5CSEBA2U19I7SN - 25K Logic, 800MHz Cyclone V SoC | Altera
부품 번호: 5CSEBA2U19I7SN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $74.7678 | $74.77 |
| 10 | $72.96 | $729.60 |
| 100 | $70.18 | $7,018.00 |
| 500 | $68.02 | $34,010.00 |
| 1,000 | $65.96 | $65,960.00 |
5CSEBA2U19I7SN 개요
A system-on-chip FPGA integrates a processor subsystem with configurable FPGA fabric on one device. Within the semiconductor hierarchy, the 5CSEBA2U19I7SN belongs to the FPGA and SoC family, bridging application-specific processing and field-programmable hardware acceleration. The ARM Cortex-A9 MPCore provides a processor-based execution path, while CoreSight supplies debug and trace capabilities. The Cyclone V SE architecture allows system logic, interfaces, control functions, and parallel data processing to be implemented in programmable fabric.
The verified headline parameters are 25K logic elements, 800 MHz, and a 484-UBGA package with 19 mm by 19 mm dimensions. The product is also described as a single ARM Cortex-A9 MPCore with CoreSight system-on-chip. Distributor listings identify 240 I/O for this ordering code. These characteristics make it suitable for systems that need both embedded software execution and configurable digital logic without using separate processor and FPGA devices.
Typical applications include industrial automation controllers, communications equipment, test and measurement systems, and embedded vision or data-acquisition platforms. The FPGA fabric can implement timing-critical interfaces and parallel processing functions, while the ARM subsystem can run operating systems, control software, and protocol stacks. CoreSight integration supports processor bring-up and embedded debugging. The 484-UBGA package provides a substantial high-density package platform for designs requiring many programmable I/O connections.
Designers should verify board-level power rails, configuration circuitry, memory interfaces, clock distribution, thermal behavior, and exact ball assignments against the manufacturer documentation before release to production. The verified web data does not provide the complete 484-ball pinout, individual I/O bank limits, transceiver count, memory type, operating-voltage range, or thermal-resistance values, so those details must be confirmed from the full manufacturer datasheet. Pricing and availability should also be checked with an authorized distributor.
This page combines verified distributor specifications, package information, pricing observations, and clearly marked data gaps. Its practical value is a concise engineering entry point for identifying the part, comparing same-package options, and planning the next documentation and PCB verification steps.
드롭인 대체품: 5CSEBA2U19I7SN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA2U19I7SN (동일 폼 팩터 및 풋프린트) — 차이점: Logic Elements, Package, RoHS Status, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA2U19C7SN
✅ 드롭인✓ 재고 있음
$40.33 / 개
데이터시트 보기 →5CSEBA5U19I7SN
✅ 드롭인✓ 재고 있음
$118.4 / 개
데이터시트 보기 →5CSEBA6U19C8SN
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →5CSEBA2U19I7N
✅ 드롭인✓ 재고 있음
$445.65 / 개
데이터시트 보기 →5CSEBA2U19C8SN
✅ 드롭인✓ 재고 있음
$198.4 / 개
데이터시트 보기 →5CSEBA2U19I7SN 최대 정격 & 전기적 특성
| Device Type | Cyclone V SE FPGA system-on-chip (SoC) |
| Processor Core | Single ARM Cortex-A9 MPCore |
| Debug Technology | CoreSight |
| Logic Elements | 25K logic elements |
| Device Frequency | 800 MHz |
| I/O Count | 240 I/O |
| 패키지 | 484-UBGA |
| Package Dimensions | 19 mm x 19 mm |
| FPGA Architecture | Cyclone V SE |
| 실장 유형 | Surface mount |
| Integrated Processor | Yes |
| Logic Technology | Field-programmable gate array |
| Device Category | Embedded system-on-chip FPGA |
| RoHS 상태 | unknown |
| REACH Status | unknown |
| AEC-Q100 Status | unknown |
5CSEBA2U19I7SN 19 mm x 19 mm 핀 구성 가이드
5CSEBA2U19I7SN(19 mm x 19 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA2U19I7SN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA2U19I7SN 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Communications Equipment, Test and Measurement Instrument, Embedded Data-Acquisition Platform, Embedded Vision and Image Processing, Automotive and Transportation Electronics.
Industrial Automation Controller
The 5CSEBA2U19I7SN fits industrial automation controllers that need embedded software, deterministic logic, and many external connections in one device. Its single ARM Cortex-A9 MPCore can run control software, protocol stacks, and supervisory functions, while the 25K logic elements can implement state machines, sensor interfaces, motion-control timing, and safety-oriented logic partitioning. The 240-I/O listing is useful when the controller must connect to encoders, digital I/O, analog-to-digital converters, and industrial communications devices. A practical implementation should use the FPGA fabric for deterministic parallel processing and the processor for sequencing, configuration, and higher-level management. The 800 MHz listing is a device-level performance figure, not a guaranteed timing result, so clock constraints and external memory behavior must be checked in the manufacturer documentation.
추천
Communications Equipment
The 5CSEBA2U19I7SN is a practical candidate for communications equipment that combines packet processing, control software, and hardware datapaths. The ARM Cortex-A9 MPCore can host protocol software and management tasks, while the FPGA fabric can implement framing, buffering, clock-domain crossing, filtering, and interface adaptation. The 25K logic-element capacity provides room for moderate parallel logic without moving to a larger device, and the verified 240-I/O count supports systems with multiple external buses and control signals. The package is a 484-UBGA device measuring 19 mm by 19 mm, so signal escape, power integrity, and high-speed routing require careful planning. Designers should verify the exact transceiver and I/O-bank capabilities in the full Cyclone V documentation because the supplied verified data does not list transceiver count or electrical limits.
추천
Test and Measurement Instrument
In a test and measurement instrument, 5CSEBA2U19I7SN can provide both control and real-time signal-processing functions. The ARM Cortex-A9 MPCore is suited to user-interface control, data formatting, calibration workflows, and communications with a host system, while the FPGA fabric can capture samples, generate timing sequences, detect events, and process multiple channels in parallel. The verified 25K logic elements and 800 MHz performance figure support moderate logic-density designs, while 240 I/O help connect converters, sensors, triggers, and test fixtures. A careful architecture should isolate high-speed acquisition paths from slower control signals and use appropriate clock and power domains. The supplied data does not provide the number of multipliers, memory blocks, PLLs, or high-speed interfaces, so those resources must be confirmed before committing to a design.
추천
Embedded Data-Acquisition Platform
The 5CSEBA2U19I7SN suits embedded data-acquisition platforms that need an operating-system-capable processor and programmable acquisition logic. The Cortex-A9 MPCore can manage data storage, conversion control, network transfer, and local processing, while the FPGA fabric can interface to parallel converters, implement timing generators, and reduce incoming data before it reaches software. The verified 240-I/O specification provides substantial connection potential for multi-channel systems, and the 484-UBGA package is appropriate for dense board layouts when signal escape and power delivery are carefully designed. The design should define fixed-latency boundaries between the fabric and processor, account for DMA and memory bandwidth, and validate the actual I/O electrical standards. Operating voltage, thermal limits, memory resources, and transceiver details are not included in the supplied web data.
추천
Embedded Vision and Image Processing
The 5CSEBA2U19I7SN can support embedded vision systems where image capture, preprocessing, and application control share a single platform. The FPGA fabric can perform pixel formatting, filtering, region-of-interest extraction, line buffers, and parallel image operations, while the ARM Cortex-A9 MPCore can run image analysis, user interfaces, and communication services. The verified 25K logic elements may suit compact preprocessing pipelines, but available memory blocks, multipliers, and external memory interfaces are not stated in the supplied data. The 800 MHz value should be treated as a device-level specification from the distributor listing, not as a complete design guarantee. A production design should estimate pixel throughput, frame-buffer bandwidth, clock rates, and thermal conditions using the manufacturer resource and timing tables before selecting the part.
추천
Automotive and Transportation Electronics
5CSEBA2U19I7SN may be evaluated for transportation electronics that require embedded processing and programmable I/O, but the supplied data does not establish an automotive qualification. The device offers a single ARM Cortex-A9 MPCore, 25K logic elements, 800 MHz listed performance, and 240 I/O, which can support control, monitoring, communications, and sensor aggregation. The FPGA fabric can implement deterministic input processing and interface logic, while the processor can manage application software and diagnostics. Before using it in an automotive design, confirm AEC-Q100 status, operating temperature range, PPAP documentation, quality flow, reliability data, and long-term supply commitments from the manufacturer. The package is a 484-UBGA device measuring 19 mm by 19 mm, so PCB reliability, thermal cycling, solder joint qualification, and environmental testing are also essential.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA2U19I7SN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA2U19C7SN | 5CSEBA5U19I7SN | 5CSEBA2U19I7N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 484-UBGA, 19 mm x 19 mm | 484-FBGA | 484-UBGA | 484-UBGA |
주요 차별점
- Higher listed I/O count than 5CSEBA2U19C7SN (vs 5CSEBA2U19C7SN)
- Higher listed I/O count than 5CSEBA5U19I7SN (vs 5CSEBA5U19I7SN)
- Integrated processor and FPGA fabric (vs 5CSEBA2U19C7SN)
설계 노트
Verify every required rail, power-up sequence, current limit, and decoupling network against the manufacturer datasheet before schematic release. The supplied web data confirms 25K logic elements, 800 MHz, and a 484-UBGA package but does not provide voltage ranges, current consumption, or power sequencing. Use local bulk and high-frequency decoupling close to the package, define power domains in the design constraints, and simulate startup behavior. Estimated power calculations are not possible from the verified material because the device’s actual configuration, clocking, I/O utilization, and processor activity are not specified.
Treat the 484-UBGA package as a high-density BGA layout that requires a verified escape strategy rather than a generic 19 mm by 19 mm footprint. Obtain the manufacturer land pattern, complete ball map, I/O-bank tables, and recommended via and trace geometry before PCB fabrication. Separate sensitive clock and processor signals from switching power and high-current outputs where possible. The provided data does not include ball assignments or stack-up recommendations, so the package name alone is insufficient for pin-accurate implementation.
Use controlled impedance for high-speed interfaces and define clock, reset, configuration, and memory topologies in the HDL and PCB constraints. The 5CSEBA2U19I7SN is listed at 800 MHz, but the available material does not identify the exact high-speed interfaces, transceiver count, I/O standards, or timing limits. Validate every external interface with IBIS or manufacturer-provided signal-integrity models, account for simultaneous switching behavior, and keep reference-clock paths short and continuous. Do not infer fabric timing from the distributor frequency value.
Thermal design must use the final configuration, clock rates, toggle rates, output loading, processor workload, and ambient conditions. The verified data does not provide junction-to-ambient resistance, junction-to-case resistance, maximum junction temperature, or package power limits. Place thermal vias beneath exposed or internal package features only when permitted by the manufacturer land pattern, spread heat through the board stack-up, and verify temperature with a representative system test. Estimated thermal values are intentionally omitted because the required input conditions are not available.
규정 준수 정보
The verified web data does not provide compliance, automotive qualification, lead-free, halogen-free, or conflict-minerals statements.
