10AX090S3F45E2LG - Arria 10 GX FPGA 900K LE, 1932-FCBGA | Intel
부품 번호: 10AX090S3F45E2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $15820 | $15,820.00 |
| 10 | $14950 | $149,500.00 |
| 100 | $14100 | $1,410,000.00 |
| 500 | $13250 | $6,625,000.00 |
| 1,000 | $12480 | $12,480,000.00 |
10AX090S3F45E2LG 개요
What is an FPGA? A Field-Programmable Gate Array is a reconfigurable integrated circuit whose logic, interconnect, and I/O behavior are defined by user-supplied configuration bitstreams rather than fixed mask layers. FPGAs sit at the apex of programmable logic alongside CPLDs and are commonly used for ASIC prototyping, hardware-accelerated compute, communications baseband, and any application demanding parallel, deterministic latency. The Arria 10 family belongs to Intel's mid-range portfolio between Cyclone (low-power) and Stratix (high-performance).
Key features of this device include up to 24.33 Gbps transceivers for high-speed serial links, integrated hard IP for PCIe Gen3, 10/25/40/100 Gigabit Ethernet, Interlaken, and CPRI, plus a hardened Floating-Point DSP block. The chip integrates a dual-core ARM Cortex-A9 hard processor subsystem variant in some Arria 10 SKUs, and provides advanced power management with smart voltage ID (SmartVID) to reduce dynamic power. Memory interfaces support DDR4 up to 2666 MT/s with physical layer hard controllers.
Typical applications include wireless baseband processing, military radar arrays, medical imaging pipelines, broadcast video processing, high-end test and measurement equipment, and high-performance computing accelerators. In these systems, the 10AX090S3F45E2LG provides the parallel DSP throughput and transceiver bandwidth needed for real-time data movement and processing. The dense logic fabric also enables multi-protocol bridging on a single device.
When designing with this part, thermal management is critical. The flip-chip BGA package typically dissipates 20-40W depending on utilization, so a multi-layer PCB with thermal vias and, often, a heatsink is required. Designers must use Quartus Prime design software (Standard or Pro edition) and follow Intel's pinout guidelines for power, ground, and high-speed transceiver routing. Use IBIS or HSPICE models for signal-integrity closure on memory and transceiver channels.
This page synthesizes distributor pricing, drop-in same-family alternatives, and PCB-aware design notes that go beyond the manufacturer's datasheet block diagrams to help engineers move from concept to prototype quickly.
드롭인 대체품: 10AX090S3F45E2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090S3F45E2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, DSP Blocks, Transceivers, Process Node.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090S2F45E2LG
✅ 드롭인✓ 재고 있음
$3750 / 개
데이터시트 보기 →10AX090S2F45E2SG
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →10AX090S2F45E1SG
✅ 드롭인✓ 재고 있음
$4890 / 개
데이터시트 보기 →10AX090S1F45E1SG
✅ 드롭인✓ 재고 있음
$8200 / 개
데이터시트 보기 →10AX090R4F40E3LG
✅ 드롭인✓ 재고 있음
$4415.91 / 개
데이터시트 보기 →10AX090R3F40E2LG
✅ 드롭인✓ 재고 있음
$5750 / 개
데이터시트 보기 →10AX090S3F45E2LG 최대 정격 & 전기적 특성
| Series | Arria 10 GX |
| Logic Elements | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 |
| Embedded Memory (bits) | 59,234,304 |
| DSP Blocks | 1,518 |
| Transceivers | 624 (per package aggregate channels) |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) |
| 패키지 | 1932-ball FCBGA (F45, 45mm flip-chip BGA) |
| Process Node | TSMC 20nm |
| Core Voltage (nominal) | 0.9 V |
| User I/O Banks | 12 |
| Maximum User I/O | 624 |
| 동작 온도 범위 | 0C to 100C (E2 commercial) |
| Speed Grade | S3 (-2 speed grade equivalent) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 |
10AX090S3F45E2LG 1932-ball fcbga (f45, 45mm flip-chip bga) 핀 구성 가이드
10AX090S3F45E2LG(1932-ball fcbga (f45, 45mm flip-chip bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090S3F45E2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090S3F45E2LG 적합 용도: 8 애플리케이션s: 10G/25G Optical Transport Networking, Wireless Baseband and CPRI Processing, Phased-Array Radar Signal Processing, Medical Imaging and Diagnostic Equipment, High-Performance Compute Acceleration, Broadcast Video Processing and 4K/8K Routing, Test and Measurement Instrumentation, Industrial Factory Automation and Machine Vision.
10G/25G Optical Transport Networking
The 10AX090S3F45E2LG fits 10G and 25G optical transport line cards because of its 624 high-speed transceivers operating up to 17.4 Gbps per lane (and up to 25.78 Gbps on GT channels) and its integrated hard IP for 10G/25G Ethernet, Interlaken, and CPRI. Placed as the central switching/forwarding engine, it aggregates multiple SFP+/SFP28 optical modules and feeds a backplane or fabric ASIC. The 900K logic elements plus 1,518 hardened floating-point DSP blocks deliver wire-speed packet processing, MAC/PCS offload, and OTN framer functions without external ASSPs. Power consumption typically sits in the 20-35W range at full utilization, requiring a heatsink.
추천
Wireless Baseband and CPRI Processing
The 10AX090S3F45E2LG is well-matched to 4G/5G baseband units where CPRI and eCPRI links between BBU and RRU must be processed in real time. The device's transceivers support up to 24 Gbps data rates, sufficient for 8x CPRI 9.8G or 4x 25G eCPRI aggregation. The hardened floating-point DSP blocks accelerate FFT, channel estimation, and turbo/Polar decoding while freeing logic for custom MAC scheduling. A typical board uses 2-4 transceivers per sector on a 4T4R radio, so the 624-channel budget covers multiple sectors with headroom. Designers rely on the Arria 10 DDR4 controller to buffer IQ samples.
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Phased-Array Radar Signal Processing
For military and commercial phased-array radar front-ends, the 10AX090S3F45E2LG provides the wide bandwidth and DSP density required for beamforming and pulse compression. Each transmit/receive channel runs at hundreds of MSPS through ADCs, and the device's parallel DSP fabric performs FFT, windowing, and Doppler processing across thousands of channels. The 900K LE and 59 Mb of embedded memory hold sample buffers and twiddle tables without external SRAM. Operating at commercial temperature, this part suits ground-based and shipboard radar enclosures with controlled cooling.
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Medical Imaging and Diagnostic Equipment
The 10AX090S3F45E2LG is suitable for high-end medical imaging modalities including ultrasound, CT, and MRI reconstruction. Ultrasound beamforming in particular requires hundreds of parallel multiply-accumulate operations per sample, which the 1,518 hardened floating-point DSP blocks execute efficiently. Compliance with IEC 60601-1 and IEC 62304 is the integrator's responsibility; the part itself is non-medical-grade silicon. Low-latency parallel signal paths reduce image-acquisition latency and enable real-time elastography or 3D rendering. Use the Arria 10 DDR4 controller to stream raw sample data to host processors.
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High-Performance Compute Acceleration
The 10AX090S3F45E2LG acts as a hardware accelerator for HPC workloads such as genomics, financial Monte Carlo simulation, and machine-learning inference. PCIe Gen3 x8 hard IP provides low-latency host attachment, while multiple transceivers enable direct links to NVMe-over-Fabric or proprietary fabric fabrics. OpenCL and Intel FPGA SDK for OpenCL let developers compile kernels from C/C++ instead of RTL, shortening time-to-results. Sustained floating-point throughput above 1 TFLOP/s is achievable with full DSP utilization, making the device competitive with mid-range GPUs on per-watt metrics.
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Broadcast Video Processing and 4K/8K Routing
Broadcast video routers and processing frames need multi-gigabit serial links for SDI (up to 12G-SDI) and parallel interfaces for 4K/8K video streams. The 10AX090S3F45E2LG's transceivers convert SDI to packet-based formats while the logic fabric handles format conversion, frame synchronization, and chroma resampling. A typical 8K processing card uses four 12G-SDI inputs feeding the FPGA, with output to HDMI 2.1 or DisplayPort via external bridge chips. The DDR4 memory controller buffers multi-frame stores for processing.
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Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators use the 10AX090S3F45E2LG for real-time DSP, FFT analysis, and protocol-aware triggering. The 900K LE allow very deep capture memory and complex trigger sequencers running in parallel without missing events. Transceivers are repurposed as digital serial analyzer inputs for PCI Express, USB, and Ethernet compliance testing. The large logic budget also supports customer-definable custom protocols through soft IP, providing a future-proof platform for emerging standards.
추천
Industrial Factory Automation and Machine Vision
Multi-camera machine vision systems with real-time inference use the 10AX090S3F45E2LG to aggregate Camera Link, CoaXPress, or GigE Vision streams and run defect-detection classifiers. The hardened floating-point DSP accelerates image preprocessing (filtering, color conversion) while custom logic performs decision-making at line rate. Transceivers enable long-reach CoaXPress links up to 13 Gbps per cable, allowing flexible factory layouts. Industrial temperature variants of this die (10AX090S2F45I2LG or 10AX090S3F45I2SG) extend the operating envelope to -40C to +100C for harsh environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090S3F45E2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090S2F45E2LG | 10AX090S2F45E2SG | 10AX090S2F45E1SG | 10AX090S1F45E1SG | 10AX090R4F40E3LG | 10AX090R3F40E2LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F40) - same ball count, F40 variant | 1932-ball FCBGA (F40) - same ball count, F40 variant |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | S3 (-2) | S2 (-3, faster) | S2 (-3, faster) | S2 (-1, slowest) | S1 (-1, slowest, lower power) | R4 (-3, fastest) | R3 (-2) |
| Operating Temperature | 0C to 100C (E2 commercial) | 0C to 100C (E2 commercial) | -40C to 100C (I2 industrial) | -40C to 100C (I1 industrial) | -40C to 100C (I1 industrial) | 0C to 100C (E3 commercial) | 0C to 100C (E2 commercial) |
| Embedded Memory (Mb) | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| Transceivers (max) | 624 (up to 17.4 Gbps) | 624 (up to 17.4 Gbps) | 624 (up to 17.4 Gbps) | 624 (up to 17.4 Gbps) | 624 (up to 17.4 Gbps) | 24 transceivers (F40 package reduces count) | 24 transceivers (F40 package reduces count) |
| Lifecycle Status | Active | Active | Active | Active | Active | Active | Active |
주요 차별점
- Highest density in Arria 10 family with 900K LEs and 624 transceiver channels (vs 10AS066K3F35E2LG)
- Same-package speed-grade flexibility without re-layout (vs 10AX090R4F40E3LG (F40 package))
- Hardened floating-point DSP blocks (vs 10AS057K4F35I3SG)
설계 노트
The 1932-ball F45 FCBGA at full 900K-LE utilization typically dissipates 25-40 W depending on toggle rate and DSP activity. Use the Arria 10 PowerPlay Early Power Estimator before final layout to size the heatsink. A minimum 8-layer PCB stackup with a dedicated inner ground/power plane and an array of thermal vias under the central die area is required. Forced airflow of 200-400 LFM is recommended in chassis with no convection.
Place decoupling capacitors on the bottom side of the PCB directly beneath their associated package balls using microvias. The Intel Arria 10 documentation specifies 0.1 uF X7R ceramics at every power pin group, plus bulk 22-47 uF tantalum or polymer caps at the voltage regulator footprints. Maintain 100 ohm differential impedance for high-speed transceiver channels up to 17.4 Gbps and 85 ohm for lower-speed LVDS. Use length-matching within 0.13 mm for transceiver pairs.
Keep transceiver channels on the package edge, using the shortest possible breakout length. Series coupling capacitors for transceiver TX must be placed within 25 mm of the BGA ball. Avoid crossing transceiver lanes to keep crosstalk below -40 dB. Reference each transceiver RX/TX pair to a continuous ground plane, never split power. Use IBM/Intel reference designators for the lane-to-pin mapping when designing your schematic symbol.
Run pre-layout signal-integrity simulation using the IBIS-AMI models from Intel for every DDR4 byte lane. After board fab, perform post-layout extraction with the same models to verify the timing margins are at least 50 ps for clocks and 30 ps for DQ. For 10G-KR/25G-KR backplanes, use the Arria 10 adaptive equalization (AEQ) blocks to compensate for channel loss. Note that AEQ requires training sequences at startup, which may extend link-up time.
Common design pitfalls: (1) forget to apply SmartVID enable pins - the device will not regulate core voltage if the VID pins are floating; (2) mis-assign the JTAG TCK/TMS pull-downs - the configuration will fail to load if these are not pulled; (3) over-provision PLL reference clocks - the fractional-N PLL will not lock if the reference is unstable; (4) leave configuration mode pins floating - configure them to AS or JTAG mode explicitly before board bring-up.
규정 준수 정보
RoHS compliance confirmed via Richard Electronics and Altera product page; per the package code BGA1932,44X44,40 description. AEC-Q100 is not applicable to FPGAs (commercial/industrial temperature grades only).
