10AS066H2F34I1HG - Arria 10 SX SoC FPGA 660K LE | Intel
부품 번호: 10AS066H2F34I1HG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4426.2 | $4,426.20 |
| 10 | $4200 | $42,000.00 |
| 100 | $3950 | $395,000.00 |
| 500 | $3700 | $1,850,000.00 |
| 1,000 | $3500 | $3,500,000.00 |
10AS066H2F34I1HG 개요
A System on Chip (SoC) FPGA is a single silicon device that fuses a general-purpose processor subsystem with configurable FPGA fabric, allowing hardware accelerators to interface with software stacks through standard bus protocols. Within the broader taxonomy, an SoC FPGA belongs to programmable logic devices, which sit alongside ASICs, ASSPs, and microcontrollers in the embedded computing hierarchy. The Arria 10 SX family specifically targets mid-range applications that need ARM Cortex-A9 software compatibility combined with mid-bandwidth FPGA acceleration.
Key features of the 10AS066H2F34I1HG include 660K logic elements, 492 user I/O pins, embedded transceivers supporting multi-gigabit serial protocols, on-chip memory blocks, and DSP blocks optimized for high-throughput signal processing. The HPS includes hardened peripherals such as USB, Gigabit Ethernet, UART, SPI, I2C, and SD/eMMC controllers, reducing external component count. Industrial temperature range (-40C to +100C) supports harsh-environment deployments.
The Arria 10 architecture uses adaptive logic modules (ALMs), variable-precision DSP blocks, and 20-Gbps transceivers. Hardened memory controllers and PCIe Gen2/Gen3 IP blocks reduce soft logic overhead. The integrated HPS connects to FPGA fabric via AXI buses, allowing tight coupling between software tasks running on Cortex-A9 and hardware accelerators in fabric.
Typical applications include 5G baseband processing, industrial motor control, software-defined radio (SDR), military radar and electronic warfare, broadcast video processing, medical imaging accelerators, and high-performance embedded computing platforms. The 1.5 GHz HPS frequency makes it suitable for protocol stack processing, while FPGA fabric handles DSP-intensive operations in parallel.
Design considerations for the 10AS066H2F34I1HG include proper power supply sequencing, JTAG configuration infrastructure, thermal management for the 35x35 mm BGA package, and PCB layout for high-speed transceiver channels. Quartus Prime software is required for synthesis, place-and-route, and HPS firmware development.
드롭인 대체품: 10AS066H2F34I1HG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS066H2F34I1HG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Temperature Grade, Logic Elements, Mounting Type, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS066H2F34E2SG
✅ 드롭인✓ 재고 있음
$2400 / 개
데이터시트 보기 →10AS066H2F34E2LG
✅ 드롭인✓ 재고 있음
$3250 / 개
데이터시트 보기 →10AS066H2F34E1HG
✅ 드롭인✓ 재고 있음
$2980 / 개
데이터시트 보기 →10AS066H1F34I1HG
✅ 드롭인✓ 재고 있음
$3720 / 개
데이터시트 보기 →10AS066H1F34E1HG
✅ 드롭인✓ 재고 있음
$3900 / 개
데이터시트 보기 →10AS066H2F34I1HG 최대 정격 & 전기적 특성
| Series | Arria 10 SX |
| Logic Elements | 660,000 |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| User I/O Count | 492 |
| 패키지 | 1152-pin FC-FBGA (35x35 mm) |
| 공급 전압 | 0.9 V |
| 동작 온도 범위 | -40C to +100C (Industrial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Configuration Method | SRAM-based, JTAG |
| On-chip Memory | Embedded memory blocks (M20K) |
| DSP Blocks | Variable-precision DSP |
| Transceivers | Multi-gigabit transceivers (up to 12.5 Gbps) |
| Hard Memory Controller | Yes (DDR3/DDR4/LPDDR3) |
| PCIe Hard IP | PCIe Gen2/Gen3 |
10AS066H2F34I1HG 1152-pin fc-fbga (35x35 mm) 핀 구성 가이드
10AS066H2F34I1HG(1152-pin fc-fbga (35x35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS066H2F34I1HG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS066H2F34I1HG 적합 용도: 6 애플리케이션s: 5G Baseband Processing, Software Defined Radio (SDR), Industrial Motor Control, Military Radar and Electronic Warfare, Broadcast Video Processing, Medical Imaging Accelerators.
5G Baseband Processing
The 10AS066H2F34I1HG fits 5G baseband processing because its 660K logic elements deliver the parallel DSP throughput needed for PHY-layer channel coding, FFT/IFFT, and MIMO processing. The dual-core ARM Cortex-A9 HPS running at 1.5 GHz handles MAC-layer scheduling and protocol stack execution without off-chip processor latency. Multi-gigabit transceivers supporting up to 12.5 Gbps enable fronthaul CPRI/eCPRI links between the baseband unit and remote radio heads. Hardened PCIe Gen3 IP simplifies backhaul connectivity to host processors, while DDR4 memory controllers sustain the data bandwidth for real-time baseband sample streams. Compared with pure-logic FPGAs, the integrated HPS eliminates an external CPU, reducing PCB footprint and BOM cost in compact small-cell deployments.
추천
Software Defined Radio (SDR)
The 10AS066H2F34I1HG suits SDR platforms because its FPGA fabric accelerates wideband signal processing for waveforms such as LTE, Wi-Fi, and military radio standards, while the Cortex-A9 HPS runs real-time operating systems and waveform libraries. The 12.5 Gbps transceivers handle multi-band RF sampling and digital pre-distortion feedback loops. DSP blocks with variable precision support both fixed-point and floating-point arithmetic, enabling efficient implementation of FFTs, FIR filters, and modulation/demodulation chains. Industrial temperature range ensures operation in tactical and outdoor SDR installations. The integrated ARM cores allow single-chip implementation of waveforms that would otherwise require a separate DSP or CPU subsystem.
추천
Industrial Motor Control
The 10AS066H2F34I1HG addresses industrial motor control by combining FPGA-based high-speed PWM generation and encoder feedback processing with an ARM Cortex-A9 HPS running real-time control loops. Variable-precision DSP blocks execute field-oriented control (FOC) algorithms with sub-microsecond latency. The 492 user I/O pins accommodate multiple motor channels, quadrature encoder interfaces, and industrial communication peripherals. Industrial temperature range (-40C to +100C) supports factory floor and outdoor equipment deployments. HPS peripherals such as CAN, UART, and SPI connect directly to industrial networks, while FPGA fabric implements custom safety logic and fast interrupt handlers required by IEC 61508 functional safety standards.
추천
Military Radar and Electronic Warfare
The 10AS066H2F34I1HG supports military radar and electronic warfare (EW) applications because its 660K logic elements handle wideband digital beamforming, pulse compression, and adaptive jamming algorithms in parallel. The dual-core ARM Cortex-A9 HPS runs threat library databases and mission management software. High-speed transceivers at 12.5 Gbps process digitized antenna array data streams, while variable-precision DSP blocks implement fast Fourier transforms for radar signal processing. Industrial temperature range ensures operation in military vehicle and airborne environments. The FPGA-HPS shared memory architecture via AXI buses enables deterministic low-latency communication between hardware accelerators and mission software, critical for time-sensitive EW responses.
추천
Broadcast Video Processing
The 10AS066H2F34I1HG serves broadcast video processing because its FPGA fabric handles real-time HEVC/H.264 encoding, color space conversion, and overlay compositing at 4K resolutions. The dual-core ARM Cortex-A9 HPS runs video transport protocols (SMPTE 2022, NDI, or MPEG-TS) and network management. Multi-gigabit transceivers support 12G-SDI and HDMI 2.0 interfaces for uncompressed video transport. DDR4 memory controllers sustain the bandwidth required for reference frame buffering at high resolutions. Industrial temperature grade suits outdoor broadcast equipment and mobile production units. The integrated SoC architecture reduces system latency by allowing direct fabric-to-HPS video frame transfer without external memory.
추천
Medical Imaging Accelerators
The 10AS066H2F34I1HG accelerates medical imaging workloads such as CT reconstruction, MRI image processing, and ultrasound beamforming because its parallel fabric executes back-projection, Fourier transforms, and image filtering algorithms at line-rate. The dual-core Cortex-A9 HPS manages DICOM networking, user interface, and patient data handling. Hardened PCIe Gen3 IP enables connection to host workstations or capture cards, while on-chip DSP blocks implement floating-point reconstruction algorithms efficiently. Industrial temperature range supports operation in clinical and laboratory environments. The SoC integration reduces system size for portable imaging carts, and the FPGA-HPS shared memory model eliminates external frame-buffer transfers that would otherwise limit frame rate.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS066H2F34I1HG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS066H2F34E2SG | 10AS066H2F34E2LG | 10AS066H2F34E1HG | 10AS066H1F34I1HG | 10AS066H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-pin FC-FBGA (35x35 mm) | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 (H1 family) | 660,000 (H1 family) |
| HPS Core | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz |
| Speed Grade | -2 (H2) | -2 | -2 | -1 (slower) | -2 (H1 family) | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Extended | Extended | Industrial (-40C to +100C) | Extended |
| User I/O Count | 492 | 492 | 492 | 492 | 492 | 492 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
주요 차별점
- Integrated dual-core ARM Cortex-A9 HPS at 1.5 GHz (vs 10AS066H1F34I1HG)
- Industrial temperature grade (-40C to +100C) (vs 10AS066H2F34E2SG)
- 660K logic elements in a single SoC device (vs 10AS066H1F34E1HG)
설계 노트
The 10AS066H2F34I1HG requires multiple power rails: 0.9 V core, 1.8 V/2.5 V/3.3 V I/O, and dedicated HPS rails (1.1 V, 1.5 V, DDR PHY). Use a sequenced power controller such as the LTC2978 or similar to enforce Intel-specified power-up and power-down sequencing. Decoupling: place 0.1 uF and 10 uF ceramic capacitors adjacent to every power pin, with bulk capacitance distributed across the board. Refer to Intel's 'Arria 10 Power Management User Guide' for the authoritative sequence and tolerance windows.
The 35x35 mm FC-FBGA package has limited heat dissipation through the PCB; in -2 speed grade industrial applications, worst-case power can exceed 25 W. Use a high-layer-count PCB (12+ layers) with dedicated inner power/ground planes, and attach a heatsink with thermal interface material rated for the junction-to-ambient resistance target. Maintain ambient temperature within the device's industrial range (-40C to +100C) by verifying chassis airflow or conduction-cooling capacity.
The 1152-ball FC-FBGA requires a high-density PCB with microvia stack-ups and 0.4-0.5 mm pitch escape routing. Use Intel's 'Arria 10 GX/SX FPGA Board Design Guidelines' for trace width, impedance targets (100 ohm differential for transceivers, 50 ohm single-ended), and layer stackup recommendations. Length-match high-speed interfaces (DDR4, PCIe, transceivers) per the Quartus Prime Fitter reports after place-and-route.
Route multi-gigabit transceiver channels on the top layers with a continuous reference ground plane beneath; avoid crossing reference plane splits. Decouple HPS clock inputs with high-Q crystals or oscillators meeting the jitter spec defined in the HPS clock controller section of the device datasheet. Place the JTAG header within 2 inches of the device for reliable programming, and add test points for PROG_N, CONFIG_DONE, and INIT_DONE signals for debugging.
A common pitfall is configuring the HPS boot source pins incorrectly, which can cause non-boot. Verify MSEL[4:0] and BOOTSEL pin straps against the intended boot source (QSPI, SD, NAND, or eMMC) before board bring-up. Another pitfall is omitting the external watchdog or reset supervisor on HPS reset, leading to boot hangs on power glitches. Always include a POR supervisor with appropriate reset pulse width.
규정 준수 정보
RoHS and REACH compliance per Intel Arria 10 product documentation. AEC-Q100 qualification is not applicable for FPGAs (this is an automotive IC qualification standard typically not pursued for high-density FPGAs). Conflict minerals compliance per Intel's published Conflict-Free Smelter Program disclosures.