EP1SGX25DF1020I5 - 25K LEs Stratix GX FPGA 1020-BGA | Altera
부품 번호: EP1SGX25DF1020I5 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP1SGX25DF1020I5 개요
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and I/O cells that can be customized after manufacturing. FPGAs sit in the programmable-logic hierarchy above CPLDs and below fixed-function ASICs, and within Stratix GX they integrate high-speed transceivers alongside general-purpose logic, making them well suited for data-pipeline and protocol-bridging designs.
Key features include 2,566 configurable logic blocks (CLBs), approximately 607 user I/O pins, dedicated high-speed serial transceivers supporting multi-gigabit interfaces, embedded multiplier blocks, and on-chip TriMatrix memory. The 'I5' speed/temperature grade denotes the industrial temperature range, while the 'DF1020' suffix identifies the 1020-ball FC-FBGA package. The 'GX' suffix denotes the Stratix GX transceiver-enhanced sub-family.
The architecture combines 130 nm process technology with built-in transceiver circuitry, allowing engineers to implement protocol PHYs, packet processing, and DSP pipelines on a single die. Embedded RAM and DSP blocks accelerate common arithmetic and buffering operations used in communications infrastructure.
Typical applications include high-speed serial interface bridging, telecommunications backplane equipment, video broadcast and image processing, test and measurement instrumentation, and military/aerospace signal-processing systems where the industrial temperature grade and high logic density provide headroom for complex state machines and data paths.
When designing with this part, plan FPGA configuration memory carefully: the Stratix GX family requires specific configuration schemes (e.g., passive serial, fast passive parallel, JTAG). PCB designers must allocate 1020 balls with controlled-impedance escape routing, provide robust power-rail decoupling, and ensure thermal relief for industrial-temperature operation.
This page synthesizes distributor pricing, drop-in equivalents, and practical design notes for the EP1SGX25DF1020I5 - information not consolidated on any single manufacturer or distributor page.
드롭인 대체품: EP1SGX25DF1020I5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF1020I5 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Package Type, Speed Grade, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF1020C7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25DF1020C7
✅ 드롭인✓ 재고 있음
$145 / 개
데이터시트 보기 →EP1SGX25DF1020C7ES
✅ 드롭인✓ 재고 있음
$1950 / 개
데이터시트 보기 →EP1SGX25DF1020C6N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1SGX25DF1020C5N
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1SGX25DF1020C4
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP1SGX25DF1020I5 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements (LEs) | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Maximum Internal Frequency | 5000 MHz |
| Combinatorial Delay (CLB max) | 7.49 ns |
| User I/O Pins | 607 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| 패키지 | 1020-pin FC-FBGA |
| Package Code | BGA (Flip-Chip) |
| Terminal Pitch | 1.00 mm |
| Terminal Form | Ball |
| Temperature Grade | Industrial (I5) |
| 실장 유형 | Surface Mount |
EP1SGX25DF1020I5 bga (flip-chip) 핀 구성 가이드
EP1SGX25DF1020I5(bga (flip-chip) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF1020I5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF1020I5 적합 용도: 6 애플리케이션s: Telecommunications Backplane Equipment, High-Speed Serial Protocol Bridging, Video Broadcast and Image Processing, Test and Measurement Instrumentation, Military and Aerospace Signal Processing, Industrial Automation and Process Control.
Telecommunications Backplane Equipment
The EP1SGX25DF1020I5's 25,660 logic elements and integrated multi-gigabit transceivers make it a strong fit for telecom backplane line cards that aggregate multiple serial links. Its industrial temperature grade ensures reliable operation in central-office and outdoor-cabinet environments. Compared with smaller FPGAs, the 607 user I/Os allow direct interfacing to many parallel buses and SFP/SFP+ cages, while 130 nm CMOS technology and embedded transceivers simplify board layout by eliminating external PHY chips. Designers can implement framing, encryption, and link-training logic alongside the PHY on a single die, reducing BOM cost and improving reliability. The 1020-ball FC-FBGA footprint accommodates dense escape routing for high-speed serializer/deserializer channels. This consolidation of logic and SERDES is the key reason Stratix GX parts became reference platforms for legacy telecom infrastructure.
추천
High-Speed Serial Protocol Bridging
Bridging between RapidIO, PCI Express, Gigabit Ethernet, and custom serial protocols is a canonical Stratix GX use case where the EP1SGX25DF1020I5 excels. The integrated transceivers support multiple data rates from hundreds of Mbps to multi-Gbps, while the 25,660 logic elements provide the headroom needed for protocol state machines, CRC engines, and packet buffering. Industrial temperature operation enables deployment in factory and outdoor systems where cooling is limited. The 1020-ball FC-FBGA package provides the high pin density required for many simultaneous serial channels. Designers typically instantiate PHY PCS, MAC, and application-layer logic all on-chip, removing discrete bridge chips from the BOM. This single-chip integration lowers latency and power compared with multi-chip bridge designs based on older 90 nm or 130 nm ASSP parts.
추천
Video Broadcast and Image Processing
The EP1SGX25DF1020I5 is a credible platform for video broadcast routers, format converters, and image-processing pipelines because it combines 25,660 logic elements with embedded multiplier blocks and TriMatrix memory well suited to FIR filters and DCT-style transforms. Industrial temperature operation lets the part serve outdoor broadcast trucks and stadium installations where thermal stress is significant. The 607 user I/Os accept many parallel video data lanes without external buffers, simplifying PCB integration. Compared with smaller Cyclone or Spartan parts, the Stratix GX silicon provides higher throughput at the cost of larger FC-FBGA packaging. The transceiver channels also handle SDI and HD-SDI serial video transport at standard broadcast rates. This combination of logic, memory, DSP, and SERDES in one device streamlines broadcast-engineering workflows.
추천
Test and Measurement Instrumentation
Bench-top instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators benefit from the EP1SGX25DF1020I5's blend of high logic density and integrated transceivers. The 25,660 LEs host deep acquisition memory, trigger state machines, and DSP-style signal-conditioning logic, while the SERDES channels capture high-speed serial data without external PHYs. The 1020-ball FC-FBGA package enables compact instrument front-end layouts where channel density is critical. The industrial temperature grade supports lab and field-deployed instruments that may experience varying ambient conditions. Compared with mid-range CPLDs, the Stratix GX architecture accelerates real-time processing for high sample rates. Long product lifecycles in test equipment made the original 130 nm Stratix GX a long-running platform choice.
추천
Military and Aerospace Signal Processing
Ruggedized communications, electronic-warfare, and radar signal-processing subsystems historically rely on Altera Stratix GX parts like the EP1SGX25DF1020I5 because the industrial temperature grade supports harsh thermal envelopes and the 25,660 logic elements implement real-time FFT, channelization, and beamforming pipelines. The integrated transceivers handle high-speed ADC/DAC data links without external PHYs, reducing SWaP-C in space-constrained enclosures. The 1020-ball FC-FBGA accommodates many parallel sensor interfaces and high-speed serial links on one die. Compared with newer Stratix V or Stratix 10 parts, the original 130 nm Stratix GX has a longer pedigree in fielded military platforms. Designers pair it with external SRAM/DDR memories and high-speed ADCs to build complete sensor-processing units.
추천
Industrial Automation and Process Control
Programmable Logic Controllers, motor-control front-ends, and deterministic EtherCAT/CAN-FD gateways leverage the EP1SGX25DF1020I5's industrial temperature grade and SERDES channels for high-speed backplane fabrics. The 607 user I/Os connect to many sensors, actuators, and parallel industrial buses without external bus drivers, while the 25,660 logic elements implement motion-control state machines and safety logic on one chip. Compared with smaller FPGAs, the part consolidates industrial-Ethernet MACs, protocol translation, and signal conditioning in a single device, simplifying long-life industrial designs. The 1020-ball FC-FBGA supports long-term manufacturing continuity through industrial channels. This integration of logic, memory, and transceivers remains a key reason legacy factory-automation platforms continue to specify this part.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF1020I5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF1020C7N | EP1SGX25DF1020C7 | EP1SGX25DF1020C7ES | EP1SGX25DF1020C6N | EP1SGX25DF1020C5N | EP1SGX25DF1020C4 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-pin FC-FBGA | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Configurable Logic Blocks | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Temperature Grade | Industrial (I5) | Commercial (C7) | Commercial (C7) | Commercial (C7, ES) | Commercial (C6) | Commercial (C5) | Commercial (C4) |
| Speed Grade | I5 | C7 (faster than I5) | C7 (faster than I5) | C7 (faster than I5) | C6 (faster than I5) | C5 | C4 (slower) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| User I/O Pins | 607 | 607 | 607 | 607 | 607 | 607 | 607 |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
주요 차별점
- Industrial temperature grade for harsh-environment deployments (vs EP1SGX25DF1020C7N)
- Balanced density for mid-complexity Stratix GX designs (vs EP1SGX10DF672I6N)
- 1020-ball FC-FBGA supports maximum transceiver and I/O density (vs EP1S25F1020C6N)
설계 노트
The EP1SGX25DF1020I5 requires multiple supply rails (1.5 V core, separate VCCIO bank voltages, PLL analog supply, and transceiver analog supplies) per the Stratix GX datasheet. Estimated core current at full utilization reaches several amps, so allocate bulk decoupling capacitors (typically 220 uF low-ESR polymer or tantalum plus 0.1 uF/10 nF ceramics per supply pin group). Power-rail sequencing between VCCINT, VCCPD, and VCCA must follow Altera's recommended sequence to avoid latch-up during FPGA configuration.
In the industrial-grade FC-FBGA package, thermal performance relies primarily on PCB thermal vias under the die-flag and copper pours on outer/inner layers. Estimated junction-to-ambient thermal resistance (theta_JA) for the 1020-ball FC-FBGA on a standard 8-layer PCB is approximately 15-20 C/W without airflow. For full-die utilization at industrial temperatures, designers should target at least 200 LFM airflow or a heat-spreader lid to keep the die below 100 C junction at +85 C ambient.
The 1020-ball FC-FBGA at 1.00 mm pitch requires 4-6 layer PCB stack-up with microvia-in-pad or via-on-pad technology for reliable assembly. Escape routing for transceiver balls must maintain 90 ohm differential impedance and length matching within the budgets specified in the Stratix GX handbook. Keep high-speed serial traces on the top layers with continuous reference planes; avoid routing signal traces across plane splits. Ground-bounce mitigation requires stitching vias near BGA perimeter rows.
Common pitfalls include: (1) forgetting to strap MSEL pins correctly for the chosen configuration mode, (2) leaving unused transceiver channels powered down via software rather than hardware, (3) omitting pull-ups on JTAG TCK/TMS/TDI to avoid floating-config issues, and (4) underestimating IO bank VCCIO requirements when mixing LVDS and single-ended I/O standards. Always validate configuration with Quartus II programmer and the JTAG ID code 0x02xxxxxx before committing to volume production.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status not stated in the verified web data for this legacy Altera FPGA; refer to the original Stratix GX datasheet and the manufacturer's material declaration documents for definitive compliance information.