10AS066H3F34E2LG - Arria 10 SX SoC FPGA, 660K LE, Dual A9 | Intel
부품 번호: 10AS066H3F34E2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3675 | $36,750.00 |
| 100 | $3400 | $340,000.00 |
| 500 | $3125 | $1,562,500.00 |
| 1,000 | $2875 | $2,875,000.00 |
10AS066H3F34E2LG 개요
An SoC FPGA (System-on-Chip FPGA) is a hybrid device that pairs a traditional field-programmable gate array fabric with one or more embedded hard processor cores, plus shared memory and I/O peripherals. The hypernym hierarchy is SoC FPGA -> FPGA -> programmable logic device -> logic IC -> semiconductor. This architecture reduces BOM count, lowers power versus a two-chip CPU+FPGA solution, and simplifies board layout because the processor-to-FPGA interconnect is implemented inside the package. The Arria 10 SX variant specifically targets mixed-signal signal processing, software-defined radio, and industrial imaging workloads.
Key differentiating features include the dual-core ARM Cortex-A9 MPCore subsystem with NEON SIMD and single/double-precision floating-point unit, dedicated DDR3/DDR4 memory controllers with hard PHY, up to 24 transceivers supporting multi-gigabit serial protocols, and partial reconfiguration support for in-field logic updates. The 20nm process allows the 660K logic-element fabric to operate at high toggle rates while keeping dynamic power lower than the previous 28nm Arria V generation, and the hardened ARM subsystem removes the silicon cost and latency of a soft processor core.
Typical applications include software-defined radio baseband processing, machine vision and industrial imaging pipelines, medical diagnostic imaging front-ends, high-performance industrial motor control, and secure military/aerospace signal processing where the combination of a deterministic FPGA fabric and a Linux-capable processor delivers both throughput and flexibility. The wide transceiver range and ARM ecosystem also make the part suitable for 5G fronthaul test equipment and high-speed data acquisition.
When designing with the 10AS066H3F34E2LG, plan the PCB layout around the 35x35mm FCBGA with HDI stack-up, use Intel Quartus Prime for synthesis and place-and-route, and provision for the dual-configuration images typically required for fail-safe remote updates. Thermal management at full transceiver utilization must account for the 0.9V core rail and the device's full industrial operating range. Compared with discrete CPU+FPGA designs, this single-chip approach typically reduces PCB area by 40-60% and simplifies EMI compliance.
드롭인 대체품: 10AS066H3F34E2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS066H3F34E2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Mounting Type, Temperature Grade, Operating Temperature Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS066H2F34E2LG
✅ 드롭인✓ 재고 있음
$3250 / 개
데이터시트 보기 →10AS066H2F34I2LG
✅ 드롭인✓ 재고 있음
$11050 / 개
데이터시트 보기 →10AS066H2F34I2SG
✅ 드롭인✓ 재고 있음
$3550 / 개
데이터시트 보기 →10AS066H1F34E1HG
✅ 드롭인✓ 재고 있음
$3900 / 개
데이터시트 보기 →10AS066H2F34I1HG
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →10AS048H3F34E2LG
✅ 드롭인✓ 재고 있음
$1280 / 개
데이터시트 보기 →10AS066H3F34E2LG 최대 정격 & 전기적 특성
| Family | Arria 10 SX |
| Logic Elements | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Maximum Core Frequency | 1.5 GHz |
| 패키지 | 1152-ball FCBGA (F34), 35 mm x 35 mm |
| 실장 유형 | Surface Mount (BGA) |
| Memory Controllers | Hard DDR3/DDR4 PHY (per Arria 10 SoC datasheet) |
| Transceivers | Up to 24 multi-gigabit transceivers (family-level) |
| Operating Temperature Grade | Industrial (per F34 ordering code) |
| Device Type | System-on-Chip FPGA (SoC) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Configuration Image Support | Dual configuration, partial reconfiguration (family-level) |
10AS066H3F34E2LG 1152-ball fcbga (f34), 35 mm x 35 mm 핀 구성 가이드
10AS066H3F34E2LG(1152-ball fcbga (f34), 35 mm x 35 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS066H3F34E2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS066H3F34E2LG 적합 용도: 6 애플리케이션s: Software-Defined Radio Baseband, Industrial Machine Vision, Medical Diagnostic Imaging, 5G Fronthaul Test Equipment, High-Speed Data Acquisition, Aerospace & Defense Signal Processing.
Software-Defined Radio Baseband
The 10AS066H3F34E2LG's 660K logic elements and dual ARM Cortex-A9 MPCore HPS make it well suited to software-defined radio baseband processing, where the FPGA fabric handles high-rate modulation/demodulation and channelization while the A9 cores run the MAC and protocol stacks. The Arria 10 SX family supports up to 24 multi-gigabit transceivers, so a single chip can interface to multiple antenna paths. Designers typically pair the device with DDR3 or DDR4 memory attached to the hardened memory controllers, and use Intel Quartus Prime DSP Builder to implement FFTs and channel filters in fabric. Compared with discrete CPU+FPGA designs, this SoC FPGA typically reduces PCB area by 40-60% and lowers system power by enabling tighter clock gating between the processor and accelerator blocks.
추천
Industrial Machine Vision
In industrial imaging and machine-vision pipelines the 10AS066H3F34E2LG provides the logic density needed to run multi-channel image preprocessing (debayer, color correction, geometric rectification) in the FPGA fabric, while the dual ARM Cortex-A9 cores handle higher-level inspection algorithms and GigE Vision or CoaXPress protocol stacks. The 20nm process keeps dynamic power low enough for fan-less sealed enclosures typical of factory-floor cameras. Designers can leverage the hard DDR3/DDR4 controllers to buffer full-resolution frames at line rates above 1 Gpixel/s. Compared with CPU-only vision systems, the SoC FPGA architecture eliminates the need for expensive frame grabber cards and cuts end-to-end latency below 5 ms, which is critical for inline quality-control loops.
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Medical Diagnostic Imaging
Ultrasound, CT and MRI front-ends benefit from the 10AS066H3F34E2LG's combination of high logic density and an ARM Cortex-A9 HPS capable of running embedded Linux for user-interface and network connectivity. The FPGA fabric implements beamforming, FIR filtering and envelope detection in real time, while the HPS manages the panel display, DICOM network stack and patient-data logging. The Arria 10 SX family's hard floating-point DSP blocks reduce the need for external coprocessors. As with all medical designs, engineers should verify IEC 60601-1 compliance at the system level; the SoC FPGA itself simplifies EMI compliance by integrating processor and FPGA into a single package, reducing radiated emissions from high-speed board traces.
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5G Fronthaul Test Equipment
Test equipment for 5G fronthaul (eCPRI, CPRI) requires both high serial bandwidth and flexible packet processing, which the 10AS066H3F34E2LG delivers through its multi-gigabit transceivers and 660K logic elements. The dual A9 HPS runs Linux for management-plane protocols (NETCONF, gNMI) and presents a standard network stack to higher-level test orchestration tools. Designers can implement 10G/25G Ethernet MAC and PCS directly in fabric, achieving deterministic latency well below 1 microsecond. The device's industrial temperature grade and 0.9V core rail make it appropriate for lab-grade equipment that must operate reliably in uncontrolled environments.
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High-Speed Data Acquisition
Multi-channel data-acquisition systems sampling ADC outputs at hundreds of MSPS benefit from the 10AS066H3F34E2LG's abundant LVDS-capable I/O banks and dedicated DDR3/DDR4 memory controllers. The 660K logic elements can implement real-time DSP such as polyphase decimation filters and channel calibration, while the dual ARM Cortex-A9 cores manage the user interface, file storage and Ethernet streaming. Designers typically pair this SoC FPGA with external JESD204B ADCs or LVDS ADC banks; the FPGA fabric handles the high-rate deserialization and data formatting. Compared with FPGA-only designs, the integrated HPS eliminates the need for a separate microcontroller or external processor, simplifying both the BOM and the firmware build flow.
추천
Aerospace & Defense Signal Processing
Defense and aerospace signal-processing systems need deterministic throughput, radiation tolerance at the system level, and the ability to run sensitive algorithms on a hardened ARM subsystem. The 10AS066H3F34E2LG provides 660K logic elements for high-throughput signal processing combined with a dual A9 MPCore HPS that can run security-aware software stacks. The Arria 10 SX family supports partial reconfiguration, enabling in-field logic updates without halting the entire system. For flight-rated applications, designers typically add board-level mitigation (watchdog timers, scrubbing memory, ECC on configuration) around the SoC FPGA; the device itself is qualified to industrial temperature, with extended-temperature screening performed at the system level by the integrator.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS066H3F34E2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS066H2F34E2LG | 10AS066H2F34I2LG | 10AS066H2F34I2SG | 10AS066H1F34E1HG | 10AS066H2F34I1HG | 10AS048H3F34E2LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34), 35x35 mm | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed Grade | 3 | 2 | 2 | 2 | 1 | 2 | 3 |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Commercial | Commercial | Industrial |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
주요 차별점
- Highest speed grade in 10AS066 F34 family (vs 10AS066H2F34E2LG)
- Full 660K LE fabric (vs 10AS048H3F34E2LG)
- Industrial temperature grade (vs 10AS066H1F34E1HG)
설계 노트
The 1152-ball FCBGA (35x35mm, 1.0mm ball pitch) requires an HDI PCB stack-up with micro-via-in-pad technology. Plan at least 8-10 routing layers, use sequential lamination, and ensure the BGA escape pattern can be completed within the four outer row pairs before reaching the inner balls. Decoupling must combine 0402-size 100nF capacitors placed within 2mm of every power ball plus bulk 22uF/47uF ceramic capacitors on each supply rail. The 0.9V core rail in particular needs at least 8 bulk capacitors distributed around the package perimeter to suppress transient response during simultaneous HPS + fabric switching events.
At full transceiver utilization (24 lanes at 10-12.5 Gbps) plus 80% logic utilization, the 10AS066H3F34E2LG can dissipate 15-20W. The estimated junction-to-ambient thermal resistance of the F34 package is approximately 8-10 C/W with a properly designed thermal via array under the central ball grid; without thermal vias this rises above 15 C/W. Estimated: assume theta_JA = 9 C/W, T_ambient = 55 C (industrial), and P = 18 W, giving T_junction = 55 + 9*18 = 217 C - well above the 100 C industrial limit, so a heatsink or cold plate is mandatory for transceiver-heavy designs.
Match lengths on DDR3/DDR4 byte lanes to within +/- 25 mil (0.635mm) and route differential pairs to within +/- 10 mil of the target length; the hard memory controller will not train out gross length mismatches. Keep all high-speed transceiver traces on inner stripline layers with continuous reference planes, and avoid routing any signal across a plane split under the BGA. The HPS boot configuration (MSEL pins) determines whether the part boots from QSPI, SD or NAND; tie these pins through 4.7k pull-ups or pull-downs to a clearly labeled header so board re-spin and field update are possible.
Estimated: do not assume the 'H3' speed grade guarantees 1.5GHz on every fabric path - the family-level 1.5GHz figure refers to the HPS core clock, not the FPGA fabric Fmax, which is typically 400-700MHz depending on logic depth and routing. Always run full place-and-route with realistic timing constraints before committing to the part. Also avoid mixing Quartus Prime versions between development and production; pinout files are version-specific and small Quartus revisions can shift the I/O bank assignments, which would invalidate the PCB layout.
Plan for three or more independent power rails: 0.9V core (largest current, 15-25A peak), 1.1V/1.2V transceiver PLL and analog supplies, and 1.8V/2.5V/3.3V I/O rails driven by load. Power-on sequencing must follow the Arria 10 datasheet's required order (typically 3.3V -> 2.5V -> 1.8V -> 1.1V -> 0.9V) with monotonic rise times below 100ms; violation of the sequencing can latch-up the device. Use a multi-rail PMIC such as the Intel-recommended controller to avoid discrete LDO complexity.
규정 준수 정보
RoHS and lead-free compliance per Altera/Intel product page. Not AEC-Q100 qualified (FPGA SoC is not an automotive-grade part). Halogen-free status not stated in the verified web data and is marked unknown.
