5CSEBA6U19I7SN - Cyclone V SE SoC FPGA 110K LE | Intel | UBGA-484
부품 번호: 5CSEBA6U19I7SN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 250 | $332 | $83,000.00 |
| 500 | $305 | $152,500.00 |
5CSEBA6U19I7SN 개요
A System-on-Chip (SoC) FPGA combines a hard processor subsystem (HPS) - in this case a single-core ARM Cortex-A9 with NEON media engine, single/double-precision FPU, 32KB I-cache and 32KB D-cache, plus 512KB L2 cache - with an FPGA fabric on a single die, sharing a high-bandwidth interconnect. This SoC architecture sits within the broader taxonomy: SoC FPGA -> FPGA -> programmable logic device -> semiconductor. Compared with discrete CPU-plus-FPGAs, it offers lower BOM cost, tighter latency, and unified power management.
Key features of the 5CSEBA6U19I7SN include 110K LEs, 4150 LABs, 66 user I/Os, 64KB of on-chip RAM per the marketing part description, support for DDR3/DDR3L/LPDDR2 external memory through the HPS, variable-precision DSP blocks, and integrated phase-locked loops. The part runs the HPS at up to 800 MHz (per Cyclone V SE family specifications) and operates over the industrial -40C to +100C (or 100C) junction range. The device is RoHS compliant and ships in lead-free UBGA-484 surface-mount packaging.
Architecturally, the device pairs a Cyclone V FPGA fabric with a single-core ARM Cortex-A9 HPS through a high-throughput ARM Cortex-A9 MPCore coherent interconnect, supporting symmetric multiprocessing semantics even on the single-core variant. The HPS includes standard peripherals: EMAC, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/MMC controller, and NAND flash controller, eliminating external companion chips for common interfaces.
Typical applications include industrial motor control and machine vision, factory automation HMIs, low-cost video processing pipelines, point-of-sale terminals, medical patient monitoring, broadcast auxiliary data handling, and defense/aerospace sub-systems where a hardened ARM core plus FPGA DSP is required. Designers value the part for unifying deterministic FPGA logic and a Linux-capable processor on one die.
When designing with the 5CSEBA6U19I7SN, allocate pins early between HPS and FPGA banks, ensure adequate PCB thermal relief for the 19x19 mm UBGA, and use Quartus Prime software (Standard edition suffices) for synthesis, place-and-route, and HPS configuration. Plan the boot source (NAND, SD/MMC, or QSPI) at the architecture stage because the HPS boot pins are muxed.
This page synthesizes distributor pricing, drop-in alternatives within the Cyclone V SE family, and practical design notes not aggregated in the manufacturer datasheet alone.
드롭인 대체품: 5CSEBA6U19I7SN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA6U19I7SN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Process Technology, Operating Temperature, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA6U19I7N
✅ 드롭인✓ 재고 있음
$142.75 / 개
데이터시트 보기 →5CSEBA6U19I7NTS
✅ 드롭인✓ 재고 있음
$46.25 / 개
데이터시트 보기 →5CSEBA6U19I7LN
✅ 드롭인✓ 재고 있음
$288.9 / 개
데이터시트 보기 →5CSEBA6U19C8SN
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →5CSEBA6U19C7SN
✅ 드롭인✓ 재고 있음
$149.85 / 개
데이터시트 보기 →5CSEBA5U19I7SN
✅ 드롭인✓ 재고 있음
$118.4 / 개
데이터시트 보기 →5CSEBA6U19I7SN 최대 정격 & 전기적 특성
| Family | Cyclone V SE SoC FPGA |
| Hard Processor System (HPS) | Single-core ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements (LEs) | 110,000 |
| Logic Array Blocks (LABs) | 4150 |
| Maximum User I/Os | 66 |
| On-chip Memory | 64 KB |
| DSP Blocks | Variable-precision DSP blocks |
| PLLs | Integrated phase-locked loops |
| HPS Maximum Frequency | 800 MHz |
| External Memory Support | DDR3, DDR3L, LPDDR2 (via HPS) |
| Process Technology | 28 nm low-power (TSMC) |
| 패키지 | 484-pin UBGA (19x19 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | Industrial grade (I) -40C to +100C junction |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
| Ordering Part Number | 5CSEBA6U19I7SN |
5CSEBA6U19I7SN 484-pin ubga (19x19 mm) 핀 구성 가이드
5CSEBA6U19I7SN(484-pin ubga (19x19 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA6U19I7SN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA6U19I7SN 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drive, Machine Vision and Industrial Imaging, Human-Machine Interface (HMI) and Industrial Displays, Factory Automation and Protocol Bridging, Point-of-Sale and Retail Terminals, Broadcast Auxiliary Data and Pro-Audio Processing.
Industrial Motor Control and Drive
The 5CSEBA6U19I7SN is well-suited for industrial motor-control applications because its single-core ARM Cortex-A9 HPS at 800 MHz can execute real-time control loops (field-oriented control, trapezoidal commutation) while the FPGA fabric runs deterministic PWM generation and encoder decoding. The 110K LE capacity absorbs custom logic for safety interlocks, STO (safe torque off), and Modbus/Profibus bridges. Industrial-grade -40C to +100C junction tolerance (I7) ensures reliable operation in cabinet environments reaching 70C ambient. Using Quartus Prime Standard, designers map the FPGA control fabric and HPS C-code to a single chip, reducing BOM cost versus a discrete MCU-plus-FPGA partition.
추천
Machine Vision and Industrial Imaging
For machine-vision pipelines, the 5CSEBA6U19I7SN pairs an FPGA fabric capable of real-time image preprocessing (Sobel, threshold, Bayer demosaic, histogram) with a Linux-capable ARM Cortex-A9 running the application layer. The variable-precision DSP blocks handle 1080p30 streams at modest frame sizes, while the HPS executes OpenCV-based classification. The UBGA-484 (19x19 mm) package provides the I/O density needed for parallel image-sensor interfaces (MIPI-CSI bridge, parallel CMOS). Industrial I7 grade supports factory-floor deployment. Typical designs use HPS DDR3 for frame buffers and FPGA fabric for high-throughput pixel processing.
추천
Human-Machine Interface (HMI) and Industrial Displays
The 5CSEBA6U19I7SN is a strong fit for industrial HMIs where a Linux-capable Cortex-A9 runs Qt/QML rendering while the FPGA fabric handles TFT/LVDS timing generation and touch-panel scanning. The single-core HPS at 800 MHz drives modest 7-10 inch WVGA/XGA panels smoothly, and the 110K LE capacity supports custom 2D accelerators, video overlays, and fail-safe display freeze logic. Industrial I7 temperature grade tolerates cabinet mounting at 60-70C ambient. The UBGA-484 package accommodates the parallel RGB or LVDS panel interface plus USB 2.0, Ethernet (via HPS EMAC), and CAN bus connectivity typical of industrial HMI BOMs.
추천
Factory Automation and Protocol Bridging
For factory-automation gateways, the 5CSEBA6U19I7SN integrates multiple industrial protocols (EtherCAT, PROFINET, Modbus TCP, CANopen) in the FPGA fabric while the ARM Cortex-A9 HPS executes Linux-based protocol stacks and supervisory logic. The single-core HPS at 800 MHz handles multiple Ethernet sessions and JSON/REST northbound interfaces. Industrial I7 grade and the robust UBGA-484 U19 package make it suitable for DIN-rail-mounted PLCs and protocol-converter modules. FPGA-based deterministic MAC/PHY timing alongside HPS-based packet processing is a well-established pattern for industrial Ethernet slaves.
추천
Point-of-Sale and Retail Terminals
The 5CSEBA6U19I7SN suits point-of-sale terminals that need secure payment processing (HPS running Linux with PCI PTS software) and FPGA-driven peripherals (barcode imagers, thermal printers, encrypted PIN pads). The single-core Cortex-A9 with NEON accelerates cryptographic primitives (AES, RSA, ECC) for transaction signing, while FPGA fabric handles custom display controllers and tamper-detection logic. Although commercial C8 grade is more typical for indoor POS deployments, the industrial I7 grade extends lifetime to 10+ years in kiosks and outdoor vending machines. The UBGA-484 U19 package provides ample I/O for multiple serial peripherals.
추천
Broadcast Auxiliary Data and Pro-Audio Processing
In broadcast and pro-audio applications, the 5CSEBA6U19I7SN leverages its DSP blocks for FIR/IIR filters, audio sample-rate conversion, and metadata embedding (SMPTE 2020, AES3 channel status). The ARM Cortex-A9 HPS runs web-based remote-management software, while the FPGA fabric maintains deterministic audio sample-clock jitter under 1 ns. Industrial I7 grade supports studio and field-deployment environments. The 110K LE capacity enables multi-channel audio engines (32+ channels at 48 kHz) with FPGA-driven ASRC. The UBGA-484 U19 package accommodates multiple MADI/AES3 transceivers via user I/Os.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA6U19I7SN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA6U19I7N | 5CSEBA6U19I7NTS | 5CSEBA6U19I7LN | 5CSEBA6U19C8SN | 5CSEBA6U19C7SN | 5CSEBA5U19I7SN |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin UBGA (U19, 19x19 mm) | 484-pin UBGA (U19, 19x19 mm) - same | 484-pin UBGA (U19, 19x19 mm) - same | 484-pin UBGA (U19, 19x19 mm) - same | 484-pin UBGA (U19, 19x19 mm) - same | 484-pin UBGA (U19, 19x19 mm) - same | 484-pin UBGA (U19, 19x19 mm) - same |
| Logic Elements | 110,000 | 110,000 (same) | 110,000 (same) | 110,000 (same) | 110,000 (same) | 110,000 (same) | 85,000 (-23%) |
| HPS Configuration | Single-core ARM Cortex-A9 MPCore | Single-core ARM Cortex-A9 MPCore (same) | Single-core ARM Cortex-A9 MPCore (same) | Single-core ARM Cortex-A9 MPCore (same) | Single-core ARM Cortex-A9 MPCore (same) | Single-core ARM Cortex-A9 MPCore (same) | Single-core ARM Cortex-A9 MPCore (same) |
| HPS Maximum Frequency | 800 MHz | 800 MHz (same) | 800 MHz (same) | 800 MHz (same) | 800 MHz (same) | 800 MHz (same) | 800 MHz (same) |
| Temperature Grade | Industrial I7 (-40C to +100C junction) | Industrial I7 (-40C to +100C) | Industrial I7 (-40C to +100C) | Industrial I7 (-40C to +100C) | Commercial C8 (0C to +85C) | Commercial C7 (0C to +85C) | Industrial I7 (-40C to +100C) |
| User I/Os | 66 | 66 (same) | 66 (same) | 66 (same) | 66 (same) | 66 (same) | 66 (same) |
| Process Technology | 28 nm low-power (TSMC) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) |
| RoHS Compliant | Yes | Yes | Yes | Yes (lead-free) | Yes | Yes | Yes |
주요 차별점
- Industrial -40C to +100C temperature grade in the same U19 package as commercial C8 (vs 5CSEBA6U19C8SN)
- Drop-in supply-chain alternatives within the same Cyclone V SE family (vs 5CSEBA6U19I7N)
- Mid-density 110K LE with industrial-grade qualification (vs 5CSEBA5U19I7SN)
설계 노트
Estimated: at typical SoC FPGA utilization (~70% LE, ~50% DSP, HPS running Linux) the 5CSEBA6U19I7SN dissipates approximately 3-5 W depending on toggle rate. The UBGA-484 (19x19 mm) U19 package has a junction-to-ambient thermal resistance of roughly 12-15 C/W on a 6-layer PCB with adequate thermal vias and ground pour, so under industrial -40C to +100C envelope the part must keep junction temperature below 100C. In cabinet deployments at 60-70C ambient, design copper flood at least 50% of the BGA break-out region on top and inner layers with 0.3 mm thermal vias. If higher FPGA utilization is expected (90%+ LE, full DSP, high HPS load), an active heat sink or airflow is recommended.
The 484-ball UBGA (19x19 mm) U19 package uses a 1.0 mm ball pitch, requiring microvia (HDI) PCB technology with at least 4-6 build-up layers and laser-drilled vias. Per Cyclone V SE family design guidelines, allocate dedicated ground and power planes beneath the BGA, with 0.1 uF + 1 uF + 10 uF decoupling on each power rail (VCCINT, VCCAUX, VCCPD, VCCIO_HPS, VCCIO_FPGA). Match the DDR3 trace lengths to within 25 mil for the HPS EMIF and 50 mil for FPGA fabric memory interfaces. Plan HPS boot pins (BSEL, CSEL) at the architecture stage because they share muxed functions.
Three pitfalls to avoid with the 5CSEBA6U19I7SN: (1) Don't confuse the A6 density code with A4 or A5 - the same UBGA-484 U19 footprint is used across density variants, but pin-compatibility is preserved only across the same OPN-letter family. (2) Quartus Prime Standard edition supports the Cyclone V SE family; do not attempt Cyclone V GX/ST design files in this project because HPS pin assignments differ. (3) When migrating from commercial C8 to industrial I7, re-run timing analysis and power estimation; the I7 grade has tighter timing margins at cold temperatures. Use the Quartus Early Power Estimator (EPE) before tape-out.
Per Cyclone V SE hardware design guidelines, route the HPS EMIF (DDR3/DDR3L) interface on inner layers with 50 ohm controlled impedance, and keep the FPGA fabric DDR/parallel memory interfaces on a separate set of layers. The HPS reference clock (HPS_CLK1) must come from a low-jitter oscillator (less than 50 ppm). Pin 1 of the UBGA is at the corner indicated by a beveled edge or dot; follow the official package footprint file (CSV or DXF) from Intel/Altera rather than approximating from the datasheet drawing. Use Intel's board design tool to verify BGA break-out routing before committing artwork.
규정 준수 정보
RoHS compliance per Altera/Intel product page. AEC-Q100 not applicable (not an automotive-qualified part). Lead-free packaging standard for UBGA-484 U19. Industrial I7 grade qualified to -40C to +100C junction per Cyclone V SE family datasheet.
