 10AS057K3F35E2SG)
- Dual-core ARM Cortex-A9 HPS with CoreSight debug (vs Cyclone V SoC (5CSEBA6U23I7))
설계 노트
The 1152-FBGA flip-chip package (35x35 mm) can dissipate significant power under sustained 570K LE fabric utilization. Estimated: at typical Arria 10 SX utilization of 70 percent fabric and 1.5 GHz HPS, total power can reach 25-30 W. The exposed die flip-chip BGA requires a thermal interface material and either a heatsink or chassis thermal path. Refer to the Intel Arria 10 SX PowerPlay Early Power Estimator before final PCB layout.
Use a minimum 12-layer PCB stack-up with dedicated ground and power planes to maintain signal integrity for the multi-gigabit transceivers and DDR3/4 interfaces. Place 0.1 uF decoupling capacitors on every power pin within 100 mils of the BGA pad, and add bulk 47 uF and 220 uF capacitors near the package perimeter. Matched-length routing is required for the HPS DDR controller and FPGA memory interfaces per the Arria 10 SX pin connection guidelines.
Do not attempt to boot the HPS without populating the QSPI flash and configuring the boot mode straps correctly. Ensure the MSEL pins are set to the correct AS x4 or QSPI mode for your chosen boot source. The configuration flash (EPCQ-L) must match the bitstream compression and encryption settings. Refer to the Intel Arria 10 SX Configuration User Guide and the Golden System Reference Design (GSRD) on RocketBoards.org for the validated boot flow.
Route the high-speed transceiver channels on the top layers with reference ground plane directly beneath, using microstrip or stripline as required by the data rate. Maintain 100 ohm differential impedance and use AC-coupling capacitors at the FPGA transmitter pins. Keep the transceiver reference clock lines short and well-isolated from noisy digital signals. The HPS RGMII interface to an external PHY also requires length-matched routing and proper source termination.
규정 준수 정보
RoHS and lead-free status inferred from Altera product page and 'G' suffix convention. AEC-Q100 not applicable (industrial FPGA, not automotive-qualified). REACH compliance assumed per Intel product policy.
