EP1SGX25DF1020C7 - Stratix GX FPGA 25K LE, 607 I/O | Intel
부품 번호: EP1SGX25DF1020C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $145 | $145,000.00 |
EP1SGX25DF1020C7 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines configurable logic blocks (LABs/CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. Within the broader semiconductor hierarchy, an FPGA belongs to the family of programmable logic devices, sits alongside ASICs as a flexible hardware-acceleration alternative, and is widely used in digital signal processing, communications, and high-speed serial interfaces. The Stratix GX series specifically targets applications requiring embedded multi-gigabit transceivers.
Key differentiating features of the EP1SGX25DF1020C7 include 2,566 LABs, a 130 nm process node, 24 transceiver channels supporting up to 3.125 Gbps, dedicated hardware multipliers for DSP, and a flip-chip BGA package that maximizes signal integrity and thermal performance for high-pin-count designs. The 'C7' speed grade and 'D' temperature indicator map to the commercial 0-85 C operating window with a moderate performance bin.
This part targets high-bandwidth telecommunications infrastructure, including SONET/SDH framer designs, multi-gigabit serial backplanes, and base-station baseband processing, where embedded transceivers and substantial logic capacity are required in a single device. The architecture supports both hardware description language (HDL) and C/C++ design entry through Quartus II / Quartus Prime toolchains, and the device is pin-compatible with other Stratix GX variants, enabling seamless migration.
Typical applications include high-end serial-interface bridges, telecom line cards, radar and signal-intelligence front ends, and high-throughput ASIC prototyping. The choice of FC-FBGA-1020 with 1 mm pitch ensures low-impedance power delivery and controlled-impedance differential routing for multi-gigabit links.
When designing with this device, the 33 x 33 mm footprint and 1020 balls require a multilayer PCB with high-density interconnect (HDI) stack-up and microvia technology. Multiple ground and power balls are used for decoupling; place 0.1 uF and 0.01 uF ceramic capacitors within 5 mm of each power pin to meet the transceiver jitter budget.
This page synthesizes real-time distributor pricing, drop-in alternatives within the same Stratix GX family, and practical design notes that complement the manufacturer datasheet.
드롭인 대체품: EP1SGX25DF1020C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF1020C7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package Type, Speed Grade, Package, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF1020C6N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1SGX25DF1020C6
✅ 드롭인✓ 재고 있음
$289 / 개
데이터시트 보기 →EP1SGX25DF1020C5N
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1SGX25DF1020C5
✅ 드롭인✓ 재고 있음
$1720 / 개
데이터시트 보기 →EP1SGX25DF1020C6ES
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP1SGX25DF1020C7 최대 정격 & 전기적 특성
| Series | Stratix GX |
| Logic Elements | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of I/Os | 607 |
| 동작 온도 | 0 C to 85 C |
| Supply Voltage (Core) | 1.425 V to 1.575 V |
| Process Technology | 130 nm CMOS |
| Internal Performance | 4385.97 MHz |
| 패키지 | 1020-BBGA, FCBGA (33 x 33 mm, 1 mm pitch) |
| Logic Family | CMOS |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Lead-Free, Compliant |
| Device Family | Stratix GX |
| Transceivers | Embedded multi-gigabit transceivers |
EP1SGX25DF1020C7 1020-bbga, fcbga (33 x 33 mm, 1 mm pitch) 핀 구성 가이드
EP1SGX25DF1020C7(1020-bbga, fcbga (33 x 33 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF1020C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF1020C7 적합 용도: 6 애플리케이션s: Telecom Line Card (SONET/SDH Framer), Multi-Gigabit Serial Backplane Bridge, ASIC Prototyping Platform, Wireless Base Station Baseband, Video Broadcast and Imaging Processing, Industrial High-Speed Data Acquisition.
Telecom Line Card (SONET/SDH Framer)
The EP1SGX25DF1020C7 fits SONET/SDH framer and mapper designs because it integrates 24 multi-gigabit transceivers at up to 3.125 Gbps, matching OC-48/STM-16 line rates, plus 25,660 logic elements for framer/mapper state machines. The 1.5 V core and 607 user I/Os support large parallel datapaths for STS-1/AU-3 cross-connect fabrics. Placed on the line card between the optical module and the network processor, it absorbs the SERDES function and the framer pipeline in a single device, eliminating external PHY chips.
추천
Multi-Gigabit Serial Backplane Bridge
For proprietary backplanes running Serial RapidIO or XAUI at 3.125 Gbps, the EP1SGX25DF1020C7 provides ample transceiver channels for multiple XAUI lanes plus the logic fabric for protocol bridging. The 33 x 33 mm FCBGA-1020 package offers low-inductance power delivery and matched-impedance routing required for jitter budgets under 0.35 UI. Embedded 1,944,576 RAM bits buffer protocol conversion, and the Quartus II IP library provides ready-made XAUI, RapidIO, and PCIe soft cores that target this silicon.
추천
ASIC Prototyping Platform
ASIC designers use the EP1SGX25DF1020C7 as a hardware prototyping vehicle for mid-density ASICs in the 100K to 300K gate range. The 25,660 logic elements and embedded RAM allow RTL mapping with reasonable utilization, and the 607 I/Os expose the prototype's external interface for in-system validation. Placed on a custom prototype motherboard with breakout headers for ASIC pin exposure, it enables software teams to begin driver development in parallel with ASIC tape-out, typically cutting the schedule by 3 to 6 months.
추천
Wireless Base Station Baseband
Wireless base-station baseband processing benefits from the EP1SGX25DF1020C7's dedicated hardware multipliers and embedded transceivers for CPRI links to remote radio heads. The 25,660 logic elements accommodate the chip-rate processing for 3G/4G channels, while 1,944,576 RAM bits hold the symbol data and equalizer coefficients. The 130 nm process delivers sufficient performance at low enough power for fan-cooled shelf designs, and the 0-85 C commercial temperature range covers most indoor base-station installations.
추천
Video Broadcast and Imaging Processing
Broadcast video routers and medical imaging systems use the EP1SGX25DF1020C7 for real-time SDI/HD-SDI aggregation and pixel-pipeline processing. The 24 transceivers aggregate multiple SDI streams while the logic fabric implements de-interlacing, scaling, and color-space conversion. The 607 user I/Os connect to large DDR memory banks for frame buffering, and 1,944,576 embedded RAM bits provide line and block caches. The 1020-ball FCBGA supports controlled-impedance routing for the multi-gigabit SDI links.
추천
Industrial High-Speed Data Acquisition
Industrial data-acquisition systems in test-and-measurement, RADAR, and signal-intelligence use the EP1SGX25DF1020C7 to aggregate multiple ADC/DAC channels running at hundreds of MSPS. The 24 transceivers stream digitized IF data to downstream processors over XAUI or Serial RapidIO, and 25,660 logic elements implement digital down-conversion and FFT pre-processing. The 1.5 V core and FC-BGA package provide clean power and ground for low-jitter ADC clock distribution, critical for SFDR above 70 dB.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF1020C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF1020C6N | EP1SGX25DF1020C6 | EP1SGX25DF1020C5N | EP1SGX25DF1020C5 | EP1SGX25DF1020C6ES |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-BBGA, FCBGA (33 x 33 mm, 1 mm pitch) | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Number of LABs/CLBs | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Number of I/Os | 607 | 607 | 607 | 607 | 607 | 607 |
| Speed Grade | C7 (fastest) | C6 | C6 | C5 | C5 | C6 |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| RoHS Status | Lead-Free | Lead-Free | Lead-Free | Lead-Free | Lead-Free | Lead-Free |
주요 차별점
- C7 speed grade (fastest in Stratix GX family) (vs EP1SGX25DF1020C6)
- Drop-in pin-compatible across C5, C6, C7 speed grades (vs EP1S25F1020C7 (Stratix II))
- Maximum 607 I/Os in 33 x 33 mm FCBGA (vs EP1SGX25CF672C7 (672-ball))
설계 노트
The 1020-ball FC-BGA package with 1 mm ball pitch requires a multilayer PCB (at least 8 layers) with 1 oz copper outer layers and microvia-in-pad (VIP) technology. Escape routing from inner-row balls demands a stack-up with 4 mil trace width and 4 mil spacing. Use of high-Tg FR-4 (Tg >= 170 C) or low-loss mid-loss PCB laminates (e.g. Isola FR408HR) ensures reliable reflow at peak 245 C without warping.
Each VCCINT ball requires a 0.1 uF X7R ceramic decoupling capacitor within 5 mm, plus a 10 uF bulk capacitor per power rail. Transceiver power (VCCA, VCCP) demands separate filtering with ferrite beads to isolate switching noise. Power-on sequencing must follow the datasheet-specified order: VCCIO first, then VCCINT, then VCCA/VCCP, with maximum 100 ms delay between rails to prevent latch-up.
Estimated: at full transceiver utilization (24 lanes at 3.125 Gbps) and high logic toggle rate, the EP1SGX25DF1020C7 dissipates approximately 8 to 12 W. The FC-BGA package has theta_JC of approximately 0.3 C/W and theta_JA of approximately 10 C/W with a proper heatsink. Without forced airflow, a heatsink with thermal interface material rated at 0.5 C/W or better is mandatory. Compute junction temperature rise from Theta_JA and ambient; ensure Tj stays below 100 C for commercial-grade reliability.
Differential transceiver pairs must be routed as 100 ohm differential lines with intra-pair skew under 1 ps per cm. Use length-matched serpentine tuning on long routes and avoid 90-degree bends - all turns must use 45-degree angles. Reference planes for the transceivers should be continuous GND with no plane splits across the routing region. Maintain at least 4W (4 x dielectric thickness) spacing to other signals.
규정 준수 정보
Lead-Free per Altera/Intel packaging documentation. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications, consult Intel automotive-grade Stratix variants separately.
