5CSEBA6U23A7N - Cyclone V SE SoC FPGA 110K LE | Intel
부품 번호: 5CSEBA6U23A7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $295 | $2,950.00 |
| 100 | $268 | $26,800.00 |
| 500 | $245 | $122,500.00 |
| 1,000 | $225 | $225,000.00 |
5CSEBA6U23A7N 개요
A System-on-Chip FPGA is a single device that combines a general-purpose processor subsystem (in this case, ARM Cortex-A9 with CoreSight debug) with a programmable FPGA fabric on the same die, eliminating the need for a discrete processor plus separate FPGA. Within the broader hierarchy, this places the part as: SoC FPGA -> FPGA -> Programmable Logic Device -> Integrated Circuit -> Semiconductor. Cyclone V SE variants specifically target cost- and power-sensitive embedded systems with moderate logic density.
Key features include 110K logic elements, 700 MHz processor subsystem performance, an integrated HPS with peripherals (DDR controller, USB, Ethernet, UART, SPI, I2C), high-speed transceivers, variable-precision DSP blocks, and 1.1 V core operation. The device is built on TSMC's 28 nm low-power process to optimize the watts-per-100K-LE metric common in mid-range FPGAs.
The architecture pairs the FPGA fabric with a dedicated HPS (Hard Processor System) block connected via a high-bandwidth on-chip interconnect, allowing deterministic data exchange between software running on the Cortex-A9 and custom accelerator logic in the FPGA. The 672-UBGA package provides the high I/O count needed for industrial motor control, automotive driver-assistance, and vision pre-processing applications.
Typical applications include industrial motor control, automotive ADAS sensor fusion, machine vision pre-processing, factory automation controllers, and HMI (human-machine interface) systems. The automotive-grade temperature rating and AEC-Q100 compliance make it well-suited for in-cabin electronics and chassis-domain controllers.
When designing with this device, ensure PCB layout supports 1.1 V core supply decoupling, DDR3/DDR3L routing to the HPS, and sufficient thermal copper under the UBG A to handle peak FPGA power dissipation.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet, with information extracted from the 5CSEBA6U23A7N datasheet, the Cyclone V Device Handbook, and current distributor listings as of 2026-09-06.
드롭인 대체품: 5CSEBA6U23A7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA6U23A7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, RoHS Status, DSP Blocks, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA5U23A7N
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →5CSEBA4U23A7N
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →5CSEBA2U23A7N
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →5CSEBA6U19A7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$198.4 / 개
데이터시트 보기 →5CSXFC6D6F31C8N
✅ 드롭인✓ 재고 있음
$355 / 개
데이터시트 보기 →5CSEBA6U23A7N 최대 정격 & 전기적 특성
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 |
| Process Node | 28 nm low-power |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 700 MHz |
| Core Voltage | 1.1 V |
| 패키지 | 672-UBGA (23x23 mm) |
| Automotive Qualification | AEC-Q100 compliant |
| 동작 온도 | -40C to +85C (industrial) |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| DSP Blocks | Variable-precision DSP blocks (per family datasheet) |
| Memory Interfaces | DDR3/DDR3L controller in HPS |
| RoHS 상태 | RoHS compliant |
| Shipping Media | Tray |
5CSEBA6U23A7N 핀 구성
| 핀 1 | VCC — Core supply (1.1 V) - representative ball; full 672-ball pinout is in Intel Pin-Out Files for Cyclone V Devices |
| 핀 100 | GND — Ground - representative ball; full ball map in Intel Pin-Out Files for Cyclone V Devices |
| 핀 200 | HPS_DDR_DQ[0] — HPS DDR3/DDR3L data line 0 - representative HPS ball |
| 핀 300 | IO_3V3_BANK_8A — FPGA I/O bank 8A pin - representative FPGA I/O ball |
| 핀 400 | HPS_CLK1 — HPS clock input - representative clock ball |
| 핀 500 | CONFIG_DATA — FPGA configuration data pin - representative configuration ball |
| 핀 600 | JTAG_TCK — JTAG test clock - boundary-scan programming pin |
| 핀 672 | NC — No-connect (per package pinout) |
일반적인 애플리케이션
5CSEBA6U23A7N 적합 용도: 6 애플리케이션s: Automotive ADAS Sensor Fusion, Industrial Motor Control, Machine Vision Pre-Processing, Human-Machine Interface (HMI) Controllers, Programmable Logic Controller (PLC) Backplane, Medical Imaging Signal Conditioning.
Automotive ADAS Sensor Fusion
The 5CSEBA6U23A7N's AEC-Q100 qualification and 110K logic elements make it a strong fit for automotive ADAS sensor-fusion ECUs. The dual-core Cortex-A9 HPS at 700 MHz runs the sensor-fusion OS (typically AUTOSAR or RT-Linux), while the FPGA fabric implements low-latency preprocessing of camera, radar, and lidar data streams - object detection, point-cloud filtering, and time synchronization. The 672-UBGA package exposes enough I/O to interface multiple MIPI CSI-2 cameras and CAN-FD vehicle networks, and the 28 nm low-power process keeps chassis-domain power budgets realistic.
추천
Industrial Motor Control
For high-end industrial servo drives and multi-axis motor controllers, the 5CSEBA6U23A7N's 110K LEs host PWM generators, encoder interfaces (EnDat, BiSS), and current-control loops in hardware, while the Cortex-A9 HPS runs the motion-control stack (EtherCAT, CANopen) and supervisory logic. The 672-UBGA provides sufficient I/O banks for simultaneous three-phase current sensing and resolver excitation, and the -40C to +85C industrial range supports cabinet and machine-mount installations. Variable-precision DSP blocks accelerate the Park/Clark transforms and SVPWM calculations.
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Machine Vision Pre-Processing
The 5CSEBA6U23A7N suits factory-floor machine vision pre-processing where the FPGA fabric pipelines image acquisition, lens correction, color conversion, and feature extraction before forwarding results to the Cortex-A9 HPS for higher-level decision making. The 700 MHz dual-core CPU handles inspection logic, while FPGA logic keeps throughput deterministic at high frame rates. The 672-UBGA supports parallel image-sensor interfaces (MIPI CSI-2, LVDS, parallel CMOS) and GigE Vision hand-off to upstream networks.
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Human-Machine Interface (HMI) Controllers
For industrial HMI panels, the 5CSEBA6U23A7N drives TFT-LCD controllers, touch-screen I2C interfaces, and graphics accelerators in the FPGA fabric while the HPS runs the embedded Linux GUI stack (Qt or WebKit). The 672-UBGA provides the LVDS pairs and HSIO banks needed for large 10- to 15-inch displays, and the industrial temperature grade supports panel-mount installations near heat-generating equipment. AEC-Q100 compliance also enables in-cabin automotive HMI deployments such as instrument clusters and infotainment auxiliary displays.
추천
Programmable Logic Controller (PLC) Backplane
As a PLC backplane controller, the 5CSEBA6U23A7N's 110K LEs implement industrial fieldbus protocols (PROFINET, EtherCAT, EtherNet/IP, Modbus TCP) and high-speed digital I/O scan engines directly in FPGA logic, while the Cortex-A9 HPS executes the IEC 61131-3 runtime and supervisory logic. The 672-UBGA package accommodates multiple industrial Ethernet PHYs and a parallel backplane interface, and the automotive/industrial temperature range guarantees operation in factory cabinets and process-control racks.
추천
Medical Imaging Signal Conditioning
Although not FDA-cleared for life-support devices, the 5CSEBA6U23A7N is used in non-life-support medical imaging equipment (portable ultrasound pre-beamforming, lab analyzers, dental imaging) where its FPGA fabric performs high-speed ADC conditioning and DSP, while the dual-core Cortex-A9 HPS runs the user interface and image processing stack. The 672-UBGA accepts multiple high-speed ADC channels, and the industrial temperature range supports clinical and laboratory environments without additional ruggedization.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA6U23A7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA5U23A7N | 5CSEBA4U23A7N | 5CSEBA2U23A7N | 5CSEBA6U19A7N | 5CSXFC6D6F31C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (23x23 mm, U23) | 672-UBGA (23x23 mm, U23) - same | 672-UBGA (23x23 mm, U23) - same | 672-UBGA (23x23 mm, U23) - same | 672-UBGA (19x19 mm, U19) - smaller | 896-FBGA (31x31 mm, F31) - larger |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual-core ARM Cortex-A9 MPCore (same) | Dual-core ARM Cortex-A9 MPCore (same) | Dual-core ARM Cortex-A9 MPCore (same) | Dual-core ARM Cortex-A9 MPCore (same) | Dual-core ARM Cortex-A9 MPCore (same) |
| Process Node | 28 nm low-power | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) |
| AEC-Q100 Automotive Grade | Yes | Yes | Yes | Yes | Yes | No (industrial) |
| Operating Temperature | -40C to +85C | -40C to +85C (same) | -40C to +85C (same) | -40C to +85C (same) | -40C to +85C (same) | -40C to +85C (same) |
주요 차별점
- Lowest LE density in same-package U23 footprint (vs 5CSEBA6U19A7N)
- Higher LE density vs lower-density same-package variants (vs 5CSEBA2U23A7N)
- Lower power and cost tier vs Cyclone V SX feature-rich variant (vs 5CSXFC6D6F31C8N)
설계 노트
Estimated: the 5CSEBA6U23A7N in the 672-UBGA package typically dissipates 3-8 W depending on FPGA utilization, HPS workload, and toggle rate. Provide a minimum 4-layer PCB with a dedicated ground plane and a copper pour under the UBG A thermal footprint to keep junction temperature within the 100C automotive derating budget. A small heatsink is recommended if utilization exceeds 60% with high toggle rates.
Per Intel's Cyclone V device handbook, the SoC FPGA requires at minimum a 1.1 V core supply, a 2.5 V or 3.3 V I/O supply, and a separate HPS supply rail. Decouple each supply pin with 0.1 uF and 10 uF ceramic capacitors placed as close to the balls as possible. Power sequencing must follow the Cyclone V Power Management User Guide to avoid latch-up during hot-plug events.
The 672-UBGA package uses fine-pitch (0.8 mm) balls; per IPC-7351 guidelines, microvia stacks with dog-bone fan-out are recommended, and trace escape routing must respect the BGA pitch. Use 50 ohm controlled impedance for HPS DDR3/DDR3L nets and length-match within the tolerances specified in the Cyclone V External Memory Interface Handbook.
Do not assume that different Cyclone V SE variants with the same UBG A footprint are interchangeable without verifying pinout - while 5CSEBA6U23A7N, 5CSEBA5U23A7N, 5CSEBA4U23A7N, and 5CSEBA2U23A7N share the same U23 package, 5CSEBA6U19A7N uses the smaller U19 footprint and is NOT drop-in. Confirm via Intel's Pin-Out Files before substituting.
Keep HPS DDR memory traces on the same PCB layer as the HPS balls with no vias in the data byte groups, per the Cyclone V External Memory Interface Handbook. Maintain at least 25 mil spacing between high-speed HPS traces and noisy switching supplies to avoid coupling into the DDR sampling window.
규정 준수 정보
AEC-Q100 qualification per Veswin and Datasheets.com listings; RoHS and conflict-minerals compliance per standard Intel FPGA product policy. Halogen-free status not explicitly stated in the verified data.