EP1SGX40DF1020C5N - Stratix GX FPGA 41,250 LEs | Altera / Intel
MPN: EP1SGX40DF1020C5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $210 | $210,000.00 |
Drop-in alternatives for EP1SGX40DF1020C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX40DF1020C5
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View Datasheet →EP1SGX40DF1020C5N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4,125 |
| Total Memory Bits | 3,423,744 |
| Number of I/O | 624 |
| Package | 1020-BBGA (FC-FBGA), 33 x 33 mm, 1 mm pitch |
| Mounting Type | Surface Mount |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Operating Temperature | 0C to 85C (Commercial) |
| Speed Grade | C5 |
| Logic Family | CMOS |
| Programmable Type | In-System Programmable |
| Transceivers | Embedded multi-gigabit serial transceivers |
| Configuration | JTAG / EPCS serial |
| RoHS Status | Compliant (lead-free) |
EP1SGX40DF1020C5N 1020-bbga (fc-fbga), 33 x 33 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX40DF1020C5N (1020-bbga (fc-fbga), 33 x 33 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40DF1020C5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020C5N is suitable for 6 applications: Telecom Line Card Processing, PCI Express Endpoint and Root Complex, Serial RapidIO Backplane Bridge, High-Definition Video Processing, Software Defined Radio and DSP, Test and Measurement Instrumentation.
Telecom Line Card Processing
The EP1SGX40DF1020C5N's 41,250 logic elements and embedded multi-gigabit transceivers make it well suited for telecom line card signal processing. Its 4,125 LABs and 3,423,744 memory bits support complex packet classification, traffic management, and framer logic at line rate, while the 624 user I/Os interface with external PHY devices and backplane SERDES. The C5 commercial speed grade delivers deterministic timing closure across the design. Pin-compatible family members such as EP1SGX25DF1020C5N allow capacity scaling without PCB rework.
Recommended
PCI Express Endpoint and Root Complex
The Stratix GX embedded transceivers natively support PCI Express, enabling EP1SGX40DF1020C5N designs for PCIe x4 or x8 endpoints and root complexes. The dedicated hard IP blocks deliver 8b/10b encoding, clock data recovery, and PCIe protocol layers without consuming logic resources, leaving the 41,250 LEs for application logic and DMA engines. This is ideal for high-throughput host adapters, embedded servers, and FPGA-based accelerators. Quartus II IP library provides pre-verified PCIe cores.
Recommended
Serial RapidIO Backplane Bridge
RapidIO interconnect for embedded systems is well served by EP1SGX40DF1020C5N, which integrates multi-gigabit transceivers and high logic density for protocol bridging. Designs using this FPGA can implement 1x or 4x Serial RapidIO links to backplane or DSP farms, with on-chip DSP blocks handling real-time packet manipulation. The 1020-pin FC-FBGA provides dedicated transceiver balls, simplifying board layout for impedance-controlled serial links. Pin-compatible alternatives like EP1SGX40CF1020I5N target industrial temperature backplane cards.
Recommended
High-Definition Video Processing
Broadcast and video processing equipment leverage EP1SGX40DF1020C5N's parallel datapaths and 3.4 Mbit embedded RAM for HD-SDI, DVB-ASI, or HDMI-based designs. The 4,125 LABs enable multi-channel video pipelines, while DSP blocks accelerate chroma resampling and deinterlacing. The 624 user I/Os support parallel RGB, BT.1120, or memory interfaces to DDR SDRAM for frame buffers. Designers should plan power sequencing for the multi-rail FPGA supply during PCB bring-up to avoid latch-up.
Recommended
Software Defined Radio and DSP
Software Defined Radio platforms benefit from EP1SGX40DF1020C5N's combination of logic density, DSP blocks, and multi-gigabit transceivers for ADC/DAC interfacing. The 41,250 LEs and embedded multipliers can implement digital down-conversion, channelization, and modulation/demodulation for wideband receivers. Transceivers connect directly to high-speed ADC/DAC serial LVDS links. The Stratix GX architecture supports sample rates up to hundreds of MSPS in real time, making this FPGA a strong choice for SDR prototyping and base-station processing.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment such as logic analyzers, protocol analyzers, and bit-error-rate testers use EP1SGX40DF1020C5N for deep capture buffers and real-time pattern matching. The 3.4 Mbit embedded RAM stores trace data, while the 624 I/Os fan out to high-speed probe channels. The embedded transceivers enable 10 Gbps-capable protocol testing for USB 3.0, SATA, and SAS. Commercial temperature range suits laboratory and factory test environments where thermal management can be designed in. Quartus II allows in-system reconfiguration for different test scenarios.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40DF1020C5 | EP1SGX40DF1020C5ES | EP1SGX40CF1020I5 | EP1SGX25DF1020C5N | EP1SGX40DF1020C |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BBGA FC-FBGA 33x33mm | 1020-BBGA FC-FBGA - same | 1020-BBGA FC-FBGA - same | 1020-BBGA FC-FBGA - same | 1020-BBGA FC-FBGA - same | 1020-BBGA FC-FBGA - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 25,560 | 41,250 |
| Number of LABs/CLBs | 4,125 | 4,125 | 4,125 | 4,125 | 2,556 | 4,125 |
| Total Memory Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 1,944,576 | 3,423,744 |
| User I/O Pins | 624 | 624 | 624 | 624 | 624 | 624 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | C5 | C5 | C5 (ES) | I5 (Industrial) | C5 | C (unspecified) |
Key Differentiators
- Highest-density Stratix GX with 41,250 logic elements in DF1020 package (vs EP1SGX25DF1020C5N)
- Commercial temperature grade suitable for indoor deployments (vs EP1SGX40CF1020I5)
- Lead-free / RoHS compliant N-suffix variant (vs EP1SGX40DF1020C5)
- Engineering sample availability for early prototyping (vs EP1SGX40DF1020C5N (production))
Design Notes
Stratix GX FPGAs require multiple regulated supply rails: VCCINT (1.5V core), VCCIO (per bank, 1.5V/1.8V/2.5V/3.3V), VCCA (analog PLL), VCCP (configuration), and VCCRT/RX/TX for transceiver supplies. Power sequencing must follow the Stratix GX datasheet recommendations to prevent latch-up; the typical sequence is VCCINT first, then VCCIO, then analog rails. Estimated power consumption for EP1SGX40DF1020C5N at full utilization with active transceivers can exceed 10W, so plan a multi-phase buck regulator and adequate copper pour on the PCB.
The 1020-ball FC-FBGA package with 1 mm pitch requires multilayer PCB fabrication with microvia or via-in-pad technology for break-out routing. Use 8+ layer stack-up with dedicated ground and power planes adjacent to signal layers. Maintain 100-ohm differential impedance for the transceiver pairs and 50-ohm single-ended for clock signals. Place the EPCS configuration memory and clock source within 5 mm of the FPGA to minimize routing parasitics.
Estimated: at typical Stratix GX utilization (50% logic, 50% memory, active transceivers), the EP1SGX40DF1020C5N may dissipate 8-12W. The FC-FBGA package relies on PCB copper heatsinking rather than a top-side heat spreader. For commercial 0C to +85C operation, provide at least 4 square inches of 2 oz copper thermal pad beneath the package, connected through thermal vias to inner ground planes. Active airflow may be required for enclosed chassis designs.
Common pitfalls include: (1) forgetting JTAG chain isolation when chaining EPCS configuration devices, which causes configuration failure; (2) ignoring the differential pair length matching requirements within +/-5 mil for transceiver channels; (3) leaving transceiver PLLs unpowered at startup, which prevents the transceiver block from initializing; (4) using the wrong Quartus II device library version, which can produce bitstreams that fail post-route verification. Always validate bitstream integrity by reading back via JTAG before board assembly.
Stratix GX transceivers require AC-coupling capacitors on the serial TX/RX pairs - do not omit these or DC offsets will damage the FPGA. Use 100 nF X7R ceramic capacitors placed within 200 mil of the FPGA balls. Maintain 90-ohm differential impedance (not 100-ohm) for Stratix GX links per the datasheet. Keep transceiver channels away from switching power inductors to avoid common-mode interference.
Compliance Information
N-suffix indicates lead-free RoHS-compliant packaging per Altera/Intel product page. REACH, halogen-free, and conflict minerals status were not found in the verified web data and are marked as unknown.
