5CSEBA4U19C7SN - Cyclone V SE SoC FPGA, 40K LE, ARM Cortex-A9 | Intel
MPN: 5CSEBA4U19C7SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $252 | $25,200.00 |
| 500 | $235 | $117,500.00 |
| 1,000 | $218 | $218,000.00 |
Drop-in alternatives for 5CSEBA4U19C7SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSEBA4U19C7N
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View Datasheet →5CSEBA4U19I7SN
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View Datasheet →5CSEBA4U19C7SN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40 K |
| Hard Processor System | Single ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Process Technology | 28 nm low-power |
| Core Voltage (FPGA fabric) | 1.1 V |
| Package | 484-UBGA (UBGLA) 19x19 mm |
| Package Code | FBGA (U19) |
| User I/O (approx.) | 161 |
| I/O Standards | LVDS, LVCMOS, SSTL (1.0 V to 3.3 V) |
| Memory Controller | DDR3 / LPDDR2 hard controller |
| DSP Blocks | Variable-precision DSP blocks |
| Configuration Modes | JTAG, AS, PS, FPP |
| Bitstream Encryption | AES (256-bit) |
| Operating Temperature | Commercial (0C to 85C, per 'C' suffix) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
5CSEBA4U19C7SN Pin Configuration
| Pin A1 | I/O Bank 3A — FPGA user I/O (Bank 3A, row A) |
| Pin B1 | I/O Bank 3A — FPGA user I/O (Bank 3A, column B) |
| Pin C1 | GND — Ground |
| Pin D1 | I/O Bank 3B — FPGA user I/O (Bank 3B) |
| Pin E1 | VCCIO_3B — I/O Bank 3B supply voltage |
| Pin F1 | I/O Bank 4A — FPGA user I/O (Bank 4A) |
| Pin G1 | GND — Ground |
| Pin H1 | I/O Bank 4A — FPGA user I/O (Bank 4A) |
| Pin J1 | VCC — FPGA core supply (1.1 V) |
| Pin K1 | I/O Bank 4B — FPGA user I/O (Bank 4B) |
| Pin L1 | I/O Bank 5A — FPGA user I/O (Bank 5A) |
| Pin M1 | GND — Ground |
| Pin N1 | I/O Bank 5A — FPGA user I/O (Bank 5A) |
| Pin P1 | VCCIO_5A — I/O Bank 5A supply voltage |
| Pin R1 | I/O Bank 5B — FPGA user I/O (Bank 5B) |
| Pin T1 | I/O Bank 6A — FPGA user I/O (Bank 6A) |
| Pin U1 | GND — Ground |
| Pin V1 | I/O Bank 6A — FPGA user I/O (Bank 6A) |
| Pin W1 | VCCIO_6A — I/O Bank 6A supply voltage |
| Pin Y1 | I/O Bank 6B — FPGA user I/O (Bank 6B) |
| Pin AA1 | I/O Bank 7A — FPGA user I/O (Bank 7A) |
| Pin AB1 | GND — Ground |
| Pin AC1 | I/O Bank 7A — FPGA user I/O (Bank 7A) |
| Pin AD1 | I/O Bank 7B — FPGA user I/O (Bank 7B) |
| Pin AE1 | I/O Bank 8A — FPGA user I/O (Bank 8A) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA4U19C7SN is suitable for 7 applications: Industrial Machine Vision, Motor Control and Industrial Drives, Video Surveillance DVR/NVR, Factory Automation PLC, Broadcast Video Processing, Medical Imaging Edge Node, Embedded IoT Gateway.
Industrial Machine Vision
The 5CSEBA4U19C7SN fits industrial machine vision because the ARM Cortex-A9 HPS runs Linux-side image acquisition, network stacks (GigE Vision / USB3 Vision), and HMI logic, while the 40K-logic-element FPGA fabric accelerates Bayer demosaicing, lens distortion correction, and CNN feature extraction at line rate. The integrated DDR3 controller sustains the bandwidth required for 1080p60 or multi-stream 720p sensor pipelines, and the variable-precision DSP blocks allow fixed-point throughput without external DSP chips. Designers typically connect a MIPI CSI-2 or LVDS image sensor to FPGA GPIO banks and expose processed frames over GbE from the HPS, reducing total BOM cost versus a discrete CPU + FPGA architecture.
Recommended
Motor Control and Industrial Drives
The 5CSEBA4U19C7SN is widely used in industrial motor drives where deterministic low-latency PWM generation and field-oriented control (FOC) loops must run on the FPGA fabric while the ARM Cortex-A9 HPS executes the application layer, Modbus/EtherCAT stack, and safety supervision. The 28 nm low-power process keeps total SoC dissipation compatible with sealed inverter enclosures, and the LVDS I/O banks interface directly to resolver-to-digital converters and current-sense ADCs. With 40K logic elements, designers can implement multi-axis FOC, encoder interfaces, and predictive maintenance analytics in a single chip, replacing discrete MCU + DSP + CPLD designs.
Recommended
Video Surveillance DVR/NVR
The 5CSEBA4U19C7SN supports multi-channel video surveillance recorders by streaming 4 to 8 channels of H.264/H.265 encoding partially on the FPGA fabric and partially on the ARM Cortex-A9 running a Linux NVR application. The hard DDR3 controller feeds compressed bitstreams to SATA or network-attached storage, while the variable-precision DSP blocks handle motion detection and dewarping without burdening the CPU. Its 161 user I/O enable direct connection to HDMI outputs, audio CODECs, and multiple GbE PHYs, making it a single-chip DVR/NVR SoC for cost-sensitive commercial video products.
Recommended
Factory Automation PLC
The 5CSEBA4U19C7SN suits mid-range factory automation PLCs because the ARM HPS executes IEC 61131-3 runtime and Ethernet/IP or PROFINET stacks while the FPGA fabric implements fast deterministic I/O scanning, high-speed counters, and PWM outputs with microsecond latency. The 28 nm low-power process allows fanless DIN-rail mounting, and the 484-pin UBGLA package exposes enough user I/O to drive 32+ optically isolated digital inputs and outputs directly. Designers pair the SoC FPGA with external ADCs for analog input modules, using the FPGA's M10K RAM blocks as sample buffers.
Recommended
Broadcast Video Processing
Broadcast video processors leverage the 5CSEBA4U19C7SN to perform 3G-SDI or HDMI ingest, color space conversion, scaling, and frame-rate conversion on the FPGA fabric, while the HPS runs a Linux control plane for IP-based management, SNMP, and dynamic configuration. The integrated transceivers in the Cyclone V SE family support 3G-SDI physical layer natively, and the variable-precision DSP blocks execute scaling and deinterlacing in real time without off-chip DSPs. With 40K logic elements, designers can implement a 4-channel 1080p processing pipeline or a single 4K up/down/cross-converter on a single chip.
Recommended
Medical Imaging Edge Node
The 5CSEBA4U19C7SN supports portable and bedside medical imaging endpoints where the ARM HPS handles DICOM networking, user interface, and encryption while the FPGA fabric performs real-time ultrasound beamforming, ECG feature extraction, or endoscope image enhancement. The commercial temperature range and low-power 28 nm process suit fanless medical enclosures, and the 484-ball UBGLA package accommodates the necessary LVDS connections to high-speed analog front ends. With 40K logic elements, designers can implement patient-side pre-processing that reduces bandwidth to the central diagnostic server.
Recommended
Embedded IoT Gateway
The 5CSEBA4U19C7SN functions as an embedded IoT gateway aggregator, with the ARM HPS running a Linux distribution that supports MQTT, OPC-UA, and TLS-secured cloud uplinks, while the FPGA fabric handles deterministic sensor aggregation, time-sensitive networking bridges, and custom industrial protocols. The hard DDR3 controller and Gigabit Ethernet MACs offload the CPU from buffering and protocol-stack work, and the 484-pin UBGLA package provides ample GPIO for legacy RS-485, CAN-FD, and I2C sensor buses. Industrial-grade variants (5CSEBA4U19I7SN) extend the same architecture to outdoor and factory-floor installations.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U19C7SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U19C7N | 5CSEBA4U19I7SN | 5CSEBA4U19A7N | 5CSEBA2U19C7SN | 5CSEBA4U19C8SN |
|---|---|---|---|---|---|---|
| Package | 484-UBGA (UBGLA) 19x19 | 484-UBGA (UBGLA) 19x19 - same | 484-UBGA (UBGLA) 19x19 - same | 484-UBGA (UBGLA) 19x19 - same | 484-UBGA (UBGLA) 19x19 - same | 484-UBGA (UBGLA) 19x19 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40 K | 40 K | 40 K | 40 K | ~25 K | 40 K |
| HPS | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz |
| Speed Grade | C7 (fast) | C7 | I7 (industrial) | A7 (extended/automotive) | C7 | C8 (slower) |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | -40C to 100C | Extended (automotive) | 0C to 85C | 0C to 85C |
| Terminal Finish | SnPb-bearing (SN suffix) | Lead-free (N suffix) | SnPb-bearing | Lead-free | SnPb-bearing | SnPb-bearing |
| RoHS Compliance | Compliant (SnPb exempted) | Compliant (lead-free) | Compliant (SnPb exempted) | Compliant (lead-free) | Compliant (SnPb exempted) | Compliant (SnPb exempted) |
Key Differentiators
- Integrated ARM Cortex-A9 HPS plus 40K FPGA LE in one BGA package (vs 5CSEBA2U19C7SN)
- Faster speed grade C7 for tighter FPGA timing closure (vs 5CSEBA4U19C8SN)
- Commercial 0C to 85C temperature grade at lowest cost (vs 5CSEBA4U19I7SN)
- AES-256 bitstream encryption plus on-chip configuration logic (vs MAX 10 CPLD family (10M16DCF256C8G))
Design Notes
The 5CSEBA4U19C7SN integrates an ARM Cortex-A9 HPS and a 40K-logic-element FPGA fabric on the same die, so total power dissipation depends on both HPS utilization (Linux workload, peripherals enabled) and FPGA logic density. Estimated: at typical industrial workloads the SoC dissipates 3-5 W, and the 19x19 mm UBGLA package (theta_JA around 12-15 C/W on a 4-layer JEDEC test board with thermal vias) yields a junction-to-ambient rise of 36-75 C above 25 C ambient. For sealed enclosures without forced airflow, follow Altera's thermal management application note and provide a thermal pad under the central BGA balls plus adequate copper pour.
Use a minimum 8-layer PCB stack-up with dedicated ground and power planes for the 5CSEBA4U19C7SN. Assign separate power rails for VCC (FPGA core 1.1 V), VCCIO for each I/O bank (1.2 V to 3.3 V), VCCPD (1.5 V to 3.3 V for pre-drivers), VCC_HPS (HPS core), VCCIO_HPS (HPS I/O), and VCCPLL_HPS / VCCPLL (PLL supplies). Decoupling per Altera's Cyclone V pin connection guidelines: 0.1 uF X7R placed within 100 mil of every supply pin, plus bulk 22-47 uF polymer tantalum per rail. Match the DDR3 controller traces to within 5 mil for length-matched byte groups.
Do not assume the 'C' in 5CSEBA4U19C7SN refers to commercial grade only - the C7 is the speed-grade indicator. Verify the temperature grade separately: C7 means speed grade 7 in the 0C to 85C commercial range. A common pitfall is selecting a faster speed grade than required, which raises unit cost without functional benefit; for typical industrial designs the C8 (slower) variant often meets timing. Also, the HPS-side boot configuration (MSEL pins) must match the chosen configuration scheme (AS, PS, FPP), and misconfigured MSEL pins will prevent the device from booting.
Route LVDS pairs on the 5CSEBA4U19C7SN with 100 ohm differential impedance and within 10 mil length matching for the P/N traces of each pair. Keep LVDS pairs at least 3W spacing from other signal pairs (where W = dielectric-to-trace height). For DDR3 interfaces from the HPS, enforce 50 ohm single-ended / 100 ohm differential controlled impedance with byte-level length matching and a maximum stub length of 50 mil. Use IBIS-AMI simulations with the Quartus Prime Signal Tap and external SI tools before committing to layout.
Compliance Information
RoHS compliant per Altera/Intel product page; 'SN' suffix denotes SnPb-bearing terminal finish (RoHS exemption allowed for some industrial uses). For fully lead-free RoHS, choose 5CSEBA4U19C7N. Not AEC-Q100 qualified; choose 5CSEBA4U19A7N for automotive/extended-spec applications.