5CSEBA2U19C8SN - Cyclone V SE SoC FPGA, 25K LE | Intel
MPN: 5CSEBA2U19C8SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $165 | $165.00 |
| 10 | $152.5 | $1,525.00 |
| 100 | $138 | $13,800.00 |
| 250 | $125 | $31,250.00 |
| 500 | $112 | $56,000.00 |
Drop-in alternatives for 5CSEBA2U19C8SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSEBA2U19C8SN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25K |
| HPS Processor | Single ARM Cortex-A9 MPCore with CoreSight (dual-core CPU on the silicon, single-core configuration enabled by ordering code) |
| HPS Maximum Frequency | 600 MHz |
| Process Technology | 28 nm low-power |
| Package | 484-pin UBGA (U19) 19x19 mm |
| Operating Temperature | 0C to +85C (commercial, code 'C') |
| Speed Grade | 8 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
5CSEBA2U19C8SN 484-pin ubga (u19) 19x19 mm Pin Configuration Guide
Complete pinout information for 5CSEBA2U19C8SN (484-pin ubga (u19) 19x19 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U19C8SN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U19C8SN is suitable for 7 applications: Industrial Motor Control, Machine Vision and Image Processing, Industrial IoT Gateway, Factory Automation PLC, Video Surveillance Edge Analytics, Medical Diagnostic Equipment, Aerospace Avionics Subsystem.
Industrial Motor Control
The 5CSEBA2U19C8SN fits industrial motor control because it pairs a deterministic dual-core ARM Cortex-A9 MPCore at 600 MHz with 25K logic elements of Cyclone V SE FPGA fabric in a single 484-pin UBGA package. The HPS runs the control loop, communications stack (EtherCAT, PROFINET, Modbus), and HMI, while the FPGA fabric handles high-resolution PWM generation, encoder decoding (EnDat, BISS, SSI), and current-sampling signal conditioning in parallel. The 600 MHz Cortex-A9 with NEON delivers the throughput needed for field-oriented control (FOC) algorithms at multi-kHz loop rates, and the AXI bridge between HPS and FPGA keeps the torque-loop latency below 10 us. This partitioning eliminates a discrete MCU plus DSP architecture, reducing BOM and PCB area.
Recommended
Machine Vision and Image Processing
The 5CSEBA2U19C8SN is well suited for machine vision pipelines because its 25K logic elements and variable-precision DSP blocks can perform real-time image preprocessing (color conversion, filtering, thresholding, edge detection) at MIPI CSI-2 or parallel sensor data rates, while the Cortex-A9 HPS runs the Linux-based object-recognition stack (OpenCV, TensorFlow Lite). At a typical 1.3 MP @ 30 fps sensor, the FPGA fabric preprocesses frames with 2-3 ms latency and the HPS classifies them, an architecture cheaper than a discrete SoC + FPGA. The 484-pin U19 BGA exposes the high I/O count required for multi-lane MIPI, GPIO, and Ethernet concurrently.
Recommended
Industrial IoT Gateway
The 5CSEBA2U19C8SN powers industrial IoT gateways because the dual-core ARM Cortex-A9 HPS runs a Linux or RTOS stack with TLS/DTLS, MQTT, OPC-UA, and Modbus gateways, while the FPGA fabric handles deterministic protocol bridging (RS-485, CAN-FD, SPI sensor aggregation) with sub-millisecond jitter. The 600 MHz HPS is sufficient for TLS handshake and JSON/XML parsing at typical IIoT message rates, and the 25K LE fabric implements custom industrial sensor interfaces without consuming HPS CPU cycles. The 484-pin U19 package supports multiple Ethernet PHYs, USB, and SD-card interfaces concurrently.
Recommended
Factory Automation PLC
The 5CSEBA2U19C8SN enables programmable logic controllers where the HPS runs the IEC 61131-3 runtime and HMI while the FPGA fabric executes deterministic bit-level I/O scanning, high-speed counters, and PWM outputs with microsecond-level determinism. The 25K logic elements accommodate a full industrial PLC backplane interface in fabric, while the Cortex-A9 MPCore handles ladder/structured-text execution and Modbus/TCP server stacks. The single-chip architecture reduces the PCB footprint and eliminates the FPGA-MCU interconnect that traditional PLCs require.
Recommended
Video Surveillance Edge Analytics
The 5CSEBA2U19C8SN supports edge analytics for surveillance cameras because the FPGA fabric performs motion detection, ROI cropping, and H.264/H.265 encoding preprocessing at full frame rate, while the Cortex-A9 HPS runs motion-vector analysis and AI inference (MobileNet, YOLO-tiny). The 484-pin U19 BGA exposes the GPIO, Ethernet PHY, and ISP interfaces required for a typical IP-camera architecture. This partitioning offloads the most compute-intensive tasks from the application processor, allowing lower clock rates and reduced power.
Recommended
Medical Diagnostic Equipment
The 5CSEBA2U19C8SN suits medical diagnostic devices where the dual-core Cortex-A9 MPCore runs the user interface and connectivity stack while the FPGA fabric performs deterministic DSP signal-processing for ultrasound beamforming, ECG/EEG feature extraction, or pulse-oximetry filtering. The 28 nm low-power process helps meet medical IEC 60601-1 thermal and patient-safety requirements, and the 25K LE fabric can implement the entire DSP pipeline for a portable diagnostic device. The HPS-FPGA AXI bridge ensures deterministic latency for closed-loop patient-monitoring control.
Recommended
Aerospace Avionics Subsystem
The 5CSEBA2U19C8SN integrates well into avionics subsystems where the FPGA fabric implements DO-254 certifiable I/O interfaces (ARINC 429, MIL-STD-1553, discrete I/O) and the Cortex-A9 HPS runs application software for navigation, communication, or sensor aggregation. The 484-pin U19 BGA supports high pin-count for redundant interfaces typical in aerospace systems. Designers can map the FPGA fabric to safety-critical I/O and run the HPS at a lower safety integrity level for non-critical application code, partitioning cleanly.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U19C8SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U19C8N | 5CSEBA2U19C7SN | 5CSEBA2U19C7N | 5CSEBA2U19C6N | 5CSEBA2U19A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin UBGA (U19) 19x19 mm | 484-pin UBGA (U19) 19x19 mm - same | 484-pin UBGA (U19) 19x19 mm - same | 484-pin UBGA (U19) 19x19 mm - same | 484-pin UBGA (U19) 19x19 mm - same | 484-pin UBGA (U19) 19x19 mm - same |
| Logic Elements | 25K | 25K | 25K | 25K | 25K | 25K |
| HPS Configuration | Single ARM Cortex-A9 with CoreSight (dual-core silicon, single-core enabled) | No HPS (logic-only) | Single ARM Cortex-A9 with CoreSight (dual-core silicon, single-core enabled) | No HPS (logic-only) | No HPS (logic-only) | No HPS (logic-only) |
| HPS Maximum Frequency | 600 MHz | N/A | 600 MHz | N/A | N/A | N/A |
| Speed Grade | 8 | 8 | 7 (faster bin) | 7 (faster bin) | 6 (fastest bin) | 7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
| Approximate Unit Price (qty 1, as of 2026-09-06) | USD 165 | USD ~135 (logic-only, lower cost) | USD ~190 (faster speed grade premium) | USD ~155 | USD ~210 (fastest bin premium) | USD ~230 (automotive grade premium) |
Key Differentiators
- Hard ARM Cortex-A9 MPCore HPS integrated with FPGA fabric in one BGA (vs 5CSEBA2U19C8N (logic-only variant, same U19 package))
- Faster speed grade available in identical U19 package for cost-free timing margin (vs 5CSEBA2U19C7SN (speed grade 7))
- Automotive temperature grade variant available in identical U19 package (vs 5CSEBA2U19A7N (automotive -40C to +125C, logic-only))
- Logic-only variant available in identical U19 package when HPS is unused (vs 5CSEBA2U19C8N (logic-only, no HPS))
Design Notes
The 5CSEBA2U19C8SN has separate power rails for the FPGA fabric (VCCINT, VCCAUX, VCCIO banks), HPS core (VCC_HPS, VCC_HPS_IO), and HPS DDR PHYs. Per Intel Cyclone V device datasheet power management chapter, power sequencing requires the HPS rails to ramp before or concurrently with the FPGA fabric rails to avoid back-powering. Use a dedicated power-supply sequencer IC or an FPGA-controlled MOSFET array; do not rely on RC delays alone, because HPS POR behavior is order-sensitive and can latch up if rails are mis-ordered.
Estimated: at full HPS utilization (dual-core Cortex-A9 at 600 MHz) plus ~70% FPGA logic utilization toggling at 200 MHz, the 5CSEBA2U19C8SN in the 484-pin UBGA (U19) 19x19 mm package dissipates approximately 3.5 to 5 W depending on toggle rate. With theta_JA of ~10 C/W for this BGA on a JEDEC 4-layer test board with minimum thermal vias, junction-to-ambient rise is 35 to 50 C. For sealed enclosures or industrial deployments, place the part on a 4x4 BGA thermal via array under the exposed die paddle area and connect inner-layer copper pours to spread heat.
The 484-pin UBGA (U19) package uses a 1.0 mm ball pitch per the Cyclone V SE package specification. Per Intel Cyclone V PCB design guidelines, route all signals on inner layers with microvia-in-pad if using HDI stack-up, and ensure 50 ohm controlled impedance for high-speed transceiver and DDR3/3L interfaces. The HPS DDR3 controller requires matched-length fly-by topology across byte groups; use the Quartus Prime pin planner to validate DQS-to-DQ skew before committing to stack-up. Place 100 nF decoupling caps on every VCCIO bank pin adjacent to the BGA.
A frequent design pitfall is using the wrong boot configuration for the HPS - the 5CSEBA2U19C8SN supports SD card, QSPI flash, and NAND boot modes selected via BSEL pins, and the wrong strap state at POR can brick the board. Another pitfall is forgetting that the HPS peripherals (EMAC, USB, SD/MMC) are multiplexed with the FPGA fabric I/O, so pin assignments must be planned jointly using Quartus Prime's SoC EDS peripheral pin multiplexer tool. Finally, do not share the HPS reset with the FPGA fabric configuration reset; isolate them with separate reset supervisor ICs to recover gracefully from soft HPS hangs.
Compliance Information
RoHS and REACH compliance confirmed per Intel Cyclone V product environmental compliance documentation. The commercial 'C' speed grade is NOT AEC-Q100 qualified; the 'A' speed grade variant (5CSEBA2U19A7N) is the AEC-Q100 qualified option for automotive designs. Lead-free and halogen-free per Intel product materials declaration.
