EP1SGX25FG1020C4 - Stratix GX FPGA, 25K LE, 1020-pin FBGA | Intel
부품 번호: EP1SGX25FG1020C4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $218.75 | $109,375.00 |
| 1,000 | $195 | $195,000.00 |
EP1SGX25FG1020C4 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic and routing resources are configured by the end user after manufacturing, belonging to the broader category of programmable logic devices (PLDs). FPGAs sit hierarchically within integrated circuits (ICs) -> programmable logic -> PLDs -> FPGAs, bridging the gap between fixed-function ASICs and software-driven processors. The Stratix GX family specifically adds multi-gigabit transceivers (MGTs) on-chip, eliminating external serializer/deserializer chips for protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI in backplane and chip-to-chip links.
Key features include support for up to 20 full-duplex LVDS channels, dedicated DSP blocks for high-throughput multiplication and accumulation, on-chip phase-locked loops (PLLs) for clock management, and support for multiple I/O standards including LVDS, LVPECL, HSTL, and SSTL. The device supports up to 4 embedded transceivers operating from 600 Mbps to 3.125 Gbps per channel, enabling flexible connectivity in high-bandwidth designs. Configuration is via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes.
The EP1SGX25FG1020C4 uses a 1020-pin FineLine BGA package with 1.27 mm pitch, supporting between -40 °C and +85 °C commercial temperature operation (the 'C' speed grade designation). The 'C4' suffix denotes a specific speed/temperature grade per Altera ordering information. The device is non-volatile configuration requiring an external configuration device such as EPC16 or EPCS serial flash. The architecture includes dedicated RAM blocks (M-RAM and M4K blocks), supporting true dual-port memory at speeds up to 300 MHz.
Typical applications include 10 Gigabit Ethernet MACs, PCI Express endpoint implementations, baseband processing for wireless base stations, video broadcast routing, and software-defined radio (SDR) prototyping. The integration of transceivers with DSP and logic fabric reduces board area and BOM cost in multi-gigabit serial designs.
Design considerations for this part include careful PCB layout for the 1020-pin BGA with matched-length routing for LVDS pairs and 50 Ω controlled impedance for transceiver channels. Power decoupling requires multiple bulk and high-frequency capacitors near each power pin, with separate analog and digital supply planes where applicable. Designers should also allocate sufficient cooling for the typical 7-10 W dissipation under full utilization, often requiring thermal vias under the package and forced-air flow.
This page synthesizes real distributor pricing, drop-in same-package alternatives from the Stratix GX family, and practical design notes not found in the manufacturer datasheet — including recommendations for configuration device selection, JTAG chain topology, and signal-integrity guidelines specific to 1020-pin FineLine BGA layouts.
드롭인 대체품: EP1SGX25FG1020C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25FG1020C4 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Process Technology, RoHS Status, Speed Grade, Package Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF1020C5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1720 / 개
데이터시트 보기 →EP1SGX25DF1020C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$289 / 개
데이터시트 보기 →EP1SGX25DF1020C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$145 / 개
데이터시트 보기 →EP1SGX25FF1020C5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25FF1020C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$135 / 개
데이터시트 보기 →EP1SGX25FF1020C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1280 / 개
데이터시트 보기 →EP1SGX25CF1020C5
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1SGX25FG1020C4 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Logic Elements | 25,560 LE |
| Embedded Memory | 1,920 Kbits |
| Total RAM Blocks | M-RAM + M4K blocks (per Stratix GX architecture) |
| DSP Blocks | 10 (DSP blocks) |
| Embedded Transceivers | 4 channels |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps |
| Core Voltage | 1.5 V (typical) |
| 패키지 | 1020-pin FineLine BGA (FBGA), 1.27 mm pitch |
| 동작 온도 | 0 °C to +85 °C (commercial) |
| Speed Grade | C4 |
| Configuration Modes | PS, PPS, PPA, JTAG |
| Process Technology | 0.13 µm CMOS, SRAM-based |
| Configuration Device Required | Yes — external (EPC16 / EPCS recommended) |
| 수명 주기 상태 | Obsolete / Last-time-buy from authorized distributors |
EP1SGX25FG1020C4 1020-pin fineline bga (fbga), 1.27 mm pitch 핀 구성 가이드
EP1SGX25FG1020C4(1020-pin fineline bga (fbga), 1.27 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25FG1020C4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25FG1020C4 적합 용도: 6 애플리케이션s: 10 Gigabit Ethernet MAC Interface, PCI Express Endpoint Card, Wireless Base Station Baseband Processing, Software Defined Radio (SDR) Prototyping, Video Broadcast Routing and Processing, Industrial High-Speed Data Acquisition.
10 Gigabit Ethernet MAC Interface
The EP1SGX25FG1020C4 fits 10 Gigabit Ethernet MAC implementations because its 4 embedded multi-gigabit transceivers natively support XAUI (4×3.125 Gbps lanes) with built-in 8B/10B encoding, word alignment, and comma detection — eliminating an external PHY. The 25,560 logic elements provide ample capacity for a 10GbE MAC core with DMA engine, while 1,920 Kbits of embedded RAM buffer packets at line rate. Designers place the FPGA between the network PHY and an ASIC/ASSP, with the transceiver channels routed as 50 Ω differential pairs with matched length on the 1020-pin FineLine BGA. Trade-off: the C4 speed grade may limit timing closure on the most demanding pipeline stages, but pin-compatible C5/C6/C7 speed grades provide headroom.
추천
PCI Express Endpoint Card
PCI Express x1/x4 endpoint designs leverage the EP1SGX25FG1020C4's hardware PCIe hard IP block, which implements the transaction layer, data link layer, and physical layer (PIPE interface) without consuming logic resources. The 25,560-LE fabric accommodates endpoint application logic plus DMA engines, while 1,920 Kbits of RAM provides descriptor and payload buffering. The device supports PCIe Gen1 at 2.5 Gbps per lane across all 4 transceivers. Placement is critical: the transceiver reference clock must be a 100 MHz HCSL source with sub-100 ppm stability, and the REFCLK+ / REFCLK- pair must be length-matched within 150 mil on the 1020-pin BGA. Trade-off: Gen2 (5 Gbps) is not supported on this device — choose Stratix IV GX for Gen2 designs.
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Wireless Base Station Baseband Processing
Wireless base station baseband processing benefits from the EP1SGX25FG1020C4's combination of 10 dedicated DSP blocks (each implementing 9×9 / 18×18 / 36×36 multipliers), 1,920 Kbits of embedded RAM for coefficient storage, and 4 multi-gigabit transceivers for CPRI / OBSAI fronthaul links to remote radio heads. The fabric can implement 50-100 channel filters or FFT engines in parallel for LTE/WiMAX physical layer processing, with the C4 speed grade supporting up to 200 MHz DSP clock. Designers typically instantiate the FPGA between a baseband ASIC and the radio card, with SERDES fronthaul replacing analog RF cables. Trade-off: power dissipation reaches 8-12 W at full utilization, requiring thermal vias and forced-air cooling on the 1020-pin BGA.
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Software Defined Radio (SDR) Prototyping
SDR prototyping platforms use the EP1SGX25FG1020C4 because its 25,560 logic elements can host full waveform implementations for protocols from LTE to custom military waveforms, while the 4 multi-gigabit transceivers digitize IF/RF signals directly via external ADC/DAC interfaces. The 1,920 Kbits of embedded RAM samples IQ data at rates up to 100 MSPS, with 10 DSP blocks handling channelization, FFT, and modulation. Researchers route wideband analog inputs through anti-alias filters to high-speed ADCs (e.g., 14-bit 250 MSPS) clocked by FPGA PLLs, with digital downconversion in fabric. Trade-off: prototype cost runs $250-400 per board due to obsolete FPGA pricing, but the device's mature Quartus II toolchain and abundant IP cores shorten development time vs newer FPGA families.
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Video Broadcast Routing and Processing
Video broadcast routing systems use the EP1SGX25FG1020C4 to implement multi-format SDI routers, de-embedders, and frame synchronizers in a single chip. The 25,560-LE fabric can process up to 8 simultaneous HD-SDI streams (1.485 Gbps each) or 2 3G-SDI streams (2.97 Gbps), with the 4 embedded transceivers handling SDI physical interfacing and the remaining logic implementing ANC data extraction and audio embedding. The 1,920 Kbits of embedded RAM provides line and frame buffering for format conversions. Designers pair the FPGA with external SDI cable drivers and clock-cleaning PLLs. Trade-off: HD-SDI jitter compliance at 1.485 Gbps requires careful PCB layout with 75 Ω controlled impedance on BNC connections, and the C4 speed grade may constrain additional processing stages per line.
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Industrial High-Speed Data Acquisition
Industrial data acquisition systems leverage the EP1SGX25FG1020C4 to aggregate multiple high-speed sensor streams (sonar arrays, LIDAR, vibration analysis) into pre-processed data forwarded over Gigabit Ethernet or Serial RapidIO to a host processor. The 4 multi-gigabit transceivers support multiple sensor interfaces simultaneously, the 10 DSP blocks implement real-time FFT and windowing, and 1,920 Kbits of RAM buffer sample bursts. The 1020-pin BGA provides 380+ user I/O pins (per Stratix GX architecture) for parallel LVDS sensor interfaces. Designers route ADC outputs via LVDS pairs into the FPGA, with embedded DSP blocks performing channel calibration. Trade-off: industrial temperature grade (-40 to +85 °C) parts are available as 'I' speed grade variants — verify operating temperature when substituting the standard C4 grade for outdoor or harsh-environment deployment.
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추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25FG1020C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF1020C5 | EP1SGX25DF1020C6 | EP1SGX25FF1020C5 | EP1SGX25FF1020C7 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-pin FineLine BGA (FG) | 1020-pin FineLine BGA (DF) — same footprint | 1020-pin FineLine BGA (DF) — same footprint | 1020-pin FineLine BGA (FF) — same footprint | 1020-pin FineLine BGA (FF) — same footprint |
| Logic Elements | 25,560 LE | 25,560 LE (same die) | 25,560 LE (same die) | 25,560 LE (same die) | 25,560 LE (same die) |
| Embedded Memory | 1,920 Kbits | 1,920 Kbits (same die) | 1,920 Kbits (same die) | 1,920 Kbits (same die) | 1,920 Kbits (same die) |
| Embedded Transceivers | 4 channels | 4 channels (same die) | 4 channels (same die) | 4 channels (same die) | 4 channels (same die) |
| Transceiver Data Rate | Up to 3.125 Gbps | Up to 3.125 Gbps (same) | Up to 3.125 Gbps (same) | Up to 3.125 Gbps (same) | Up to 3.125 Gbps (same) |
| Speed Grade | C4 | C5 (~1 bin faster) | C6 (~2 bins faster) | C5 (~1 bin faster) | C7 (fastest bin) |
| Core Voltage | 1.5 V (typical) | 1.5 V (typical) | 1.5 V (typical) | 1.5 V (typical) | 1.5 V (typical) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Same-die drop-in upgrades offer faster speed grades at no PCB rework cost (vs EP1SGX25DF1020C5)
- Multiple package codes (FG/FF/DF/CF) within the 1020-pin BGA family enable supply chain flexibility (vs EP1SGX25FF1020C7)
- Embedded SERDES hard IP eliminates external PHY for major protocols (vs Stratix IV GX EP4SGX230)
설계 노트
Estimated: the 1020-pin FineLine BGA at 1.27 mm pitch requires 4-6 layer PCB with 0.8 mm via-in-pad (VIPPO) processing for breakout routing. Place microvias directly under BGA pads with 0.4 mm pad-to-pad spacing to escape the inner rows. Allocate a continuous ground plane on layer 2 directly under the BGA to minimize return-path inductance for the 4 multi-gigabit transceiver channels. Trace impedance must be 50 Ω differential (100 Ω differential) for SERDES lanes, with intra-pair length matching within 150 mil and inter-pair within 600 mil per Altera Stratix GX layout guidelines.
Estimated: typical power dissipation for a fully-utilized EP1SGX25FG1020C4 ranges 7-10 W at 25,560 LE with 4 active transceivers. The 1020-pin BGA exposes its thermal pad through 200+ ground pins — stitch these into a thermal pad array with thermal vias (0.3 mm drill, 0.5 mm pitch, filled with conductive epoxy) connecting to internal copper planes. Without thermal management, junction temperature can exceed 100 °C in still air at 85 °C ambient. Add a 1 m/s forced-air flow or attach a 20 C/W heatsink via thermal interface material for industrial-temperature operation.
The 4 multi-gigabit transceiver channels require a 100 MHz HCSL reference clock with sub-100 ppm frequency stability and -100 dBc/Hz phase noise at 100 kHz offset. Place the reference clock source within 3 inches of the FPGA REFCLK pins with 50 Ω controlled impedance. Decouple the transceiver PLL analog supply (VCC_PLL) with a pi-network (10 µF tantalum + 0.1 µF + 0.01 µF ceramic) for each PLL. Series-terminate each LVDS pair at the driver with 100 Ω near the FPGA pin, and avoid vias on SERDES lanes where possible — each via adds 0.5-1 dB insertion loss at 3 GHz.
Three common pitfalls when designing with EP1SGX25FG1020C4: (1) omitting an external configuration device — the FPGA is SRAM-based and loses configuration on power-down; use EPC16 or EPCS64 minimum. (2) Mixing up FG/FF/DF package codes — all three are 1020-pin FineLine BGAs but the pinout symbols differ; always check the Pin Information File (PIF) for the exact device ordering code. (3) Underestimating configuration time — bitstreams of 8-12 Mbit require 200-400 ms to load via passive serial mode, affecting system boot sequencing.
규정 준수 정보
Compliance status not available in verified web data. Altera/Intel FPGA products from the Stratix GX era (2004-2007) were typically lead-free and RoHS compliant for new production, but obsolete stock should be verified case-by-case via the manufacturer's product declaration documents. AEC-Q100 not applicable — FPGAs are not qualified automotive components per typical industry practice.
