10AS066H3F34E2SG - Arria 10 SX SoC FPGA 660K LE | Altera
부품 번호: 10AS066H3F34E2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4300 | $43,000.00 |
| 100 | $4050 | $405,000.00 |
| 500 | $3800 | $1,900,000.00 |
| 1,000 | $3600 | $3,600,000.00 |
10AS066H3F34E2SG 개요
A SoC FPGA is a heterogeneous compute device that combines a general-purpose application processor subsystem (typically ARM Cortex-A cores plus peripherals, memory controllers and CoreSight debug fabric) with a programmable FPGA fabric on a single die. In the system hierarchy, SoC FPGAs sit between standard microcontrollers and discrete CPU-plus-FPGA two-chip solutions: they replace board-level partitioning with on-die coherent links, reducing latency, board area, BOM count and power compared with equivalent two-chip designs.
Key features of the 10AS066H3F34E2SG include the dual ARM Cortex-A9 MPCore subsystem, integrated CoreSight debug, 660K logic elements, embedded hard memory controllers, transceivers rated for high-speed serial protocols, and the Arria 10 hardened floating-point DSP and variable-precision DSP blocks. The 1152-pin FC-FBGA (35x35 mm) package supports the high I/O count needed for memory interfaces, transceivers and parallel fabric I/O without resorting to package-on-package stacking.
Architecturally, the device separates the HPS (Hard Processor System) domain and the FPGA fabric domain while allowing shared access to on-chip RAM and external DDR via hardened controllers. This lets designers allocate latency-critical control loops to the FPGA fabric and higher-level OS-driven tasks to the Cortex-A9 cores, communicating over the on-die system interconnect without external bus bottlenecks.
Typical applications include wireless baseband processing, radar and beamforming front-ends, industrial machine vision and high-speed serial interface bridging. The combination of ARM cores with 660K LE of fabric is well matched to mid-range software-defined radio, medical imaging pre-processing and test-and-measurement equipment that needs deterministic real-time fabric plus a Linux-capable host.
When designing with this part, pay close attention to PCB layout of the 35x35 mm FC-FBGA: matched-length routing for DDR, clean power planes for the 0.9 V core and adequate thermal relief are mandatory. Pin compatibility exists with other 10AS066 variants in the same F34 package, but the device is not drop-in compatible with non-SX Arria 10 family members because of the integrated HPS and its dedicated pin map.
This page synthesizes current distributor stock, same-family pin-compatible alternatives and practical board-design guidance that is not bundled in the manufacturer datasheet, giving engineers a faster path from evaluation to production.
드롭인 대체품: 10AS066H3F34E2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS066H3F34E2SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Speed Grade, Temperature Grade, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS066H3F34E2LG
✅ 드롭인✓ 재고 있음
$2875 / 개
데이터시트 보기 →10AS066H3F34I2SG
✅ 드롭인✓ 재고 있음
$3200 / 개
데이터시트 보기 →10AS066H2F34E2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2400 / 개
데이터시트 보기 →10AS066H2F34E2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3250 / 개
데이터시트 보기 →10AS066H1F34E1HG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3900 / 개
데이터시트 보기 →10AS066H3F34E2SG 최대 정격 & 전기적 특성
| Family | Arria 10 SX |
| Device Variant | 10AS066 |
| Logic Elements | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Maximum Operating Frequency (IP dependent) | 1.5 GHz |
| 패키지 | 1152-ball FC-FBGA (F34) |
| Package Size | 35 x 35 mm |
| 실장 유형 | Surface Mount (flip-chip BGA) |
| Operating Temperature Grade | Extended (E) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Shipping Medium | Tray |
| Architecture Type | SoC FPGA (HPS + FPGA fabric) |
10AS066H3F34E2SG 35 x 35 mm 핀 구성 가이드
10AS066H3F34E2SG(35 x 35 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS066H3F34E2SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS066H3F34E2SG 적합 용도: 7 애플리케이션s: Wireless Baseband Processing, Radar and Beamforming Front-Ends, Industrial Machine Vision, Medical Imaging Pre-Processing, Test and Measurement Equipment, High-Speed Serial Interface Bridging, Software Defined Radio (SDR) Platforms.
Wireless Baseband Processing
The 10AS066H3F34E2SG is well suited to wireless baseband signal processing because it combines 660,000 logic elements with hard ARM Cortex-A9 cores on the same die. The fabric runs PHY layer functions, channelization filters and FFT cores with deterministic latency, while the HPS handles the MAC, network stack and protocol timers. Hardened DDR controllers and high-speed transceivers remove the need for external bridge chips, shrinking the radio baseband BOM. The 1.5 GHz fabric IP blocks accelerate datapath processing, and the 0.9 V core supply keeps dynamic power reasonable for always-on small-cell or picocell deployments.
추천
Radar and Beamforming Front-Ends
In phased-array radar and 5G beamforming front-ends, the 10AS066H3F34E2SG provides the mix of parallel compute, fast memory access and low-latency control required to drive hundreds of antenna elements. The 660K logic elements host beamforming weight calculations, calibration logic and digital up/down conversion, while the HPS runs calibration, monitoring and higher-level control loops. The 1152-pin F34 FC-FBGA exposes the large number of LVDS and transceiver lanes needed for ADC/DAC interfacing. The 0.9 V core and 20 nm process keep per-element power low enough to scale to large arrays.
추천
Industrial Machine Vision
Industrial machine vision pipelines need both pixel-rate preprocessing in fabric and a Linux-class processor for inference, networking and HMI. The 10AS066H3F34E2SG places the dual ARM Cortex-A9 HPS and 660K LE fabric on one die, allowing high-throughput image preprocessing, Bayer conversion, exposure and gain control in hardware, while the HPS runs OpenCV, TensorFlow Lite inference or vendor vision stacks. MIPI and LVDS I/O from the F34 FC-BGA connect to image sensors, and the SoC reduces part count versus a discrete CPU-plus-FPGA design.
추천
Medical Imaging Pre-Processing
Ultrasound, endoscopy and CT pre-processing benefit from the 10AS066H3F34E2SG's mix of high logic density, low-latency fabric and an integrated ARM host. The fabric handles beamforming, FIR filtering and envelope detection at sample rates up to tens of MHz per channel, while the HPS runs the user interface, networking and post-processing stacks. Hardened memory controllers feed large frame buffers without contention, and the SoC form factor reduces board space inside constrained medical enclosures. The Extended temperature grade supports controlled medical environments reliably.
추천
Test and Measurement Equipment
Test and measurement instruments need fast deterministic fabric for protocol-aware capture and a Linux-class host for UI and analysis. The 10AS066H3F34E2SG meets this with 660K LE of Arria 10 SX fabric paired with the dual Cortex-A9 HPS, allowing one chip to drive high-speed ADC/DAC capture paths, trigger logic and on-board analysis. The 1152-ball FC-BGA exposes the LVDS and transceiver lanes needed for instrument front-ends, and the 0.9 V core helps manage chassis thermal load. Quartus Prime tool flow supports standard instrument IP cores.
추천
High-Speed Serial Interface Bridging
Protocol bridging between PCIe, Ethernet, JESD204B and custom serial links is a strong use case for the 10AS066H3F34E2SG. Its hardened transceivers and Protocol IP from the Arria 10 family handle the physical and data-link layers, while the 660K LE fabric implements protocol adaptation, buffering and packet processing. The HPS runs network stacks, management agents and user configuration. The 1152-pin F34 package brings out all necessary high-speed lanes, and SoC integration eliminates external host controllers on the bridge board.
추천
Software Defined Radio (SDR) Platforms
The 10AS066H3F34E2SG is widely used in SDR platforms because the 660K LE fabric can implement digital down-conversion, channelization and modulation/demodulation, while the dual ARM Cortex-A9 HPS runs GNU Radio or vendor SDR frameworks. This single-die SoC approach reduces latency between fabric DSP and host-side processing compared with two-chip designs. The 1.5 GHz fabric IP blocks handle demanding real-time DSP, and the 0.9 V core voltage keeps board power budget reasonable for portable SDR platforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS066H3F34E2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS066H3F34E2LG | 10AS066H3F34I2SG | 10AS066H2F34E2SG | 10AS066H2F34E2LG | 10AS066H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Family | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | H3 (Extended temp) | H3 | H3 | H2 | H2 | H1 |
| Operating Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Extended (E) | Extended (E) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
주요 차별점
- Integrated dual-core ARM Cortex-A9 hard processor system (vs Non-SoC Arria 10 (10AX) family)
- H3 speed grade in Extended temperature (vs 10AS066H1F34E1HG (H1 speed grade))
- Same die/package across the 10AS066 SX family (vs 10AS048 Arria 10 SX variants)
설계 노트
The 1152-ball flip-chip BGA (35x35 mm) of the 10AS066H3F34E2SG demands high-density PCB stackup with microvia build-up layers. Use a stackup with at least 8 layers, dedicated ground and 0.9 V power planes placed adjacent to the core supply, and matched-length routing for DDR3/DDR4 interfaces to the HPS. Source: Altera Arria 10 SX device design guidelines.
Estimated: with a 20 nm Arria 10 SX die in a 35x35 mm FC-BGA, a worst-case utilization at room temperature can draw several watts; design the PCB with a continuous thermal copper pour under the package and consider forced airflow. Theta-JA depends heavily on PCB stackup; refer to the manufacturer thermal model for accurate junction-temperature estimates before locking the mechanical design.
Keep high-speed transceiver and DDR traces matched within the tolerance specified in the Arria 10 SX pin-out file. Place decoupling capacitors as close as practical to each power pin group and use the recommended decoupling network from the Arria 10 SX device schematic checklist. Source: Altera Arria 10 SX schematic review checklist.
Do not assume pin compatibility with non-SX Arria 10 devices (10AX series) - the SX adds dedicated HPS pins that are reserved on the AX. Also confirm the speed grade suffix in the MPN (H1, H2, H3) matches your timing requirements; substituting a lower speed grade can fail timing closure even if the package is identical.
규정 준수 정보
RoHS compliance and lead-free status taken from Altera/Intel product page for 10AS066 (F34). REACH, halogen-free, and conflict-minerals status were not stated in the Verified Web Data provided and are marked unknown.
