A3P600-PQG208 - 600K-Gate ProASIC3 Flash FPGA | Microchip
부품 번호: A3P600-PQG208 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.1 | $621.00 |
| 100 | $55.8 | $5,580.00 |
| 500 | $49.9 | $24,950.00 |
| 1,000 | $44.6 | $44,600.00 |
A3P600-PQG208 개요
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory cells rather than an external configuration ROM. This places it in the power-management hierarchy of programmable logic: FPGA -> flash FPGA -> single-chip programmable SoC solution. Because configuration data is non-volatile, the A3P600 powers up instantly with no external boot device, reducing bill-of-materials cost, board area, and configuration-time attack surface.
Key features include single-chip operation with on-chip flash, low total cost of ownership, wide-range I/O supporting the JESD8-B specification for 3V and 3.3V supplies, 110,592 bits of distributed resources, and reprogrammability for field upgrades. The VersaTile architecture lets each tile act as a three-input LUT, a D-flip-flop with enable, or a latch, improving fabric utilization versus pure LUT architectures.
Architecturally, the ProASIC3 core tile combines VersaTiles with embedded flash blocks and clock-conditioning circuitry. The 130nm flash process yields instant-on, high-security, low-power operation suited to sense-and-control systems where reliability, security, and power matter.
Typical applications include industrial automation and motor control, aerospace and defense secure logic, medical instrumentation, communications line cards, and power sequencing/glue logic replacing multiple ASICs or ASSPs.
A key design consideration is I/O bank planning: the wide-range I/O eases bank management, but designers must still verify voltage domains and toggle-rate-driven power per the datasheet guidelines.
This page adds value beyond the datasheet by synthesizing distributor pricing, drop-in alternatives within the ProASIC3 PQ208 family, and practical design notes in one place.
드롭인 대체품: A3P600-PQG208 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600-PQG208 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, Family, Core Supply Voltage, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-PQG208I
✅ 드롭인✓ 재고 있음
$68.08 / 개
데이터시트 보기 →A3P600-1PQG208
✅ 드롭인✓ 재고 있음
$49.94 / 개
데이터시트 보기 →A3P600-1PQG208I
✅ 드롭인✓ 재고 있음
$68 / 개
데이터시트 보기 →A3P600-2PQG208
✅ 드롭인✓ 재고 있음
$55.87 / 개
데이터시트 보기 →A3P600-2PQG208I
✅ 드롭인✓ 재고 있음
$71.3 / 개
데이터시트 보기 →A3P600L-1PQG208I
✅ 드롭인✓ 재고 있음
$29 / 개
데이터시트 보기 →A3P600-PQG208 최대 정격 & 전기적 특성
| Number of Gates | 600000 |
| Logic Elements (LEs) | 7000 |
| VersaTiles | 13824 |
| Number of I/O | 154 |
| System Performance | 231 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| I/O Supply (wide range) | 3 V / 3.3 V per JESD8-B |
| Configuration Memory | On-chip flash (non-volatile, single-chip) |
| Reprogrammable | Yes |
| 패키지 | 208-Pin PQFP (PQG208), 28 x 28 mm, 0.5 mm pitch |
| Package Height | 3.4 mm |
| 실장 유형 | Surface Mount (gull-wing) |
| Operating Temperature Grade | Commercial (0C to +70C) for -PQG208; -I grade available |
| RoHS 상태 | RoHS Compliant |
| Lead Free Status | Lead Free |
| Packaging | Tray |
A3P600-PQG208 3.4 mm 핀 구성 가이드
A3P600-PQG208(3.4 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600-PQG208.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600-PQG208 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Aerospace and Defense Secure Logic, Medical Instrumentation, Communications Line Cards and Bridging, Power Sequencing and System Glue Logic, Security and Surveillance Equipment.
Industrial Automation and Motor Control
The A3P600-PQG208 fits industrial sense-and-control nodes where 154 user I/Os interface PWM outputs, encoder inputs, and safety interlocks in one instant-on device. Its non-volatile flash configuration means the controller is live within microseconds of power application - no boot delay that could leave a motor drive uncontrolled. The wide-range JESD8-B I/O tolerates 3V/3.3V logic domains common on PLC backplanes and provides extra tolerance against system voltage spikes. With 600K gates and 231 MHz performance, it implements multi-axis PWM, quadrature decoding, and fieldbus glue logic simultaneously. Designers should use the industrial -I temperature grade (-40C to +100C) for factory-floor environments and verify power budgets against I/O toggle rates per the ProASIC3 datasheet guidelines.
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Aerospace and Defense Secure Logic
Flash FPGAs are preferred in defense and avionics because configuration stored in on-chip flash eliminates the external bitstream readout that makes SRAM FPGAs vulnerable to cloning and glitch attacks. The A3P600-PQG208's single-chip design reduces component count on size- and weight-constrained boards, and its instant-on behavior supports deterministic startup required by power-sequencing and health-monitoring logic. With 13,824 VersaTiles and 154 I/Os, it implements bus interfaces, telemetry formatting, and secure glue logic. Designs should select the -I industrial grade for extended environment and follow Microchip's ProASIC3 security application guidance. Note that for spaceflight, Microchip's radiation-tolerant RT proASIC3 family should be evaluated instead of the commercial A3P600.
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Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the A3P600-PQG208's combination of reprogrammability and instant-on flash configuration, allowing field firmware updates without sacrificing deterministic power-up behavior required for patient-safety interlocks. The 154 user I/Os drive front-end multiplexers, ADC control lines, and display interfaces, while 600K gates accommodate filtering, protocol bridging, and sensor-fusion state machines at up to 231 MHz. Wide-range I/O eases mixed 3V/3.3V interfacing between legacy analog boards and modern digital sections. Designers must comply with applicable IEC 60601 system isolation externally, as the FPGA I/Os do not provide patient-isolation barriers. For benchtop instruments with controlled environments, the commercial temperature grade is typically sufficient.
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Communications Line Cards and Bridging
The A3P600-PQG208 serves as line-card glue logic and protocol bridging fabric in networking equipment, where its 231 MHz system performance and 13824 VersaTiles handle framing, deserializer interfacing, and backplane handshaking. The wide-range I/O compliant with JESD8-B simplifies interfacing across 3V and 3.3V PHY devices and improves robustness against backplane voltage spikes. Instant-on flash configuration shortens card bring-up time during chassis power sequencing, which matters in high-availability systems with aggressive reset budgets. Designers should budget power using the datasheet toggle-rate guidelines for high-activity I/O banks and consider the A3P600L low-power variant where thermal density across a full chassis is the limiting factor.
추천
Power Sequencing and System Glue Logic
Replacing multiple ASICs, CPLDs, and discrete sequencers, the A3P600-PQG208 consolidates power-good monitoring, reset distribution, and rail-sequencing state machines into one 208-pin device. Because it is flash based, its supervisory logic is active within microseconds of power arrival - faster than any host processor can boot - making it a deterministic system supervisor. The 154 I/Os monitor numerous rails and drive enable signals with wide-range 3V/3.3V tolerance. With 600K gates, spare capacity remains for board-revision bridging and JTAG boundary functionality. Designers should reserve margin on VersaTile count for late ECOs and validate that the FPGA's own I/O banks are powered before driving external enables.
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Security and Surveillance Equipment
Video surveillance nodes use the A3P600-PQG208 for sensor interfacing, image-pipeline glue logic, and encrypted storage bridging. Instant-on flash configuration ensures cameras begin capturing immediately after power restoration - valuable for post-event forensics - while the single-chip design removes an external configuration flash that could be desoldered and analyzed. The device's 154 I/Os connect CMOS imagers, DRAM controllers, and Ethernet PHYs across mixed 3V/3.3V domains with wide-range tolerance. At 231 MHz, simple compression accelerators and streaming formatters fit within 600K gates. For outdoor equipment, specify the industrial -I grade, and follow the datasheet's I/O toggle-rate power tables when several video interfaces run concurrently at high rates.
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추천 제품 요약
엔지니어링 참조 데이터: A3P600-PQG208 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-PQG208I | A3P600-1PQG208 | A3P600-2PQG208I | A3P600L-1PQG208I |
|---|---|---|---|---|---|
| Package | 208-PQFP (PQG208), 28 x 28 mm | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Gate Density | 600K | 600K | 600K | 600K | 600K |
| User I/O | 154 | 154 | 154 | 154 | 154 |
| Speed Grade | Standard | Standard | -1 (slower) | -2 (faster) | -1 (slower) |
| Temperature Range | Commercial (0C to +70C) | -40C to +100C | Commercial (0C to +70C) | -40C to +100C | -40C to +100C |
| RoHS / Lead Free | Compliant / Yes | Compliant / Yes | Compliant / Yes | Compliant / Yes | Compliant / Yes |
주요 차별점
- Instant-on single-chip flash configuration (vs SRAM FPGAs (e.g., Xilinx Spartan-3))
- Same-footprint speed-grade escape path (vs A3P600-1PQG208)
- Industrial temperature availability in the identical package (vs A3P600-PQG208I)
- Trade-off: moderate 154 I/O count for the PQFP format (vs A3P600-FGG256/FGG484 variants)
설계 노트
Estimated: dynamic power in flash FPGAs scales with I/O toggle rate. Use the ProASIC3 datasheet power-calculation guidelines - the toggle rates of I/O pins and VersaTiles (guidelines in the datasheet Table 2-16 region) and output-buffer enable rates must be entered into Microchip's power calculator for each clock domain. Underestimating high-toggle I/O banks is the most common power budget error on PQ208 designs with 154 active I/Os.
The 208-PQFP uses a 0.5 mm pitch with gull-wing leads; specify a 4 mil/5 mil solder-mask-defined land pattern per IPC-7351 class 2 and place decoupling capacitors (100 nF per supply pin pair plus bulk 10 uF) on the underside beneath the package to minimize loop inductance. Route the 1.5V core plane as a dedicated pour and keep I/O bank VCCI planes separated by domain so mixed 3V/3.3V banks remain isolated.
Do not substitute the commercial PQG208 into environments below 0C - specify the A3P600-PQG208I. When migrating designs from ProASIC PLUS (APA600) parts, note the packages and pinouts differ completely; re-implement in Libero SoC rather than attempting port-only migration. For timing-critical designs, close timing at the target speed grade in Libero before locking the BOM; the -2 grade (A3P600-2PQG208) exists precisely for this escape path.
With up to 154 simultaneously switching outputs on four sides of a 28 mm PQFP, manage ground bounce by distributing output enables across banks, using the datasheet's slew-rate settings for non-critical signals, and maximizing ground pin connectivity. Series-terminate (22-33 ohm) any I/O driving traces longer than roughly one-third of the signal rise time to control reflections on FR-4 backplanes.
규정 준수 정보
RoHS compliant and lead free per distributor datasheet listings (digchip, DigiKey). REACH, halogen-free, and conflict-minerals declarations not stated in retrieved data - consult Microchip's official environmental documentation.
