5CSEBA6U19I7SN - Cyclone V SE SoC FPGA 110K LE | Intel | UBGA-484
MPN: 5CSEBA6U19I7SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 250 | $332 | $83,000.00 |
| 500 | $305 | $152,500.00 |
Drop-in alternatives for 5CSEBA6U19I7SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSEBA6U19C7SN
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View Datasheet →5CSEBA5U19I7SN
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View Datasheet →5CSEBA6U19I7SN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Hard Processor System (HPS) | Single-core ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements (LEs) | 110,000 |
| Logic Array Blocks (LABs) | 4150 |
| Maximum User I/Os | 66 |
| On-chip Memory | 64 KB |
| DSP Blocks | Variable-precision DSP blocks |
| PLLs | Integrated phase-locked loops |
| HPS Maximum Frequency | 800 MHz |
| External Memory Support | DDR3, DDR3L, LPDDR2 (via HPS) |
| Process Technology | 28 nm low-power (TSMC) |
| Package | 484-pin UBGA (19x19 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | Industrial grade (I) -40C to +100C junction |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Ordering Part Number | 5CSEBA6U19I7SN |
5CSEBA6U19I7SN 484-pin ubga (19x19 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA6U19I7SN (484-pin ubga (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U19I7SN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA6U19I7SN is suitable for 6 applications: Industrial Motor Control and Drive, Machine Vision and Industrial Imaging, Human-Machine Interface (HMI) and Industrial Displays, Factory Automation and Protocol Bridging, Point-of-Sale and Retail Terminals, Broadcast Auxiliary Data and Pro-Audio Processing.
Industrial Motor Control and Drive
The 5CSEBA6U19I7SN is well-suited for industrial motor-control applications because its single-core ARM Cortex-A9 HPS at 800 MHz can execute real-time control loops (field-oriented control, trapezoidal commutation) while the FPGA fabric runs deterministic PWM generation and encoder decoding. The 110K LE capacity absorbs custom logic for safety interlocks, STO (safe torque off), and Modbus/Profibus bridges. Industrial-grade -40C to +100C junction tolerance (I7) ensures reliable operation in cabinet environments reaching 70C ambient. Using Quartus Prime Standard, designers map the FPGA control fabric and HPS C-code to a single chip, reducing BOM cost versus a discrete MCU-plus-FPGA partition.
Recommended
Machine Vision and Industrial Imaging
For machine-vision pipelines, the 5CSEBA6U19I7SN pairs an FPGA fabric capable of real-time image preprocessing (Sobel, threshold, Bayer demosaic, histogram) with a Linux-capable ARM Cortex-A9 running the application layer. The variable-precision DSP blocks handle 1080p30 streams at modest frame sizes, while the HPS executes OpenCV-based classification. The UBGA-484 (19x19 mm) package provides the I/O density needed for parallel image-sensor interfaces (MIPI-CSI bridge, parallel CMOS). Industrial I7 grade supports factory-floor deployment. Typical designs use HPS DDR3 for frame buffers and FPGA fabric for high-throughput pixel processing.
Recommended
Human-Machine Interface (HMI) and Industrial Displays
The 5CSEBA6U19I7SN is a strong fit for industrial HMIs where a Linux-capable Cortex-A9 runs Qt/QML rendering while the FPGA fabric handles TFT/LVDS timing generation and touch-panel scanning. The single-core HPS at 800 MHz drives modest 7-10 inch WVGA/XGA panels smoothly, and the 110K LE capacity supports custom 2D accelerators, video overlays, and fail-safe display freeze logic. Industrial I7 temperature grade tolerates cabinet mounting at 60-70C ambient. The UBGA-484 package accommodates the parallel RGB or LVDS panel interface plus USB 2.0, Ethernet (via HPS EMAC), and CAN bus connectivity typical of industrial HMI BOMs.
Recommended
Factory Automation and Protocol Bridging
For factory-automation gateways, the 5CSEBA6U19I7SN integrates multiple industrial protocols (EtherCAT, PROFINET, Modbus TCP, CANopen) in the FPGA fabric while the ARM Cortex-A9 HPS executes Linux-based protocol stacks and supervisory logic. The single-core HPS at 800 MHz handles multiple Ethernet sessions and JSON/REST northbound interfaces. Industrial I7 grade and the robust UBGA-484 U19 package make it suitable for DIN-rail-mounted PLCs and protocol-converter modules. FPGA-based deterministic MAC/PHY timing alongside HPS-based packet processing is a well-established pattern for industrial Ethernet slaves.
Recommended
Point-of-Sale and Retail Terminals
The 5CSEBA6U19I7SN suits point-of-sale terminals that need secure payment processing (HPS running Linux with PCI PTS software) and FPGA-driven peripherals (barcode imagers, thermal printers, encrypted PIN pads). The single-core Cortex-A9 with NEON accelerates cryptographic primitives (AES, RSA, ECC) for transaction signing, while FPGA fabric handles custom display controllers and tamper-detection logic. Although commercial C8 grade is more typical for indoor POS deployments, the industrial I7 grade extends lifetime to 10+ years in kiosks and outdoor vending machines. The UBGA-484 U19 package provides ample I/O for multiple serial peripherals.
Recommended
Broadcast Auxiliary Data and Pro-Audio Processing
In broadcast and pro-audio applications, the 5CSEBA6U19I7SN leverages its DSP blocks for FIR/IIR filters, audio sample-rate conversion, and metadata embedding (SMPTE 2020, AES3 channel status). The ARM Cortex-A9 HPS runs web-based remote-management software, while the FPGA fabric maintains deterministic audio sample-clock jitter under 1 ns. Industrial I7 grade supports studio and field-deployment environments. The 110K LE capacity enables multi-channel audio engines (32+ channels at 48 kHz) with FPGA-driven ASRC. The UBGA-484 U19 package accommodates multiple MADI/AES3 transceivers via user I/Os.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U19I7SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U19I7N | 5CSEBA6U19I7NTS | 5CSEBA6U19I7LN | 5CSEBA6U19C8SN | 5CSEBA6U19C7SN | 5CSEBA5U19I7SN |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin UBGA (U19, 19x19 mm) | 484-pin UBGA (U19, 19x19 mm) - same | 484-pin UBGA (U19, 19x19 mm) - same | 484-pin UBGA (U19, 19x19 mm) - same | 484-pin UBGA (U19, 19x19 mm) - same | 484-pin UBGA (U19, 19x19 mm) - same | 484-pin UBGA (U19, 19x19 mm) - same |
| Logic Elements | 110,000 | 110,000 (same) | 110,000 (same) | 110,000 (same) | 110,000 (same) | 110,000 (same) | 85,000 (-23%) |
| HPS Configuration | Single-core ARM Cortex-A9 MPCore | Single-core ARM Cortex-A9 MPCore (same) | Single-core ARM Cortex-A9 MPCore (same) | Single-core ARM Cortex-A9 MPCore (same) | Single-core ARM Cortex-A9 MPCore (same) | Single-core ARM Cortex-A9 MPCore (same) | Single-core ARM Cortex-A9 MPCore (same) |
| HPS Maximum Frequency | 800 MHz | 800 MHz (same) | 800 MHz (same) | 800 MHz (same) | 800 MHz (same) | 800 MHz (same) | 800 MHz (same) |
| Temperature Grade | Industrial I7 (-40C to +100C junction) | Industrial I7 (-40C to +100C) | Industrial I7 (-40C to +100C) | Industrial I7 (-40C to +100C) | Commercial C8 (0C to +85C) | Commercial C7 (0C to +85C) | Industrial I7 (-40C to +100C) |
| User I/Os | 66 | 66 (same) | 66 (same) | 66 (same) | 66 (same) | 66 (same) | 66 (same) |
| Process Technology | 28 nm low-power (TSMC) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) |
| RoHS Compliant | Yes | Yes | Yes | Yes (lead-free) | Yes | Yes | Yes |
Key Differentiators
- Industrial -40C to +100C temperature grade in the same U19 package as commercial C8 (vs 5CSEBA6U19C8SN)
- Drop-in supply-chain alternatives within the same Cyclone V SE family (vs 5CSEBA6U19I7N)
- Mid-density 110K LE with industrial-grade qualification (vs 5CSEBA5U19I7SN)
Design Notes
Estimated: at typical SoC FPGA utilization (~70% LE, ~50% DSP, HPS running Linux) the 5CSEBA6U19I7SN dissipates approximately 3-5 W depending on toggle rate. The UBGA-484 (19x19 mm) U19 package has a junction-to-ambient thermal resistance of roughly 12-15 C/W on a 6-layer PCB with adequate thermal vias and ground pour, so under industrial -40C to +100C envelope the part must keep junction temperature below 100C. In cabinet deployments at 60-70C ambient, design copper flood at least 50% of the BGA break-out region on top and inner layers with 0.3 mm thermal vias. If higher FPGA utilization is expected (90%+ LE, full DSP, high HPS load), an active heat sink or airflow is recommended.
The 484-ball UBGA (19x19 mm) U19 package uses a 1.0 mm ball pitch, requiring microvia (HDI) PCB technology with at least 4-6 build-up layers and laser-drilled vias. Per Cyclone V SE family design guidelines, allocate dedicated ground and power planes beneath the BGA, with 0.1 uF + 1 uF + 10 uF decoupling on each power rail (VCCINT, VCCAUX, VCCPD, VCCIO_HPS, VCCIO_FPGA). Match the DDR3 trace lengths to within 25 mil for the HPS EMIF and 50 mil for FPGA fabric memory interfaces. Plan HPS boot pins (BSEL, CSEL) at the architecture stage because they share muxed functions.
Three pitfalls to avoid with the 5CSEBA6U19I7SN: (1) Don't confuse the A6 density code with A4 or A5 - the same UBGA-484 U19 footprint is used across density variants, but pin-compatibility is preserved only across the same OPN-letter family. (2) Quartus Prime Standard edition supports the Cyclone V SE family; do not attempt Cyclone V GX/ST design files in this project because HPS pin assignments differ. (3) When migrating from commercial C8 to industrial I7, re-run timing analysis and power estimation; the I7 grade has tighter timing margins at cold temperatures. Use the Quartus Early Power Estimator (EPE) before tape-out.
Per Cyclone V SE hardware design guidelines, route the HPS EMIF (DDR3/DDR3L) interface on inner layers with 50 ohm controlled impedance, and keep the FPGA fabric DDR/parallel memory interfaces on a separate set of layers. The HPS reference clock (HPS_CLK1) must come from a low-jitter oscillator (less than 50 ppm). Pin 1 of the UBGA is at the corner indicated by a beveled edge or dot; follow the official package footprint file (CSV or DXF) from Intel/Altera rather than approximating from the datasheet drawing. Use Intel's board design tool to verify BGA break-out routing before committing artwork.
Compliance Information
RoHS compliance per Altera/Intel product page. AEC-Q100 not applicable (not an automotive-qualified part). Lead-free packaging standard for UBGA-484 U19. Industrial I7 grade qualified to -40C to +100C junction per Cyclone V SE family datasheet.
