10AS048K3F35I2SG - Arria 10 SX SoC FPGA 480K LE | Altera
부품 번호: 10AS048K3F35I2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2650 | $26,500.00 |
| 100 | $2400 | $240,000.00 |
| 500 | $2180 | $1,090,000.00 |
| 1,000 | $1995 | $1,995,000.00 |
10AS048K3F35I2SG 개요
An SoC FPGA is a single silicon device that combines a general-purpose processor subsystem (typically ARM Cortex-A) with programmable FPGA fabric, on-chip memory controllers, and high-speed transceiver interfaces. The Arria 10 SX series targets mid-range applications that need deterministic real-time processing alongside software programmability. Within the broader hierarchy, this places the part in the category chain: SoC FPGA -> FPGA -> programmable logic -> semiconductor device. Compared with a discrete CPU + FPGA two-chip solution, an SoC FPGA reduces board area, lowers latency between the CPU and fabric, and simplifies the data path between the application processor and FPGA-accelerated functions.
Key features of the 10AS048K3F35I2SG include dual ARM Cortex-A9 MPCore cores with CoreSight debug, integrated DDR3/DDR4 memory controllers with ECC support, up to 24 transceivers capable of multi-gigabit serial links, on-chip hard memory controllers, and high-speed LVDS I/O. The 1152-pin FCBGA package provides extensive I/O count needed for memory channels, transceivers, and parallel interfaces in mid-range embedded designs.
The Arria 10 SX architecture combines a hard processor system (HPS) on the same die as the programmable logic, sharing a coherent interconnect. This architecture is widely used in industrial automation, software-defined radio, machine vision, and medical imaging, where ARM software control coordinates FPGA-accelerated DSP, image processing, or protocol bridging.
Typical applications for the 10AS048K3F35I2SG include motor control and industrial drives, broadcast video processing, software-defined networking, and high-speed data acquisition. The HPS runs Linux or RTOS while the FPGA fabric handles deterministic, parallel workloads such as signal processing, encryption, or image pipelines.
When designing with this device, pay close attention to PCB layout for the 1152-pin FCBGA: a multi-layer PCB with buried vias, microvia stack-ups, and matched-length traces for transceivers and DDR memory interfaces is mandatory. Power sequencing between the HPS and FPGA rails must follow the Intel/Altera reference design to avoid latch-up during bring-up.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Arria 10 SX family, and practical design notes not typically combined in the manufacturer datasheet.
드롭인 대체품: 10AS048K3F35I2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048K3F35I2SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Mounting Type, Family, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS048K3F35I2LG
✅ 드롭인✓ 재고 있음
$3850 / 개
데이터시트 보기 →10AS048K3F35E2SG
✅ 드롭인✓ 재고 있음
$2720 / 개
데이터시트 보기 →10AS048K3F35E2LG
✅ 드롭인✓ 재고 있음
$3495 / 개
데이터시트 보기 →10AS048K2F35I2SG
✅ 드롭인✓ 재고 있음
$3450 / 개
데이터시트 보기 →10AS048K2F35I2LG
✅ 드롭인✓ 재고 있음
$2650 / 개
데이터시트 보기 →10AS048K3F35I2SG 최대 정격 & 전기적 특성
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| 패키지 | 1152-pin FCBGA (35x35 mm) |
| 동작 온도 | -40C to +100C (Industrial) |
| Speed Grade | 3 |
| Transceiver Data Rate | 1.5 Gbps (max, per distributor listing) |
| 메모리 유형 | DDR3/DDR4 with ECC (HPS + FPGA fabric) |
| Architecture | SoC (HPS + programmable logic) |
| 실장 유형 | Surface Mount (FCBGA) |
| RoHS 상태 | Compliant |
| Device Series | 10AS048 (F35) |
| Hard Processor System | Yes (dual ARM Cortex-A9) |
10AS048K3F35I2SG 1152-pin fcbga (35x35 mm) 핀 구성 가이드
10AS048K3F35I2SG(1152-pin fcbga (35x35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048K3F35I2SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048K3F35I2SG 적합 용도: 7 애플리케이션s: Industrial Motor Control and Drives, Software-Defined Radio Baseband, Broadcast Video Processing, Medical Imaging Acceleration, High-Speed Data Acquisition, Automotive ADAS Prototyping, 5G Small Cell Baseband.
Industrial Motor Control and Drives
The 10AS048K3F35I2SG suits industrial motor control where deterministic FPGA fabric handles PWM generation, encoder decoding, and field-oriented control loops at microsecond latency, while the dual ARM Cortex-A9 HPS runs Linux for supervisory control, EtherCAT master, and HMI networking. The 480K logic elements support multi-axis servo control with high-resolution PWM and sigma-delta demodulation. Industrial temperature rating (-40C to +100C) suits factory-floor cabinets without active cooling.
추천
Software-Defined Radio Baseband
The 10AS048K3F35I2SG serves as the baseband processor in software-defined radio platforms where the FPGA fabric implements DDC/DUC, channelization, and protocol-specific modulation while the HPS runs a Linux SDR stack (such as GNU Radio) for higher-layer packet processing. The 1.5 Gbps transceivers interface with RF front-ends and ADC/DAC JESD204B/C links. The HPS-DDR controller feeds the radio's circular buffers at line rate, leveraging 480K LE for multi-channel wideband capture.
추천
Broadcast Video Processing
The 10AS048K3F35I2SG handles real-time broadcast video workloads such as 4K/UHD upconversion, HDR tone-mapping, and multi-stream transcoding where FPGA fabric accelerates motion-adaptive deinterlacing and scaling, while the HPS runs a Linux media stack for codec orchestration. The 1152-pin FCBGA I/O budget supports multiple SDI/HDMI inputs and outputs with frame-buffer DDR. K3 speed grade supports multi-format switching without timing closure issues at 4K line rate.
추천
Medical Imaging Acceleration
In ultrasound and endoscopy systems, the 10AS048K3F35I2SG's FPGA fabric performs beamforming, Doppler processing, and image reconstruction at sub-frame latency, while the Cortex-A9 HPS handles patient interface, DICOM networking, and image display. Industrial temperature rating suits portable cart systems. The 480K LE comfortably fits beamformed 64-channel beamforming pipelines plus JPEG2000 or H.264 compression, enabling compact medical imaging designs.
추천
High-Speed Data Acquisition
The 10AS048K3F35I2SG is well matched to multi-channel data acquisition systems where the FPGA fabric digitizes streams from JESD204B ADCs, applies FIR filtering and decimation, and pre-processes data before forwarding to the HPS over the coherent interconnect. The HPS runs embedded analytics or streams data over 10 Gigabit Ethernet via the integrated transceivers. The 1.5 Gbps transceiver data rate supports direct ADC link to FPGA fabric at high channel count.
추천
Automotive ADAS Prototyping
For ADAS sensor fusion prototyping, the 10AS048K3F35I2SG fuses camera, radar, and LiDAR streams where FPGA fabric handles low-latency object detection and sensor synchronization while the Cortex-A9 HPS runs a Linux robotics stack for higher-level path planning. Industrial temperature rating suits in-cabin and outdoor-mounted prototype vehicles. The 1152-pin FCBGA supports multiple GMSL/FPD-Link camera inputs and CAN-FD vehicle network interfaces.
추천
5G Small Cell Baseband
The 10AS048K3F35I2SG's 480K LE and 1.5 Gbps transceivers support 5G small-cell baseband where the FPGA fabric implements the PHY layer (LDPC, polar coding, FFT/iFFT) while the HPS runs the higher MAC and RRC layers in a real-time Linux environment. Industrial temperature rating suits outdoor small-cell enclosures. The HPS-DDR bandwidth supports sub-6 GHz carrier aggregation without external processing chips.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048K3F35I2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS048K3F35I2LG | 10AS048K3F35E2SG | 10AS048K3F35E2LG | 10AS048K2F35I2SG | 10AS048K2F35I2LG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-pin FCBGA (35x35 mm) | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | 3 (K3) | 3 (K3) | 3 (K3) | 3 (K3) | 2 (K2) - lower Fmax, lower power | 2 (K2) - lower Fmax, lower power |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| HPS Cores | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Lead Finish | Leaded (SnPb) | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Industrial temperature grade for harsh-environment deployment (vs 10AS048K3F35E2SG)
- Highest speed grade for timing-critical designs (vs 10AS048K2F35I2SG)
- Same-package variant for supply continuity (vs 10AS048K3F35I2LG)
설계 노트
The 1152-pin FCBGA (35x35 mm) requires a high-density PCB with microvia stack-ups and matched-length routing for transceivers and DDR memory. Estimated: plan for at least 8 to 12 PCB layers with buried capacitance to handle simultaneous switching noise. Decoupling must follow the Altera reference design with bulk, mid-frequency, and high-frequency capacitors placed as close to the BGA balls as possible.
The Arria 10 SX requires multiple power rails (0.9V core, HPS rails, transceiver analog, DDR termination) that must be sequenced per the Intel/Altera reference design to avoid latch-up during FPGA configuration and HPS boot-up. Estimated: use a dedicated power management IC (PMIC) such as the Intel-recommended Enpirion or comparable multi-rail PMIC. In-rush current at configuration can exceed 10A on the core rail if decoupling is insufficient.
Estimated: at full utilization of the 480K logic elements plus active HPS and transceivers, junction temperature can rise 30-50C above ambient with the standard FCBGA theta_JA. Industrial designs must include thermal vias under the BGA and a heatsink or thermal interface material in enclosures without forced airflow. Validate thermal performance against the device's junction-to-ambient and junction-to-case thermal metrics from the datasheet.
Configuration failures are common when the MSEL pins are not correctly set for the desired configuration scheme (AS, PS, JTAG, FPP). Verify MSEL settings against the Arria 10 pin connection guidelines. The HPS boot from QSPI or SD requires boot ROM configuration via the Quartus Programming File Generator - leaving this unset results in a non-booting HPS even when FPGA fabric configures correctly.
DDR3/DDR4 trace lengths to the HPS memory controller must be matched within +/- 25 mil across byte lanes and the address/command bus, with proper fly-by routing for clock. Transceiver channels require length-matched differential pairs (within +/- 5 mil) and continuous reference planes. Estimated: leave 4 routing layers dedicated to DDR and transceiver routing with the rest of the layers for signal integrity.
규정 준수 정보
RoHS compliant per Altera/Intel product page. 'I' industrial temperature range per part numbering. Not AEC-Q100 qualified (choose automotive-qualified variants where required). Lead finish encoded in 'SG' suffix (leaded); choose 'LG' for lead-free.
